JP6018404B2 - 基板処理装置 - Google Patents
基板処理装置 Download PDFInfo
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- JP6018404B2 JP6018404B2 JP2012099340A JP2012099340A JP6018404B2 JP 6018404 B2 JP6018404 B2 JP 6018404B2 JP 2012099340 A JP2012099340 A JP 2012099340A JP 2012099340 A JP2012099340 A JP 2012099340A JP 6018404 B2 JP6018404 B2 JP 6018404B2
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- substrate
- chuck
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- 239000000758 substrate Substances 0.000 title claims description 252
- 230000002093 peripheral effect Effects 0.000 claims description 48
- 230000007246 mechanism Effects 0.000 claims description 36
- 210000000078 claw Anatomy 0.000 claims description 25
- 230000032258 transport Effects 0.000 claims description 2
- 238000004140 cleaning Methods 0.000 description 45
- 239000007788 liquid Substances 0.000 description 20
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 18
- 238000003825 pressing Methods 0.000 description 11
- 239000004065 semiconductor Substances 0.000 description 10
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 238000005498 polishing Methods 0.000 description 3
- 239000000126 substance Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000009931 harmful effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23B—TURNING; BORING
- B23B31/00—Chucks; Expansion mandrels; Adaptations thereof for remote control
- B23B31/02—Chucks
- B23B31/10—Chucks characterised by the retaining or gripping devices or their immediate operating means
- B23B31/12—Chucks with simultaneously-acting jaws, whether or not also individually adjustable
- B23B31/1261—Chucks with simultaneously-acting jaws, whether or not also individually adjustable pivotally movable in a radial plane
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T279/00—Chucks or sockets
- Y10T279/18—Pivoted jaw
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T279/00—Chucks or sockets
- Y10T279/19—Radially reciprocating jaws
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T279/00—Chucks or sockets
- Y10T279/26—Chucks or sockets with centering means
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Description
直径300mmの基板を処理する場合、第1ガイド面の上端を円弧状に結んで形成される開口(すくい口)内径は、例えば305.785mmである。
直径300mmの基板を処理する場合、ガイド部の基板載置部上面からの高さは、例えば2.5mmである。
前記第2ガイド面は、前記チャック爪が内側に閉じる方向に回動するときの前記チャック爪の先端よりも下方に位置する。
A=299.8+((1.23×2)2+(0.5×2)2+(0.75×2)2)1/2
そして、許容値Bを2.965mm(302.82+2.965=305.785)としている。この許容値Bは、任意に設定される。
12 アーム
14a 基板ステージ
16b 基板チャック機構
24 揺動アーム
26 ペンシル型洗浄具
30 チャック本体
32,56 基板載置部
34b ガイド部
36b ガイド面
40 チャック爪
48 開放ピン
50 コイルばね
52a 第1ガイド面
52b 第2ガイド面
Claims (7)
- 基板の周縁部を把持し基板を回転させて処理する基板処理装置において、
放射状に延びる複数のアームを有する回転自在な基板ステージと、
前記アームの先端にそれぞれ固定されて基板の周縁部を把持する基板チャック機構とを備え、
前記基板チャック機構は、
基板の周縁部を載置する基板載置部と該基板載置部に基板を載置する時に基板の外周端面をガイドして該基板の位置決めを行うガイド面とを有するチャック本体と、
前記チャック本体に回動自在に支承され、内側に閉じる方向に回動して、基板の周縁部を前記基板載置部との間で挟持するチャック爪とを有し、
前記ガイド面は、前記基板載置部に基板を載置保持する時に自重で下降する基板の外周端面をガイドする第1ガイド面と、チャック爪を内側に閉じる方向に回動させて基板周縁部を前記基板載置部との間で挟持する時に該チャック爪に接触しつつ移動する基板の外周端面をガイドする第2ガイド面とを有し、
前記第2ガイド面の傾斜は前記第1ガイド面の傾斜に比べて緩いことを特徴とする基板処理装置。 - 前記第1ガイド面の上端を円弧状に結んで形成される開口内径は、処理される基板の外径に、基板をロボットハンドで保持して搬送するロボットの位置決め精度の最大値、ロボットハンド内での基板のずれ範囲の最大値、及び作業者のティーチング誤差の合計を加えた値に許容値を加えた値に設定されていることを特徴とする請求項1に記載の基板処理装置。
- 前記ガイド部の前記基板載置部上面からの高さは、0.5mm〜8.5mmであることを特徴とする請求項1または2に記載の基板処理装置。
- 前記アームの数を8以上としたことを特徴とする請求項1乃至3のいずれか一項に記載の基板処理装置。
- 前記基板載置部をリング状に連続させたことを特徴とする請求項1乃至4のいずれか一項に記載の基板処理装置。
- 前記リング状に連続した基板載置部の一部に、ロボットハンドを通過させる切欠きを設けたことを特徴とする請求項5に記載の基板処理装置。
- 前記第2ガイド面は、前記チャック爪が内側に閉じる方向に回動するときの前記チャック爪の先端よりも下方に位置することを特徴とする請求項1乃至6のいずれか一項に記載の基板処理装置。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012099340A JP6018404B2 (ja) | 2012-04-25 | 2012-04-25 | 基板処理装置 |
TW102114334A TWI596687B (zh) | 2012-04-25 | 2013-04-23 | Substrate processing apparatus |
KR1020130045495A KR102094281B1 (ko) | 2012-04-25 | 2013-04-24 | 기판 처리 장치 |
US13/869,849 US9472441B2 (en) | 2012-04-25 | 2013-04-24 | Substrate processing apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012099340A JP6018404B2 (ja) | 2012-04-25 | 2012-04-25 | 基板処理装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2013229409A JP2013229409A (ja) | 2013-11-07 |
JP6018404B2 true JP6018404B2 (ja) | 2016-11-02 |
Family
ID=49669289
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012099340A Active JP6018404B2 (ja) | 2012-04-25 | 2012-04-25 | 基板処理装置 |
Country Status (4)
Country | Link |
---|---|
US (1) | US9472441B2 (ja) |
JP (1) | JP6018404B2 (ja) |
KR (1) | KR102094281B1 (ja) |
TW (1) | TWI596687B (ja) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5712782B2 (ja) * | 2011-05-13 | 2015-05-07 | 株式会社Sumco | エピタキシャルウェーハ成長装置用サセプタサポートシャフトおよびエピタキシャル成長装置 |
JP6181438B2 (ja) | 2013-06-24 | 2017-08-16 | 株式会社荏原製作所 | 基板保持装置および基板洗浄装置 |
JP6331189B2 (ja) * | 2014-03-07 | 2018-05-30 | 株式会社Screenホールディングス | 基板処理装置 |
JP6335103B2 (ja) * | 2014-11-14 | 2018-05-30 | 株式会社荏原製作所 | 基板保持装置 |
JP6416723B2 (ja) * | 2014-11-21 | 2018-10-31 | 東京エレクトロン株式会社 | 基板処理システム |
US10276425B2 (en) * | 2014-11-21 | 2019-04-30 | Tokyo Electron Limited | Substrate processing system |
JP6456712B2 (ja) | 2015-02-16 | 2019-01-23 | 東京エレクトロン株式会社 | 基板保持機構及びこれを用いた基板処理装置 |
US9618857B2 (en) * | 2015-02-28 | 2017-04-11 | Kla-Tencor Corporation | End effectors and reticle handling at a high throughput |
JP6946151B2 (ja) * | 2017-11-13 | 2021-10-06 | 株式会社荏原製作所 | 基板保持装置および基板保持装置を備える基板処理装置 |
KR102564113B1 (ko) * | 2018-09-05 | 2023-08-07 | 주식회사 케이씨텍 | 기판 처리 장치 |
WO2021133436A1 (en) * | 2019-12-26 | 2021-07-01 | Zeng An Andrew | Tool architecture for wafer geometry measurement in semiconductor industry |
WO2023037424A1 (ja) * | 2021-09-08 | 2023-03-16 | 株式会社日立ハイテク | ウェハ検査装置 |
US20230390898A1 (en) * | 2022-06-07 | 2023-12-07 | Ebara Corporation | Substrate clamping apparatus |
CN115472553B (zh) * | 2022-11-11 | 2023-05-02 | 苏州智程半导体科技股份有限公司 | 一种半导体晶圆刻蚀或清洗的夹定装置 |
Family Cites Families (22)
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JPS512322A (ja) | 1974-05-20 | 1976-01-09 | Matsushita Electric Ind Co Ltd | Seishigahosojushinsochi |
JP3625331B2 (ja) | 1995-01-19 | 2005-03-02 | 東京エレクトロン株式会社 | 洗浄装置および洗浄方法 |
JPH1059540A (ja) * | 1996-05-13 | 1998-03-03 | Ebara Corp | 基板把持装置 |
US5775000A (en) * | 1996-05-13 | 1998-07-07 | Ebara Corporation | Substrate gripper device for spin drying |
JP3512322B2 (ja) | 1997-12-15 | 2004-03-29 | 大日本スクリーン製造株式会社 | 枚葉式基板処理装置 |
US6167893B1 (en) * | 1999-02-09 | 2001-01-02 | Novellus Systems, Inc. | Dynamic chuck for semiconductor wafer or other substrate |
JP4488646B2 (ja) * | 2001-04-23 | 2010-06-23 | 株式会社トプコン | ウェーハ保持装置 |
KR100445259B1 (ko) * | 2001-11-27 | 2004-08-21 | 삼성전자주식회사 | 세정방법 및 이를 수행하기 위한 세정 장치 |
JP2003303871A (ja) * | 2002-04-11 | 2003-10-24 | Nisso Engineering Co Ltd | ウエハ保持装置及び保持方法 |
JP4275420B2 (ja) * | 2003-01-28 | 2009-06-10 | 大日本スクリーン製造株式会社 | 基板処理装置および基板処理方法 |
JP4037777B2 (ja) * | 2003-03-10 | 2008-01-23 | 東京エレクトロン株式会社 | 基板搬送装置 |
JP2004356517A (ja) * | 2003-05-30 | 2004-12-16 | Ebara Corp | 基板洗浄装置及び基板洗浄方法 |
JP4305749B2 (ja) * | 2003-10-02 | 2009-07-29 | 株式会社安川電機 | 基板保持装置 |
US20080110861A1 (en) * | 2004-02-24 | 2008-05-15 | Shinji Kajita | Substrate Processing Apparatus and Method |
KR100672937B1 (ko) * | 2004-07-19 | 2007-01-24 | 삼성전자주식회사 | 반도체 기판 처리 장치 |
JP4814731B2 (ja) * | 2006-08-30 | 2011-11-16 | 株式会社日立ハイテクノロジーズ | 基板保持装置、検査または処理の装置、基板保持方法、検査または処理の方法および検査装置 |
JP4920387B2 (ja) * | 2006-12-01 | 2012-04-18 | 信越半導体株式会社 | 基板収納容器 |
JP4825771B2 (ja) * | 2007-10-22 | 2011-11-30 | 信越ポリマー株式会社 | ウェーハ収納容器およびウェーハのハンドリング方法 |
US8118940B2 (en) * | 2008-02-07 | 2012-02-21 | Asm Japan K.K. | Clamping mechanism for semiconductor device |
JP2010021257A (ja) * | 2008-07-09 | 2010-01-28 | Hitachi High-Tech Control Systems Corp | ウェーハアライメント装置及びそれを用いたウェーハ搬送装置 |
JP2010258170A (ja) * | 2009-04-23 | 2010-11-11 | Tokyo Electron Ltd | 基板保持部材、基板搬送アーム及び基板搬送装置 |
JP6053528B2 (ja) * | 2013-01-11 | 2016-12-27 | 株式会社荏原製作所 | 基板把持装置 |
-
2012
- 2012-04-25 JP JP2012099340A patent/JP6018404B2/ja active Active
-
2013
- 2013-04-23 TW TW102114334A patent/TWI596687B/zh active
- 2013-04-24 KR KR1020130045495A patent/KR102094281B1/ko active IP Right Grant
- 2013-04-24 US US13/869,849 patent/US9472441B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
TW201351541A (zh) | 2013-12-16 |
US9472441B2 (en) | 2016-10-18 |
JP2013229409A (ja) | 2013-11-07 |
KR20130120410A (ko) | 2013-11-04 |
KR102094281B1 (ko) | 2020-03-30 |
TWI596687B (zh) | 2017-08-21 |
US20130320636A1 (en) | 2013-12-05 |
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