JP7382924B2 - 独立型の付属フィードスルーを備えた基板搬送装置 - Google Patents
独立型の付属フィードスルーを備えた基板搬送装置 Download PDFInfo
- Publication number
- JP7382924B2 JP7382924B2 JP2020519405A JP2020519405A JP7382924B2 JP 7382924 B2 JP7382924 B2 JP 7382924B2 JP 2020519405 A JP2020519405 A JP 2020519405A JP 2020519405 A JP2020519405 A JP 2020519405A JP 7382924 B2 JP7382924 B2 JP 7382924B2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- motor
- arm
- substrate transfer
- drive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000000758 substrate Substances 0.000 title claims description 381
- 238000012546 transfer Methods 0.000 title claims description 191
- 230000033001 locomotion Effects 0.000 claims description 76
- 230000005540 biological transmission Effects 0.000 claims description 75
- 238000012545 processing Methods 0.000 claims description 67
- 239000012636 effector Substances 0.000 claims description 58
- 238000000034 method Methods 0.000 claims description 45
- 230000007246 mechanism Effects 0.000 claims description 26
- 235000012431 wafers Nutrition 0.000 claims description 15
- 238000011065 in-situ storage Methods 0.000 claims description 9
- 238000012544 monitoring process Methods 0.000 claims description 9
- 230000000694 effects Effects 0.000 claims description 8
- 230000032258 transport Effects 0.000 description 91
- 210000000245 forearm Anatomy 0.000 description 24
- 239000004065 semiconductor Substances 0.000 description 20
- 238000010586 diagram Methods 0.000 description 15
- 230000008569 process Effects 0.000 description 13
- 210000003857 wrist joint Anatomy 0.000 description 13
- 210000002310 elbow joint Anatomy 0.000 description 10
- 210000000707 wrist Anatomy 0.000 description 6
- 230000008878 coupling Effects 0.000 description 4
- 238000010168 coupling process Methods 0.000 description 4
- 238000005859 coupling reaction Methods 0.000 description 4
- 238000006073 displacement reaction Methods 0.000 description 4
- 238000002955 isolation Methods 0.000 description 4
- 230000004888 barrier function Effects 0.000 description 3
- 239000000872 buffer Substances 0.000 description 3
- 238000004320 controlled atmosphere Methods 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 238000013507 mapping Methods 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 210000000323 shoulder joint Anatomy 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 238000000231 atomic layer deposition Methods 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 230000009977 dual effect Effects 0.000 description 2
- 238000000407 epitaxy Methods 0.000 description 2
- 210000001503 joint Anatomy 0.000 description 2
- 230000005291 magnetic effect Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 239000003302 ferromagnetic material Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 238000002513 implantation Methods 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000005468 ion implantation Methods 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000001020 plasma etching Methods 0.000 description 1
- 238000010248 power generation Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000013519 translation Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 238000013022 venting Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J9/00—Programme-controlled manipulators
- B25J9/02—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type
- B25J9/04—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type by rotating at least one arm, excluding the head movement itself, e.g. cylindrical coordinate type or polar coordinate type
- B25J9/041—Cylindrical coordinate type
- B25J9/042—Cylindrical coordinate type comprising an articulated arm
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J15/00—Gripping heads and other end effectors
- B25J15/0052—Gripping heads and other end effectors multiple gripper units or multiple end effectors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J17/00—Joints
- B25J17/02—Wrist joints
- B25J17/0283—Three-dimensional joints
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J9/00—Programme-controlled manipulators
- B25J9/06—Programme-controlled manipulators characterised by multi-articulated arms
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J9/00—Programme-controlled manipulators
- B25J9/10—Programme-controlled manipulators characterised by positioning means for manipulator elements
- B25J9/106—Programme-controlled manipulators characterised by positioning means for manipulator elements with articulated links
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J9/00—Programme-controlled manipulators
- B25J9/10—Programme-controlled manipulators characterised by positioning means for manipulator elements
- B25J9/106—Programme-controlled manipulators characterised by positioning means for manipulator elements with articulated links
- B25J9/1065—Programme-controlled manipulators characterised by positioning means for manipulator elements with articulated links with parallelograms
- B25J9/107—Programme-controlled manipulators characterised by positioning means for manipulator elements with articulated links with parallelograms of the froglegs type
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J9/00—Programme-controlled manipulators
- B25J9/16—Programme controls
- B25J9/1615—Programme controls characterised by special kind of manipulator, e.g. planar, scara, gantry, cantilever, space, closed chain, passive/active joints and tendon driven manipulators
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
- H01L21/67265—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
Landscapes
- Engineering & Computer Science (AREA)
- Robotics (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Health & Medical Sciences (AREA)
- General Health & Medical Sciences (AREA)
- Orthopedic Medicine & Surgery (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Manipulator (AREA)
- Threshing Machine Elements (AREA)
- Auxiliary Devices For And Details Of Packaging Control (AREA)
Description
本特許出願は、2017年10月5日に出願された米国仮特許出願第62/568,541号の優先権および利益を主張するものであり、本開示はその全体が参照により本明細書に組み込まれる。
例示的な実施形態は、概して、基板処理装置に関し、より具体的には、基板搬送装置に関する。
Claims (19)
- 基板搬送装置であって、前記基板搬送装置が、
フレームと、
前記フレームに接続された基板搬送アームであって、エンドエフェクタを有する基板搬送アームと、
前記基板搬送アームに連結された少なくとも1つのモータを有する駆動セクションであって、前記少なくとも1つのモータが、前記基板搬送アームの各運動学的動作をもたらすように構成された前記駆動セクションの運動学的部分を画定し、前記駆動セクションが、前記運動学的部分に隣接した付属部分を含み、前記付属部分が、前記少なくとも1つのモータとは異なり、別個である、別のモータを有し、前記付属部分の前記別のモータが、前記基板搬送アームの各運動学的動作とは無関係に、1つまたは複数の付属デバイスに動作可能に連結され、1つまたは複数の付属デバイスを駆動するように構成されている、駆動セクションと
を備える、基板搬送装置。 - 前記付属部分の前記別のモータが、少なくとも1つの運動学的トランスミッション連結部を介して前記1つまたは複数の付属デバイスを駆動する、請求項1記載の基板搬送装置。
- 前記基板搬送アームが関節アームであり、前記少なくとも1つの運動学的トランスミッション連結部が前記関節アームの少なくとも1つの関節ジョイントを横切って延在する、請求項2記載の基板搬送装置。
- 前記1つまたは複数の付属デバイスが、グリッパ機構、ウエハアライナ、または電力生成機の1つまたは複数を備える、請求項1記載の基板搬送装置。
- 前記グリッパ機構が、ウエハの縁部を把持する、または前記ウエハの上面および背面を垂直に把持するように構成されている、請求項4記載の基板搬送装置。
- 前記ウエハアライナが、前記付属部分の前記別のモータからのフィードバックを介して、欠落しているウエハを検出すること、ウエハ厚さを検出すること、およびその場での動きをモニタリングすることのうちの1つまたは複数のために構成されている、請求項4記載の基板搬送装置。
- 前記少なくとも1つのモータが、前記基板搬送アームにN自由度を提供するN個のモータである、請求項1記載の基板搬送装置。
- 前記少なくとも1つのモータが3つのモータを備え、前記3つのモータの各々が、前記基板搬送アームの垂直、回転、または水平面の動作のそれぞれ1つを駆動するように構成されている、請求項1記載の基板搬送装置。
- 前記基板搬送装置が、処理装置用の少なくとも1つのツールを備える、請求項1記載の基板搬送装置。
- 基板搬送装置のフレームを提供することと、
前記フレームに接続された基板搬送アームを提供することであって、前記基板搬送アームがエンドエフェクタを有する、基板搬送アームを提供することと、
駆動セクションを提供することであって、前記駆動セクションが、前記基板搬送アームに連結された少なくとも1つのモータ、および前記少なくとも1つのモータに隣接した別のモータを有し、前記少なくとも1つのモータが、前記駆動セクションの運動学的部分を画定し、前記別のモータが、前記少なくとも1つのモータとは異なり、別個であり、付属部分を画定する、駆動セクションを提供することと、
前記少なくとも1つのモータを用いて、前記基板搬送アームの各運動学的動作を駆動することと、
前記別のモータを用いて、前記基板搬送アームの各運動学的動作とは無関係に、1つまたは複数の付属デバイスを駆動することと
を含む方法。 - 前記付属部分の前記別のモータの少なくとも1つの運動学的トランスミッション連結部を用いて、前記1つまたは複数の付属デバイスを駆動することをさらに含む、請求項10記載の方法。
- 前記基板搬送アームが関節アームであり、前記少なくとも1つの運動学的トランスミッション連結部が前記関節アームの少なくとも1つの関節ジョイントを横切って延在する、請求項11記載の方法。
- 前記1つまたは複数の付属デバイスが、グリッパ機構、ウエハアライナ、または電力生成機の1つまたは複数を備える、請求項10記載の方法。
- 前記グリッパ機構を用いて、ウエハの縁部を把持すること、または前記ウエハの上面および背面を垂直に把持することをさらに含む、請求項13記載の方法。
- 前記ウエハアライナを用いて、前記付属部分の前記別のモータからのフィードバックを介して、欠落しているウエハを検出すること、ウエハ厚さを検出すること、および/またはその場での動きをモニタリングすることをさらに含む、請求項13記載の方法。
- 前記少なくとも1つのモータが、前記基板搬送アームにN自由度を提供するN個のモータである、請求項10記載の方法。
- 前記少なくとも1つのモータが3つのモータを備え、前記方法が、前記3つのモータの各々を用いて、前記基板搬送アームの垂直、回転、または水平面の動作のそれぞれ1つを駆動することをさらに含む、請求項10記載の方法。
- 動作中の前記基板搬送アーム上で前記1つまたは複数の付属デバイスを動作させることをさらに含む、請求項10記載の方法。
- ウエハ保持ステーションにおいて、前記基板搬送アーム上で前記1つまたは複数の付属デバイスを動作させることをさらに含む、請求項10記載の方法。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2023131390A JP2023154038A (ja) | 2017-10-05 | 2023-08-10 | 独立型の付属フィードスルーを備えた基板搬送装置 |
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201762568541P | 2017-10-05 | 2017-10-05 | |
US62/568,541 | 2017-10-05 | ||
US16/151,598 | 2018-10-04 | ||
US16/151,598 US11020852B2 (en) | 2017-10-05 | 2018-10-04 | Substrate transport apparatus with independent accessory feedthrough |
PCT/US2018/054525 WO2019071077A1 (en) | 2017-10-05 | 2018-10-05 | SUBSTRATE TRANSPORT APPARATUS WITH INDEPENDENT ACCESSORY CROSSING |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2023131390A Division JP2023154038A (ja) | 2017-10-05 | 2023-08-10 | 独立型の付属フィードスルーを備えた基板搬送装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2020537339A JP2020537339A (ja) | 2020-12-17 |
JP7382924B2 true JP7382924B2 (ja) | 2023-11-17 |
Family
ID=65992830
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2020519405A Active JP7382924B2 (ja) | 2017-10-05 | 2018-10-05 | 独立型の付属フィードスルーを備えた基板搬送装置 |
JP2023131390A Pending JP2023154038A (ja) | 2017-10-05 | 2023-08-10 | 独立型の付属フィードスルーを備えた基板搬送装置 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2023131390A Pending JP2023154038A (ja) | 2017-10-05 | 2023-08-10 | 独立型の付属フィードスルーを備えた基板搬送装置 |
Country Status (7)
Country | Link |
---|---|
US (2) | US11020852B2 (ja) |
EP (1) | EP3691836A1 (ja) |
JP (2) | JP7382924B2 (ja) |
KR (1) | KR102643087B1 (ja) |
CN (2) | CN117637564A (ja) |
TW (1) | TWI786199B (ja) |
WO (1) | WO2019071077A1 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWM600933U (zh) * | 2020-05-07 | 2020-09-01 | 鈦昇科技股份有限公司 | 晶圓裝卸機 |
JP2023005881A (ja) * | 2021-06-29 | 2023-01-18 | 東京エレクトロン株式会社 | 成膜装置、および成膜装置のクリーニング方法 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000506789A (ja) | 1996-03-22 | 2000-06-06 | ジェンマーク オートメーション インコーポレイテッド | 多自由度ロボット |
JP2001096480A (ja) | 1999-09-28 | 2001-04-10 | Tatsumo Kk | 水平多関節型産業用ロボット |
JP2003165086A (ja) | 2001-11-27 | 2003-06-10 | Toshiba Mach Co Ltd | 産業用ロボット、これを用いた加工方法およびエンドエフェクタ |
JP2009099845A (ja) | 2007-10-18 | 2009-05-07 | Yaskawa Electric Corp | 基板アライメント機構を備えた搬送ロボット及びそれを備えた半導体製造装置 |
JP2012074485A (ja) | 2010-09-28 | 2012-04-12 | Tokyo Electron Ltd | 基板処理装置及び基板搬送方法並びにその方法を実施するためのプログラムを記憶する記憶媒体 |
JP2017085127A (ja) | 2011-03-11 | 2017-05-18 | ブルックス オートメーション インコーポレイテッド | 基板処理ツール |
Family Cites Families (45)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4181465A (en) * | 1975-02-13 | 1980-01-01 | Aktiebolaget Electrolux | Apparatus utilizing magnetic means for transferring articles to and from predetermined positions |
US4555217A (en) | 1983-01-06 | 1985-11-26 | Intelledex Incorporated | Robot arm with split wrist motion |
US4606695A (en) | 1984-05-18 | 1986-08-19 | Kurt Manufacturing Company, Inc. | Multiple axis robot arm |
US4897015A (en) | 1987-05-15 | 1990-01-30 | Ade Corporation | Rotary to linear motion robot arm |
US5007784A (en) | 1989-01-20 | 1991-04-16 | Genmark Automation | Dual end effector robotic arm |
US5700046A (en) | 1995-09-13 | 1997-12-23 | Silicon Valley Group, Inc. | Wafer gripper |
US5624398A (en) | 1996-02-08 | 1997-04-29 | Symbiosis Corporation | Endoscopic robotic surgical tools and methods |
US6121743A (en) | 1996-03-22 | 2000-09-19 | Genmark Automation, Inc. | Dual robotic arm end effectors having independent yaw motion |
EP2362285B1 (en) | 1997-09-19 | 2015-03-25 | Massachusetts Institute of Technology | Robotic apparatus |
US6155773A (en) | 1997-09-22 | 2000-12-05 | Applied Materials, Inc. | Substrate clamping apparatus |
US6692485B1 (en) | 1998-02-24 | 2004-02-17 | Endovia Medical, Inc. | Articulated apparatus for telemanipulator system |
US6167322A (en) | 1998-07-10 | 2000-12-26 | Holbrooks; Orville Ray | Intelligent wafer handling system and method |
IL143467A (en) | 1998-12-02 | 2005-05-17 | Newport Corp | Specimen holding robotic arm and effector |
US6256555B1 (en) | 1998-12-02 | 2001-07-03 | Newport Corporation | Robot arm with specimen edge gripping end effector |
US6322312B1 (en) | 1999-03-18 | 2001-11-27 | Applied Materials, Inc. | Mechanical gripper for wafer handling robots |
US6491330B1 (en) | 1999-05-04 | 2002-12-10 | Ade Corporation | Edge gripping end effector wafer handling apparatus |
US6828772B1 (en) | 2000-06-14 | 2004-12-07 | Micron Technology, Inc. | Rotating gripper wafer flipper |
US6468022B1 (en) | 2000-07-05 | 2002-10-22 | Integrated Dynamics Engineering, Inc. | Edge-gripping pre-aligner |
US6435807B1 (en) | 2000-12-14 | 2002-08-20 | Genmark Automation | Integrated edge gripper |
US6623235B2 (en) | 2001-04-11 | 2003-09-23 | Pri Automation, Inc. | Robot arm edge gripping device for handling substrates using two four-bar linkages |
US20030035711A1 (en) * | 2001-07-14 | 2003-02-20 | Ulysses Gilchrist | Centering double side edge grip end effector with integrated mapping sensor |
US7891935B2 (en) * | 2002-05-09 | 2011-02-22 | Brooks Automation, Inc. | Dual arm robot |
US8167522B2 (en) | 2005-03-30 | 2012-05-01 | Brooks Automation, Inc. | Substrate transport apparatus with active edge gripper |
US8573919B2 (en) | 2005-07-11 | 2013-11-05 | Brooks Automation, Inc. | Substrate transport apparatus |
US7712808B2 (en) | 2005-09-29 | 2010-05-11 | Brooks Automation, Inc. | End effector with centering grip |
US8551114B2 (en) | 2006-11-06 | 2013-10-08 | Human Robotics S.A. De C.V. | Robotic surgical device |
US8376428B2 (en) | 2006-11-15 | 2013-02-19 | Dynamic Micro System Semiconductor Equipment GmbH | Integrated gripper for workpiece transfer |
US20080213076A1 (en) | 2007-03-02 | 2008-09-04 | Stephen Hanson | Edge grip end effector |
US8752449B2 (en) | 2007-05-08 | 2014-06-17 | Brooks Automation, Inc. | Substrate transport apparatus with multiple movable arms utilizing a mechanical switch mechanism |
JP5823742B2 (ja) | 2010-07-02 | 2015-11-25 | 芝浦メカトロニクス株式会社 | 把持装置、搬送装置、処理装置、および電子デバイスの製造方法 |
WO2012064949A1 (en) * | 2010-11-10 | 2012-05-18 | Brooks Automation, Inc. | Dual arm robot |
KR101829397B1 (ko) * | 2011-09-16 | 2018-02-19 | 퍼시몬 테크놀로지스 코포레이션 | 낮은 가변성을 가진 로봇 |
US9076830B2 (en) * | 2011-11-03 | 2015-07-07 | Applied Materials, Inc. | Robot systems and apparatus adapted to transport dual substrates in electronic device manufacturing with wrist drive motors mounted to upper arm |
US9401296B2 (en) | 2011-11-29 | 2016-07-26 | Persimmon Technologies Corporation | Vacuum robot adapted to grip and transport a substrate and method thereof with passive bias |
JP2013136141A (ja) | 2011-11-30 | 2013-07-11 | Canon Inc | 把持装置、ロボット装置及び把持装置の制御方法 |
KR102135466B1 (ko) * | 2011-12-16 | 2020-07-17 | 브룩스 오토메이션 인코퍼레이티드 | 이송 장치 |
TWI725303B (zh) * | 2012-02-10 | 2021-04-21 | 美商布魯克斯自動機械公司 | 基材處理設備 |
US9149936B2 (en) * | 2013-01-18 | 2015-10-06 | Persimmon Technologies, Corp. | Robot having arm with unequal link lengths |
JP6594304B2 (ja) * | 2013-10-18 | 2019-10-23 | ブルックス オートメーション インコーポレイテッド | 処理装置 |
US9352471B1 (en) | 2015-01-21 | 2016-05-31 | Applied Materials, Inc. | Substrate gripper apparatus and methods |
CN107251211B (zh) * | 2015-02-13 | 2020-10-23 | 川崎重工业株式会社 | 衬底搬送机械手及其运转方法 |
CN107408526B (zh) * | 2015-03-12 | 2022-03-15 | 柿子技术公司 | 具有从动末端执行器运动的机器人 |
CA3029355A1 (en) * | 2015-05-22 | 2016-11-22 | Covidien Lp | Surgical instruments and methods for performing tonsillectomy, adenoidectomy, and other surgical procedures |
JP6692078B2 (ja) * | 2016-02-19 | 2020-05-13 | パナソニックIpマネジメント株式会社 | 電動装置 |
US10155309B1 (en) * | 2017-11-16 | 2018-12-18 | Lam Research Corporation | Wafer handling robots with rotational joint encoders |
-
2018
- 2018-10-04 US US16/151,598 patent/US11020852B2/en active Active
- 2018-10-05 CN CN202311681466.8A patent/CN117637564A/zh active Pending
- 2018-10-05 EP EP18864263.1A patent/EP3691836A1/en not_active Withdrawn
- 2018-10-05 JP JP2020519405A patent/JP7382924B2/ja active Active
- 2018-10-05 WO PCT/US2018/054525 patent/WO2019071077A1/en unknown
- 2018-10-05 TW TW107135224A patent/TWI786199B/zh active
- 2018-10-05 KR KR1020207012892A patent/KR102643087B1/ko active IP Right Grant
- 2018-10-05 CN CN201880078979.0A patent/CN111432986B/zh active Active
-
2021
- 2021-06-01 US US17/335,479 patent/US20210291357A1/en active Pending
-
2023
- 2023-08-10 JP JP2023131390A patent/JP2023154038A/ja active Pending
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000506789A (ja) | 1996-03-22 | 2000-06-06 | ジェンマーク オートメーション インコーポレイテッド | 多自由度ロボット |
JP2001096480A (ja) | 1999-09-28 | 2001-04-10 | Tatsumo Kk | 水平多関節型産業用ロボット |
JP2003165086A (ja) | 2001-11-27 | 2003-06-10 | Toshiba Mach Co Ltd | 産業用ロボット、これを用いた加工方法およびエンドエフェクタ |
JP2009099845A (ja) | 2007-10-18 | 2009-05-07 | Yaskawa Electric Corp | 基板アライメント機構を備えた搬送ロボット及びそれを備えた半導体製造装置 |
JP2012074485A (ja) | 2010-09-28 | 2012-04-12 | Tokyo Electron Ltd | 基板処理装置及び基板搬送方法並びにその方法を実施するためのプログラムを記憶する記憶媒体 |
JP2017085127A (ja) | 2011-03-11 | 2017-05-18 | ブルックス オートメーション インコーポレイテッド | 基板処理ツール |
Also Published As
Publication number | Publication date |
---|---|
KR102643087B1 (ko) | 2024-03-05 |
JP2020537339A (ja) | 2020-12-17 |
EP3691836A1 (en) | 2020-08-12 |
JP2023154038A (ja) | 2023-10-18 |
CN111432986B (zh) | 2024-03-08 |
TW201922603A (zh) | 2019-06-16 |
KR20200064120A (ko) | 2020-06-05 |
WO2019071077A4 (en) | 2019-05-16 |
US20210291357A1 (en) | 2021-09-23 |
US11020852B2 (en) | 2021-06-01 |
TWI786199B (zh) | 2022-12-11 |
WO2019071077A1 (en) | 2019-04-11 |
CN117637564A (zh) | 2024-03-01 |
CN111432986A (zh) | 2020-07-17 |
US20190105770A1 (en) | 2019-04-11 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP7263641B2 (ja) | 基板搬送装置 | |
KR101519642B1 (ko) | 불균등 링크 스카라 아암 | |
JP6705750B2 (ja) | 基板搬送装置 | |
JP6662559B2 (ja) | 機械的スイッチ機構を利用する複数の可動アームを有する基板搬送装置 | |
EP3510633B1 (en) | Substrate processing apparatus | |
JP2023154038A (ja) | 独立型の付属フィードスルーを備えた基板搬送装置 | |
KR20160047556A (ko) | 기판 이송 장치 | |
CN115244674B (zh) | 基板处理设备 | |
US20240178032A1 (en) | Substrate transport apparatus | |
EP3039714A1 (en) | Substrate transport apparatus | |
TWI829700B (zh) | 基板運送裝置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20210506 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20220613 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20220621 |
|
A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20220909 |
|
A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20221109 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20221221 |
|
A711 | Notification of change in applicant |
Free format text: JAPANESE INTERMEDIATE CODE: A711 Effective date: 20230209 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20230310 |
|
A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20230418 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20230810 |
|
A911 | Transfer to examiner for re-examination before appeal (zenchi) |
Free format text: JAPANESE INTERMEDIATE CODE: A911 Effective date: 20230823 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20231010 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20231107 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 7382924 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |