JP2008539594A5 - - Google Patents

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Publication number
JP2008539594A5
JP2008539594A5 JP2008508983A JP2008508983A JP2008539594A5 JP 2008539594 A5 JP2008539594 A5 JP 2008539594A5 JP 2008508983 A JP2008508983 A JP 2008508983A JP 2008508983 A JP2008508983 A JP 2008508983A JP 2008539594 A5 JP2008539594 A5 JP 2008539594A5
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JP
Japan
Prior art keywords
substrate
rollers
edge
diameter
cleaning
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2008508983A
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English (en)
Japanese (ja)
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JP2008539594A (ja
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Publication date
Application filed filed Critical
Priority claimed from PCT/US2006/015399 external-priority patent/WO2006116263A1/en
Publication of JP2008539594A publication Critical patent/JP2008539594A/ja
Publication of JP2008539594A5 publication Critical patent/JP2008539594A5/ja
Pending legal-status Critical Current

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JP2008508983A 2005-04-25 2006-04-24 基板の縁部を洗浄するための方法および装置 Pending JP2008539594A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US67491005P 2005-04-25 2005-04-25
PCT/US2006/015399 WO2006116263A1 (en) 2005-04-25 2006-04-24 Methods and apparatus for cleaning and edge of a substrate

Publications (2)

Publication Number Publication Date
JP2008539594A JP2008539594A (ja) 2008-11-13
JP2008539594A5 true JP2008539594A5 (enExample) 2009-05-28

Family

ID=36694310

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008508983A Pending JP2008539594A (ja) 2005-04-25 2006-04-24 基板の縁部を洗浄するための方法および装置

Country Status (6)

Country Link
US (3) US20060243304A1 (enExample)
JP (1) JP2008539594A (enExample)
KR (1) KR20080005974A (enExample)
CN (1) CN101164141A (enExample)
TW (1) TWI362064B (enExample)
WO (1) WO2006116263A1 (enExample)

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* Cited by examiner, † Cited by third party
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US20070238393A1 (en) * 2006-03-30 2007-10-11 Shin Ho S Methods and apparatus for polishing an edge of a substrate
US20080156360A1 (en) * 2006-12-26 2008-07-03 Applied Materials, Inc. Horizontal megasonic module for cleaning substrates
US7823241B2 (en) 2007-03-22 2010-11-02 Taiwan Semiconductor Manufacturing Co., Ltd. System for cleaning a wafer
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JP2008306179A (ja) 2007-05-21 2008-12-18 Applied Materials Inc バッキングパッドを使用して基板の両面の縁部から膜及び薄片を除去する方法及び装置
JP2008306180A (ja) * 2007-05-21 2008-12-18 Applied Materials Inc 膜の基板斜面及び縁部の研磨プロファイルを制御する方法及び装置
JP2008284683A (ja) * 2007-05-21 2008-11-27 Applied Materials Inc 基板の振動により基板のノッチを研磨する方法及び装置
JP2009004765A (ja) * 2007-05-21 2009-01-08 Applied Materials Inc 基板研磨のためにローリングバッキングパッドを使用する方法及び装置
JP2009119537A (ja) * 2007-11-12 2009-06-04 Toshiba Corp 基板処理方法及び基板処理装置
TWI433251B (zh) * 2007-11-23 2014-04-01 Lam Res Corp 用於濕處理晶圓狀物件之周邊區域的裝置及方法
US20100105299A1 (en) * 2008-10-24 2010-04-29 Applied Materials, Inc. Methods and apparatus for polishing an edge and/or notch of a substrate
US20100105291A1 (en) * 2008-10-24 2010-04-29 Applied Materials, Inc. Methods and apparatus for polishing a notch of a substrate
JP5302781B2 (ja) * 2009-06-04 2013-10-02 東京エレクトロン株式会社 基板液処理装置及び基板液処理方法並びに基板液処理プログラムを格納した記憶媒体
GB2480875B (en) 2010-06-04 2014-09-03 Plastic Logic Ltd Production of electronic switching devices
JP2012094602A (ja) * 2010-10-25 2012-05-17 Tokyo Electron Ltd ブラシ、基板処理装置および基板処理方法。
US20130111678A1 (en) * 2011-11-08 2013-05-09 Applied Materials, Inc. Brush box module for chemical mechanical polishing cleaner
KR20130090209A (ko) * 2012-02-03 2013-08-13 삼성전자주식회사 기판처리장치 및 기판처리방법
KR101415983B1 (ko) * 2012-12-24 2014-07-08 주식회사 케이씨텍 웨이퍼 세정장치
US9613845B2 (en) 2014-01-17 2017-04-04 Taiwan Semiconductor Manufacturing Company, Ltd. Immersion de-taping
JP6461748B2 (ja) 2015-08-25 2019-01-30 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
CN108723972B (zh) * 2017-04-20 2020-09-22 上海新昇半导体科技有限公司 基于伯努利原理的边缘研磨基座、边缘研磨系统及方法
US11551940B2 (en) * 2018-12-25 2023-01-10 Xia Tai Xin Semiconductor (Qing Dao) Ltd. Roller for cleaning wafer and cleaning apparatus having the same
CN109571232B (zh) * 2018-12-28 2020-05-19 西安奕斯伟硅片技术有限公司 晶圆研磨方法及其研磨系统
DE102020132780A1 (de) 2020-05-28 2021-12-02 Taiwan Semiconductor Manufacturing Co., Ltd. Reinigungsverfahren für fotomasken und apparat dafür
US20230411227A1 (en) * 2022-06-17 2023-12-21 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor processing tool and methods of operation
CN116153803B (zh) * 2023-04-23 2023-07-14 苏州晶睿半导体科技有限公司 一种带有清理结构的半导体晶圆测试台及方法
CN119458049A (zh) * 2024-12-02 2025-02-18 西安奕斯伟材料科技股份有限公司 倒角加工装置和倒角加工方法

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JP3892635B2 (ja) * 2000-02-04 2007-03-14 大日本スクリーン製造株式会社 洗浄装置
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US6622334B1 (en) * 2000-03-29 2003-09-23 International Business Machines Corporation Wafer edge cleaning utilizing polish pad material
US6438781B1 (en) * 2000-04-21 2002-08-27 Toda Citron Technologies, Inc. Washer for cleaning substrates
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JP2004241658A (ja) * 2003-02-06 2004-08-26 Nippei Toyama Corp 半導体デバイスのエッジ部の研削方法及び研削装置
US20050109371A1 (en) * 2003-10-27 2005-05-26 Applied Materials, Inc. Post CMP scrubbing of substrates
US20050172430A1 (en) * 2003-10-28 2005-08-11 Joseph Yudovsky Wafer edge cleaning
JP2008539594A (ja) * 2005-04-25 2008-11-13 アプライド マテリアルズ インコーポレイテッド 基板の縁部を洗浄するための方法および装置
US7993485B2 (en) * 2005-12-09 2011-08-09 Applied Materials, Inc. Methods and apparatus for processing a substrate
US20070131653A1 (en) * 2005-12-09 2007-06-14 Ettinger Gary C Methods and apparatus for processing a substrate
US20070238393A1 (en) * 2006-03-30 2007-10-11 Shin Ho S Methods and apparatus for polishing an edge of a substrate
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