JP2007533167A - ワークピース処理システム - Google Patents

ワークピース処理システム Download PDF

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Publication number
JP2007533167A
JP2007533167A JP2007508638A JP2007508638A JP2007533167A JP 2007533167 A JP2007533167 A JP 2007533167A JP 2007508638 A JP2007508638 A JP 2007508638A JP 2007508638 A JP2007508638 A JP 2007508638A JP 2007533167 A JP2007533167 A JP 2007533167A
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JP
Japan
Prior art keywords
workpiece
load lock
wafer
robot
low pressure
Prior art date
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Pending
Application number
JP2007508638A
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English (en)
Japanese (ja)
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JP2007533167A5 (enExample
Inventor
フェラーラ ジョセフ
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アクセリス テクノロジーズ インコーポレーテッド
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Publication of JP2007533167A publication Critical patent/JP2007533167A/ja
Publication of JP2007533167A5 publication Critical patent/JP2007533167A5/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • H01L21/67213—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one ion or electron beam chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67201—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the load-lock chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/139—Associated with semiconductor wafer handling including wafer charging or discharging means for vacuum chamber

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2007508638A 2004-04-16 2005-04-18 ワークピース処理システム Pending JP2007533167A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/826,419 US7246985B2 (en) 2004-04-16 2004-04-16 Work-piece processing system
PCT/US2005/013273 WO2006041530A2 (en) 2004-04-16 2005-04-18 Work-piece processing system

Publications (2)

Publication Number Publication Date
JP2007533167A true JP2007533167A (ja) 2007-11-15
JP2007533167A5 JP2007533167A5 (enExample) 2008-05-08

Family

ID=35096438

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007508638A Pending JP2007533167A (ja) 2004-04-16 2005-04-18 ワークピース処理システム

Country Status (7)

Country Link
US (2) US7246985B2 (enExample)
EP (1) EP1735822A2 (enExample)
JP (1) JP2007533167A (enExample)
KR (1) KR101276014B1 (enExample)
CN (1) CN100437898C (enExample)
TW (1) TWI347295B (enExample)
WO (1) WO2006041530A2 (enExample)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009534867A (ja) * 2006-04-24 2009-09-24 アクセリス テクノロジーズ， インコーポレイテッド ロードロック制御
WO2012098871A1 (ja) * 2011-01-20 2012-07-26 東京エレクトロン株式会社 真空処理装置
WO2020059574A1 (ja) * 2018-09-21 2020-03-26 東京エレクトロン株式会社 真空処理装置及び基板搬送方法
JP2020510310A (ja) * 2017-03-15 2020-04-02 ラム リサーチ コーポレーションＬａｍ Ｒｅｓｅａｒｃｈ Ｃｏｒｐｏｒａｔｉｏｎ リニア真空搬送モジュールを有する省スペースプラットフォームアーキテクチャ
JP2024526523A (ja) * 2021-10-12 2024-07-19 アプライド マテリアルズ インコーポレイテッド 組み込まれたロードロックと共に使用可能であるファクトリインターフェースロボット

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US20040221811A1 (en) * 2001-11-30 2004-11-11 Robert Mitchell Method and apparatus for processing wafers
US20060045668A1 (en) * 2004-07-19 2006-03-02 Grabowski Al W System for handling of wafers within a process tool
US7720558B2 (en) * 2004-09-04 2010-05-18 Applied Materials, Inc. Methods and apparatus for mapping carrier contents
US9110456B2 (en) * 2004-09-08 2015-08-18 Abb Research Ltd. Robotic machining with a flexible manipulator
JP4907077B2 (ja) * 2004-11-30 2012-03-28 株式会社Ｓｅｎ ウエハ処理装置及びウエハ処理方法並びにイオン注入装置
CN101128177A (zh) * 2004-12-22 2008-02-20 智能医院体系有限公司 自动配药系统（apas）
US7604449B1 (en) * 2005-06-27 2009-10-20 Kla-Tencor Technologies Corporation Equipment front end module
US7534080B2 (en) * 2005-08-26 2009-05-19 Ascentool, Inc. Vacuum processing and transfer system
US8153513B2 (en) * 2006-07-25 2012-04-10 Silicon Genesis Corporation Method and system for continuous large-area scanning implantation process
US7740437B2 (en) 2006-09-22 2010-06-22 Asm International N.V. Processing system with increased cassette storage capacity
JP4664264B2 (ja) * 2006-10-26 2011-04-06 東京エレクトロン株式会社 検出装置及び検出方法
US20080138178A1 (en) * 2006-12-06 2008-06-12 Axcelis Technologies,Inc. High throughput serial wafer handling end station
US7585142B2 (en) * 2007-03-16 2009-09-08 Asm America, Inc. Substrate handling chamber with movable substrate carrier loading platform
US8752449B2 (en) 2007-05-08 2014-06-17 Brooks Automation, Inc. Substrate transport apparatus with multiple movable arms utilizing a mechanical switch mechanism
US8823294B2 (en) 2007-06-27 2014-09-02 Brooks Automation, Inc. Commutation of an electromagnetic propulsion and guidance system
US8659205B2 (en) 2007-06-27 2014-02-25 Brooks Automation, Inc. Motor stator with lift capability and reduced cogging characteristics
US8283813B2 (en) * 2007-06-27 2012-10-09 Brooks Automation, Inc. Robot drive with magnetic spindle bearings
US9752615B2 (en) 2007-06-27 2017-09-05 Brooks Automation, Inc. Reduced-complexity self-bearing brushless DC motor
JP5416104B2 (ja) 2007-06-27 2014-02-12 ブルックス オートメーション インコーポレイテッド セルフベアリングモータ用位置フィードバック
KR101660894B1 (ko) 2007-06-27 2016-10-10 브룩스 오토메이션 인코퍼레이티드 다차원 위치 센서
CN101801817B (zh) 2007-07-17 2015-07-22 布鲁克斯自动化公司 具备集成到室壁上的电动机的基片加工装置
WO2011007753A1 (ja) * 2009-07-14 2011-01-20 キヤノンアネルバ株式会社 基板処理装置
JP5465979B2 (ja) * 2009-10-26 2014-04-09 東京エレクトロン株式会社 半導体製造装置
JP5476171B2 (ja) * 2010-03-16 2014-04-23 株式会社日立ハイテクノロジーズ 真空処理装置
JP5755842B2 (ja) * 2010-04-22 2015-07-29 株式会社ダイヘン ワーク搬送システム
CN102310999B (zh) * 2010-07-09 2013-07-17 上海凯世通半导体有限公司 真空传输制程设备及方法
JP5503006B2 (ja) * 2010-08-06 2014-05-28 東京エレクトロン株式会社 基板処理システム、搬送モジュール、基板処理方法及び半導体素子の製造方法
JP5494617B2 (ja) * 2011-10-26 2014-05-21 株式会社安川電機 ロボットシステムおよび加工品の製造方法
CN102539263A (zh) * 2011-11-29 2012-07-04 南通大学 基于掩蔽处理技术的轻微磨损测量方法
US9139402B2 (en) * 2012-02-21 2015-09-22 Altec Industries, Inc. Retractable load guide
JP6002532B2 (ja) * 2012-10-10 2016-10-05 株式会社日立ハイテクノロジーズ 真空処理装置及び真空処理方法
US10328580B2 (en) * 2013-08-09 2019-06-25 Persimmon Technologies Corporation Reduced footprint substrate transport vacuum platform
CN104016175A (zh) * 2014-05-26 2014-09-03 王义峰 一种丝网印刷机的自动输出机构
JP6257455B2 (ja) * 2014-06-17 2018-01-10 住友重機械イオンテクノロジー株式会社 イオン注入装置及びイオン注入装置の制御方法
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CN107111251B (zh) * 2014-11-14 2020-10-20 Asml荷兰有限公司 用于在光刻系统中转移基材的加载锁定系统和方法
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JP6493339B2 (ja) * 2016-08-26 2019-04-03 村田機械株式会社 搬送容器、及び収容物の移載方法
CN108695217B (zh) * 2017-04-07 2021-06-29 台湾积体电路制造股份有限公司 衬底传送装置及其端缘作用器
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Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009534867A (ja) * 2006-04-24 2009-09-24 アクセリス テクノロジーズ， インコーポレイテッド ロードロック制御
WO2012098871A1 (ja) * 2011-01-20 2012-07-26 東京エレクトロン株式会社 真空処理装置
JP6006643B2 (ja) * 2011-01-20 2016-10-12 東京エレクトロン株式会社 真空処理装置
JP7275039B2 (ja) 2017-03-15 2023-05-17 ラム リサーチ コーポレーション リニア真空搬送モジュールを有する省スペースプラットフォームアーキテクチャ
JP7608512B2 (ja) 2017-03-15 2025-01-06 ラム リサーチ コーポレーション リニア真空搬送モジュールを有する省スペースプラットフォームアーキテクチャ
JP2020510310A (ja) * 2017-03-15 2020-04-02 ラム リサーチ コーポレーションＬａｍ Ｒｅｓｅａｒｃｈ Ｃｏｒｐｏｒａｔｉｏｎ リニア真空搬送モジュールを有する省スペースプラットフォームアーキテクチャ
JP2023099172A (ja) * 2017-03-15 2023-07-11 ラム リサーチ コーポレーション リニア真空搬送モジュールを有する省スペースプラットフォームアーキテクチャ
JP7210960B2 (ja) 2018-09-21 2023-01-24 東京エレクトロン株式会社 真空処理装置及び基板搬送方法
JP2020053418A (ja) * 2018-09-21 2020-04-02 東京エレクトロン株式会社 真空処理装置及び基板搬送方法
TWI844566B (zh) * 2018-09-21 2024-06-11 日商東京威力科創股份有限公司 真空處理裝置及基板搬送方法
WO2020059574A1 (ja) * 2018-09-21 2020-03-26 東京エレクトロン株式会社 真空処理装置及び基板搬送方法
JP2024526523A (ja) * 2021-10-12 2024-07-19 アプライド マテリアルズ インコーポレイテッド 組み込まれたロードロックと共に使用可能であるファクトリインターフェースロボット
JP7704895B2 (ja) 2021-10-12 2025-07-08 アプライド マテリアルズ インコーポレイテッド 組み込まれたロードロックと共に使用可能であるファクトリインターフェースロボット

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US7246985B2 (en) 2007-07-24
WO2006041530A2 (en) 2006-04-20
EP1735822A2 (en) 2006-12-27
TWI347295B (en) 2011-08-21
TW200540087A (en) 2005-12-16
KR20070012490A (ko) 2007-01-25
CN1943009A (zh) 2007-04-04
US20070243049A1 (en) 2007-10-18
KR101276014B1 (ko) 2013-06-19
CN100437898C (zh) 2008-11-26

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