JP6335103B2 - 基板保持装置 - Google Patents
基板保持装置 Download PDFInfo
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- JP6335103B2 JP6335103B2 JP2014231817A JP2014231817A JP6335103B2 JP 6335103 B2 JP6335103 B2 JP 6335103B2 JP 2014231817 A JP2014231817 A JP 2014231817A JP 2014231817 A JP2014231817 A JP 2014231817A JP 6335103 B2 JP6335103 B2 JP 6335103B2
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- 230000002093 peripheral effect Effects 0.000 claims description 59
- 230000007246 mechanism Effects 0.000 claims description 11
- 238000006073 displacement reaction Methods 0.000 claims description 10
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 230000008878 coupling Effects 0.000 claims description 2
- 238000010168 coupling process Methods 0.000 claims description 2
- 238000005859 coupling reaction Methods 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 5
- 210000000078 claw Anatomy 0.000 description 4
- 238000012545 processing Methods 0.000 description 3
- 238000012546 transfer Methods 0.000 description 3
- 239000007788 liquid Substances 0.000 description 2
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 2
- 239000004810 polytetrafluoroethylene Substances 0.000 description 2
- 241000220317 Rosa Species 0.000 description 1
- 230000001174 ascending effect Effects 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
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- 230000004048 modification Effects 0.000 description 1
- 229910001172 neodymium magnet Inorganic materials 0.000 description 1
- -1 polytetrafluoroethylene Polymers 0.000 description 1
- 230000008569 process Effects 0.000 description 1
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/6875—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
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- Condensed Matter Physics & Semiconductors (AREA)
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- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Mechanical Engineering (AREA)
Description
また、本発明は、基板を支持する支柱の外側への変位を防止することができる基板保持装置を提供することを目的とする。
本発明の好ましい態様は、前記支柱が前記ばねの力に逆らって上昇されたとき、前記第2の構造体は前記第1の構造体内に挿入されることを特徴とする。
本発明の他の態様は、軸方向に移動自在な支柱と、前記支柱に設けられた、基板の周縁部を把持するチャックと、前記支柱をその軸方向に付勢するばねと、前記ばねの内側に配置され、かつ前記ばねの上側部位を支持する外周面を有することで、前記ばねの上側部位の、基板回転時における前記軸方向に対して垂直な方向への移動を前記外周面で制限する第1の構造体と、前記ばねの下側部位を囲む内周面を有することで、前記ばねの下側部位の、基板回転時における前記軸方向に対して垂直な方向への移動を前記内周面で制限する第2の構造体とを備えたことを特徴とする基板保持装置である。
本発明の好ましい態様は、前記ばねの力に逆らって前記支柱をその軸方向に移動させる移動機構と、前記支柱の軸方向への移動に従って前記支柱をその軸心まわりに回転させる回転機構とをさらに備えたことを特徴とする。
本発明の好ましい態様は、前記支柱、前記チャック、前記ばね、前記第1の構造体、および前記第2の構造体は、それぞれ複数設けられており、前記複数の支柱を互いに連結する連結リングをさらに備えたことを特徴とする。
本発明の好ましい態様は、前記複数の支柱および前記複数のチャックは、前記基板の周縁部に沿って配列されていることを特徴とする。
本発明の他の態様は、軸方向に移動自在な支柱と、前記支柱に設けられた、基板の周縁部を把持するチャックと、前記支柱をその軸方向に付勢する単一のばねと、前記ばねを囲む内周面を有する第1の構造体と、前記ばねの内側に配置され、かつ前記ばねを支持する外周面を有する第2の構造体とを備え、前記第1の構造体および前記第2の構造体は、耐摩耗性の高い樹脂から構成されたことを特徴とする基板保持装置である。
図1は、本発明の一実施形態に係る基板保持装置を示す縦断面図である。図2は図1に示す基板保持装置を示す平面図である。
1a アーム
2 支柱
3 チャック
5 回転軸
6 軸受
7 円筒体
9 架台
11,12 プーリー
14 ベルト
15 モータ
20 リフター
20a プッシャー
21 第1の気体チャンバ
22 第2の気体チャンバ
24 第1の気体流路
25 第2の気体流路
28 回転カップ
30 ばね
31 外側カバー
33 内側カラー
35 ばねストッパー
43 第1の磁石
44 第2の磁石
45 第3の磁石
46 溝
47 突起部
50 連結リング
53 ブロック
55 軸
56 ピン
57 切り欠き
60 爪
61 円弧面
Claims (10)
- 軸方向に移動自在な支柱と、
前記支柱に設けられた、基板の周縁部を把持するチャックと、
前記支柱をその軸方向に付勢する単一のばねと、
前記ばねの上側部位を囲む内周面を有することで、前記ばねの上側部位の、基板回転時における前記軸方向に対して垂直な方向への移動を前記内周面で制限する第1の構造体と、
前記ばねの内側に配置され、かつ前記ばねの下側部位を支持する外周面を有することで、前記ばねの下側部位の、基板回転時における前記軸方向に対して垂直な方向への移動を前記外周面で制限する第2の構造体とを備えたことを特徴とする基板保持装置。 - 前記第1の構造体は、前記ばねの上半分を囲むように配置されていることを特徴とする請求項1に記載の基板保持装置。
- 前記支柱が前記ばねの力に逆らって上昇されたとき、前記第2の構造体は前記第1の構造体内に挿入されることを特徴とする請求項1または2に記載の基板保持装置。
- 軸方向に移動自在な支柱と、
前記支柱に設けられた、基板の周縁部を把持するチャックと、
前記支柱をその軸方向に付勢するばねと、
前記ばねの内側に配置され、かつ前記ばねの上側部位を支持する外周面を有することで、前記ばねの上側部位の、基板回転時における前記軸方向に対して垂直な方向への移動を前記外周面で制限する第1の構造体と、
前記ばねの下側部位を囲む内周面を有することで、前記ばねの下側部位の、基板回転時における前記軸方向に対して垂直な方向への移動を前記内周面で制限する第2の構造体とを備えたことを特徴とする基板保持装置。 - 前記支柱は、前記第2の構造体に対して相対的に回転可能であることを特徴とする請求項1乃至4のいずれか一項に記載の基板保持装置。
- 前記ばねの力に逆らって前記支柱をその軸方向に移動させる移動機構と、
前記支柱の軸方向への移動に従って前記支柱をその軸心まわりに回転させる回転機構とをさらに備えたことを特徴とする請求項5に記載の基板保持装置。 - 前記支柱、前記チャック、前記ばね、前記第1の構造体、および前記第2の構造体は、それぞれ複数設けられており、
前記複数の支柱を互いに連結する連結リングをさらに備えたことを特徴とする請求項1または4に記載の基板保持装置。 - 前記複数の支柱および前記複数のチャックは、前記基板の周縁部に沿って配列されていることを特徴とする請求項7に記載の基板保持装置。
- 軸方向に移動自在な複数の支柱と、
前記複数の支柱に設けられた、基板の周縁部を把持する複数のチャックと、
前記複数の支柱を互いに連結する連結リングと、
前記複数の支柱をその軸方向にそれぞれ付勢する複数のばねと、
前記複数のチャックで保持された基板を回転させるときに、前記ばねの遠心力による変位を制限する構造体を備え、
前記複数のばねのそれぞれは、単一のばねであり、
前記連結リングは前記複数の支柱と一体に回転可能であるように前記複数の支柱に連結されていることを特徴とする基板保持装置。 - 軸方向に移動自在な支柱と、
前記支柱に設けられた、基板の周縁部を把持するチャックと、
前記支柱をその軸方向に付勢する単一のばねと、
前記ばねを囲む内周面を有する第1の構造体と、
前記ばねの内側に配置され、かつ前記ばねを支持する外周面を有する第2の構造体とを備え、
前記第1の構造体および前記第2の構造体は、耐摩耗性の高い樹脂から構成されたことを特徴とする基板保持装置。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014231817A JP6335103B2 (ja) | 2014-11-14 | 2014-11-14 | 基板保持装置 |
TW104134662A TWI677939B (zh) | 2014-11-14 | 2015-10-22 | 基板保持裝置 |
KR1020150153762A KR102384831B1 (ko) | 2014-11-14 | 2015-11-03 | 기판 보유 지지 장치 |
US14/935,893 US10121692B2 (en) | 2014-11-14 | 2015-11-09 | Substrate holding apparatus |
CN201510772413.6A CN105609461B (zh) | 2014-11-14 | 2015-11-12 | 基板保持装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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JP2014231817A JP6335103B2 (ja) | 2014-11-14 | 2014-11-14 | 基板保持装置 |
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JP2016096256A JP2016096256A (ja) | 2016-05-26 |
JP6335103B2 true JP6335103B2 (ja) | 2018-05-30 |
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US (1) | US10121692B2 (ja) |
JP (1) | JP6335103B2 (ja) |
KR (1) | KR102384831B1 (ja) |
CN (1) | CN105609461B (ja) |
TW (1) | TWI677939B (ja) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2018022628A (ja) * | 2016-08-04 | 2018-02-08 | 日本圧着端子製造株式会社 | コネクタ部材及びコネクタ |
JP2018022629A (ja) * | 2016-08-04 | 2018-02-08 | 日本圧着端子製造株式会社 | コネクタ部材及びコネクタ |
CN106737308B (zh) * | 2017-02-24 | 2018-10-09 | 中信戴卡股份有限公司 | 柔性装夹装置 |
CN107597472A (zh) * | 2017-08-31 | 2018-01-19 | 中信戴卡股份有限公司 | 一种用于铝合金车轮喷涂的防护装置 |
NL2020360B1 (en) * | 2018-01-31 | 2019-08-07 | Besi Netherlands Bv | Handler device for handling substrates |
CN111029236A (zh) * | 2018-10-09 | 2020-04-17 | 北京北方华创微电子装备有限公司 | 支撑装置及反应腔室 |
US10871507B2 (en) * | 2018-12-20 | 2020-12-22 | Texas Instruments Incorporated | Semiconductor device handler with chuck clamp interlock |
CN110911325B (zh) * | 2019-11-29 | 2024-03-26 | 西安奕斯伟材料科技股份有限公司 | 一种晶圆传送叶片 |
TWI812123B (zh) * | 2022-03-28 | 2023-08-11 | 辛耘企業股份有限公司 | 晶圓載台 |
CN114653660B (zh) * | 2022-05-20 | 2022-09-16 | 智程半导体设备科技(昆山)有限公司 | 一种磁性夹块及半导体基材清洗装置 |
WO2024063049A1 (ja) * | 2022-09-21 | 2024-03-28 | 芝浦メカトロニクス株式会社 | 基板処理装置 |
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GB1226747A (ja) * | 1967-07-25 | 1971-03-31 | ||
US6827092B1 (en) * | 2000-12-22 | 2004-12-07 | Lam Research Corporation | Wafer backside plate for use in a spin, rinse, and dry module and methods for making and implementing the same |
JP5744382B2 (ja) * | 2008-07-24 | 2015-07-08 | 株式会社荏原製作所 | 基板処理装置および基板処理方法 |
US8795032B2 (en) * | 2008-06-04 | 2014-08-05 | Ebara Corporation | Substrate processing apparatus, substrate processing method, substrate holding mechanism, and substrate holding method |
JP5422143B2 (ja) | 2008-06-04 | 2014-02-19 | 株式会社荏原製作所 | 基板把持機構 |
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JP6018404B2 (ja) * | 2012-04-25 | 2016-11-02 | 株式会社荏原製作所 | 基板処理装置 |
JP6053528B2 (ja) * | 2013-01-11 | 2016-12-27 | 株式会社荏原製作所 | 基板把持装置 |
JP6181438B2 (ja) * | 2013-06-24 | 2017-08-16 | 株式会社荏原製作所 | 基板保持装置および基板洗浄装置 |
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US20160141201A1 (en) | 2016-05-19 |
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