CN200983718Y - 主板 - Google Patents

主板 Download PDF

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Publication number
CN200983718Y
CN200983718Y CNU2006200162187U CN200620016218U CN200983718Y CN 200983718 Y CN200983718 Y CN 200983718Y CN U2006200162187 U CNU2006200162187 U CN U2006200162187U CN 200620016218 U CN200620016218 U CN 200620016218U CN 200983718 Y CN200983718 Y CN 200983718Y
Authority
CN
China
Prior art keywords
mainboard
protective wire
cabling
copper foil
main line
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNU2006200162187U
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English (en)
Inventor
张翔
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
Original Assignee
Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hongfujin Precision Industry Shenzhen Co Ltd, Hon Hai Precision Industry Co Ltd filed Critical Hongfujin Precision Industry Shenzhen Co Ltd
Priority to CNU2006200162187U priority Critical patent/CN200983718Y/zh
Priority to US11/748,505 priority patent/US7542260B2/en
Application granted granted Critical
Publication of CN200983718Y publication Critical patent/CN200983718Y/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0286—Programmable, customizable or modifiable circuits
    • H05K1/0293—Individual printed conductors which are adapted for modification, e.g. fusable or breakable conductors, printed switches
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/0969—Apertured conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09727—Varying width along a single conductor; Conductors or pads having different widths
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10181—Fuse

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

一种主板，包括一印刷电路板，所述印刷电路板上设有铜箔走线，所述铜箔走线包括一段保护线及与该保护线两末端分别相连的两段主线，所述主线的线宽大于所述保护线的线宽。本实用新型主板的印刷电路板上的走线的中部设有一段线宽较窄的保护线段，当电流过大时，所述保护线段会烧断，起到保护主板线路且减少线路过流燃烧时所放出的烟量的作用。

Description

主板
技术领域
本实用新型涉及一种主板，特别是涉及一种具有特殊走线的主板。
背景技术
主板的裸板是一块PCB(Printed Circuit Board，印刷电路板)板，PCB板本身的基板是由绝缘隔热、不易弯曲的材质所制作成，设于其表面的细小线路的材料是铜箔，铜箔原本是覆盖在整个PCB板上的，在制造过程中部分被蚀刻处理掉，留下来的部份就变成网状的细小线路。这些线路被称作导线或称布线，用来提供PCB板上零件的电路连接。
传统的主板上的走线的宽度处处一致，即便是蛇行走线也是如此。走线的线宽越大，其电阻越小，耐流值越大。主板的PCB板的最外层通常还有覆盖于走线上的绿油，作为这些走线的绝缘保护膜，以防在外界的导体接触电路板时发生短路。在通过走线的电流超过了该走线的最大耐流值时，走线上的绿油会因为过热而燃烧，且放出大量的烟，对环境造成污染。主板业界为了防止污染环境，规定出产的主板即使因为走线过流而燃烧，其烟量也不能超过一支香烟静态燃烧产生的烟量，因此主板在出厂前必须经过测试以确保其符合业界对放烟量的规定，这就要求主板的走线足够宽，能够承受较大的电流，不会被烧断，或者烧断所产生的烟量足够小。但是受限于主板的大小，不能任意加宽走线。
发明内容
鉴于以上内容，有必要提供一种不加宽走线且符合业界对放烟量的规定的主板。
一种主板，包括一印刷电路板，所述印刷电路板上设有铜箔走线，所述铜箔走线包括一段保护线及与该保护线两末端分别相连的两段主线，所述主线的线宽大于所述保护线的线宽。
相较于现有技术，本实用新型主板上设有至少一形状特殊的走线，所述走线的中部设有一段线宽较窄的保护线段，当电流过大时，所述保护线段会烧断，放出烟量很少，烧断后，所述走线上的电流为零，因此所述线宽较宽的主线不会燃烧，从而将烟量控制在业界规定的最大放烟量的范围以内。
附图说明
图1是本实用新型主板较佳实施方式的立体图。
具体实施方式
请参考图1，本实用新型主板较佳实施方式包括一印刷电路板10，所述印刷电路板10设有至少一条设于其外侧的铜箔走线12，所述铜箔走线12包括一段保护线127及与该段保护线127两末端分别相连的两段主线123，所述主线123的线宽大于所述保护线127的线宽，所述保护线127及所述主线123上均覆盖有绝缘绿油。所述两段主线123的外末端各设有一过孔121，内末端各设有一除去绿油的隔绝部125，所述隔绝部125分别与所述保护线127的两末端相连。所述保护线127的长度较所述主线123的长度短，所述隔绝部125的长度较所述保护线127的长度短。
由于铜箔走线的线宽越小其电阻越大，根据焦耳定律可知纯电阻产生的电热Q＝I2Rt，所述保护线127的线宽小，电阻大，因而产生的电热大于所述主线123产生的电热，在电流过大时，所述保护线127更易于烧断，所述保护线127的作用类似于保险丝。由于所述隔绝部125上未覆盖绿油，所以当所述保护线127在过流燃烧时不会蔓延至所述主线123，因此，放出的烟量很少，可以将烟量控制在主板业界规定的最大放烟量以内。
在主板上，电源走线最易因过流烧断，在本较佳实施例中，所述铜箔走线12为一电源走线。所述电源走线的一过孔121与低压直流电源相连，另一过孔121与主板上的组件，如一音频芯片相连。

Claims (7)

1.一种主板，包括一印刷电路板，所述印刷电路板上设有铜箔走线，其特征在于：所述铜箔走线包括一段保护线及与该保护线两末端分别相连的两段主线，所述主线的线宽大于所述保护线的线宽。
2.如权利要求1所述的主板，其特征在于：所述保护线及所述主线上覆盖有绝缘绿油。
3.如权利要求2所述的主板，其特征在于：所述每一主线与保护线相连的一末端设有一未覆盖绿油的隔绝部，所述两段主线的隔绝部分别与所述保护线的两末端相连。
4.如权利要求3所述的主板，其特征在于：所述每一主线的另一末端设有一过孔。
5.如权利要求3所述的主板，其特征在于：所述保护线的长度较所述主线的长度短，所述隔绝部的长度较所述保护线的长度短。
6.如权利要求5所述的主板，其特征在于：所述铜箔走线为一电源走线。
7.如权利要求6所述的主板，其特征在于：所述两段主线的两过孔其中之一与一电源相连，其中之另一与一音频芯片相连。
CNU2006200162187U 2006-12-06 2006-12-06 主板 Expired - Fee Related CN200983718Y (zh)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CNU2006200162187U CN200983718Y (zh) 2006-12-06 2006-12-06 主板
US11/748,505 US7542260B2 (en) 2006-12-06 2007-05-15 Motherboard

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CNU2006200162187U CN200983718Y (zh) 2006-12-06 2006-12-06 主板

Publications (1)

Publication Number Publication Date
CN200983718Y true CN200983718Y (zh) 2007-11-28

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CNU2006200162187U Expired - Fee Related CN200983718Y (zh) 2006-12-06 2006-12-06 主板

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US (1) US7542260B2 (zh)
CN (1) CN200983718Y (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107087351A (zh) * 2017-06-28 2017-08-22 奇酷互联网络科技（深圳）有限公司 印刷电路板、印刷电路板的制造方法以及电子产品

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2963198B1 (fr) * 2010-07-21 2018-02-16 Thales Circuit imprime possedant des pistes protegees, calculateur et procede
US8957325B2 (en) 2013-01-15 2015-02-17 Fujitsu Limited Optimized via cutouts with ground references

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5923239A (en) * 1997-12-02 1999-07-13 Littelfuse, Inc. Printed circuit board assembly having an integrated fusible link
US20040190269A1 (en) * 2003-03-24 2004-09-30 Siemens Vdo Automotive Inc. PCB fusing trace arrangement for motor drive applications
US7186922B2 (en) 2004-04-28 2007-03-06 Infineon Technologies Ag Circuit board
US7760482B2 (en) * 2006-10-31 2010-07-20 Leach International Corporation Power controller with fusible link

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107087351A (zh) * 2017-06-28 2017-08-22 奇酷互联网络科技（深圳）有限公司 印刷电路板、印刷电路板的制造方法以及电子产品

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US7542260B2 (en) 2009-06-02
US20080135281A1 (en) 2008-06-12

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Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
C17 Cessation of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20071128

Termination date: 20100106