JP2008198940A - 電子部品の実装方法 - Google Patents
電子部品の実装方法 Download PDFInfo
- Publication number
- JP2008198940A JP2008198940A JP2007035280A JP2007035280A JP2008198940A JP 2008198940 A JP2008198940 A JP 2008198940A JP 2007035280 A JP2007035280 A JP 2007035280A JP 2007035280 A JP2007035280 A JP 2007035280A JP 2008198940 A JP2008198940 A JP 2008198940A
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- Prior art keywords
- mounting
- adhesive
- electronic component
- semiconductor element
- mounting part
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 239000004065 semiconductor Substances 0.000 claims abstract description 217
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- 239000003795 chemical substances by application Substances 0.000 description 7
- 229910052709 silver Inorganic materials 0.000 description 7
- 239000004332 silver Substances 0.000 description 7
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 6
- 239000000463 material Substances 0.000 description 6
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- 238000007796 conventional method Methods 0.000 description 5
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- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- 240000006829 Ficus sundaica Species 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
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- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 1
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 description 1
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- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
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- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
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- H05K3/00—Apparatus or processes for manufacturing printed circuits
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- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
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Landscapes
- Engineering & Computer Science (AREA)
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- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Wire Bonding (AREA)
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Abstract
【解決手段】電子部品の支持基板10への実装方法として、支持基板10に於ける電子部品が搭載される複数の搭載部位S1乃至S5に、接着剤12を配設する接着剤配設工程と、吸着ツールを用いて電子部品を、所定の順番に、搭載部位S1乃至5に前記接着剤12を介して接着する電子部品搭載工程とを備える。前記接着剤配設工程において、N番目に電子部品が搭載される搭載部位S2乃至S5に配設する接着剤12−2乃至12−5の体積重心を、N−1番目以前に電子部品が搭載される搭載部位S1に於ける電子部品搭載時に、吸着ツールから噴出される圧気に因る変形分に対応して偏らせる。
【選択図】図3
Description
当該接着剤の被着・形成パターンは、支持基板に搭載する電子部品の大きさ、接着剤の材料物性、支持基板の表面の材料、搭載時の作業条件(荷重、温度等)等により適宜選択される。
このとき、吸着ツール6の吸着部7の内部は陰圧(負圧)であり、吸着ツール5による半導体素子4の吸着が解除される迄、陰圧(負圧)状態が維持される。
しかる後、吸着ツール6による半導体素子4の吸着を解除して、吸着ツール6を上昇させる。(図1(c))
このとき、吸着ツール6による半導体素子4の吸着を確実に解除するために、それまで陰圧(負圧)であった吸着ツールの吸着部7の内部が陽圧(正圧)に切り替えられ、これにより吸着部7からは圧気Wが周囲に噴出される。(図1(c)中の矢印参照)
このように、図1に示す従来の方法にあっては、支持基板1における複数の半導体素子の搭載箇所Sに対し、連続して半導体素子4を搭載・固着する際、吸着ツール6に吸着保持した半導体素子4の固着を行った後、吸着ツール6による吸引を停止し、吸着部7から圧気を周囲に噴出しながらツールを上昇させている。
次いで、吸着ツール7の穿孔9から圧気Wを周囲に噴出させながら、吸着ツール7を降下せしめ、半導体素子4を接着剤3を介して支持基板1に固着すると共に、半導体素子4の外部接続端子5と支持基板1の電極端子3とを接続する。(図2(b))
このとき、吸着ツール7の穿孔9から圧気Wが周囲に噴出されるため、接着剤2が押し広げられ、半導体素子4の周囲に流動する。これにより、接着剤2が半導体素子4の側面に沿って這い上がって吸着ツール6に付着してしまうことが防止される。
本発明の第1の実施の形態に係る、電子部品の配線基板への実装方法について、図3を用いて説明する。
当該配線基板10は、例えばガラスエポキシ、ガラスBT(ビスマレイミド・トリアジン)、ポリイミドなどの有機絶縁材料、セラミックなどの無機絶縁材料、又はシリコン(Si)などの半導体材料から形成される。そして、その表面及び/或いは内部に、電極(外部接続端子)、配線層が配設される。
尚、搭載部位S1乃至搭載部位S5の形状が略矩形であるため、接着剤の配設形状を容易に設定することができる。
当該ディスペンサ15にあっては、接着剤12の吐出量を、空気圧により制御するエア圧送方式が適用されている。
この時点では、配線基板10に於いて、搭載部位S2に被着されている接着剤12−2の体積重心は、中央部よりも右側、即ち搭載部位S1側に偏寄した箇所に位置している。
ここで、吸着ツール26は加熱手段(図示せず)を備えている。従って接着剤12−1が熱硬化性樹脂からなる場合には、当該吸着ツール26は、吸着保持された半導体素子20−1を例えば約250℃乃至300℃に加熱しつつ降下する。これにより、当該半導体素子20−1を、搭載部位S1に搭載すると同時に回路基板10上に固着することができる。
このとき、吸着ツール26による半導体素子20−1の吸着を確実に解除するために、それまで陰圧(負圧)であった吸着ツールの吸着部27の内部を陽圧(正圧)に切り替え、吸着部27から、乾燥窒素(N2)ガス等の圧気Wを周囲に噴出する(図6(c)中の矢印参照)。
このとき、配線基板10はステージ(図示せず)上に支持されている。
前述の如く、搭載部位S2に設けられた接着剤12−2の体積重心は当該搭載部位S2の中央部に移動しており、この為、搭載部位S2の中央部における接着剤12−2の被着量が最も多い。
このように、各搭載部位S1乃至S5それぞれに対して半導体素子20を搭載する際に、接着剤12は搭載部位S1乃至5の領域全体に均一に押し広げられて、半導体素子20は配線基板10上に接着される。
尚、前記半導体素子20に対して気密封止処理が必要な場合には、例えば前記個片化処理の前に、配線基板10の半導体素子20搭載面に対して樹脂封止処理を行う。かかる樹脂封止処理の後、個々の搭載部位Sを単位として、配線基板10及び封止用樹脂部をその厚さ方向に切断分離し、樹脂封止され且つ個片化された半導体装置31を形成する。
尚、搭載部位S2乃至搭載部位S5に形成される接着剤の被着パターン形状は、略同一の形状を有しているため、ここでは、搭載部位S2に配設される接着剤40−2のパターン形状を示す。
従って、当該搭載部位S2に、半導体素子20−2を搭載・固着する際、接着剤40−2は、搭載部位S2の領域全体に容易に且つ均一に押し広げられ、配線基板10上に半導体素子20−2を確実に固着することができる。
かかる被着形態により、接着剤45−1は、搭載部位S1の中央部に於ける被着量が最大となり、当該搭載部位S1にあっては、接着剤45−1の体積重心(図10(a)に示す接着剤45−1に於いて黒丸で示す箇所)が、矩形形状の中央部に位置する。
尚、搭載部位S2乃至搭載部位S5に形成される接着剤のパターン形状は、略同一の形状を有しているため、ここでは搭載部位S2に形成される接着剤45−2のパターン形状を示す。
この様な被着形態をとることにより、当該搭載部位S2に近接する搭載部位S1に半導体素子20−1を搭載する際、吸着ツールから噴出される圧気により、前記接着剤45−2の体積重心は搭載部位S2の中央部に移動する。(図10(c)参照)
従って、当該搭載部位S2に、半導体素子20−2を搭載・固着する際、接着剤45−2は、搭載部位S2の領域全体に容易に、且つ均一に押し広げられて、配線基板10上に半導体素子20−2を確実に固着することができる。
かかる被着形態により、接着剤50−1は、搭載部位S1の中央部に於ける被着量が最大となり、当該搭載部位S1にあっては、接着剤50−1の体積重心(図11(a)に示す接着剤50−1に於いて黒丸で示す箇所)が、矩形形状の中央部に位置する。
尚、搭載部位S2乃至搭載部位S5に形成される接着剤のパターン形状は、略同一の形状を有しているため、ここでは搭載部位S2に形成される接着剤50−2のパターン形状を示す。
この様な被着形態をとることにより、近接する搭載部位S1に半導体素子20−1を搭載する際、吸着ツールから噴出される圧気によって、搭載部位S2に於ける接着剤45−2の体積重心は当該搭載部位S2の中央部に移動する。(図11(c)参照)
従って、当該搭載部位S2に、半導体素子20−2を搭載・固着する際、接着剤50−2は、搭載部位S2の領域全体に容易に且つ均一に押し広げられて、配線基板10上に半導体素子20−2を確実に固着することができる。
次いで、矩形形状を有する搭載部位Sの他の対角線に沿って、接着剤50−1bを選択的に被着・形成する。(図12(b))この結果、接着剤50−1aと接着剤51−2bは、当該搭載部位Sの略中央部に於いて交差して配設される。
一方、搭載部位S2乃至搭載部位S5にあっては、接着剤50−1aと接着剤50−2bとの交差部(交点)よりも搭載部位S1側に偏寄した位置に、接着剤50−2cを円形状に被着・形成する。(図12(d)参照)
これは、前述の如く、吸着ツールから噴出する圧気に影響を考慮して設定される。
この様な選択的な配置により、搭載部位S1にあっては、接着剤55−1の体積重心(図13(a)に示す接着剤55−1において、黒丸で示す箇所)が矩形形状の中央部に位置する。従って、当該搭載部位S1に半導体素子20−1を搭載・固着する際、当該接着剤55−1は、搭載部位S1の領域全体に容易に且つ均一に押し広げられて、配線基板10上に半導体素子20−1を確実に固着することができる。
尚、搭載部位S2乃至搭載部位S5に形成される接着剤のパターン形状は、略同一の形状を有しているため、ここでは搭載部位S2に形成される接着剤55−2のパターン形状を示す。
この様な被着形態をとることによっても、隣接乃至近接する搭載部位S1に半導体素子20−1を搭載する際、吸着ツールから噴出される圧気により、搭載部位S2に於ける接着剤55−2の体積重心は当該搭載部位S2の中央部に移動する。(図13(c)参照)
従って、搭載部位S2に、半導体素子20−2を搭載・固着する際、接着剤55−2は、当該搭載部位S2の領域全体に容易に且つ均一に押し広げられ、配線基板10上に半導体素子20−2を確実に固着することができる。
この様な選択的な配置により、搭載部位S1にあっても、接着剤60−1の体積重心(図14(a)に示す接着剤60−1において、黒丸で示す箇所)が矩形形状の中央部に位置する。
尚、搭載部位S2乃至搭載部位S5に形成される接着剤のパターン形状は、略同一の形状を有しているため、ここでは搭載部位S2に形成される接着剤60−2のパターン形状を示す。
従って、当該搭載部位S2に、半導体素子20−2を搭載・固着する際、接着剤60−2は、搭載部位S2の領域全体に容易に且つ均一に押し広げられて、配線基板10上に半導体素子20−2を確実に固着することができる。
本発明の第2の実施の形態に係る、電子部品の配線基板への実装方法について、図15を用いて説明する。
従って、当該搭載部位S1に於いては、接着剤100−1は、その体積重心が搭載部位S1の中央部に位置して被着される。
この様な選択的な配置により、接着剤100−2は、その体積重心が搭載部位S2の中央部から搭載部位S1側に偏寄して配設される。
本発明の第3の実施の形態に係る、電子部品の配線基板への実装方法について、図18並びに図19を用いて説明する。
図18に於いて、破線により囲んでいる、パッケージ基板部150の一つを、図19に拡大して示す。
(付記1)
支持基板上の、複数の電子部品搭載部位のそれぞれに、接着剤を配設する工程と、
前記複数の電子部品搭載部位のそれぞれに、前記接着剤を介して電子部品を固着する工程と、を具備し、
前記複数の電子部品搭載部位のそれぞれに接着剤を配設する際、
N番目に電子部品が搭載される搭載部位に配置する接着剤の体積重心を、当該N番目に電子部品が搭載される搭載部位に近接して配置され且つN−1番目以前に電子部品が搭載される搭載部位に対して近づく方向に偏寄して配置することを特徴とする電子部品の実装方法。
(付記2)
支持基板上の、複数の電子部品搭載部位のそれぞれに、接着剤を配設する工程と、
前記複数の電子部品搭載部位のそれぞれに、前記接着剤を介して電子部品を固着する工程と、を具備し、
前記複数の電子部品搭載部位のそれぞれに接着剤を配設する際、
N番目に電子部品が搭載される搭載部位に配設される接着剤の体積重心を、N−1番目以前に電子部品が搭載される搭載部位に対し電子部品が搭載される際に吸着ツールから噴出される圧気に対応して配置することを特徴とする電子部品の実装方法。
(付記3)
付記1又は2記載の電子部品の実装方法であって、
前記N番目に電子部品が搭載される搭載部位に配設される接着剤の体積重心を、前記N−1番目以前に前記電子部品が搭載される近接する搭載部位の面積中心に向かう方向に偏寄して配置することを特徴とする電子部品の実装方法。
(付記4)
付記1乃至3いずれか一項記載の電子部品の実装方法であって、
N=1である場合は、前記電子部品が搭載される搭載部位に形成する前記接着剤の体積重心が当該搭載部位の面積中心に位置するように、前記接着剤を当該搭載部位において略点対称に形成することを特徴とする電子部品の実装方法。
(付記5)
支持基板上の、複数の電子部品搭載部位のそれぞれに接着剤を配設する工程と、
前記複数の電子部品搭載部位のそれぞれに、前記接着剤を介して電子部品を固着する工程と、を具備し、
前記複数の電子部品搭載部位のそれぞれに接着剤を配設する際、
N番目に電子部品が搭載される搭載部位に配設される接着剤の体積重心を、N−1番目以前に電子部品が搭載され、当該N番目に電子部品が搭載される搭載部位に近接する複数の搭載部位に於けるそれぞれの面積中心に向かう方向のベクトルの和の方向に偏寄して配置することを特徴とする電子部品の実装方法。
(付記6)
付記1乃至5いずれか一項記載の電子部品の実装方法であって、
前記接着剤はディスペンス法により被着され、
当該接着剤は、支持基板の電子部品搭載部位にパターン描画されることを特徴とする電子部品の実装方法。
(付記7)
付記6記載の電子部品の実装方法であって、
パターン描画される接着剤は、略直線形状又は略円形形状のパターン形状を有することを特徴とする電子部品の実装方法。
(付記8)
付記6又は7記載の電子部品の実装方法であって、
N番目に電子部品が搭載される搭載部位に配設される接着剤のうち、少なくとも搭載部位の中心又は中心近傍に被着される接着剤は、N−1番目以前に電子部品が搭載され近接する搭載部位に於ける電子部品搭載時に吸着ツールから噴出される圧気に対応して配置されることを特徴とする電子部品の実装方法。
(付記9)
付記1乃至8いずれか一項記載の電子部品の実装方法であって、
前記電子部品を固着する工程において、前記支持基板及び前記支持基板の各電子部品搭載部位に形成された前記接着剤を加熱することを特徴とする電子部品の実装方法。
(付記10)
付記2乃至9いずれか一項記載の電子部品の実装方法であって、
前記接着剤は熱硬化性樹脂であり、
前記吸着ツールは加熱手段を備え、
前記電子部品を固着する工程において、当該加熱手段により前記電子部品を加熱しながら、前記吸着ツールを降下することを特徴とする電子部品の実装方法。
(付記11)
付記1乃至10いずれか一項記載の電子部品の実装方法であって、
前記支持基板の前記電子部品搭載部位は、略矩形形状を有していることを特徴とする電子部品の実装方法。
(付記12)
付記1乃至11いずれか一項記載の電子部品の実装方法であって、
前記電子部品は、下面に外部接続端子が形成された半導体素子であることを特徴とする電子部品の実装方法。
(付記13)
付記1乃至12記載の電子部品の実装方法であって、
複数個の搭載部位を具備する支持基板の、前記当該搭載部位に電子部品を搭載した後、前記支持基板を当該搭載部位ごとに分離する工程を有することを特徴とする電子部品の実装方法。
(付記14)
付記1乃至12記載の電子部品の実装方法であって、
複数のパッケージ基板部が形成された支持基板の、前記当該パッケージ基板部に電子部品を搭載した後、前記支持基板を当該パッケージ基板部ごとに分離する工程を有することを特徴とする電子部品の実装方法。
(付記15)
支持基板上の、複数の電子部品搭載部位のそれぞれに、接着剤を配設する工程と、
前記複数の電子部品搭載部位それぞれに、前記接着剤を介して電子部品を固着する工程と、を具備し、
前記複数の電子部品搭載部位のそれぞれに接着剤を配設する際、
一つの電子部品が搭載される搭載部位に配設される接着剤の体積重心を、当該一つの電子部品に先行して搭載される他の電子部品が搭載される搭載部位に対し当該他の電子部品が搭載される際に吸着ツールから噴出される圧気に対応して配置することを特徴とする電子部品の実装方法。
12、40、45、50、55、60、100、110、160 接着剤
15 ディスペンサ
20−1、20−2、20−3、20−4、20−5 半導体素子
26、28 吸着ツール
150 パッケージ基板部
Claims (10)
- 支持基板上の、複数の電子部品搭載部位のそれぞれに、接着剤を配設する工程と、
前記複数の電子部品搭載部位のそれぞれに、前記接着剤を介して電子部品を固着する工程と、を具備し、
前記複数の電子部品搭載部位のそれぞれに接着剤を配設する際、
N番目に電子部品が搭載される搭載部位に配置する接着剤の体積重心を、当該N番目に電子部品が搭載される搭載部位に近接して配置され且つN−1番目以前に電子部品が搭載される搭載部位に対して近づく方向に偏寄して配置することを特徴とする電子部品の実装方法。 - 支持基板上の、複数の電子部品搭載部位のそれぞれに、接着剤を配設する工程と、
前記複数の電子部品搭載部位のそれぞれに、前記接着剤を介して電子部品を固着する工程と、を具備し、
前記複数の電子部品搭載部位のそれぞれに接着剤を配設する際、
N番目に電子部品が搭載される搭載部位に配設される接着剤の体積重心を、N−1番目以前に電子部品が搭載される搭載部位に対し電子部品が搭載される際に吸着ツールから噴出される圧気に対応して配置することを特徴とする電子部品の実装方法。 - 請求項1又は2記載の電子部品の実装方法であって、
前記N番目に電子部品が搭載される搭載部位に配設される接着剤の体積重心を、前記N−1番目以前に前記電子部品が搭載される近接する搭載部位の面積中心に向かう方向に偏寄して配置することを特徴とする電子部品の実装方法。 - 支持基板上の、複数の電子部品搭載部位のそれぞれに接着剤を配設する工程と、
前記複数の電子部品搭載部位のそれぞれに、前記接着剤を介して電子部品を固着する工程と、を具備し、
前記複数の電子部品搭載部位のそれぞれに接着剤を配設する際、
N番目に電子部品が搭載される搭載部位に配設される接着剤の体積重心を、N−1番目以前に電子部品が搭載され、当該N番目に電子部品が搭載される搭載部位に近接する複数の搭載部位に於けるそれぞれの面積中心に向かう方向のベクトルの和の方向に偏寄して配置することを特徴とする電子部品の実装方法。 - 請求項1乃至4いずれか一項記載の電子部品の実装方法であって、
前記接着剤はディスペンス法により被着され、
当該接着剤は、支持基板の電子部品搭載部位にパターン描画されることを特徴とする電子部品の実装方法。 - 請求項5記載の電子部品の実装方法であって、
パターン描画される接着剤は、略直線形状又は略円形形状のパターン形状を有することを特徴とする電子部品の実装方法。 - 請求項5又は6記載の電子部品の実装方法であって、
N番目に電子部品が搭載される搭載部位に配設される接着剤のうち、少なくとも搭載部位の中心又は中心近傍に被着される接着剤は、N−1番目以前に電子部品が搭載され近接する搭載部位に於ける電子部品搭載時に吸着ツールから噴出される圧気に対応して配置されることを特徴とする電子部品の実装方法。 - 請求項1乃至7いずれか一項記載の電子部品の実装方法であって、
前記電子部品は、下面に外部接続端子が形成された半導体素子であることを特徴とする電子部品の実装方法。 - 請求項1乃至4いずれか一項記載の電子部品の実装方法であって、
複数個の搭載部位を具備する支持基板の、前記当該搭載部位に電子部品を搭載した後、前記支持基板を当該搭載部位ごとに分離する工程を有することを特徴とする電子部品の実装方法。 - 請求項1乃至4いずれか一項記載の電子部品の実装方法であって、
複数のパッケージ基板部が形成された支持基板の、前記当該パッケージ基板部に電子部品を搭載した後、前記支持基板を当該パッケージ基板部ごとに分離する工程を有することを特徴とする電子部品の実装方法。
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TW097100157A TWI381461B (zh) | 2007-02-15 | 2008-01-03 | 安裝電子組件之方法 |
US11/968,971 US8230590B2 (en) | 2007-02-15 | 2008-01-03 | Method for mounting electronic components |
KR1020080008438A KR100941644B1 (ko) | 2007-02-15 | 2008-01-28 | 전자부품의 실장 방법 |
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US11296015B2 (en) | 2016-08-04 | 2022-04-05 | Infineon Technologies Ag | Die attach methods and semiconductor devices manufactured based on such methods |
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JP7127269B2 (ja) * | 2017-10-23 | 2022-08-30 | 昭和電工マテリアルズ株式会社 | 部材接続方法 |
KR102074951B1 (ko) | 2019-07-11 | 2020-02-07 | 이연수 | 공기환경개선장치 |
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TWI381461B (zh) | 2013-01-01 |
US8230590B2 (en) | 2012-07-31 |
KR100941644B1 (ko) | 2010-02-11 |
TW200834759A (en) | 2008-08-16 |
CN101246826A (zh) | 2008-08-20 |
KR20080076731A (ko) | 2008-08-20 |
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US20080196245A1 (en) | 2008-08-21 |
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