JP6232515B2 - 基板保持装置 - Google Patents
基板保持装置 Download PDFInfo
- Publication number
- JP6232515B2 JP6232515B2 JP2017115013A JP2017115013A JP6232515B2 JP 6232515 B2 JP6232515 B2 JP 6232515B2 JP 2017115013 A JP2017115013 A JP 2017115013A JP 2017115013 A JP2017115013 A JP 2017115013A JP 6232515 B2 JP6232515 B2 JP 6232515B2
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- JP
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- Prior art keywords
- substrate
- wafer
- support
- chucks
- chuck
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Description
本発明の好ましい態様は、前記複数のチャックと前記複数の支持部材は、前記基板の周方向に沿って交互に配列されていることを特徴とする。
上記参考例の好ましい態様は、前記少なくとも1つの支持部材は、前記基板の中心まわりに配置された複数の支持部材であることを特徴とする。
上記参考例の好ましい態様は、前記複数のチャックと前記複数の支持部材は、前記基板の周方向に沿って交互に配列されていることを特徴とする。
上記参考例の好ましい態様は、前記複数のチャックおよび前記支持部材を前記基板の軸心まわりに回転させる回転装置をさらに備えたことを特徴とする。
本発明の一参考例は、上記基板保持装置と、前記基板保持装置に保持された基板の表面に洗浄液を供給する洗浄液供給ノズルと、前記洗浄液の存在下で前記基板の表面をこすり洗いする洗浄具とを備えたことを特徴とする基板洗浄装置である。
2 鉛直軸
5 支持ピン(支持部材)
7 駆動装置
10 回転台
11 回転軸
14 回転装置
15 モータ
16 ベルト
20 ジョイント
21 支軸
22 支柱
25 基板支持面
28 第1のばね
29 第1の押し上げ部材
30 昇降台
31 エアシリンダ(アクチュエータ)
50 上下動ピン
51 リンク機構
54 第2のばね
55 第2の押し上げ部材
61 リンク
62 ジョイント
63 ジョイント
65 支軸
67 支柱
70 洗浄液供給ノズル
71 洗浄具
72 アーム
100 ハンド
p1,p2 プーリー
Claims (2)
- 基板の周縁部を保持する複数のチャックと、
前記基板の下方に配置された、前記基板の中心まわりに配置された複数の支持部材と、
前記複数のチャックおよび前記複数の支持部材を支持する回転台と、
前記複数のチャックを前記基板の周縁部に接触するまで移動させるとともに前記複数の支持部材を上昇させて前記基板の下面に接触させ、さらに前記複数のチャックを前記基板の周縁部から離れる方向に移動させるとともに前記複数の支持部材を下降させて前記基板の下面から離間させる駆動装置とを備え、
前記複数のチャックおよび前記複数の支持部材は前記回転台と一体に回転可能であり、
前記複数の支持部材は、前記回転台に対して上下動可能であることを特徴とする基板保持装置。 - 前記複数のチャックと前記複数の支持部材は、前記基板の周方向に沿って交互に配列されていることを特徴とする請求項1に記載の基板保持装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017115013A JP6232515B2 (ja) | 2013-06-24 | 2017-06-12 | 基板保持装置 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013131409A JP6181438B2 (ja) | 2013-06-24 | 2013-06-24 | 基板保持装置および基板洗浄装置 |
JP2017115013A JP6232515B2 (ja) | 2013-06-24 | 2017-06-12 | 基板保持装置 |
Related Parent Applications (1)
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JP2013131409A Division JP6181438B2 (ja) | 2013-06-24 | 2013-06-24 | 基板保持装置および基板洗浄装置 |
Publications (2)
Publication Number | Publication Date |
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JP2017163162A JP2017163162A (ja) | 2017-09-14 |
JP6232515B2 true JP6232515B2 (ja) | 2017-11-15 |
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JP2013131409A Active JP6181438B2 (ja) | 2013-06-24 | 2013-06-24 | 基板保持装置および基板洗浄装置 |
JP2017115013A Active JP6232515B2 (ja) | 2013-06-24 | 2017-06-12 | 基板保持装置 |
Family Applications Before (1)
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JP2013131409A Active JP6181438B2 (ja) | 2013-06-24 | 2013-06-24 | 基板保持装置および基板洗浄装置 |
Country Status (5)
Country | Link |
---|---|
US (1) | US9558971B2 (ja) |
JP (2) | JP6181438B2 (ja) |
KR (1) | KR102169086B1 (ja) |
CN (1) | CN104241185B (ja) |
TW (2) | TWI631654B (ja) |
Families Citing this family (13)
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JP6335103B2 (ja) * | 2014-11-14 | 2018-05-30 | 株式会社荏原製作所 | 基板保持装置 |
JP6456712B2 (ja) * | 2015-02-16 | 2019-01-23 | 東京エレクトロン株式会社 | 基板保持機構及びこれを用いた基板処理装置 |
JP6461748B2 (ja) | 2015-08-25 | 2019-01-30 | 株式会社Screenホールディングス | 基板処理方法および基板処理装置 |
KR102615853B1 (ko) * | 2015-10-15 | 2023-12-21 | 어플라이드 머티어리얼스, 인코포레이티드 | 기판 캐리어 시스템 |
JP6777985B2 (ja) | 2015-11-19 | 2020-10-28 | 株式会社荏原製作所 | 基板保持装置 |
TWI705519B (zh) * | 2017-07-25 | 2020-09-21 | 日商Hoya股份有限公司 | 基板處理裝置、基板處理方法、光罩洗淨方法及光罩製造方法 |
JP6946151B2 (ja) * | 2017-11-13 | 2021-10-06 | 株式会社荏原製作所 | 基板保持装置および基板保持装置を備える基板処理装置 |
CN107937881B (zh) * | 2017-11-20 | 2019-07-05 | 深圳市华星光电半导体显示技术有限公司 | 基板夹紧装置 |
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JP7471170B2 (ja) * | 2020-08-03 | 2024-04-19 | 東京エレクトロン株式会社 | 基板処理方法、及び基板処理装置 |
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2013
- 2013-06-24 JP JP2013131409A patent/JP6181438B2/ja active Active
-
2014
- 2014-06-19 KR KR1020140074978A patent/KR102169086B1/ko active IP Right Grant
- 2014-06-19 US US14/309,287 patent/US9558971B2/en active Active
- 2014-06-20 TW TW103121316A patent/TWI631654B/zh active
- 2014-06-20 TW TW107121898A patent/TWI663687B/zh active
- 2014-06-20 CN CN201410280327.9A patent/CN104241185B/zh active Active
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- 2017-06-12 JP JP2017115013A patent/JP6232515B2/ja active Active
Also Published As
Publication number | Publication date |
---|---|
US20140373289A1 (en) | 2014-12-25 |
US9558971B2 (en) | 2017-01-31 |
CN104241185A (zh) | 2014-12-24 |
TWI663687B (zh) | 2019-06-21 |
TW201838083A (zh) | 2018-10-16 |
TW201505124A (zh) | 2015-02-01 |
KR102169086B1 (ko) | 2020-10-22 |
JP2017163162A (ja) | 2017-09-14 |
TWI631654B (zh) | 2018-08-01 |
JP2015005689A (ja) | 2015-01-08 |
KR20150000417A (ko) | 2015-01-02 |
JP6181438B2 (ja) | 2017-08-16 |
CN104241185B (zh) | 2018-06-01 |
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