JP2010258170A - 基板保持部材、基板搬送アーム及び基板搬送装置 - Google Patents
基板保持部材、基板搬送アーム及び基板搬送装置 Download PDFInfo
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- JP2010258170A JP2010258170A JP2009105649A JP2009105649A JP2010258170A JP 2010258170 A JP2010258170 A JP 2010258170A JP 2009105649 A JP2009105649 A JP 2009105649A JP 2009105649 A JP2009105649 A JP 2009105649A JP 2010258170 A JP2010258170 A JP 2010258170A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J11/00—Manipulators not otherwise provided for
- B25J11/0095—Manipulators transporting wafers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J15/00—Gripping heads and other end effectors
- B25J15/009—Gripping heads and other end effectors with pins for accurately positioning the object on the gripping head
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68735—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge profile or support profile
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/6875—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/141—Associated with semiconductor wafer handling includes means for gripping wafer
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- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Manipulator (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Abstract
【解決手段】基板搬送装置の基板搬送アームに取り付けられ、基板の周縁を載置して基板を保持する基板保持部材4であって、基板の裏面に当接して基板を保持する裏面保持部5と、基板の端面に当接する端面当接部6とを有する。端面当接部6は、R形状を有し、基板の端面に当接して基板のずれを規制するR形状部8と、R形状部8の上方側に設けられ、庇状に形成されたオーバーハング部81とを含む。
【選択図】図5
Description
(第1の実施の形態)
始めに、図1から図14を参照し、第1の実施の形態に係る基板搬送装置、基板搬送アーム及び基板保持部材について説明する。
次に、塗布膜形成装置におけるウェハWの流れについて説明する。先ず外部からキャリアCがキャリア載置部21に搬入され、受け渡し手段22によりキャリアC内からウェハWが取り出される。ウェハWは、受け渡し手段22から棚ユニットU1の受け渡しユニット28を介して基板搬送装置3に受け渡され、所定のユニットへ順次搬送される。例えば洗浄ユニット25にて所定の洗浄処理が行われ、加熱ユニット26の一つにて加熱乾燥が行われた後、冷却ユニット27にて所定の温度に調整され、塗布ユニット23にて塗布膜の成分が溶剤に溶解されたレジスト液の塗布処理が行われる。
(第1の実施の形態の変形例)
次に、図15を参照し、第1の実施の形態に係る基板保持部材の変形例について説明する。
(第2の実施の形態)
次に、図16から図18を参照し、第2の実施の形態に係る基板搬送装置、基板搬送アーム及び基板保持部材について説明する。
(第2の実施の形態の変形例)
次に、図19を参照し、第2の実施の形態に係る基板保持部材の変形例について説明する。
(第3の実施の形態)
次に、図20から図22を参照し、第3の実施の形態に係る基板搬送装置、基板搬送アーム及び基板保持部材について説明する。
(第3の実施の形態の第1の変形例)
次に、図23を参照し、第3の実施の形態に係る基板保持部材の第1の変形例について説明する。
(第3の実施の形態の第2の変形例)
次に、図24を参照し、第3の実施の形態に係る基板保持部材の第2の変形例について説明する。
22 受け渡し手段
23 塗布ユニット
24 現像ユニット
25 洗浄ユニット
26 加熱ユニット
27 冷却ユニット
28 受け渡しユニット
29 受け渡し手段
3 基板搬送装置
30 内縁
31 基板搬送アーム
32 基台
32a 案内溝
33、34 案内レール
35、36 連結部材
37 回転駆動部
38 回転軸部
4、4a〜4d 基板保持部材
5、5d〜5f 裏面保持部
51 裏面保持部本体部
52、52d〜52f 当接部
6、6a〜6d 端面当接部
61、61a〜61d 規制部
62、62a〜62d 傾斜部
7 基板保持部材本体部
71 上面部
72 側面部
73 貫通孔
8 R形状部
81 オーバーハング部
A 付着物
B1 キャリアブロック
B2 処理部
B3 インターフェイス部
B4 露光装置
C キャリア
D1、D2 水平距離
H1、H2 高さ
PF0、PF1、PF2 平面
PR 薬液
U1、U2 棚ユニット
W ウェハ
θ1、θ2、θ3、θ4 傾斜角
Claims (9)
- 基板搬送装置の基板搬送アームに取り付けられ、基板の周縁を載置して該基板を保持する基板保持部材であって、
基板の裏面に当接して該基板を保持する裏面保持部と、
基板の端面に当接する端面当接部と
を有し、
前記端面当接部は、
R形状を有し、前記基板の端面に当接して該基板のずれを規制するR形状部と、
前記R形状部の上方側に設けられ、庇状に形成されたオーバーハング部と
を含むことを特徴とする基板保持部材。 - 前記R形状部の前記基板の端面に当接する面が傾斜面であることを特徴とする請求項1に記載の基板保持部材。
- 基板搬送装置の基板搬送アームに取り付けられ、基板の周縁を載置して該基板を保持する基板保持部材であって、
基板の裏面に当接して該基板を保持する裏面保持部と、
基板の端面に当接する端面当接部と、
前記裏面保持部及び前記端面保持部が取り付けられ、一体的に前記基板搬送アームに取り付け可能な基板保持部材本体部と
を有し、
前記端面当接部は、載置する基板の半径方向に変形可能に、前記基板保持部材本体部に取り付けられることを特徴とする基板保持部材。 - 前記端面当接部の水平断面が薄肉形状に形成されていることを特徴とする請求項3に記載の基板保持部材。
- 前記端面当接部の水平断面がつづら折り状に形成されていることを特徴とする請求項3に記載の基板保持部材。
- 基板搬送装置の基板搬送アームに取り付けられ、基板の周縁を載置して該基板を保持する基板保持部材であって、
基板の裏面に当接して該基板を保持する裏面保持部と、
基板の端面に当接する端面当接部と
を有し、
前記裏面保持部は、載置する基板の半径方向に沿う縦断面形状が凸形状である当接部を有することを特徴とする基板保持部材。 - 前記裏面保持部は、載置する基板の半径方向に沿う縦断面形状が凸形状である当接部を複数有することを特徴とする請求項6に記載の基板保持部材。
- 請求項1から請求項7のいずれかに記載の基板保持部材が取り付けられた基板搬送アーム。
- 請求項8に記載の基板搬送アームを備えた基板搬送装置。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009105649A JP2010258170A (ja) | 2009-04-23 | 2009-04-23 | 基板保持部材、基板搬送アーム及び基板搬送装置 |
KR1020100029764A KR101528894B1 (ko) | 2009-04-23 | 2010-04-01 | 기판 보지 부재, 기판 반송 암 및 기판 반송 장치 |
TW099112733A TWI436446B (zh) | 2009-04-23 | 2010-04-22 | 基板保持構件、基板搬運臂及基板搬運裝置 |
CN201010167338.8A CN101872732B (zh) | 2009-04-23 | 2010-04-23 | 基板保持部件、基板搬送臂和基板搬送装置 |
Applications Claiming Priority (1)
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JP2009105649A JP2010258170A (ja) | 2009-04-23 | 2009-04-23 | 基板保持部材、基板搬送アーム及び基板搬送装置 |
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JP2012249532A Division JP5425998B2 (ja) | 2012-11-13 | 2012-11-13 | 基板保持部材、基板搬送アーム及び基板搬送装置 |
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JP2010258170A true JP2010258170A (ja) | 2010-11-11 |
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JP2009105649A Pending JP2010258170A (ja) | 2009-04-23 | 2009-04-23 | 基板保持部材、基板搬送アーム及び基板搬送装置 |
Country Status (4)
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---|---|
JP (1) | JP2010258170A (ja) |
KR (1) | KR101528894B1 (ja) |
CN (1) | CN101872732B (ja) |
TW (1) | TWI436446B (ja) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012156418A (ja) * | 2011-01-28 | 2012-08-16 | Lintec Corp | 板状部材の支持装置 |
JP2013229409A (ja) * | 2012-04-25 | 2013-11-07 | Ebara Corp | 基板処理装置 |
KR101380993B1 (ko) * | 2012-10-02 | 2014-04-04 | 쥬가이로 고교 가부시키가이샤 | 패널탑재용 랙 |
US8707893B2 (en) | 2010-11-29 | 2014-04-29 | Tokyo Electron Limited | Substrate treatment system, substrate treatment method, and non-transitory computer storage medium |
KR20140003992U (ko) | 2012-12-20 | 2014-06-30 | 도쿄엘렉트론가부시키가이샤 | 기판 유지 부재 |
JP2015126135A (ja) * | 2013-12-26 | 2015-07-06 | 川崎重工業株式会社 | エンドエフェクタおよび基板搬送ロボット |
KR200479599Y1 (ko) | 2011-05-11 | 2016-02-17 | 도쿄엘렉트론가부시키가이샤 | 기판 반송 암 |
WO2019008814A1 (ja) * | 2017-07-05 | 2019-01-10 | 川崎重工業株式会社 | 基板把持ハンド及びそれを備える基板搬送装置 |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI625814B (zh) * | 2012-07-27 | 2018-06-01 | 荏原製作所股份有限公司 | 工件搬送裝置 |
JP6535187B2 (ja) | 2015-03-10 | 2019-06-26 | 株式会社荏原製作所 | 基板搬送用ハンド |
JP6276317B2 (ja) * | 2016-03-31 | 2018-02-07 | 平田機工株式会社 | ハンドユニットおよび移載方法 |
CN106737619B (zh) * | 2016-12-27 | 2023-06-13 | 高维智控机器人科技(苏州)有限公司 | 机械手爪 |
AT16129U1 (de) * | 2017-11-14 | 2019-02-15 | Miba Gleitlager Austria Gmbh | Vorrichtung und Verfahren zur Montage von Buchsen auf Wellen |
CN111319981B (zh) * | 2020-03-17 | 2021-05-18 | 刘春宝 | 一种电路板电镀提升输送装置 |
EP4044217A1 (de) * | 2021-02-10 | 2022-08-17 | Siltronic AG | Verfahren und vorrichtung zum markieren von defekten auf einer oberfläche einer halbleiterscheibe |
CN113113340A (zh) * | 2021-03-30 | 2021-07-13 | 北京北方华创微电子装备有限公司 | 半导体设备的机械手 |
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KR20040008057A (ko) * | 2002-07-15 | 2004-01-28 | 삼성전자주식회사 | 웨이퍼 이송용 로봇암 |
-
2009
- 2009-04-23 JP JP2009105649A patent/JP2010258170A/ja active Pending
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2010
- 2010-04-01 KR KR1020100029764A patent/KR101528894B1/ko active IP Right Grant
- 2010-04-22 TW TW099112733A patent/TWI436446B/zh active
- 2010-04-23 CN CN201010167338.8A patent/CN101872732B/zh active Active
Patent Citations (4)
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JPH11243133A (ja) * | 1998-02-24 | 1999-09-07 | Tokyo Electron Ltd | 基板の保持装置 |
JP2003282670A (ja) * | 2002-03-27 | 2003-10-03 | Dainippon Screen Mfg Co Ltd | 基板保持アーム、基板搬送装置、基板処理装置および基板保持方法 |
JP2004172463A (ja) * | 2002-11-21 | 2004-06-17 | Kyocera Corp | ウェハ支持部材 |
JP2007067303A (ja) * | 2005-09-01 | 2007-03-15 | Tokyo Electron Ltd | 基板搬送装置、基板搬送方法及び塗布、現像装置 |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8707893B2 (en) | 2010-11-29 | 2014-04-29 | Tokyo Electron Limited | Substrate treatment system, substrate treatment method, and non-transitory computer storage medium |
JP2012156418A (ja) * | 2011-01-28 | 2012-08-16 | Lintec Corp | 板状部材の支持装置 |
KR200479599Y1 (ko) | 2011-05-11 | 2016-02-17 | 도쿄엘렉트론가부시키가이샤 | 기판 반송 암 |
JP2013229409A (ja) * | 2012-04-25 | 2013-11-07 | Ebara Corp | 基板処理装置 |
KR101380993B1 (ko) * | 2012-10-02 | 2014-04-04 | 쥬가이로 고교 가부시키가이샤 | 패널탑재용 랙 |
KR20140003992U (ko) | 2012-12-20 | 2014-06-30 | 도쿄엘렉트론가부시키가이샤 | 기판 유지 부재 |
JP2015126135A (ja) * | 2013-12-26 | 2015-07-06 | 川崎重工業株式会社 | エンドエフェクタおよび基板搬送ロボット |
WO2019008814A1 (ja) * | 2017-07-05 | 2019-01-10 | 川崎重工業株式会社 | 基板把持ハンド及びそれを備える基板搬送装置 |
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TW201110265A (en) | 2011-03-16 |
KR101528894B1 (ko) | 2015-06-15 |
CN101872732A (zh) | 2010-10-27 |
CN101872732B (zh) | 2015-02-18 |
KR20100117021A (ko) | 2010-11-02 |
TWI436446B (zh) | 2014-05-01 |
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