JP2008198667A - 半導体製造装置及び半導体装置の製造方法 - Google Patents

半導体製造装置及び半導体装置の製造方法 Download PDF

Info

Publication number
JP2008198667A
JP2008198667A JP2007029787A JP2007029787A JP2008198667A JP 2008198667 A JP2008198667 A JP 2008198667A JP 2007029787 A JP2007029787 A JP 2007029787A JP 2007029787 A JP2007029787 A JP 2007029787A JP 2008198667 A JP2008198667 A JP 2008198667A
Authority
JP
Japan
Prior art keywords
support device
wafer
axis
brush
roller
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2007029787A
Other languages
English (en)
Japanese (ja)
Other versions
JP2008198667A5 (enExample
Inventor
Masanori Goto
正憲 後藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Electronics Corp
Original Assignee
NEC Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Electronics Corp filed Critical NEC Electronics Corp
Priority to JP2007029787A priority Critical patent/JP2008198667A/ja
Priority to US12/028,225 priority patent/US20080190451A1/en
Publication of JP2008198667A publication Critical patent/JP2008198667A/ja
Publication of JP2008198667A5 publication Critical patent/JP2008198667A5/ja
Pending legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02057—Cleaning during device manufacture
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/30—Cleaning by methods involving the use of tools by movement of cleaning members over a surface
    • B08B1/32—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members
    • B08B1/34—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members rotating about an axis parallel to the surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/30—Cleaning by methods involving the use of tools by movement of cleaning members over a surface
    • B08B1/32—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members
    • B08B1/36—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members rotating about an axis orthogonal to the surface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02082—Cleaning product to be cleaned
    • H01L21/0209—Cleaning of wafer backside
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2007029787A 2007-02-08 2007-02-08 半導体製造装置及び半導体装置の製造方法 Pending JP2008198667A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2007029787A JP2008198667A (ja) 2007-02-08 2007-02-08 半導体製造装置及び半導体装置の製造方法
US12/028,225 US20080190451A1 (en) 2007-02-08 2008-02-08 Semiconductor manufacturing apparatus and method for manufacturing semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007029787A JP2008198667A (ja) 2007-02-08 2007-02-08 半導体製造装置及び半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JP2008198667A true JP2008198667A (ja) 2008-08-28
JP2008198667A5 JP2008198667A5 (enExample) 2010-03-04

Family

ID=39684794

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007029787A Pending JP2008198667A (ja) 2007-02-08 2007-02-08 半導体製造装置及び半導体装置の製造方法

Country Status (2)

Country Link
US (1) US20080190451A1 (enExample)
JP (1) JP2008198667A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101415983B1 (ko) 2012-12-24 2014-07-08 주식회사 케이씨텍 웨이퍼 세정장치

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5336506B2 (ja) * 2007-11-23 2013-11-06 ラム・リサーチ・アーゲー ウエハ状物品の周縁領域をウェット処理するための装置及び方法
US8844546B2 (en) * 2008-10-01 2014-09-30 Applied Materials, Inc. Apparatus and method for cleaning semiconductor substrate using pressurized fluid
JP5535687B2 (ja) * 2010-03-01 2014-07-02 株式会社荏原製作所 基板洗浄方法及び基板洗浄装置
CN102909185A (zh) * 2012-10-26 2013-02-06 世成电子(深圳)有限公司 一种清洁机

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0637077A (ja) * 1992-05-18 1994-02-10 Tokyo Electron Ltd 処理装置
JP2000176386A (ja) * 1998-12-16 2000-06-27 Ebara Corp 基板洗浄装置
JP2001179188A (ja) * 1999-12-22 2001-07-03 Shimada Phys & Chem Ind Co Ltd ディスク洗浄方法及びそれを使用したディスク洗浄装置
JP2003031541A (ja) * 2001-07-18 2003-01-31 Speedfam Co Ltd 洗浄装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3549141B2 (ja) * 1997-04-21 2004-08-04 大日本スクリーン製造株式会社 基板処理装置および基板保持装置
US6293855B1 (en) * 1998-03-09 2001-09-25 Ebara Corporation Polishing apparatus
US6622334B1 (en) * 2000-03-29 2003-09-23 International Business Machines Corporation Wafer edge cleaning utilizing polish pad material
US6932558B2 (en) * 2002-07-03 2005-08-23 Kung Chris Wu Wafer aligner

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0637077A (ja) * 1992-05-18 1994-02-10 Tokyo Electron Ltd 処理装置
JP2000176386A (ja) * 1998-12-16 2000-06-27 Ebara Corp 基板洗浄装置
JP2001179188A (ja) * 1999-12-22 2001-07-03 Shimada Phys & Chem Ind Co Ltd ディスク洗浄方法及びそれを使用したディスク洗浄装置
JP2003031541A (ja) * 2001-07-18 2003-01-31 Speedfam Co Ltd 洗浄装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101415983B1 (ko) 2012-12-24 2014-07-08 주식회사 케이씨텍 웨이퍼 세정장치

Also Published As

Publication number Publication date
US20080190451A1 (en) 2008-08-14

Similar Documents

Publication Publication Date Title
JP3976718B2 (ja) ウェーハ乾燥装置
TWI865303B (zh) 基板處理裝置
US9050634B2 (en) Substrate processing apparatus
TWI556881B (zh) 基板處理裝置及基板處理方法
JP2001060571A (ja) ケミカルメカニカルポリッシャ用のウェーハ搬送ステーション
TWI593040B (zh) 基板處理方法、基板處理系統及記憶有基板處理程式之電腦可讀取記憶媒體
US10926376B2 (en) Method and apparatus for polishing a substrate, and method for processing a substrate
JP2013171918A (ja) 基板回転保持装置および基板処理装置
US6560809B1 (en) Substrate cleaning apparatus
JP2008198667A (ja) 半導体製造装置及び半導体装置の製造方法
WO2019102868A1 (ja) 基板搬送装置、基板処理システム、基板処理方法及びコンピュータ記憶媒体
KR20190074951A (ko) 기판 처리 장치, 기판 처리 방법, 프로그램을 저장한 기억 매체
CN217306451U (zh) 基板清洗装置
US8635968B2 (en) Substrate processing apparatus and substrate processing method
KR102128176B1 (ko) 기판 처리 장치 및 기판 처리 방법
JP2017108113A (ja) 基板処理装置および基板処理方法ならびに基板処理装置の制御プログラム
CN111566784B (zh) 清洗装置、清洗方法以及计算机存储介质
JP6625461B2 (ja) 研磨装置
JP2008198667A5 (enExample)
US12023779B2 (en) Post-chemical mechanical polishing brush cleaning box
JP5241317B2 (ja) クリーニング装置
JP3964517B2 (ja) 洗浄装置とその方法
CN100362629C (zh) 半导体晶片的清洗方法
JPH06163491A (ja) 半導体基板の洗浄方法および洗浄装置
JP3179571B2 (ja) ウェハ貼付プレートの洗浄および移送装置

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20100115

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20100115

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20110624

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20110628

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20111205