KR20080005974A - 기판의 에지를 세정하기 위한 방법 및 장치 - Google Patents

기판의 에지를 세정하기 위한 방법 및 장치 Download PDF

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Publication number
KR20080005974A
KR20080005974A KR1020077027413A KR20077027413A KR20080005974A KR 20080005974 A KR20080005974 A KR 20080005974A KR 1020077027413 A KR1020077027413 A KR 1020077027413A KR 20077027413 A KR20077027413 A KR 20077027413A KR 20080005974 A KR20080005974 A KR 20080005974A
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KR
South Korea
Prior art keywords
substrate
rollers
edge
roller
cleaning
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1020077027413A
Other languages
English (en)
Korean (ko)
Inventor
웨이-융 후
도날드 제이. 케이. 올가도
호-선 신
리앙-유 첸
Original Assignee
어플라이드 머티어리얼스, 인코포레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 어플라이드 머티어리얼스, 인코포레이티드 filed Critical 어플라이드 머티어리얼스, 인코포레이티드
Publication of KR20080005974A publication Critical patent/KR20080005974A/ko
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/30—Cleaning by methods involving the use of tools by movement of cleaning members over a surface
    • B08B1/32—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members
    • B08B1/34—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members rotating about an axis parallel to the surface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Cleaning In General (AREA)
KR1020077027413A 2005-04-25 2006-04-24 기판의 에지를 세정하기 위한 방법 및 장치 Ceased KR20080005974A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US67491005P 2005-04-25 2005-04-25
US60/674,910 2005-04-25

Publications (1)

Publication Number Publication Date
KR20080005974A true KR20080005974A (ko) 2008-01-15

Family

ID=36694310

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020077027413A Ceased KR20080005974A (ko) 2005-04-25 2006-04-24 기판의 에지를 세정하기 위한 방법 및 장치

Country Status (6)

Country Link
US (3) US20060243304A1 (enExample)
JP (1) JP2008539594A (enExample)
KR (1) KR20080005974A (enExample)
CN (1) CN101164141A (enExample)
TW (1) TWI362064B (enExample)
WO (1) WO2006116263A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
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KR101415983B1 (ko) * 2012-12-24 2014-07-08 주식회사 케이씨텍 웨이퍼 세정장치

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US7823241B2 (en) 2007-03-22 2010-11-02 Taiwan Semiconductor Manufacturing Co., Ltd. System for cleaning a wafer
JP2008306180A (ja) * 2007-05-21 2008-12-18 Applied Materials Inc 膜の基板斜面及び縁部の研磨プロファイルを制御する方法及び装置
US8142260B2 (en) 2007-05-21 2012-03-27 Applied Materials, Inc. Methods and apparatus for removal of films and flakes from the edge of both sides of a substrate using backing pads
JP2008288600A (ja) * 2007-05-21 2008-11-27 Applied Materials Inc 基板の縁部除外領域の大きさを制御する方法及び装置
JP2008284683A (ja) * 2007-05-21 2008-11-27 Applied Materials Inc 基板の振動により基板のノッチを研磨する方法及び装置
TW200908122A (en) * 2007-05-21 2009-02-16 Applied Materials Inc Methods and apparatus for using a rolling backing pad for substrate polishing
JP2009119537A (ja) * 2007-11-12 2009-06-04 Toshiba Corp 基板処理方法及び基板処理装置
TWI433251B (zh) * 2007-11-23 2014-04-01 Lam Res Corp 用於濕處理晶圓狀物件之周邊區域的裝置及方法
US20100105291A1 (en) * 2008-10-24 2010-04-29 Applied Materials, Inc. Methods and apparatus for polishing a notch of a substrate
US20100105299A1 (en) * 2008-10-24 2010-04-29 Applied Materials, Inc. Methods and apparatus for polishing an edge and/or notch of a substrate
JP5302781B2 (ja) * 2009-06-04 2013-10-02 東京エレクトロン株式会社 基板液処理装置及び基板液処理方法並びに基板液処理プログラムを格納した記憶媒体
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JP2012094602A (ja) * 2010-10-25 2012-05-17 Tokyo Electron Ltd ブラシ、基板処理装置および基板処理方法。
US20130111678A1 (en) * 2011-11-08 2013-05-09 Applied Materials, Inc. Brush box module for chemical mechanical polishing cleaner
KR20130090209A (ko) * 2012-02-03 2013-08-13 삼성전자주식회사 기판처리장치 및 기판처리방법
US9613845B2 (en) 2014-01-17 2017-04-04 Taiwan Semiconductor Manufacturing Company, Ltd. Immersion de-taping
JP6461748B2 (ja) * 2015-08-25 2019-01-30 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
CN108723972B (zh) * 2017-04-20 2020-09-22 上海新昇半导体科技有限公司 基于伯努利原理的边缘研磨基座、边缘研磨系统及方法
US11551940B2 (en) * 2018-12-25 2023-01-10 Xia Tai Xin Semiconductor (Qing Dao) Ltd. Roller for cleaning wafer and cleaning apparatus having the same
CN109571232B (zh) * 2018-12-28 2020-05-19 西安奕斯伟硅片技术有限公司 晶圆研磨方法及其研磨系统
DE102020132780A1 (de) * 2020-05-28 2021-12-02 Taiwan Semiconductor Manufacturing Co., Ltd. Reinigungsverfahren für fotomasken und apparat dafür
US20230411227A1 (en) * 2022-06-17 2023-12-21 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor processing tool and methods of operation
CN116153803B (zh) * 2023-04-23 2023-07-14 苏州晶睿半导体科技有限公司 一种带有清理结构的半导体晶圆测试台及方法
CN119458049A (zh) * 2024-12-02 2025-02-18 西安奕斯伟材料科技股份有限公司 倒角加工装置和倒角加工方法

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101415983B1 (ko) * 2012-12-24 2014-07-08 주식회사 케이씨텍 웨이퍼 세정장치

Also Published As

Publication number Publication date
TWI362064B (en) 2012-04-11
CN101164141A (zh) 2008-04-16
US20080216867A1 (en) 2008-09-11
US20090038642A1 (en) 2009-02-12
WO2006116263A1 (en) 2006-11-02
US20060243304A1 (en) 2006-11-02
TW200731367A (en) 2007-08-16
JP2008539594A (ja) 2008-11-13

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