KR101276014B1 - 워크피스 프로세싱 시스템 - Google Patents

워크피스 프로세싱 시스템 Download PDF

Info

Publication number
KR101276014B1
KR101276014B1 KR1020067024015A KR20067024015A KR101276014B1 KR 101276014 B1 KR101276014 B1 KR 101276014B1 KR 1020067024015 A KR1020067024015 A KR 1020067024015A KR 20067024015 A KR20067024015 A KR 20067024015A KR 101276014 B1 KR101276014 B1 KR 101276014B1
Authority
KR
South Korea
Prior art keywords
workpiece
load lock
isolation
wafer
processing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020067024015A
Other languages
English (en)
Korean (ko)
Other versions
KR20070012490A (ko
Inventor
조셉 페라라
Original Assignee
액셀리스 테크놀로지스, 인크.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 액셀리스 테크놀로지스, 인크. filed Critical 액셀리스 테크놀로지스, 인크.
Publication of KR20070012490A publication Critical patent/KR20070012490A/ko
Application granted granted Critical
Publication of KR101276014B1 publication Critical patent/KR101276014B1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • H01L21/67213—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one ion or electron beam chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67201—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the load-lock chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/139—Associated with semiconductor wafer handling including wafer charging or discharging means for vacuum chamber

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1020067024015A 2004-04-16 2005-04-18 워크피스 프로세싱 시스템 Expired - Fee Related KR101276014B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US10/826,419 US7246985B2 (en) 2004-04-16 2004-04-16 Work-piece processing system
US10/826,419 2004-04-16
PCT/US2005/013273 WO2006041530A2 (en) 2004-04-16 2005-04-18 Work-piece processing system

Publications (2)

Publication Number Publication Date
KR20070012490A KR20070012490A (ko) 2007-01-25
KR101276014B1 true KR101276014B1 (ko) 2013-06-19

Family

ID=35096438

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020067024015A Expired - Fee Related KR101276014B1 (ko) 2004-04-16 2005-04-18 워크피스 프로세싱 시스템

Country Status (7)

Country Link
US (2) US7246985B2 (enExample)
EP (1) EP1735822A2 (enExample)
JP (1) JP2007533167A (enExample)
KR (1) KR101276014B1 (enExample)
CN (1) CN100437898C (enExample)
TW (1) TWI347295B (enExample)
WO (1) WO2006041530A2 (enExample)

Families Citing this family (48)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040221811A1 (en) * 2001-11-30 2004-11-11 Robert Mitchell Method and apparatus for processing wafers
US20060045668A1 (en) * 2004-07-19 2006-03-02 Grabowski Al W System for handling of wafers within a process tool
US7720558B2 (en) * 2004-09-04 2010-05-18 Applied Materials, Inc. Methods and apparatus for mapping carrier contents
US9110456B2 (en) * 2004-09-08 2015-08-18 Abb Research Ltd. Robotic machining with a flexible manipulator
JP4907077B2 (ja) * 2004-11-30 2012-03-28 株式会社Ｓｅｎ ウエハ処理装置及びウエハ処理方法並びにイオン注入装置
CN101128177A (zh) * 2004-12-22 2008-02-20 智能医院体系有限公司 自动配药系统（apas）
US7604449B1 (en) * 2005-06-27 2009-10-20 Kla-Tencor Technologies Corporation Equipment front end module
US7534080B2 (en) * 2005-08-26 2009-05-19 Ascentool, Inc. Vacuum processing and transfer system
US7381969B2 (en) * 2006-04-24 2008-06-03 Axcelis Technologies, Inc. Load lock control
US8153513B2 (en) * 2006-07-25 2012-04-10 Silicon Genesis Corporation Method and system for continuous large-area scanning implantation process
US7740437B2 (en) 2006-09-22 2010-06-22 Asm International N.V. Processing system with increased cassette storage capacity
JP4664264B2 (ja) * 2006-10-26 2011-04-06 東京エレクトロン株式会社 検出装置及び検出方法
US20080138178A1 (en) * 2006-12-06 2008-06-12 Axcelis Technologies,Inc. High throughput serial wafer handling end station
US7585142B2 (en) * 2007-03-16 2009-09-08 Asm America, Inc. Substrate handling chamber with movable substrate carrier loading platform
US8752449B2 (en) 2007-05-08 2014-06-17 Brooks Automation, Inc. Substrate transport apparatus with multiple movable arms utilizing a mechanical switch mechanism
US8823294B2 (en) 2007-06-27 2014-09-02 Brooks Automation, Inc. Commutation of an electromagnetic propulsion and guidance system
US8659205B2 (en) 2007-06-27 2014-02-25 Brooks Automation, Inc. Motor stator with lift capability and reduced cogging characteristics
US8283813B2 (en) * 2007-06-27 2012-10-09 Brooks Automation, Inc. Robot drive with magnetic spindle bearings
US9752615B2 (en) 2007-06-27 2017-09-05 Brooks Automation, Inc. Reduced-complexity self-bearing brushless DC motor
JP5416104B2 (ja) 2007-06-27 2014-02-12 ブルックス オートメーション インコーポレイテッド セルフベアリングモータ用位置フィードバック
KR101660894B1 (ko) 2007-06-27 2016-10-10 브룩스 오토메이션 인코퍼레이티드 다차원 위치 센서
CN101801817B (zh) 2007-07-17 2015-07-22 布鲁克斯自动化公司 具备集成到室壁上的电动机的基片加工装置
WO2011007753A1 (ja) * 2009-07-14 2011-01-20 キヤノンアネルバ株式会社 基板処理装置
JP5465979B2 (ja) * 2009-10-26 2014-04-09 東京エレクトロン株式会社 半導体製造装置
JP5476171B2 (ja) * 2010-03-16 2014-04-23 株式会社日立ハイテクノロジーズ 真空処理装置
JP5755842B2 (ja) * 2010-04-22 2015-07-29 株式会社ダイヘン ワーク搬送システム
CN102310999B (zh) * 2010-07-09 2013-07-17 上海凯世通半导体有限公司 真空传输制程设备及方法
JP5503006B2 (ja) * 2010-08-06 2014-05-28 東京エレクトロン株式会社 基板処理システム、搬送モジュール、基板処理方法及び半導体素子の製造方法
JP6006643B2 (ja) * 2011-01-20 2016-10-12 東京エレクトロン株式会社 真空処理装置
JP5494617B2 (ja) * 2011-10-26 2014-05-21 株式会社安川電機 ロボットシステムおよび加工品の製造方法
CN102539263A (zh) * 2011-11-29 2012-07-04 南通大学 基于掩蔽处理技术的轻微磨损测量方法
US9139402B2 (en) * 2012-02-21 2015-09-22 Altec Industries, Inc. Retractable load guide
JP6002532B2 (ja) * 2012-10-10 2016-10-05 株式会社日立ハイテクノロジーズ 真空処理装置及び真空処理方法
US10328580B2 (en) * 2013-08-09 2019-06-25 Persimmon Technologies Corporation Reduced footprint substrate transport vacuum platform
CN104016175A (zh) * 2014-05-26 2014-09-03 王义峰 一种丝网印刷机的自动输出机构
JP6257455B2 (ja) * 2014-06-17 2018-01-10 住友重機械イオンテクノロジー株式会社 イオン注入装置及びイオン注入装置の制御方法
US9378992B2 (en) 2014-06-27 2016-06-28 Axcelis Technologies, Inc. High throughput heated ion implantation system and method
US9776807B2 (en) * 2014-10-29 2017-10-03 Alain Cerf Changing orientation of an article on a moving conveyor
CN107111251B (zh) * 2014-11-14 2020-10-20 Asml荷兰有限公司 用于在光刻系统中转移基材的加载锁定系统和方法
US9607803B2 (en) 2015-08-04 2017-03-28 Axcelis Technologies, Inc. High throughput cooled ion implantation system and method
US10559483B2 (en) * 2016-08-10 2020-02-11 Lam Research Corporation Platform architecture to improve system productivity
JP6493339B2 (ja) * 2016-08-26 2019-04-03 村田機械株式会社 搬送容器、及び収容物の移載方法
CN118538644A (zh) * 2017-03-15 2024-08-23 朗姆研究公司 采用线性真空传送模块减少占用面积平台架构
CN108695217B (zh) * 2017-04-07 2021-06-29 台湾积体电路制造股份有限公司 衬底传送装置及其端缘作用器
JP7210960B2 (ja) * 2018-09-21 2023-01-24 東京エレクトロン株式会社 真空処理装置及び基板搬送方法
US11581203B2 (en) * 2020-09-02 2023-02-14 Applied Materials, Inc. Systems for integrating load locks into a factory interface footprint space
US12159802B2 (en) 2021-03-04 2024-12-03 Applied Materials, Inc. Shortened load port for factory interface
US12142508B2 (en) * 2021-10-12 2024-11-12 Applied Materials, Inc. Factory interface robots usable with integrated load locks

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11307608A (ja) * 1998-04-16 1999-11-05 Nissin Electric Co Ltd 被処理物体搬送装置
JP2000012647A (ja) * 1998-06-19 2000-01-14 Sumitomo Eaton Noba Kk ウエハ搬送装置及びその方法
JP2000323551A (ja) * 1999-05-11 2000-11-24 Anelva Corp 基板処理装置
KR100425364B1 (ko) * 2000-03-23 2004-03-30 가부시기가이샤 산교세이기 세이사꾸쇼 더블암형 로봇

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4498832A (en) * 1982-05-21 1985-02-12 The Boc Group, Inc. Workpiece accumulating and transporting apparatus
US5003183A (en) * 1989-05-15 1991-03-26 Nissin Electric Company, Limited Ion implantation apparatus and method of controlling the same
US5186718A (en) * 1989-05-19 1993-02-16 Applied Materials, Inc. Staged-vacuum wafer processing system and method
KR0155158B1 (ko) * 1989-07-25 1998-12-01 카자마 젠쥬 종형 처리 장치 및 처리방법
JPH04298060A (ja) * 1991-03-26 1992-10-21 Tokyo Electron Ltd ウエハの位置合わせ装置
US5376212A (en) * 1992-02-18 1994-12-27 Tokyo Electron Yamanashi Limited Reduced-pressure processing apparatus
JP2531910Y2 (ja) * 1992-03-31 1997-04-09 株式会社スガイ 物品把持装置
US5482607A (en) * 1992-09-21 1996-01-09 Nissin Electric Co., Ltd. Film forming apparatus
US5486080A (en) * 1994-06-30 1996-01-23 Diamond Semiconductor Group, Inc. High speed movement of workpieces in vacuum processing
TW406861U (en) * 1994-07-28 2000-09-21 Semiconductor Energy Lab Laser processing system
TW295677B (enExample) * 1994-08-19 1997-01-11 Tokyo Electron Co Ltd
JP3215643B2 (ja) * 1997-01-31 2001-10-09 ワイエイシイ株式会社 プラズマ処理装置
EP2099061A3 (en) * 1997-11-28 2013-06-12 Mattson Technology, Inc. Systems and methods for low contamination, high throughput handling of workpieces for vacuum processing
JP2000208589A (ja) * 1998-11-09 2000-07-28 Tokyo Electron Ltd 処理装置
JP2000174091A (ja) * 1998-12-01 2000-06-23 Fujitsu Ltd 搬送装置及び製造装置
US6610150B1 (en) * 1999-04-02 2003-08-26 Asml Us, Inc. Semiconductor wafer processing system with vertically-stacked process chambers and single-axis dual-wafer transfer system
US6350097B1 (en) * 1999-04-19 2002-02-26 Applied Materials, Inc. Method and apparatus for processing wafers
GB2349269A (en) * 1999-04-19 2000-10-25 Applied Materials Inc Ion implanter
JP4316752B2 (ja) * 1999-11-30 2009-08-19 キヤノンアネルバ株式会社 真空搬送処理装置
US6977014B1 (en) * 2000-06-02 2005-12-20 Novellus Systems, Inc. Architecture for high throughput semiconductor processing applications
US6860965B1 (en) * 2000-06-23 2005-03-01 Novellus Systems, Inc. High throughput architecture for semiconductor processing
US6918731B2 (en) * 2001-07-02 2005-07-19 Brooks Automation, Incorporated Fast swap dual substrate transport for load lock
US6663333B2 (en) * 2001-07-13 2003-12-16 Axcelis Technologies, Inc. Wafer transport apparatus
SG115630A1 (en) * 2003-03-11 2005-10-28 Asml Netherlands Bv Temperature conditioned load lock, lithographic apparatus comprising such a load lock and method of manufacturing a substrate with such a load lock
US7010388B2 (en) * 2003-05-22 2006-03-07 Axcelis Technologies, Inc. Work-piece treatment system having load lock and buffer

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11307608A (ja) * 1998-04-16 1999-11-05 Nissin Electric Co Ltd 被処理物体搬送装置
JP2000012647A (ja) * 1998-06-19 2000-01-14 Sumitomo Eaton Noba Kk ウエハ搬送装置及びその方法
JP2000323551A (ja) * 1999-05-11 2000-11-24 Anelva Corp 基板処理装置
KR100425364B1 (ko) * 2000-03-23 2004-03-30 가부시기가이샤 산교세이기 세이사꾸쇼 더블암형 로봇

Also Published As

Publication number Publication date
US20050232727A1 (en) 2005-10-20
WO2006041530A3 (en) 2006-06-08
US7699574B2 (en) 2010-04-20
US7246985B2 (en) 2007-07-24
WO2006041530A2 (en) 2006-04-20
EP1735822A2 (en) 2006-12-27
TWI347295B (en) 2011-08-21
TW200540087A (en) 2005-12-16
KR20070012490A (ko) 2007-01-25
CN1943009A (zh) 2007-04-04
US20070243049A1 (en) 2007-10-18
JP2007533167A (ja) 2007-11-15
CN100437898C (zh) 2008-11-26

Similar Documents

Publication Publication Date Title
KR101276014B1 (ko) 워크피스 프로세싱 시스템
JP4935987B2 (ja) イオン注入機と共に使用するための移送装置及びその方法
US20200388523A1 (en) Wafer aligner
US6860965B1 (en) High throughput architecture for semiconductor processing
JP5323718B2 (ja) 高生産性ウエハ連続処理末端装置
JP5273437B2 (ja) イオンビーム注入装置用のワークピース移送システム及びその処理方法
KR20010023014A (ko) 다중스테이션 장비용 웨이퍼 핸들러
CN101548374A (zh) 高产量的晶片刻痕校准器
JP4620214B2 (ja) ウェハ処理装置
JP2000012647A (ja) ウエハ搬送装置及びその方法
KR101142211B1 (ko) 웨이퍼 핸들링 방법 및 시스템
US20240379396A1 (en) Substrate processing apparatus

Legal Events

Date Code Title Description
PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

R17-X000 Change to representative recorded

St.27 status event code: A-3-3-R10-R17-oth-X000

A201 Request for examination
P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E90F Notification of reason for final refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U12-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

FPAY Annual fee payment

Payment date: 20160330

Year of fee payment: 4

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

FPAY Annual fee payment

Payment date: 20170330

Year of fee payment: 5

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 5

FPAY Annual fee payment

Payment date: 20180329

Year of fee payment: 6

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 6

FPAY Annual fee payment

Payment date: 20190327

Year of fee payment: 7

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 7

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 8

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 9

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 10

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 11

PC1903 Unpaid annual fee

St.27 status event code: A-4-4-U10-U13-oth-PC1903

Not in force date: 20240612

Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

PC1903 Unpaid annual fee

St.27 status event code: N-4-6-H10-H13-oth-PC1903

Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

Not in force date: 20240612