JP2007533167A5 - - Google Patents

Download PDF

Info

Publication number
JP2007533167A5
JP2007533167A5 JP2007508638A JP2007508638A JP2007533167A5 JP 2007533167 A5 JP2007533167 A5 JP 2007533167A5 JP 2007508638 A JP2007508638 A JP 2007508638A JP 2007508638 A JP2007508638 A JP 2007508638A JP 2007533167 A5 JP2007533167 A5 JP 2007533167A5
Authority
JP
Japan
Prior art keywords
workpiece
load lock
load
low pressure
wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2007508638A
Other languages
English (en)
Japanese (ja)
Other versions
JP2007533167A (ja
Filing date
Publication date
Priority claimed from US10/826,419 external-priority patent/US7246985B2/en
Application filed filed Critical
Publication of JP2007533167A publication Critical patent/JP2007533167A/ja
Publication of JP2007533167A5 publication Critical patent/JP2007533167A5/ja
Pending legal-status Critical Current

Links

JP2007508638A 2004-04-16 2005-04-18 ワークピース処理システム Pending JP2007533167A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/826,419 US7246985B2 (en) 2004-04-16 2004-04-16 Work-piece processing system
PCT/US2005/013273 WO2006041530A2 (en) 2004-04-16 2005-04-18 Work-piece processing system

Publications (2)

Publication Number Publication Date
JP2007533167A JP2007533167A (ja) 2007-11-15
JP2007533167A5 true JP2007533167A5 (enExample) 2008-05-08

Family

ID=35096438

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007508638A Pending JP2007533167A (ja) 2004-04-16 2005-04-18 ワークピース処理システム

Country Status (7)

Country Link
US (2) US7246985B2 (enExample)
EP (1) EP1735822A2 (enExample)
JP (1) JP2007533167A (enExample)
KR (1) KR101276014B1 (enExample)
CN (1) CN100437898C (enExample)
TW (1) TWI347295B (enExample)
WO (1) WO2006041530A2 (enExample)

Families Citing this family (48)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040221811A1 (en) * 2001-11-30 2004-11-11 Robert Mitchell Method and apparatus for processing wafers
US20060045668A1 (en) * 2004-07-19 2006-03-02 Grabowski Al W System for handling of wafers within a process tool
US7720558B2 (en) * 2004-09-04 2010-05-18 Applied Materials, Inc. Methods and apparatus for mapping carrier contents
US9110456B2 (en) * 2004-09-08 2015-08-18 Abb Research Ltd. Robotic machining with a flexible manipulator
JP4907077B2 (ja) * 2004-11-30 2012-03-28 株式会社Sen ウエハ処理装置及びウエハ処理方法並びにイオン注入装置
CN101128177A (zh) * 2004-12-22 2008-02-20 智能医院体系有限公司 自动配药系统(apas)
US7604449B1 (en) * 2005-06-27 2009-10-20 Kla-Tencor Technologies Corporation Equipment front end module
US7534080B2 (en) * 2005-08-26 2009-05-19 Ascentool, Inc. Vacuum processing and transfer system
US7381969B2 (en) * 2006-04-24 2008-06-03 Axcelis Technologies, Inc. Load lock control
US8153513B2 (en) * 2006-07-25 2012-04-10 Silicon Genesis Corporation Method and system for continuous large-area scanning implantation process
US7740437B2 (en) 2006-09-22 2010-06-22 Asm International N.V. Processing system with increased cassette storage capacity
JP4664264B2 (ja) * 2006-10-26 2011-04-06 東京エレクトロン株式会社 検出装置及び検出方法
US20080138178A1 (en) * 2006-12-06 2008-06-12 Axcelis Technologies,Inc. High throughput serial wafer handling end station
US7585142B2 (en) * 2007-03-16 2009-09-08 Asm America, Inc. Substrate handling chamber with movable substrate carrier loading platform
US8752449B2 (en) 2007-05-08 2014-06-17 Brooks Automation, Inc. Substrate transport apparatus with multiple movable arms utilizing a mechanical switch mechanism
US8823294B2 (en) 2007-06-27 2014-09-02 Brooks Automation, Inc. Commutation of an electromagnetic propulsion and guidance system
US8659205B2 (en) 2007-06-27 2014-02-25 Brooks Automation, Inc. Motor stator with lift capability and reduced cogging characteristics
US8283813B2 (en) * 2007-06-27 2012-10-09 Brooks Automation, Inc. Robot drive with magnetic spindle bearings
US9752615B2 (en) 2007-06-27 2017-09-05 Brooks Automation, Inc. Reduced-complexity self-bearing brushless DC motor
JP5416104B2 (ja) 2007-06-27 2014-02-12 ブルックス オートメーション インコーポレイテッド セルフベアリングモータ用位置フィードバック
KR101660894B1 (ko) 2007-06-27 2016-10-10 브룩스 오토메이션 인코퍼레이티드 다차원 위치 센서
CN101801817B (zh) 2007-07-17 2015-07-22 布鲁克斯自动化公司 具备集成到室壁上的电动机的基片加工装置
WO2011007753A1 (ja) * 2009-07-14 2011-01-20 キヤノンアネルバ株式会社 基板処理装置
JP5465979B2 (ja) * 2009-10-26 2014-04-09 東京エレクトロン株式会社 半導体製造装置
JP5476171B2 (ja) * 2010-03-16 2014-04-23 株式会社日立ハイテクノロジーズ 真空処理装置
JP5755842B2 (ja) * 2010-04-22 2015-07-29 株式会社ダイヘン ワーク搬送システム
CN102310999B (zh) * 2010-07-09 2013-07-17 上海凯世通半导体有限公司 真空传输制程设备及方法
JP5503006B2 (ja) * 2010-08-06 2014-05-28 東京エレクトロン株式会社 基板処理システム、搬送モジュール、基板処理方法及び半導体素子の製造方法
JP6006643B2 (ja) * 2011-01-20 2016-10-12 東京エレクトロン株式会社 真空処理装置
JP5494617B2 (ja) * 2011-10-26 2014-05-21 株式会社安川電機 ロボットシステムおよび加工品の製造方法
CN102539263A (zh) * 2011-11-29 2012-07-04 南通大学 基于掩蔽处理技术的轻微磨损测量方法
US9139402B2 (en) * 2012-02-21 2015-09-22 Altec Industries, Inc. Retractable load guide
JP6002532B2 (ja) * 2012-10-10 2016-10-05 株式会社日立ハイテクノロジーズ 真空処理装置及び真空処理方法
US10328580B2 (en) * 2013-08-09 2019-06-25 Persimmon Technologies Corporation Reduced footprint substrate transport vacuum platform
CN104016175A (zh) * 2014-05-26 2014-09-03 王义峰 一种丝网印刷机的自动输出机构
JP6257455B2 (ja) * 2014-06-17 2018-01-10 住友重機械イオンテクノロジー株式会社 イオン注入装置及びイオン注入装置の制御方法
US9378992B2 (en) 2014-06-27 2016-06-28 Axcelis Technologies, Inc. High throughput heated ion implantation system and method
US9776807B2 (en) * 2014-10-29 2017-10-03 Alain Cerf Changing orientation of an article on a moving conveyor
CN107111251B (zh) * 2014-11-14 2020-10-20 Asml荷兰有限公司 用于在光刻系统中转移基材的加载锁定系统和方法
US9607803B2 (en) 2015-08-04 2017-03-28 Axcelis Technologies, Inc. High throughput cooled ion implantation system and method
US10559483B2 (en) * 2016-08-10 2020-02-11 Lam Research Corporation Platform architecture to improve system productivity
JP6493339B2 (ja) * 2016-08-26 2019-04-03 村田機械株式会社 搬送容器、及び収容物の移載方法
CN118538644A (zh) * 2017-03-15 2024-08-23 朗姆研究公司 采用线性真空传送模块减少占用面积平台架构
CN108695217B (zh) * 2017-04-07 2021-06-29 台湾积体电路制造股份有限公司 衬底传送装置及其端缘作用器
JP7210960B2 (ja) * 2018-09-21 2023-01-24 東京エレクトロン株式会社 真空処理装置及び基板搬送方法
US11581203B2 (en) * 2020-09-02 2023-02-14 Applied Materials, Inc. Systems for integrating load locks into a factory interface footprint space
US12159802B2 (en) 2021-03-04 2024-12-03 Applied Materials, Inc. Shortened load port for factory interface
US12142508B2 (en) * 2021-10-12 2024-11-12 Applied Materials, Inc. Factory interface robots usable with integrated load locks

Family Cites Families (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4498832A (en) * 1982-05-21 1985-02-12 The Boc Group, Inc. Workpiece accumulating and transporting apparatus
US5003183A (en) * 1989-05-15 1991-03-26 Nissin Electric Company, Limited Ion implantation apparatus and method of controlling the same
US5186718A (en) * 1989-05-19 1993-02-16 Applied Materials, Inc. Staged-vacuum wafer processing system and method
KR0155158B1 (ko) * 1989-07-25 1998-12-01 카자마 젠쥬 종형 처리 장치 및 처리방법
JPH04298060A (ja) * 1991-03-26 1992-10-21 Tokyo Electron Ltd ウエハの位置合わせ装置
US5376212A (en) * 1992-02-18 1994-12-27 Tokyo Electron Yamanashi Limited Reduced-pressure processing apparatus
JP2531910Y2 (ja) * 1992-03-31 1997-04-09 株式会社スガイ 物品把持装置
US5482607A (en) * 1992-09-21 1996-01-09 Nissin Electric Co., Ltd. Film forming apparatus
US5486080A (en) * 1994-06-30 1996-01-23 Diamond Semiconductor Group, Inc. High speed movement of workpieces in vacuum processing
TW406861U (en) * 1994-07-28 2000-09-21 Semiconductor Energy Lab Laser processing system
TW295677B (enExample) * 1994-08-19 1997-01-11 Tokyo Electron Co Ltd
JP3215643B2 (ja) * 1997-01-31 2001-10-09 ワイエイシイ株式会社 プラズマ処理装置
EP2099061A3 (en) * 1997-11-28 2013-06-12 Mattson Technology, Inc. Systems and methods for low contamination, high throughput handling of workpieces for vacuum processing
JPH11307608A (ja) * 1998-04-16 1999-11-05 Nissin Electric Co Ltd 被処理物体搬送装置
JP2000012647A (ja) * 1998-06-19 2000-01-14 Sumitomo Eaton Noba Kk ウエハ搬送装置及びその方法
JP2000208589A (ja) * 1998-11-09 2000-07-28 Tokyo Electron Ltd 処理装置
JP2000174091A (ja) * 1998-12-01 2000-06-23 Fujitsu Ltd 搬送装置及び製造装置
US6610150B1 (en) * 1999-04-02 2003-08-26 Asml Us, Inc. Semiconductor wafer processing system with vertically-stacked process chambers and single-axis dual-wafer transfer system
US6350097B1 (en) * 1999-04-19 2002-02-26 Applied Materials, Inc. Method and apparatus for processing wafers
GB2349269A (en) * 1999-04-19 2000-10-25 Applied Materials Inc Ion implanter
JP2000323551A (ja) * 1999-05-11 2000-11-24 Anelva Corp 基板処理装置
JP4316752B2 (ja) * 1999-11-30 2009-08-19 キヤノンアネルバ株式会社 真空搬送処理装置
JP3973006B2 (ja) * 2000-03-23 2007-09-05 日本電産サンキョー株式会社 ダブルアーム型ロボット
US6977014B1 (en) * 2000-06-02 2005-12-20 Novellus Systems, Inc. Architecture for high throughput semiconductor processing applications
US6860965B1 (en) * 2000-06-23 2005-03-01 Novellus Systems, Inc. High throughput architecture for semiconductor processing
US6918731B2 (en) * 2001-07-02 2005-07-19 Brooks Automation, Incorporated Fast swap dual substrate transport for load lock
US6663333B2 (en) * 2001-07-13 2003-12-16 Axcelis Technologies, Inc. Wafer transport apparatus
SG115630A1 (en) * 2003-03-11 2005-10-28 Asml Netherlands Bv Temperature conditioned load lock, lithographic apparatus comprising such a load lock and method of manufacturing a substrate with such a load lock
US7010388B2 (en) * 2003-05-22 2006-03-07 Axcelis Technologies, Inc. Work-piece treatment system having load lock and buffer

Similar Documents

Publication Publication Date Title
JP2007533167A5 (enExample)
JP3437734B2 (ja) 製造装置
CN100437898C (zh) 工件加工系统
TWI571953B (zh) 真空處理裝置
TWI408766B (zh) Vacuum processing device
JP2010192855A (ja) 基板処理装置
CN102246286A (zh) 真空处理装置、真空运送装置
TWI762518B (zh) 用於工件處理之系統與方法
KR20200093222A (ko) 웨이퍼 이송 장치
JP2022551815A (ja) 基板処理装置
JP2013102235A (ja) 基板処理装置
KR102058985B1 (ko) 로드 스테이션
US11923215B2 (en) Systems and methods for workpiece processing
CN106033737B (zh) 真空锁系统及基片传送方法
TWI394242B (zh) 轉移物件通過低壓狀態下之負荷固定艙的裝置及方法
TWI732953B (zh) 具可調整周邊之靜電夾具
JP7458212B2 (ja) 基板搬送システムおよび基板搬送方法
KR100717990B1 (ko) 반도체 자재 처리를 위한 이송 시스템
CN100397558C (zh) 向处理工具提供衬底的方法和设备
CN208848874U (zh) 晶圆处理装置
CN117242562A (zh) 用于工件加工的系统和方法
KR101661217B1 (ko) 로드 포트 그리고 그것을 갖는 클러스터 설비
US20240379396A1 (en) Substrate processing apparatus