JP4880004B2 - 基板処理システム - Google Patents
基板処理システム Download PDFInfo
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- JP4880004B2 JP4880004B2 JP2009025719A JP2009025719A JP4880004B2 JP 4880004 B2 JP4880004 B2 JP 4880004B2 JP 2009025719 A JP2009025719 A JP 2009025719A JP 2009025719 A JP2009025719 A JP 2009025719A JP 4880004 B2 JP4880004 B2 JP 4880004B2
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- 238000012545 processing Methods 0.000 title claims description 256
- 239000000758 substrate Substances 0.000 title claims description 92
- 238000012546 transfer Methods 0.000 claims description 170
- 230000007246 mechanism Effects 0.000 claims description 97
- 238000010438 heat treatment Methods 0.000 claims description 74
- 239000007788 liquid Substances 0.000 claims description 29
- 230000032258 transport Effects 0.000 claims description 18
- 230000007723 transport mechanism Effects 0.000 claims description 13
- 235000012431 wafers Nutrition 0.000 description 251
- 238000000576 coating method Methods 0.000 description 46
- 239000011248 coating agent Substances 0.000 description 45
- 238000001816 cooling Methods 0.000 description 20
- 238000000034 method Methods 0.000 description 13
- 230000008569 process Effects 0.000 description 12
- 238000011161 development Methods 0.000 description 10
- 230000002093 peripheral effect Effects 0.000 description 8
- 230000003028 elevating effect Effects 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 238000000206 photolithography Methods 0.000 description 3
- 230000002209 hydrophobic effect Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 230000008901 benefit Effects 0.000 description 1
- 238000007726 management method Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
- G03F7/168—Finishing the coated layer, e.g. drying, baking, soaking
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70758—Drive means, e.g. actuators, motors for long- or short-stroke modules or fine or coarse driving
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67276—Production flow monitoring, e.g. for increasing throughput
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/6773—Conveying cassettes, containers or carriers
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Automation & Control Theory (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Description
10 カセットステーション
11 処理ステーション
13 インターフェイスステーション
20 カセット載置台
31 ウェハ搬送装置
40 第1のバッファ装置
41 第2のバッファ装置
42 ウェハ搬送装置
50〜54 レジスト塗布装置
55〜58 下部反射防止膜形成装置
60〜64 現像処理装置
65〜68 上部反射防止膜形成装置
70〜72 アドヒージョン装置
73〜78、80〜88、90〜98 熱処理装置
120 バッファ部
121 フレーム
122 保持部材
123 バッファ部移動機構
150 ウェハ搬送機構
151 搬送アーム
152 アーム部
154 吸着パッド
155 アーム移動機構
190 ウェハ搬送機構
191 搬送アーム
192 アーム部
194 保持部
195 アーム移動機構
C カセット
G1〜G5 第1〜第5の処理装置群
W ウェハ
Claims (13)
- 基板を収容するカセットとの間で基板の受け渡しを行うカセットステーションと、
前記カセットステーションに隣接して配置され、基板に所定の処理を行う処理装置を鉛直方向に多段に配置した複数の処理装置群を備える処理ステーションと、
前記処理ステーションで処理された基板を露光装置に受け渡し、露光処理後の基板を前記処理ステーションに受け渡すインターフェイスステーションと、を備え、
基板にレジスト膜を形成し露光処理された基板を現像処理してパターンを形成する基板の処理システムであって、
前記処理ステーションの複数の処理装置群は、基板に所定の液体を供給して処理を行う液処理装置が鉛直方向に多段に配置された液処理装置群と、基板に所定の温度で熱処理を行う熱処理装置が鉛直方向に多段に配置された熱処理装置群と、を有し、
前記処理ステーションは、前記液処理装置群と前記熱処理装置群との間に配置され、複数の基板を鉛直方向に多段に留置する2基のバッファ部と、前記各バッファ部を鉛直方向に移動させるバッファ部移動機構と、前記2基のバッファ部間で基板を搬送する搬送装置と、を有し、
前記処理装置は、当該処理装置と前記バッファ部との間で基板を搬送する搬送機構を有し、
前記搬送装置は、前記2基のバッファ部間で一度に複数の基板を搬送するために、基板を保持するアーム体を複数有することを特徴とする、基板処理システム。 - 前記バッファ部移動機構は、前記バッファ部の鉛直方向の中心軸周りに当該バッファ部を回転させることを特徴とする、請求項1に記載の基板処理システム。
- 前記カセットを基板処理システムの外部との間で搬入出する際に載置するカセット載置部と、
前記カセット載置部と前記バッファ部との間で基板を搬送する他の搬送装置と、を有することを特徴とする、請求項1又は2に記載の基板処理システム。 - 前記他の搬送装置は、複数の基板を保持可能であることを特徴とする、請求項3に記載の基板処理システム。
- 前記バッファ部は、内部に基板を保管するフレームと、前記フレームにおいて鉛直方向に所定の間隔で複数設けられ、基板を保持する保持部材と、を有することを特徴とする、請求項1〜4のいずれかに記載の基板処理システム。
- 前記バッファ部は、内部に基板を保管するフレームと、前記フレームにおいて鉛直方向に所定の間隔で複数設けられ、当該フレームの内部を複数に区画する平板状部材と、前記平板状部材の上面に設けられ、基板を保持する保持部材と、を有することを特徴とする、請求項1〜4のいずれかに記載の基板処理システム。
- 前記フレームは、側面が開口した円筒形状を有することを特徴とする、請求項5又は6に記載の基板処理システム。
- 前記フレームは、側面が開口した直方体形状を有することを特徴とする、請求項5又は6に記載の基板処理システム。
- 前記バッファ部は、鉛直方向に延伸する支持部材と、前記支持部材において鉛直方向に所定の間隔で設けられ、基板を保持する保持部材と、を有することを特徴とする、請求項1〜4のいずれかに記載の基板処理システム。
- 前記搬送機構は、一対のアーム部と、前記アーム部に設けられ、基板を保持する保持部とを備えた搬送アームと、前記一対のアーム部の間隔を調整すると共に、前記搬送アームを水平方向に移動させるアーム移動機構と、を有することを特徴とする、請求項1〜9のいずれかに記載の基板処理システム。
- 前記搬送機構は、基板の外周に適合する形状を有するアーム部と、前記アーム部に設けられ、基板を保持する保持部と、を備えた搬送アームと、前記搬送アームを水平方向に移動させるアーム移動機構と、を有することを特徴とする、請求項1〜9のいずれかに記載の基板処理システム。
- 前記アーム移動機構は、前記搬送アームを鉛直方向に移動させることを特徴とする、請求項10又は11に記載の基板処理システム。
- 前記搬送機構は、前記搬送アームを複数有することを特徴とする、請求項10〜12のいずれかに記載の基板処理システム。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
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JP2009025719A JP4880004B2 (ja) | 2009-02-06 | 2009-02-06 | 基板処理システム |
KR1020100010040A KR101452543B1 (ko) | 2009-02-06 | 2010-02-03 | 기판 처리 시스템 |
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JP2009025719A JP4880004B2 (ja) | 2009-02-06 | 2009-02-06 | 基板処理システム |
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JP2010182913A JP2010182913A (ja) | 2010-08-19 |
JP4880004B2 true JP4880004B2 (ja) | 2012-02-22 |
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KR (1) | KR101452543B1 (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6122256B2 (ja) * | 2011-08-12 | 2017-04-26 | 芝浦メカトロニクス株式会社 | 処理システムおよび処理方法 |
JP2013247197A (ja) * | 2012-05-24 | 2013-12-09 | Sokudo Co Ltd | 基板処理装置 |
JP6001961B2 (ja) * | 2012-08-29 | 2016-10-05 | 株式会社Screenセミコンダクターソリューションズ | 基板処理装置および基板処理方法 |
EP3908882A4 (en) | 2020-01-15 | 2022-03-16 | Lam Research Corporation | UNDERCOAT FOR PHOTOCOAT ADHESION AND DOSE REDUCTION |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH1074818A (ja) * | 1996-09-02 | 1998-03-17 | Tokyo Electron Ltd | 処理装置 |
KR100515740B1 (ko) * | 1998-08-14 | 2005-09-20 | 동경 엘렉트론 주식회사 | 기판처리장치 |
TW451274B (en) | 1999-06-11 | 2001-08-21 | Tokyo Electron Ltd | Substrate processing apparatus |
JP2003045931A (ja) * | 2001-07-31 | 2003-02-14 | Sendai Nikon:Kk | 露光装置 |
KR100848556B1 (ko) * | 2002-03-25 | 2008-07-25 | 엘지디스플레이 주식회사 | 액정 패널의 회전 버퍼 및 이를 이용한 러빙장치 |
KR20070079834A (ko) * | 2006-02-03 | 2007-08-08 | 삼성전자주식회사 | 기판 처리 장치 및 방법 |
KR101413243B1 (ko) * | 2006-11-01 | 2014-06-27 | 주식회사 원익아이피에스 | 웨이퍼 전달모듈 및 이를 구비한 박막 증착 시스템 |
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- 2009-02-06 JP JP2009025719A patent/JP4880004B2/ja active Active
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Publication number | Publication date |
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JP2010182913A (ja) | 2010-08-19 |
KR101452543B1 (ko) | 2014-10-22 |
KR20100090643A (ko) | 2010-08-16 |
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