JP2008211257A - 集積型可融リンクを有するプリント回路板アセンブリ - Google Patents
集積型可融リンクを有するプリント回路板アセンブリ Download PDFInfo
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- JP2008211257A JP2008211257A JP2008147481A JP2008147481A JP2008211257A JP 2008211257 A JP2008211257 A JP 2008211257A JP 2008147481 A JP2008147481 A JP 2008147481A JP 2008147481 A JP2008147481 A JP 2008147481A JP 2008211257 A JP2008211257 A JP 2008211257A
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- Prior art keywords
- conductive layer
- fusible link
- board
- electrical assembly
- circuit
- Prior art date
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- 238000000151 deposition Methods 0.000 description 24
- 229920002120 photoresistant polymer Polymers 0.000 description 22
- 238000005530 etching Methods 0.000 description 16
- 239000011253 protective coating Substances 0.000 description 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 8
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 7
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- 229910021578 Iron(III) chloride Inorganic materials 0.000 description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 4
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- 238000007747 plating Methods 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 238000007772 electroless plating Methods 0.000 description 2
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- 229920000877 Melamine resin Polymers 0.000 description 1
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- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910001128 Sn alloy Inorganic materials 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
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- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 1
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Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
- H01H85/02—Details
- H01H85/04—Fuses, i.e. expendable parts of the protective device, e.g. cartridges
- H01H85/041—Fuses, i.e. expendable parts of the protective device, e.g. cartridges characterised by the type
- H01H85/046—Fuses formed as printed circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H69/00—Apparatus or processes for the manufacture of emergency protective devices
- H01H69/02—Manufacture of fuses
- H01H69/022—Manufacture of fuses of printed circuit fuses
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0286—Programmable, customizable or modifiable circuits
- H05K1/0293—Individual printed conductors which are adapted for modification, e.g. fusable or breakable conductors, printed switches
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0302—Properties and characteristics in general
- H05K2201/0305—Solder used for other purposes than connections between PCB or components, e.g. for filling vias or for programmable patterns
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0338—Layered conductor, e.g. layered metal substrate, layered finish layer or layered thin film adhesion layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09727—Varying width along a single conductor; Conductors or pads having different widths
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10181—Fuse
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Fuses (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Structure Of Printed Boards (AREA)
Abstract
【解決手段】本発明は、概して回路ジオメトリに直接集積された薄膜ヒューズを有するPC板アセンブリに関し、本発明は、たとえば、複数の電気回路ジオメトリを規定するように、表面上に堆積された複数の導電性トレース(25、30)を有するプリント回路板を含むプリント回路板アセンブリ(10)を提供する。複数の薄膜ヒューズ(35)がプリント回路板上に堆積され、各ヒューズは、複数の導電性トレースの1つに回路保護を提供する。
【選択図】なし
Description
本発明は、概して回路ジオメトリに直接集積された薄膜ヒューズを有するPC板アセンブリに関する。
従来のプリント回路(「PC」)板は、概して電気絶縁基板の薄板構成、導電層および接着剤を含む。接着剤は、導電層を絶縁体基板に接合する。例えば、銅クラッディングは、通常以下の材料、すなわちFR−4、エポキシ、セラミック、ガラス−エポキシ混合物、ポリイミド、メラミンおよび電気絶縁体ポリマーのいずれかで形成される絶縁基板の表面を覆う。PC板の製造業者らは、多様な技術を用いて、導電層の一部を腐食させ、所望の電気回路ジオメトリを規定する導電トレースを残す。
本発明は、PC板アセンブリの規定された回路ジオメトリに対して集積回路保護を提供することを目的とする。
本発明が理解され得るために、以下、添付の図面を参照しながら例示として本発明を説明する。
直接堆積法の好適な実施形態による電気的アセンブリを製造するための様々な工程を図3A〜図3Kを参照しながら説明する。図3Aおよび図3Bに図示するように、導電性被覆面65を有するPC板60をフォトレジスト材料70で被覆する。典型的には、PC板60は、電気絶縁性基板(例えば、セラミック、ガラスエポキシ、電気絶縁性ポリマー、およびFR4エポキシ)と、接着剤と、導電性箔との積層体である。複数の導電性トレース120は、当該分野においては周知であるように、マスクまたはフォトリソグラフィ技術を用いてPC板60上にイメージングする。導電性トレース120の所望のジオメトリ(geometry)を形成する非マスクフォトレジスト材料71を硬化する。
図4A〜4Eを参照して、直接堆積法の第2の実施形態を説明する。この方法において、絶縁基板150が提供される。絶縁基板の表面は、メッキ性を高めるために予め調整してあり、あるいは粗くされる。表面は、MnO4に曝すことにより化学的に調整されてもよく、あるいはサンドブラスト加工などにより機械的に調整されてもよい。第1の導電層135が、絶縁基板150の処理面に付与される(図4B)。導電層は、例えば積層または無電解メッキなどの任意の従来技術によって付与され得る。好ましくは、第1の導電層135は無電解メッキされた銅を含んでなる。
直接エッチング法に基づいて電気的アセンブリを製造するための様々な工程を、図5A〜5Hを参照して説明する。図5Aにおいて、直接エッチング法は、回路ジオメトリが規定されていない外側の第1導電層65を有する、従来の「バージン」PC板60上に行われる。典型的には、PC板60は電気的に絶縁性の基板(例えばセラミック、ガラスエポキシ、電気的に絶縁性のポリマー、およびFR4エポキシ)、接着剤、および導電性箔の積層体である。直接エッチング法はまた、既に回路ジオメトリが規定されたPC板上にも行い得ることが、当業者には理解される。
Claims (1)
- 本願明細書に記載の電気アセンブリ。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/982,589 US5923239A (en) | 1997-12-02 | 1997-12-02 | Printed circuit board assembly having an integrated fusible link |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2000523837A Division JP2001525600A (ja) | 1997-12-02 | 1998-11-30 | 集積型可融リンクを有するプリント回路板アセンブリ |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2008211257A true JP2008211257A (ja) | 2008-09-11 |
Family
ID=25529323
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2000523837A Pending JP2001525600A (ja) | 1997-12-02 | 1998-11-30 | 集積型可融リンクを有するプリント回路板アセンブリ |
JP2008147481A Pending JP2008211257A (ja) | 1997-12-02 | 2008-06-04 | 集積型可融リンクを有するプリント回路板アセンブリ |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2000523837A Pending JP2001525600A (ja) | 1997-12-02 | 1998-11-30 | 集積型可融リンクを有するプリント回路板アセンブリ |
Country Status (7)
Country | Link |
---|---|
US (2) | US5923239A (ja) |
EP (1) | EP1046326B1 (ja) |
JP (2) | JP2001525600A (ja) |
AU (1) | AU1614199A (ja) |
DE (1) | DE69812179T2 (ja) |
TW (1) | TW407438B (ja) |
WO (1) | WO1999029147A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103635008A (zh) * | 2012-08-28 | 2014-03-12 | 昆山雅森电子材料科技有限公司 | 开口密集型印刷电路板用覆盖膜 |
Families Citing this family (70)
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- 1998-11-30 EP EP98960572A patent/EP1046326B1/en not_active Expired - Lifetime
- 1998-11-30 WO PCT/US1998/025417 patent/WO1999029147A1/en active IP Right Grant
- 1998-11-30 JP JP2000523837A patent/JP2001525600A/ja active Pending
- 1998-11-30 AU AU16141/99A patent/AU1614199A/en not_active Abandoned
- 1998-12-01 TW TW087119881A patent/TW407438B/zh not_active IP Right Cessation
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- 1999-05-13 US US09/311,016 patent/US6043966A/en not_active Expired - Lifetime
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CN103635008A (zh) * | 2012-08-28 | 2014-03-12 | 昆山雅森电子材料科技有限公司 | 开口密集型印刷电路板用覆盖膜 |
Also Published As
Publication number | Publication date |
---|---|
EP1046326B1 (en) | 2003-03-12 |
US5923239A (en) | 1999-07-13 |
JP2001525600A (ja) | 2001-12-11 |
DE69812179T2 (de) | 2004-01-08 |
US6043966A (en) | 2000-03-28 |
DE69812179D1 (de) | 2003-04-17 |
WO1999029147A1 (en) | 1999-06-10 |
TW407438B (en) | 2000-10-01 |
AU1614199A (en) | 1999-06-16 |
EP1046326A1 (en) | 2000-10-25 |
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