JP2015126135A - エンドエフェクタおよび基板搬送ロボット - Google Patents
エンドエフェクタおよび基板搬送ロボット Download PDFInfo
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- JP2015126135A JP2015126135A JP2013270275A JP2013270275A JP2015126135A JP 2015126135 A JP2015126135 A JP 2015126135A JP 2013270275 A JP2013270275 A JP 2013270275A JP 2013270275 A JP2013270275 A JP 2013270275A JP 2015126135 A JP2015126135 A JP 2015126135A
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- Prior art keywords
- substrate
- end effector
- blade body
- blade
- contact portion
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- 239000000758 substrate Substances 0.000 title claims abstract description 145
- 239000012636 effector Substances 0.000 title claims abstract description 84
- 235000012431 wafers Nutrition 0.000 description 65
- 238000010586 diagram Methods 0.000 description 9
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
- H01L21/67781—Batch transfer of wafers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/6773—Conveying cassettes, containers or carriers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Manipulator (AREA)
Abstract
【解決手段】このエンドエフェクタは、複数のブレード本体と、複数のブレード本体のそれぞれのブレード基端側に設けられた基板保持手段とを備える。基板保持手段は、基板の裏面縁部が載置される基板載置部と、基板載置部のブレード基端側から上方に向かって延在し、基板の側端部が当接する基板当接部とを有する。下側のブレード本体の基板当接部の上端と上側のブレード本体の裏面との間に基板が進入できないように基板当接部の高さが設定されている。
【選択図】図3
Description
同様に、図6に示した実施形態(基板当接部10が傾斜している構成)においても、図11、図12Aおよび図12Bに示したように、基板保持手段6の横に受入れ開口8が形成されると共に、基板保持手段6と受入れ開口8との配置が各ブレード本体5毎に入れ替わっている。
Ho>=(Pb−Ps)/tanθ
で表される。
2 エンドエフェクタ
3 多関節アーム
4 ブレード
5 ブレード本体
6 基板保持手段
7 基板受け部
8 受入れ開口
9 基板載置部
9a 基板載置面
10 基板当接部
W ウェハ
Claims (10)
- 上下方向のピッチを最小ピッチと最大ピッチとの間で変更可能な複数のブレードを備えたエンドエフェクタにおいて、
複数のブレード本体と、
前記複数のブレード本体のそれぞれのブレード基端側に設けられた基板保持手段と、を備え、
前記基板保持手段は、
前記基板の裏面縁部が載置される基板載置部と、
前記基板載置部の前記ブレード基端側から上方に向かって延在し、前記基板の側端部が当接する基板当接部と、を有し、
下側の前記ブレード本体の前記基板当接部の上端と上側の前記ブレード本体の裏面との間に前記基板が進入できないように前記基板当接部の高さが設定されている、エンドエフェクタ。 - 前記基板当接部は、前記基板載置部から直立に延在している、請求項1記載のエンドエフェクタ。
- 前記基板当接部は、前記基板載置部から前記ブレード基端側に傾斜して延在している、請求項1記載のエンドエフェクタ。
- 上側の前記ブレード本体には、下側の前記ブレード本体の前記基板当接部が進入できる受入れ開口が形成されている、請求項1乃至3のいずれか一項に記載のエンドエフェクタ。
- 前記最小ピッチにおいて下側の前記ブレード本体の前記基板当接部の少なくとも一部が上側の前記ブレード本体の前記受入れ開口に進入している、請求項4記載のエンドエフェクタ。
- 前記最大ピッチにおいて下側の前記ブレード本体の前記基板当接部は、少なくとも上側の前記ブレード本体の前記受入れ開口の高さを有する、請求項5記載のエンドエフェクタ。
- 複数の前記ブレード本体に形成された複数の前記受入れ開口が、前記上下方向から見て重なっている、請求項4乃至6のいずれか一項に記載のエンドエフェクタ。
- 複数の前記ブレード本体に形成された複数の前記受入れ開口が、前記上下方向から見て重なっていない、請求項4乃至6のいずれか一項に記載のエンドエフェクタ。
- 下側の前記ブレード本体の前記基板当接部と、上側の前記ブレード本体に形成された前記受入れ開口とが、前記上下方向から見て少なくとも部分的に重なっている、請求項8記載のエンドエフェクタ。
- 請求項1乃至9のいずれか一項に記載のエンドエフェクタと、
前記エンドエフェクタが先端に装着された多関節アームと、
を備えた基板搬送ロボット。
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013270275A JP6313972B2 (ja) | 2013-12-26 | 2013-12-26 | エンドエフェクタおよび基板搬送ロボット |
PCT/JP2014/083713 WO2015098752A1 (ja) | 2013-12-26 | 2014-12-19 | エンドエフェクタおよび基板搬送ロボット |
EP14873503.8A EP3091565A4 (en) | 2013-12-26 | 2014-12-19 | End effector and substrate conveying robot |
CN201480071011.7A CN106062943B (zh) | 2013-12-26 | 2014-12-19 | 末端执行器及衬底搬送机器人 |
KR1020167020266A KR101863474B1 (ko) | 2013-12-26 | 2014-12-19 | 엔드 이펙터 및 기판 반송 로봇 |
US15/108,417 US10297482B2 (en) | 2013-12-26 | 2014-12-19 | End effector and substrate conveying robot |
TW103145329A TW201532763A (zh) | 2013-12-26 | 2014-12-24 | 末端執行器及基板搬送機器人 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013270275A JP6313972B2 (ja) | 2013-12-26 | 2013-12-26 | エンドエフェクタおよび基板搬送ロボット |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2015126135A true JP2015126135A (ja) | 2015-07-06 |
JP6313972B2 JP6313972B2 (ja) | 2018-04-18 |
Family
ID=53478609
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013270275A Active JP6313972B2 (ja) | 2013-12-26 | 2013-12-26 | エンドエフェクタおよび基板搬送ロボット |
Country Status (7)
Country | Link |
---|---|
US (1) | US10297482B2 (ja) |
EP (1) | EP3091565A4 (ja) |
JP (1) | JP6313972B2 (ja) |
KR (1) | KR101863474B1 (ja) |
CN (1) | CN106062943B (ja) |
TW (1) | TW201532763A (ja) |
WO (1) | WO2015098752A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPWO2017038811A1 (ja) * | 2015-08-31 | 2018-06-28 | 川崎重工業株式会社 | 基板搬送ロボットおよび基板処理システム |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7409800B2 (ja) * | 2019-08-09 | 2024-01-09 | 川崎重工業株式会社 | ロボット制御装置、ロボット、及びロボット制御方法 |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05235147A (ja) * | 1992-02-24 | 1993-09-10 | Dainippon Screen Mfg Co Ltd | 基板移載装置 |
JPH08139152A (ja) * | 1994-11-04 | 1996-05-31 | Dainippon Screen Mfg Co Ltd | 基板交換装置及び基板交換方法 |
US20040179932A1 (en) * | 2002-07-22 | 2004-09-16 | Jaswant Sandhu | Robotic hand with multi-wafer end effector |
WO2010103876A1 (ja) * | 2009-03-13 | 2010-09-16 | 川崎重工業株式会社 | エンドエフェクタを備えたロボット及びその運転方法 |
JP2010258170A (ja) * | 2009-04-23 | 2010-11-11 | Tokyo Electron Ltd | 基板保持部材、基板搬送アーム及び基板搬送装置 |
US20110241367A1 (en) * | 2010-02-26 | 2011-10-06 | Brooks Automation, Inc. | Robot edge contact gripper |
JP2013062352A (ja) * | 2011-09-13 | 2013-04-04 | Tokyo Electron Ltd | 接合装置、接合システム、接合方法、プログラム及びコンピュータ記憶媒体 |
JP2013069914A (ja) * | 2011-09-22 | 2013-04-18 | Yaskawa Electric Corp | 基板搬送用ハンドおよび基板搬送ロボット |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1111663A (ja) * | 1997-06-27 | 1999-01-19 | Tokyo Electron Ltd | 基板搬送装置 |
US20050188923A1 (en) * | 1997-08-11 | 2005-09-01 | Cook Robert C. | Substrate carrier for parallel wafer processing reactor |
JP3033738B2 (ja) | 1998-07-29 | 2000-04-17 | 株式会社カイジョー | ウエハ搬送装置およびウエハ搬送方法 |
US20010048867A1 (en) * | 2000-03-29 | 2001-12-06 | Lebar Technology, Inc. | Method and apparatus for processing semiconductor wafers |
JP2006313865A (ja) | 2005-05-09 | 2006-11-16 | Tatsumo Kk | 基板保持装置 |
US9437469B2 (en) * | 2007-04-27 | 2016-09-06 | Brooks Automation, Inc. | Inertial wafer centering end effector and transport apparatus |
TWI538789B (zh) * | 2011-08-10 | 2016-06-21 | Kawasaki Heavy Ind Ltd | A end effector device, and a substrate transport robot including the end effector device |
JP5522181B2 (ja) * | 2012-01-26 | 2014-06-18 | 株式会社安川電機 | 搬送ロボット |
-
2013
- 2013-12-26 JP JP2013270275A patent/JP6313972B2/ja active Active
-
2014
- 2014-12-19 EP EP14873503.8A patent/EP3091565A4/en not_active Withdrawn
- 2014-12-19 KR KR1020167020266A patent/KR101863474B1/ko active IP Right Grant
- 2014-12-19 US US15/108,417 patent/US10297482B2/en active Active
- 2014-12-19 CN CN201480071011.7A patent/CN106062943B/zh active Active
- 2014-12-19 WO PCT/JP2014/083713 patent/WO2015098752A1/ja active Application Filing
- 2014-12-24 TW TW103145329A patent/TW201532763A/zh unknown
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05235147A (ja) * | 1992-02-24 | 1993-09-10 | Dainippon Screen Mfg Co Ltd | 基板移載装置 |
JPH08139152A (ja) * | 1994-11-04 | 1996-05-31 | Dainippon Screen Mfg Co Ltd | 基板交換装置及び基板交換方法 |
US20040179932A1 (en) * | 2002-07-22 | 2004-09-16 | Jaswant Sandhu | Robotic hand with multi-wafer end effector |
WO2010103876A1 (ja) * | 2009-03-13 | 2010-09-16 | 川崎重工業株式会社 | エンドエフェクタを備えたロボット及びその運転方法 |
JP2010258170A (ja) * | 2009-04-23 | 2010-11-11 | Tokyo Electron Ltd | 基板保持部材、基板搬送アーム及び基板搬送装置 |
US20110241367A1 (en) * | 2010-02-26 | 2011-10-06 | Brooks Automation, Inc. | Robot edge contact gripper |
JP2013062352A (ja) * | 2011-09-13 | 2013-04-04 | Tokyo Electron Ltd | 接合装置、接合システム、接合方法、プログラム及びコンピュータ記憶媒体 |
JP2013069914A (ja) * | 2011-09-22 | 2013-04-18 | Yaskawa Electric Corp | 基板搬送用ハンドおよび基板搬送ロボット |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPWO2017038811A1 (ja) * | 2015-08-31 | 2018-06-28 | 川崎重工業株式会社 | 基板搬送ロボットおよび基板処理システム |
Also Published As
Publication number | Publication date |
---|---|
CN106062943A (zh) | 2016-10-26 |
WO2015098752A1 (ja) | 2015-07-02 |
TW201532763A (zh) | 2015-09-01 |
US10297482B2 (en) | 2019-05-21 |
JP6313972B2 (ja) | 2018-04-18 |
CN106062943B (zh) | 2018-12-14 |
KR20160118247A (ko) | 2016-10-11 |
EP3091565A4 (en) | 2017-08-02 |
KR101863474B1 (ko) | 2018-05-31 |
US20160322247A1 (en) | 2016-11-03 |
TWI561351B (ja) | 2016-12-11 |
EP3091565A1 (en) | 2016-11-09 |
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