JP2007520617A5 - - Google Patents

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Publication number
JP2007520617A5
JP2007520617A5 JP2006552126A JP2006552126A JP2007520617A5 JP 2007520617 A5 JP2007520617 A5 JP 2007520617A5 JP 2006552126 A JP2006552126 A JP 2006552126A JP 2006552126 A JP2006552126 A JP 2006552126A JP 2007520617 A5 JP2007520617 A5 JP 2007520617A5
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JP
Japan
Prior art keywords
isocyanate
expandable polymer
polymer microspheres
polishing pad
curing agent
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JP2006552126A
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English (en)
Japanese (ja)
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JP4954716B2 (ja
JP2007520617A (ja
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Priority claimed from US10/772,054 external-priority patent/US20050171224A1/en
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Publication of JP2007520617A5 publication Critical patent/JP2007520617A5/ja
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Publication of JP4954716B2 publication Critical patent/JP4954716B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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JP2006552126A 2004-02-03 2005-01-13 ポリウレタン研磨パッド Expired - Lifetime JP4954716B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US10/772,054 US20050171224A1 (en) 2004-02-03 2004-02-03 Polyurethane polishing pad
US10/772,054 2004-02-03
PCT/US2005/001192 WO2005077999A1 (en) 2004-02-03 2005-01-13 Polyurethane polishing pad

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2012009792A Division JP5593337B2 (ja) 2004-02-03 2012-01-20 ポリウレタン研磨パッド

Publications (3)

Publication Number Publication Date
JP2007520617A JP2007520617A (ja) 2007-07-26
JP2007520617A5 true JP2007520617A5 (https=) 2011-06-16
JP4954716B2 JP4954716B2 (ja) 2012-06-20

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ID=34808579

Family Applications (2)

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JP2006552126A Expired - Lifetime JP4954716B2 (ja) 2004-02-03 2005-01-13 ポリウレタン研磨パッド
JP2012009792A Expired - Lifetime JP5593337B2 (ja) 2004-02-03 2012-01-20 ポリウレタン研磨パッド

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2012009792A Expired - Lifetime JP5593337B2 (ja) 2004-02-03 2012-01-20 ポリウレタン研磨パッド

Country Status (7)

Country Link
US (3) US20050171224A1 (https=)
EP (1) EP1716193A1 (https=)
JP (2) JP4954716B2 (https=)
KR (1) KR101141880B1 (https=)
CN (1) CN1914241B (https=)
TW (1) TWI378994B (https=)
WO (1) WO2005077999A1 (https=)

Families Citing this family (100)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050171224A1 (en) * 2004-02-03 2005-08-04 Kulp Mary J. Polyurethane polishing pad
US20060046627A1 (en) * 2004-08-25 2006-03-02 Peter Renteln Method of improving planarization of urethane polishing pads, and urethane polishing pad produced by the same
US20060046064A1 (en) * 2004-08-25 2006-03-02 Dwaine Halberg Method of improving removal rate of pads
US20060099891A1 (en) * 2004-11-09 2006-05-11 Peter Renteln Method of chemical mechanical polishing, and a pad provided therefore
KR20060099398A (ko) * 2005-03-08 2006-09-19 롬 앤드 하스 일렉트로닉 머티리얼스 씨엠피 홀딩스 인코포레이티드 수계 연마 패드 및 제조 방법
SG160368A1 (en) * 2005-03-08 2010-04-29 Toyo Tire & Rubber Co Polishing pad and process for producing the same
WO2006123559A1 (ja) * 2005-05-17 2006-11-23 Toyo Tire & Rubber Co., Ltd. 研磨パッド
JP4884725B2 (ja) * 2005-08-30 2012-02-29 東洋ゴム工業株式会社 研磨パッド
JP4884726B2 (ja) * 2005-08-30 2012-02-29 東洋ゴム工業株式会社 積層研磨パッドの製造方法
US7445847B2 (en) * 2006-05-25 2008-11-04 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad
US7169030B1 (en) 2006-05-25 2007-01-30 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad
CN102152233B (zh) * 2006-08-28 2013-10-30 东洋橡胶工业株式会社 抛光垫
JP5008927B2 (ja) * 2006-08-31 2012-08-22 東洋ゴム工業株式会社 研磨パッド
US20100009611A1 (en) * 2006-09-08 2010-01-14 Toyo Tire & Rubber Co., Ltd. Method for manufacturing a polishing pad
US20080063856A1 (en) * 2006-09-11 2008-03-13 Duong Chau H Water-based polishing pads having improved contact area
WO2008087797A1 (ja) 2007-01-15 2008-07-24 Toyo Tire & Rubber Co., Ltd. 研磨パッド及びその製造方法
JP5078000B2 (ja) * 2007-03-28 2012-11-21 東洋ゴム工業株式会社 研磨パッド
JP5061694B2 (ja) * 2007-04-05 2012-10-31 信越半導体株式会社 研磨パッドの製造方法及び研磨パッド並びにウエーハの研磨方法
US20090062414A1 (en) * 2007-08-28 2009-03-05 David Picheng Huang System and method for producing damping polyurethane CMP pads
US8052507B2 (en) * 2007-11-20 2011-11-08 Praxair Technology, Inc. Damping polyurethane CMP pads with microfillers
JP4593643B2 (ja) * 2008-03-12 2010-12-08 東洋ゴム工業株式会社 研磨パッド
US20100035529A1 (en) * 2008-08-05 2010-02-11 Mary Jo Kulp Chemical mechanical polishing pad
US8551201B2 (en) * 2009-08-07 2013-10-08 Praxair S.T. Technology, Inc. Polyurethane composition for CMP pads and method of manufacturing same
JP5606083B2 (ja) * 2010-01-29 2014-10-15 日本発條株式会社 独泡ウレタンシート及びその製造方法
US8702479B2 (en) 2010-10-15 2014-04-22 Nexplanar Corporation Polishing pad with multi-modal distribution of pore diameters
US8357446B2 (en) * 2010-11-12 2013-01-22 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Hollow polymeric-silicate composite
US8512427B2 (en) 2011-09-29 2013-08-20 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Acrylate polyurethane chemical mechanical polishing layer
JP6155018B2 (ja) * 2011-12-16 2017-06-28 ローム アンド ハース エレクトロニック マテリアルズ シーエムピー ホウルディングス インコーポレイテッド 研磨パッド
WO2013089240A1 (ja) 2011-12-16 2013-06-20 東洋ゴム工業株式会社 研磨パッド
US10722997B2 (en) * 2012-04-02 2020-07-28 Thomas West, Inc. Multilayer polishing pads made by the methods for centrifugal casting of polymer polish pads
SG11201406287QA (en) 2012-04-02 2014-11-27 Thomas West Inc Methods and systems for centrifugal casting of polymer polish pads and polishing pads made by the methods
US10022842B2 (en) 2012-04-02 2018-07-17 Thomas West, Inc. Method and systems to control optical transmissivity of a polish pad material
US9144880B2 (en) * 2012-11-01 2015-09-29 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Soft and conditionable chemical mechanical polishing pad
JP5661130B2 (ja) * 2013-01-31 2015-01-28 東洋ゴム工業株式会社 研磨パッド
US9238295B2 (en) * 2013-05-31 2016-01-19 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Soft and conditionable chemical mechanical window polishing pad
US9238296B2 (en) * 2013-05-31 2016-01-19 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Multilayer chemical mechanical polishing pad stack with soft and conditionable polishing layer
US9233451B2 (en) * 2013-05-31 2016-01-12 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Soft and conditionable chemical mechanical polishing pad stack
KR102066002B1 (ko) 2013-06-10 2020-02-11 삼성전자주식회사 연마 패드 조성물
US9102034B2 (en) 2013-08-30 2015-08-11 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method of chemical mechanical polishing a substrate
US20150065013A1 (en) * 2013-08-30 2015-03-05 Dow Global Technologies Llc Chemical mechanical polishing pad
US20150059254A1 (en) * 2013-09-04 2015-03-05 Dow Global Technologies Llc Polyurethane polishing pad
JP2015059199A (ja) * 2013-09-20 2015-03-30 Dic株式会社 ウレタン組成物及び研磨材
US8980749B1 (en) * 2013-10-24 2015-03-17 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method for chemical mechanical polishing silicon wafers
CN103862365B (zh) * 2014-01-21 2016-05-04 湖北鼎龙化学股份有限公司 聚氨酯材料抛光垫及其制备方法
US9463550B2 (en) * 2014-02-19 2016-10-11 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method of manufacturing chemical mechanical polishing layers
SG10201807026VA (en) * 2014-02-20 2018-09-27 Thomas West Inc Method and systems to control optical transmissivity of a polish pad material
US20150306731A1 (en) * 2014-04-25 2015-10-29 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad
US20150375361A1 (en) * 2014-06-25 2015-12-31 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing method
US9731398B2 (en) * 2014-08-22 2017-08-15 Rohm And Haas Electronic Materials Cmp Holding, Inc. Polyurethane polishing pad
US9873180B2 (en) 2014-10-17 2018-01-23 Applied Materials, Inc. CMP pad construction with composite material properties using additive manufacturing processes
US9776361B2 (en) 2014-10-17 2017-10-03 Applied Materials, Inc. Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles
US10875153B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Advanced polishing pad materials and formulations
US10875145B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Polishing pads produced by an additive manufacturing process
US10821573B2 (en) 2014-10-17 2020-11-03 Applied Materials, Inc. Polishing pads produced by an additive manufacturing process
US10399201B2 (en) 2014-10-17 2019-09-03 Applied Materials, Inc. Advanced polishing pads having compositional gradients by use of an additive manufacturing process
SG11201703114QA (en) 2014-10-17 2017-06-29 Applied Materials Inc Cmp pad construction with composite material properties using additive manufacturing processes
US11745302B2 (en) 2014-10-17 2023-09-05 Applied Materials, Inc. Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process
US9452507B2 (en) * 2014-12-19 2016-09-27 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Controlled-viscosity CMP casting method
US9481070B2 (en) * 2014-12-19 2016-11-01 Rohm And Haas Electronic Materials Cmp Holdings, Inc. High-stability polyurethane polishing pad
JP6600149B2 (ja) * 2015-04-03 2019-10-30 富士紡ホールディングス株式会社 研磨パッド及びその製造方法
KR101615547B1 (ko) 2015-05-20 2016-04-26 에프엔에스테크 주식회사 연마 패드 및 이의 제조 방법
US9776300B2 (en) * 2015-06-26 2017-10-03 Rohm And Haas Electronic Materials Cmp Holdings Inc. Chemical mechanical polishing pad and method of making same
US9539694B1 (en) 2015-06-26 2017-01-10 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Composite polishing layer chemical mechanical polishing pad
US10092998B2 (en) * 2015-06-26 2018-10-09 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method of making composite polishing layer for chemical mechanical polishing pad
US9630293B2 (en) 2015-06-26 2017-04-25 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad composite polishing layer formulation
US9457449B1 (en) 2015-06-26 2016-10-04 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad with composite polishing layer
US10011002B2 (en) * 2015-06-26 2018-07-03 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method of making composite polishing layer for chemical mechanical polishing pad
KR20230169424A (ko) 2015-10-30 2023-12-15 어플라이드 머티어리얼스, 인코포레이티드 원하는 제타 전위를 가진 연마 제품을 형성하는 장치 및 방법
US10593574B2 (en) 2015-11-06 2020-03-17 Applied Materials, Inc. Techniques for combining CMP process tracking data with 3D printed CMP consumables
US10391605B2 (en) 2016-01-19 2019-08-27 Applied Materials, Inc. Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process
CN105904352B (zh) * 2016-06-03 2018-06-01 湖北鼎汇微电子材料有限公司 一种抛光层及其制备方法以及低损伤化学机械抛光垫
CN106041719B (zh) * 2016-06-03 2018-10-23 湖北鼎龙控股股份有限公司 一种抛光层及其制备方法以及化学机械抛光垫
CN106965100A (zh) * 2017-04-19 2017-07-21 台山市远鹏研磨科技有限公司 一种湿式抛光垫及其制备方法
US20180304539A1 (en) 2017-04-21 2018-10-25 Applied Materials, Inc. Energy delivery system with array of energy sources for an additive manufacturing apparatus
KR101835087B1 (ko) * 2017-05-29 2018-03-06 에스케이씨 주식회사 다공성 폴리우레탄 연마패드 및 이를 사용하여 반도체 소자를 제조하는 방법
CN107163213A (zh) * 2017-05-31 2017-09-15 蓝思科技（长沙）有限公司 抛光垫、制备方法及其应用
US11471999B2 (en) 2017-07-26 2022-10-18 Applied Materials, Inc. Integrated abrasive polishing pads and manufacturing methods
US11072050B2 (en) 2017-08-04 2021-07-27 Applied Materials, Inc. Polishing pad with window and manufacturing methods thereof
WO2019032286A1 (en) 2017-08-07 2019-02-14 Applied Materials, Inc. ABRASIVE DISTRIBUTION POLISHING PADS AND METHODS OF MAKING SAME
US11179822B2 (en) 2017-08-31 2021-11-23 Hubei Dinghui Microelectronics Materials Co., Ltd Polyurethane polishing layer, polishing pad comprising polishing layer, method for preparing polishing layer and method for planarizing material
CN107553313B (zh) * 2017-08-31 2019-12-31 湖北鼎龙控股股份有限公司 一种抛光垫、聚氨酯抛光层及其制备方法
JP7045334B2 (ja) * 2017-09-11 2022-03-31 エスケイシー・ソルミックス・カンパニー・リミテッド 多孔質ポリウレタン研磨パッドおよびその製造方法
CN108047420B (zh) * 2017-11-28 2021-01-12 湖北鼎龙控股股份有限公司 一种聚氨酯抛光层及其制备方法
US11912813B2 (en) * 2018-04-10 2024-02-27 Tokuyama Corporation Urethane resin using polyrotaxane, and pad for polishing
KR20210042171A (ko) 2018-09-04 2021-04-16 어플라이드 머티어리얼스, 인코포레이티드 진보한 폴리싱 패드들을 위한 제형들
CN109693176B (zh) * 2019-01-15 2020-12-08 湖北鼎汇微电子材料有限公司 抛光层、抛光垫及制备方法
CA3128976A1 (en) * 2019-02-11 2020-08-20 Dow Global Technologies Llc Fire resistant polyurethane coating composition and a fire-resistant product comprising the same
CN110003426B (zh) * 2019-03-08 2021-05-25 合肥宏光研磨科技有限公司 一种聚氨酯海绵复合抛光盘
KR102237351B1 (ko) * 2019-06-17 2021-04-07 에스케이씨솔믹스 주식회사 연마패드용 조성물, 연마패드 및 반도체 소자의 제조방법
KR102237362B1 (ko) * 2019-06-17 2021-04-07 에스케이씨솔믹스 주식회사 연마패드용 조성물, 연마패드 및 반도체 소자의 제조방법
CN110528287B (zh) * 2019-08-08 2022-03-08 安徽安利材料科技股份有限公司 一种毛刷式高耐用化学机械抛光聚氨酯材料及其制备方法
US11813712B2 (en) 2019-12-20 2023-11-14 Applied Materials, Inc. Polishing pads having selectively arranged porosity
CN110977756B (zh) * 2019-12-27 2021-09-07 万华化学集团电子材料有限公司 一种化学机械抛光垫的抛光层及其应用
JP7489808B2 (ja) * 2020-03-30 2024-05-24 富士紡ホールディングス株式会社 研磨パッド、研磨方法及び研磨パッドの評価方法
US11806829B2 (en) 2020-06-19 2023-11-07 Applied Materials, Inc. Advanced polishing pads and related polishing pad manufacturing methods
EP3967452A1 (en) * 2020-09-07 2022-03-16 SKC Solmics Co., Ltd. Polishing pad and method of fabricating semiconductor device using the same
TWI851930B (zh) * 2020-10-19 2024-08-11 美商Ｃｍｃ材料有限責任公司 用於化學機械拋光墊之可uv固化樹脂
EP4286439A1 (en) * 2021-01-29 2023-12-06 Tokuyama Corporation Hollow microballoon
US11878389B2 (en) 2021-02-10 2024-01-23 Applied Materials, Inc. Structures formed using an additive manufacturing process for regenerating surface texture in situ
CN116985031B (zh) * 2023-03-27 2025-11-04 万华化学集团电子材料有限公司 一种化学机械抛光垫、制备方法及其应用

Family Cites Families (42)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4282344A (en) * 1978-11-02 1981-08-04 E. I. Du Pont De Nemours And Company Polyurethane curing agent dispersion, process and product
US4511605A (en) * 1980-09-18 1985-04-16 Norwood Industries, Inc. Process for producing polishing pads comprising a fully impregnated non-woven batt
EP0370408A1 (en) * 1988-11-21 1990-05-30 Air Products And Chemicals, Inc. Process for the preparation of polyisocyanate prepolymers and polyurethanes and resulting compositions
US5114982A (en) * 1989-11-20 1992-05-19 Westinghouse Electric Corp. Acoustic scattering and high reflection loss compositions
CA2048232A1 (en) * 1990-09-05 1992-03-06 Jerry W. Williams Energy curable pressure-sensitive compositions
JPH09506641A (ja) * 1992-06-26 1997-06-30 ミネソタ マイニング アンド マニュファクチャリング カンパニー ポリウレタン／ポリ尿素エラストマー
MY114512A (en) * 1992-08-19 2002-11-30 Rodel Inc Polymeric substrate with polymeric microelements
US5260343A (en) * 1993-01-04 1993-11-09 Basf Corporation Low density flexible integral skin polyurethane systems using thermoplastic hydrocarbon microspheres and water as co-blowing agents
JPH10130356A (ja) * 1996-10-24 1998-05-19 Sanyo Chem Ind Ltd 模型素材用組成物、成形品、模型の製法
US5821316A (en) * 1997-01-24 1998-10-13 Air Products And Chemicals, Inc. Polyurethane prepolymers for making elastomers having improved dynamic properties
US6022268A (en) * 1998-04-03 2000-02-08 Rodel Holdings Inc. Polishing pads and methods relating thereto
US6020387A (en) * 1997-09-22 2000-02-01 Caschem, Inc. Low density polymers and methods of making and using same
JPH11322877A (ja) * 1998-05-12 1999-11-26 Dainippon Ink & Chem Inc 微細泡含有成形物の製造方法及び微細泡含有成形物用ウレタン樹脂組成物
JPH11322878A (ja) * 1998-05-13 1999-11-26 Dainippon Ink & Chem Inc 泡含有ポリウレタン成形物の製造方法、泡含有成形物用ウレタン樹脂組成物及びそれを用いた研磨パッド
US7718102B2 (en) 1998-06-02 2010-05-18 Praxair S.T. Technology, Inc. Froth and method of producing froth
US6095902A (en) * 1998-09-23 2000-08-01 Rodel Holdings, Inc. Polyether-polyester polyurethane polishing pads and related methods
WO2000027589A1 (en) * 1998-11-09 2000-05-18 Toray Industries, Inc. Polishing pad and polishing device
TWI228522B (en) * 1999-06-04 2005-03-01 Fuji Spinning Co Ltd Urethane molded products for polishing pad and method for making same
JP2000344902A (ja) * 1999-06-04 2000-12-12 Fuji Spinning Co Ltd 研磨パッド用ウレタン成形物の製造法及び研磨パッド用ウレタン成形物
US20010050268A1 (en) * 2000-05-23 2001-12-13 Reinhardt Heinz F. Polishing pad of a polyurethane of propane diol
JP4615813B2 (ja) 2000-05-27 2011-01-19 ローム アンド ハース エレクトロニック マテリアルズ シーエムピー ホウルディングス インコーポレイテッド 化学機械平坦化用の研磨パッド
US6454634B1 (en) * 2000-05-27 2002-09-24 Rodel Holdings Inc. Polishing pads for chemical mechanical planarization
JP3490431B2 (ja) * 2000-06-13 2004-01-26 東洋ゴム工業株式会社 ポリウレタン発泡体の製造方法、ポリウレタン発泡体及び研磨シート
DE60104372T2 (de) * 2000-08-29 2004-12-09 Tokai Rubber Industries, Ltd., Komaki Förderband Transportrolle aus Polyurethan Elastomer
US6477926B1 (en) * 2000-09-15 2002-11-12 Ppg Industries Ohio, Inc. Polishing pad
WO2002046283A1 (en) 2000-12-08 2002-06-13 Kuraray. Co., Ltd. Thermoplastic polyurethane foam, process for production thereof and polishing pads made of the foam
JP3306417B2 (ja) * 2000-12-27 2002-07-24 東洋ゴム工業株式会社 半導体研磨用ポリウレタン研磨パッドを製造する方法
JP2003062748A (ja) * 2001-08-24 2003-03-05 Inoac Corp 研磨用パッド
US20030069321A1 (en) * 2001-10-05 2003-04-10 Lin Wendy Wen-Ling High modulus, impact resistant foams for structural components
JP3325562B1 (ja) * 2001-12-07 2002-09-17 東洋ゴム工業株式会社 発泡ポリウレタン研磨パッドの製造方法
JP2003145414A (ja) * 2001-11-13 2003-05-20 Toyobo Co Ltd 研磨パッド及びその製造方法
JP4047577B2 (ja) * 2001-11-26 2008-02-13 Ｓｒｉスポーツ株式会社 ウレタンカバーを有するゴルフボール
KR100467765B1 (ko) 2002-02-04 2005-01-24 에스케이씨 주식회사 고경도 및 우수한 내마모성을 갖는 폴리우레탄 탄성체제조용 조성물
JP2003257905A (ja) * 2002-03-01 2003-09-12 Disco Abrasive Syst Ltd 被研磨物の研磨方法
JP2003342341A (ja) * 2002-05-30 2003-12-03 Inoac Corp ポリウレタン系発泡体およびその製造方法
JP3983610B2 (ja) * 2002-07-02 2007-09-26 株式会社クラレ 熱可塑性ポリウレタン発泡体およびそれからなる研磨パッド
US20040021243A1 (en) * 2002-08-02 2004-02-05 Wen-Chang Shih Method for manufacturing auxiliary gas-adding polyurethae/polyurethane-urea polishing pad
WO2004046216A1 (en) * 2002-11-18 2004-06-03 Dong Sung A & T Co., Ltd. Method of fabricating polyurethane foam with micro pores and polishing pad tehrefrom
US7074115B2 (en) * 2003-10-09 2006-07-11 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Polishing pad
SG111222A1 (en) 2003-10-09 2005-05-30 Rohm & Haas Elect Mat Polishing pad
JP2005169571A (ja) * 2003-12-11 2005-06-30 Toyo Tire & Rubber Co Ltd 微細気泡を有する研磨パッド用発泡ポリウレタンの製造方法。
US20050171224A1 (en) * 2004-02-03 2005-08-04 Kulp Mary J. Polyurethane polishing pad

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