CN101164141A - 清洁基材边缘的方法及设备 - Google Patents

清洁基材边缘的方法及设备 Download PDF

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Publication number
CN101164141A
CN101164141A CNA2006800137756A CN200680013775A CN101164141A CN 101164141 A CN101164141 A CN 101164141A CN A2006800137756 A CNA2006800137756 A CN A2006800137756A CN 200680013775 A CN200680013775 A CN 200680013775A CN 101164141 A CN101164141 A CN 101164141A
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CN
China
Prior art keywords
substrate
rollers
diameter
edge
roller bearing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA2006800137756A
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English (en)
Chinese (zh)
Inventor
W·Y·苏
多纳德·J·K·欧盖杜
H·S·辛
L·Y·陈
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Inc
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of CN101164141A publication Critical patent/CN101164141A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/30—Cleaning by methods involving the use of tools by movement of cleaning members over a surface
    • B08B1/32—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members
    • B08B1/34—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members rotating about an axis parallel to the surface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Cleaning In General (AREA)
CNA2006800137756A 2005-04-25 2006-04-24 清洁基材边缘的方法及设备 Pending CN101164141A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US67491005P 2005-04-25 2005-04-25
US60/674,910 2005-04-25

Publications (1)

Publication Number Publication Date
CN101164141A true CN101164141A (zh) 2008-04-16

Family

ID=36694310

Family Applications (1)

Application Number Title Priority Date Filing Date
CNA2006800137756A Pending CN101164141A (zh) 2005-04-25 2006-04-24 清洁基材边缘的方法及设备

Country Status (6)

Country Link
US (3) US20060243304A1 (enExample)
JP (1) JP2008539594A (enExample)
KR (1) KR20080005974A (enExample)
CN (1) CN101164141A (enExample)
TW (1) TWI362064B (enExample)
WO (1) WO2006116263A1 (enExample)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108723972A (zh) * 2017-04-20 2018-11-02 上海新昇半导体科技有限公司 基于伯努利原理的边缘研磨基座、边缘研磨系统及方法
CN113253567A (zh) * 2020-05-28 2021-08-13 台湾积体电路制造股份有限公司 用于光掩模的清洁方法及其装置
CN116153803A (zh) * 2023-04-23 2023-05-23 苏州晶睿半导体科技有限公司 一种带有清理结构的半导体晶圆测试台及方法
CN119458049A (zh) * 2024-12-02 2025-02-18 西安奕斯伟材料科技股份有限公司 倒角加工装置和倒角加工方法

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI362064B (en) * 2005-04-25 2012-04-11 Applied Materials Inc Methods and apparatus for cleaning an edge of a substrate
US7993485B2 (en) * 2005-12-09 2011-08-09 Applied Materials, Inc. Methods and apparatus for processing a substrate
US20070131653A1 (en) * 2005-12-09 2007-06-14 Ettinger Gary C Methods and apparatus for processing a substrate
JP2009532210A (ja) * 2006-03-30 2009-09-10 アプライド マテリアルズ インコーポレイテッド 基板の縁部を研摩するための方法及び装置
US20080156360A1 (en) * 2006-12-26 2008-07-03 Applied Materials, Inc. Horizontal megasonic module for cleaning substrates
US7823241B2 (en) 2007-03-22 2010-11-02 Taiwan Semiconductor Manufacturing Co., Ltd. System for cleaning a wafer
JP2008306180A (ja) * 2007-05-21 2008-12-18 Applied Materials Inc 膜の基板斜面及び縁部の研磨プロファイルを制御する方法及び装置
US8142260B2 (en) 2007-05-21 2012-03-27 Applied Materials, Inc. Methods and apparatus for removal of films and flakes from the edge of both sides of a substrate using backing pads
JP2008288600A (ja) * 2007-05-21 2008-11-27 Applied Materials Inc 基板の縁部除外領域の大きさを制御する方法及び装置
JP2008284683A (ja) * 2007-05-21 2008-11-27 Applied Materials Inc 基板の振動により基板のノッチを研磨する方法及び装置
TW200908122A (en) * 2007-05-21 2009-02-16 Applied Materials Inc Methods and apparatus for using a rolling backing pad for substrate polishing
JP2009119537A (ja) * 2007-11-12 2009-06-04 Toshiba Corp 基板処理方法及び基板処理装置
TWI433251B (zh) * 2007-11-23 2014-04-01 Lam Res Corp 用於濕處理晶圓狀物件之周邊區域的裝置及方法
US20100105291A1 (en) * 2008-10-24 2010-04-29 Applied Materials, Inc. Methods and apparatus for polishing a notch of a substrate
US20100105299A1 (en) * 2008-10-24 2010-04-29 Applied Materials, Inc. Methods and apparatus for polishing an edge and/or notch of a substrate
JP5302781B2 (ja) * 2009-06-04 2013-10-02 東京エレクトロン株式会社 基板液処理装置及び基板液処理方法並びに基板液処理プログラムを格納した記憶媒体
GB2480875B (en) 2010-06-04 2014-09-03 Plastic Logic Ltd Production of electronic switching devices
JP2012094602A (ja) * 2010-10-25 2012-05-17 Tokyo Electron Ltd ブラシ、基板処理装置および基板処理方法。
US20130111678A1 (en) * 2011-11-08 2013-05-09 Applied Materials, Inc. Brush box module for chemical mechanical polishing cleaner
KR20130090209A (ko) * 2012-02-03 2013-08-13 삼성전자주식회사 기판처리장치 및 기판처리방법
KR101415983B1 (ko) * 2012-12-24 2014-07-08 주식회사 케이씨텍 웨이퍼 세정장치
US9613845B2 (en) 2014-01-17 2017-04-04 Taiwan Semiconductor Manufacturing Company, Ltd. Immersion de-taping
JP6461748B2 (ja) * 2015-08-25 2019-01-30 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
US11551940B2 (en) * 2018-12-25 2023-01-10 Xia Tai Xin Semiconductor (Qing Dao) Ltd. Roller for cleaning wafer and cleaning apparatus having the same
CN109571232B (zh) * 2018-12-28 2020-05-19 西安奕斯伟硅片技术有限公司 晶圆研磨方法及其研磨系统
US20230411227A1 (en) * 2022-06-17 2023-12-21 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor processing tool and methods of operation

Family Cites Families (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0831780A (ja) * 1994-07-14 1996-02-02 Fujitsu Ltd 半導体装置の製造方法
US5861066A (en) * 1996-05-01 1999-01-19 Ontrak Systems, Inc. Method and apparatus for cleaning edges of contaminated substrates
US5725414A (en) * 1996-12-30 1998-03-10 Intel Corporation Apparatus for cleaning the side-edge and top-edge of a semiconductor wafer
JPH11179646A (ja) * 1997-12-19 1999-07-06 Speedfam Co Ltd 洗浄装置
US6299698B1 (en) * 1998-07-10 2001-10-09 Applied Materials, Inc. Wafer edge scrubber and method
US6202658B1 (en) * 1998-11-11 2001-03-20 Applied Materials, Inc. Method and apparatus for cleaning the edge of a thin disc
US6290780B1 (en) * 1999-03-19 2001-09-18 Lam Research Corporation Method and apparatus for processing a wafer
JP2001070896A (ja) * 1999-07-06 2001-03-21 Ebara Corp 基板洗浄装置
US6434775B1 (en) * 1999-12-23 2002-08-20 Lam Research Corporaton Nozzle for rinsing the backside of a semiconductor wafer
US6558471B2 (en) * 2000-01-28 2003-05-06 Applied Materials, Inc. Scrubber operation
JP3892635B2 (ja) * 2000-02-04 2007-03-14 大日本スクリーン製造株式会社 洗浄装置
US6594847B1 (en) * 2000-03-28 2003-07-22 Lam Research Corporation Single wafer residue, thin film removal and clean
US6622334B1 (en) * 2000-03-29 2003-09-23 International Business Machines Corporation Wafer edge cleaning utilizing polish pad material
US6438781B1 (en) * 2000-04-21 2002-08-27 Toda Citron Technologies, Inc. Washer for cleaning substrates
US6540841B1 (en) * 2000-06-30 2003-04-01 Chartered Semiconductor Manufacturing Ltd. Method and apparatus for removing contaminants from the perimeter of a semiconductor substrate
JP2002052370A (ja) * 2000-08-09 2002-02-19 Ebara Corp 基板洗浄装置
JP2002110593A (ja) * 2000-09-27 2002-04-12 Sony Corp ウエハエッジ部の残膜除去方法及び除去装置
US6550091B1 (en) * 2000-10-04 2003-04-22 Lam Research Corporation Double-sided wafer edge scrubbing apparatus and method for using the same
JP2002177911A (ja) * 2000-12-14 2002-06-25 Dainippon Screen Mfg Co Ltd 基板洗浄装置および基板洗浄方法
US20020121289A1 (en) * 2001-03-05 2002-09-05 Applied Materials, Inc. Spray bar
US6904637B2 (en) * 2001-10-03 2005-06-14 Applied Materials, Inc. Scrubber with sonic nozzle
US6986185B2 (en) * 2001-10-30 2006-01-17 Applied Materials Inc. Methods and apparatus for determining scrubber brush pressure
JP2003151943A (ja) * 2001-11-19 2003-05-23 Speedfam Clean System Co Ltd スクラブ洗浄装置
US7077916B2 (en) * 2002-03-11 2006-07-18 Matsushita Electric Industrial Co., Ltd. Substrate cleaning method and cleaning apparatus
US6910240B1 (en) * 2002-12-16 2005-06-28 Lam Research Corporation Wafer bevel edge cleaning system and apparatus
JP2004241658A (ja) * 2003-02-06 2004-08-26 Nippei Toyama Corp 半導体デバイスのエッジ部の研削方法及び研削装置
US20050109371A1 (en) * 2003-10-27 2005-05-26 Applied Materials, Inc. Post CMP scrubbing of substrates
US20050172430A1 (en) * 2003-10-28 2005-08-11 Joseph Yudovsky Wafer edge cleaning
TWI362064B (en) * 2005-04-25 2012-04-11 Applied Materials Inc Methods and apparatus for cleaning an edge of a substrate
US20070131653A1 (en) * 2005-12-09 2007-06-14 Ettinger Gary C Methods and apparatus for processing a substrate
US7993485B2 (en) * 2005-12-09 2011-08-09 Applied Materials, Inc. Methods and apparatus for processing a substrate
JP2009532210A (ja) * 2006-03-30 2009-09-10 アプライド マテリアルズ インコーポレイテッド 基板の縁部を研摩するための方法及び装置
US20090238393A1 (en) * 2008-03-18 2009-09-24 Fortemedia, Inc. Package for array microphones

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108723972A (zh) * 2017-04-20 2018-11-02 上海新昇半导体科技有限公司 基于伯努利原理的边缘研磨基座、边缘研磨系统及方法
CN108723972B (zh) * 2017-04-20 2020-09-22 上海新昇半导体科技有限公司 基于伯努利原理的边缘研磨基座、边缘研磨系统及方法
CN113253567A (zh) * 2020-05-28 2021-08-13 台湾积体电路制造股份有限公司 用于光掩模的清洁方法及其装置
US12259649B2 (en) 2020-05-28 2025-03-25 Taiwan Semiconductor Manufacturing Company, Ltd. Cleaning method for photo masks and apparatus therefor
CN116153803A (zh) * 2023-04-23 2023-05-23 苏州晶睿半导体科技有限公司 一种带有清理结构的半导体晶圆测试台及方法
CN119458049A (zh) * 2024-12-02 2025-02-18 西安奕斯伟材料科技股份有限公司 倒角加工装置和倒角加工方法

Also Published As

Publication number Publication date
TWI362064B (en) 2012-04-11
US20080216867A1 (en) 2008-09-11
US20090038642A1 (en) 2009-02-12
WO2006116263A1 (en) 2006-11-02
US20060243304A1 (en) 2006-11-02
TW200731367A (en) 2007-08-16
KR20080005974A (ko) 2008-01-15
JP2008539594A (ja) 2008-11-13

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