JP2008198667A5 - - Google Patents

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Publication number
JP2008198667A5
JP2008198667A5 JP2007029787A JP2007029787A JP2008198667A5 JP 2008198667 A5 JP2008198667 A5 JP 2008198667A5 JP 2007029787 A JP2007029787 A JP 2007029787A JP 2007029787 A JP2007029787 A JP 2007029787A JP 2008198667 A5 JP2008198667 A5 JP 2008198667A5
Authority
JP
Japan
Prior art keywords
support device
axis
wafer
rotating body
roller
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2007029787A
Other languages
English (en)
Japanese (ja)
Other versions
JP2008198667A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2007029787A priority Critical patent/JP2008198667A/ja
Priority claimed from JP2007029787A external-priority patent/JP2008198667A/ja
Priority to US12/028,225 priority patent/US20080190451A1/en
Publication of JP2008198667A publication Critical patent/JP2008198667A/ja
Publication of JP2008198667A5 publication Critical patent/JP2008198667A5/ja
Pending legal-status Critical Current

Links

JP2007029787A 2007-02-08 2007-02-08 半導体製造装置及び半導体装置の製造方法 Pending JP2008198667A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2007029787A JP2008198667A (ja) 2007-02-08 2007-02-08 半導体製造装置及び半導体装置の製造方法
US12/028,225 US20080190451A1 (en) 2007-02-08 2008-02-08 Semiconductor manufacturing apparatus and method for manufacturing semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007029787A JP2008198667A (ja) 2007-02-08 2007-02-08 半導体製造装置及び半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JP2008198667A JP2008198667A (ja) 2008-08-28
JP2008198667A5 true JP2008198667A5 (enExample) 2010-03-04

Family

ID=39684794

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007029787A Pending JP2008198667A (ja) 2007-02-08 2007-02-08 半導体製造装置及び半導体装置の製造方法

Country Status (2)

Country Link
US (1) US20080190451A1 (enExample)
JP (1) JP2008198667A (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8801865B2 (en) * 2007-11-23 2014-08-12 Lam Research Ag Device and process for wet treating a peripheral area of a wafer-shaped article
US8844546B2 (en) * 2008-10-01 2014-09-30 Applied Materials, Inc. Apparatus and method for cleaning semiconductor substrate using pressurized fluid
JP5535687B2 (ja) * 2010-03-01 2014-07-02 株式会社荏原製作所 基板洗浄方法及び基板洗浄装置
CN102909185A (zh) * 2012-10-26 2013-02-06 世成电子(深圳)有限公司 一种清洁机
KR101415983B1 (ko) 2012-12-24 2014-07-08 주식회사 케이씨텍 웨이퍼 세정장치

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2869835B2 (ja) * 1992-05-18 1999-03-10 東京エレクトロン株式会社 処理装置
JP3549141B2 (ja) * 1997-04-21 2004-08-04 大日本スクリーン製造株式会社 基板処理装置および基板保持装置
US6293855B1 (en) * 1998-03-09 2001-09-25 Ebara Corporation Polishing apparatus
JP2000176386A (ja) * 1998-12-16 2000-06-27 Ebara Corp 基板洗浄装置
JP2001179188A (ja) * 1999-12-22 2001-07-03 Shimada Phys & Chem Ind Co Ltd ディスク洗浄方法及びそれを使用したディスク洗浄装置
US6622334B1 (en) * 2000-03-29 2003-09-23 International Business Machines Corporation Wafer edge cleaning utilizing polish pad material
JP2003031541A (ja) * 2001-07-18 2003-01-31 Speedfam Co Ltd 洗浄装置
US6932558B2 (en) * 2002-07-03 2005-08-23 Kung Chris Wu Wafer aligner

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