JP2008539594A - 基板の縁部を洗浄するための方法および装置 - Google Patents

基板の縁部を洗浄するための方法および装置 Download PDF

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Publication number
JP2008539594A
JP2008539594A JP2008508983A JP2008508983A JP2008539594A JP 2008539594 A JP2008539594 A JP 2008539594A JP 2008508983 A JP2008508983 A JP 2008508983A JP 2008508983 A JP2008508983 A JP 2008508983A JP 2008539594 A JP2008539594 A JP 2008539594A
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Japan
Prior art keywords
substrate
rollers
edge
diameter
cleaning
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
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JP2008508983A
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English (en)
Japanese (ja)
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JP2008539594A5 (enExample
Inventor
ウェイ‐ユン スー，
ドナルド， ジェイ．， ケイ． オルガド，
ホ‐セオン シン，
リャン‐ユウ チェン，
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Applied Materials Inc
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Applied Materials Inc
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Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of JP2008539594A publication Critical patent/JP2008539594A/ja
Publication of JP2008539594A5 publication Critical patent/JP2008539594A5/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/30—Cleaning by methods involving the use of tools by movement of cleaning members over a surface
    • B08B1/32—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members
    • B08B1/34—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members rotating about an axis parallel to the surface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning In General (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP2008508983A 2005-04-25 2006-04-24 基板の縁部を洗浄するための方法および装置 Pending JP2008539594A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US67491005P 2005-04-25 2005-04-25
PCT/US2006/015399 WO2006116263A1 (en) 2005-04-25 2006-04-24 Methods and apparatus for cleaning and edge of a substrate

Publications (2)

Publication Number Publication Date
JP2008539594A true JP2008539594A (ja) 2008-11-13
JP2008539594A5 JP2008539594A5 (enExample) 2009-05-28

Family

ID=36694310

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008508983A Pending JP2008539594A (ja) 2005-04-25 2006-04-24 基板の縁部を洗浄するための方法および装置

Country Status (6)

Country Link
US (3) US20080216867A1 (enExample)
JP (1) JP2008539594A (enExample)
KR (1) KR20080005974A (enExample)
CN (1) CN101164141A (enExample)
TW (1) TWI362064B (enExample)
WO (1) WO2006116263A1 (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010283150A (ja) * 2009-06-04 2010-12-16 Tokyo Electron Ltd 基板液処理装置及び基板液処理方法並びに基板液処理プログラムを格納した記憶媒体
JP2012094602A (ja) * 2010-10-25 2012-05-17 Tokyo Electron Ltd ブラシ、基板処理装置および基板処理方法。
WO2017033495A1 (ja) * 2015-08-25 2017-03-02 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101164141A (zh) * 2005-04-25 2008-04-16 应用材料股份有限公司 清洁基材边缘的方法及设备
US20070131653A1 (en) * 2005-12-09 2007-06-14 Ettinger Gary C Methods and apparatus for processing a substrate
US7993485B2 (en) * 2005-12-09 2011-08-09 Applied Materials, Inc. Methods and apparatus for processing a substrate
WO2007126815A2 (en) * 2006-03-30 2007-11-08 Applied Materials, Inc. Methods and apparatus for polishing an edge of a subtrate
US20080156360A1 (en) * 2006-12-26 2008-07-03 Applied Materials, Inc. Horizontal megasonic module for cleaning substrates
US7823241B2 (en) 2007-03-22 2010-11-02 Taiwan Semiconductor Manufacturing Co., Ltd. System for cleaning a wafer
JP2008306179A (ja) 2007-05-21 2008-12-18 Applied Materials Inc バッキングパッドを使用して基板の両面の縁部から膜及び薄片を除去する方法及び装置
JP2008288600A (ja) * 2007-05-21 2008-11-27 Applied Materials Inc 基板の縁部除外領域の大きさを制御する方法及び装置
US20080293337A1 (en) * 2007-05-21 2008-11-27 Applied Materials, Inc. Methods and apparatus for polishing a notch of a substrate by substrate vibration
US20080293336A1 (en) * 2007-05-21 2008-11-27 Applied Materials, Inc. Methods and apparatus to control substrate bevel and edge polishing profiles of films
TW200908122A (en) * 2007-05-21 2009-02-16 Applied Materials Inc Methods and apparatus for using a rolling backing pad for substrate polishing
JP2009119537A (ja) * 2007-11-12 2009-06-04 Toshiba Corp 基板処理方法及び基板処理装置
JP5336506B2 (ja) * 2007-11-23 2013-11-06 ラム・リサーチ・アーゲー ウエハ状物品の周縁領域をウェット処理するための装置及び方法
US20100105291A1 (en) * 2008-10-24 2010-04-29 Applied Materials, Inc. Methods and apparatus for polishing a notch of a substrate
US20100105299A1 (en) * 2008-10-24 2010-04-29 Applied Materials, Inc. Methods and apparatus for polishing an edge and/or notch of a substrate
GB2480875B (en) 2010-06-04 2014-09-03 Plastic Logic Ltd Production of electronic switching devices
US20130111678A1 (en) * 2011-11-08 2013-05-09 Applied Materials, Inc. Brush box module for chemical mechanical polishing cleaner
KR20130090209A (ko) * 2012-02-03 2013-08-13 삼성전자주식회사 기판처리장치 및 기판처리방법
KR101415983B1 (ko) * 2012-12-24 2014-07-08 주식회사 케이씨텍 웨이퍼 세정장치
US9613845B2 (en) 2014-01-17 2017-04-04 Taiwan Semiconductor Manufacturing Company, Ltd. Immersion de-taping
CN108723972B (zh) * 2017-04-20 2020-09-22 上海新昇半导体科技有限公司 基于伯努利原理的边缘研磨基座、边缘研磨系统及方法
US11551940B2 (en) * 2018-12-25 2023-01-10 Xia Tai Xin Semiconductor (Qing Dao) Ltd. Roller for cleaning wafer and cleaning apparatus having the same
CN109571232B (zh) * 2018-12-28 2020-05-19 西安奕斯伟硅片技术有限公司 晶圆研磨方法及其研磨系统
DE102020132780A1 (de) * 2020-05-28 2021-12-02 Taiwan Semiconductor Manufacturing Co., Ltd. Reinigungsverfahren für fotomasken und apparat dafür
US20230411227A1 (en) * 2022-06-17 2023-12-21 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor processing tool and methods of operation
CN116153803B (zh) * 2023-04-23 2023-07-14 苏州晶睿半导体科技有限公司 一种带有清理结构的半导体晶圆测试台及方法
CN119458049A (zh) * 2024-12-02 2025-02-18 西安奕斯伟材料科技股份有限公司 倒角加工装置和倒角加工方法

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0831780A (ja) * 1994-07-14 1996-02-02 Fujitsu Ltd 半導体装置の製造方法
JP2001212531A (ja) * 2000-02-04 2001-08-07 Dainippon Screen Mfg Co Ltd 洗浄装置
JP2002052370A (ja) * 2000-08-09 2002-02-19 Ebara Corp 基板洗浄装置
JP2002110593A (ja) * 2000-09-27 2002-04-12 Sony Corp ウエハエッジ部の残膜除去方法及び除去装置
JP2002177911A (ja) * 2000-12-14 2002-06-25 Dainippon Screen Mfg Co Ltd 基板洗浄装置および基板洗浄方法
JP2003151943A (ja) * 2001-11-19 2003-05-23 Speedfam Clean System Co Ltd スクラブ洗浄装置
JP2004241658A (ja) * 2003-02-06 2004-08-26 Nippei Toyama Corp 半導体デバイスのエッジ部の研削方法及び研削装置

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5861066A (en) * 1996-05-01 1999-01-19 Ontrak Systems, Inc. Method and apparatus for cleaning edges of contaminated substrates
US5725414A (en) * 1996-12-30 1998-03-10 Intel Corporation Apparatus for cleaning the side-edge and top-edge of a semiconductor wafer
JPH11179646A (ja) * 1997-12-19 1999-07-06 Speedfam Co Ltd 洗浄装置
US6299698B1 (en) * 1998-07-10 2001-10-09 Applied Materials, Inc. Wafer edge scrubber and method
US6202658B1 (en) * 1998-11-11 2001-03-20 Applied Materials, Inc. Method and apparatus for cleaning the edge of a thin disc
US6290780B1 (en) * 1999-03-19 2001-09-18 Lam Research Corporation Method and apparatus for processing a wafer
JP2001070896A (ja) * 1999-07-06 2001-03-21 Ebara Corp 基板洗浄装置
US6434775B1 (en) * 1999-12-23 2002-08-20 Lam Research Corporaton Nozzle for rinsing the backside of a semiconductor wafer
US6558471B2 (en) * 2000-01-28 2003-05-06 Applied Materials, Inc. Scrubber operation
US6594847B1 (en) * 2000-03-28 2003-07-22 Lam Research Corporation Single wafer residue, thin film removal and clean
US6622334B1 (en) * 2000-03-29 2003-09-23 International Business Machines Corporation Wafer edge cleaning utilizing polish pad material
US6438781B1 (en) * 2000-04-21 2002-08-27 Toda Citron Technologies, Inc. Washer for cleaning substrates
US6540841B1 (en) * 2000-06-30 2003-04-01 Chartered Semiconductor Manufacturing Ltd. Method and apparatus for removing contaminants from the perimeter of a semiconductor substrate
US6550091B1 (en) * 2000-10-04 2003-04-22 Lam Research Corporation Double-sided wafer edge scrubbing apparatus and method for using the same
US20020121289A1 (en) * 2001-03-05 2002-09-05 Applied Materials, Inc. Spray bar
US6904637B2 (en) * 2001-10-03 2005-06-14 Applied Materials, Inc. Scrubber with sonic nozzle
US6986185B2 (en) * 2001-10-30 2006-01-17 Applied Materials Inc. Methods and apparatus for determining scrubber brush pressure
US7077916B2 (en) * 2002-03-11 2006-07-18 Matsushita Electric Industrial Co., Ltd. Substrate cleaning method and cleaning apparatus
US6910240B1 (en) * 2002-12-16 2005-06-28 Lam Research Corporation Wafer bevel edge cleaning system and apparatus
US20050109371A1 (en) * 2003-10-27 2005-05-26 Applied Materials, Inc. Post CMP scrubbing of substrates
US20050172430A1 (en) * 2003-10-28 2005-08-11 Joseph Yudovsky Wafer edge cleaning
CN101164141A (zh) * 2005-04-25 2008-04-16 应用材料股份有限公司 清洁基材边缘的方法及设备
US7993485B2 (en) * 2005-12-09 2011-08-09 Applied Materials, Inc. Methods and apparatus for processing a substrate
US20070131653A1 (en) * 2005-12-09 2007-06-14 Ettinger Gary C Methods and apparatus for processing a substrate
WO2007126815A2 (en) * 2006-03-30 2007-11-08 Applied Materials, Inc. Methods and apparatus for polishing an edge of a subtrate
US20090238393A1 (en) * 2008-03-18 2009-09-24 Fortemedia, Inc. Package for array microphones

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0831780A (ja) * 1994-07-14 1996-02-02 Fujitsu Ltd 半導体装置の製造方法
JP2001212531A (ja) * 2000-02-04 2001-08-07 Dainippon Screen Mfg Co Ltd 洗浄装置
JP2002052370A (ja) * 2000-08-09 2002-02-19 Ebara Corp 基板洗浄装置
JP2002110593A (ja) * 2000-09-27 2002-04-12 Sony Corp ウエハエッジ部の残膜除去方法及び除去装置
JP2002177911A (ja) * 2000-12-14 2002-06-25 Dainippon Screen Mfg Co Ltd 基板洗浄装置および基板洗浄方法
JP2003151943A (ja) * 2001-11-19 2003-05-23 Speedfam Clean System Co Ltd スクラブ洗浄装置
JP2004241658A (ja) * 2003-02-06 2004-08-26 Nippei Toyama Corp 半導体デバイスのエッジ部の研削方法及び研削装置

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010283150A (ja) * 2009-06-04 2010-12-16 Tokyo Electron Ltd 基板液処理装置及び基板液処理方法並びに基板液処理プログラムを格納した記憶媒体
JP2012094602A (ja) * 2010-10-25 2012-05-17 Tokyo Electron Ltd ブラシ、基板処理装置および基板処理方法。
WO2017033495A1 (ja) * 2015-08-25 2017-03-02 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
JP2017045803A (ja) * 2015-08-25 2017-03-02 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
US10453674B2 (en) 2015-08-25 2019-10-22 SCREEN Holdings Co., Ltd. Substrate treatment method and substrate treatment device

Also Published As

Publication number Publication date
TWI362064B (en) 2012-04-11
KR20080005974A (ko) 2008-01-15
US20090038642A1 (en) 2009-02-12
US20060243304A1 (en) 2006-11-02
TW200731367A (en) 2007-08-16
WO2006116263A1 (en) 2006-11-02
US20080216867A1 (en) 2008-09-11
CN101164141A (zh) 2008-04-16

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