JP2007517140A5 - - Google Patents
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- Publication number
- JP2007517140A5 JP2007517140A5 JP2006547095A JP2006547095A JP2007517140A5 JP 2007517140 A5 JP2007517140 A5 JP 2007517140A5 JP 2006547095 A JP2006547095 A JP 2006547095A JP 2006547095 A JP2006547095 A JP 2006547095A JP 2007517140 A5 JP2007517140 A5 JP 2007517140A5
- Authority
- JP
- Japan
- Prior art keywords
- vinylpyridine
- reaction product
- polymer compound
- substituted pyridyl
- poly
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US53177103P | 2003-12-22 | 2003-12-22 | |
| US10/963,369 US8002962B2 (en) | 2002-03-05 | 2004-10-12 | Copper electrodeposition in microelectronics |
| PCT/US2004/041620 WO2005066391A1 (en) | 2003-12-22 | 2004-12-13 | Copper electrodeposition in microelectronics |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2007517140A JP2007517140A (ja) | 2007-06-28 |
| JP2007517140A5 true JP2007517140A5 (enExample) | 2008-02-07 |
| JP4539925B2 JP4539925B2 (ja) | 2010-09-08 |
Family
ID=34752972
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006547095A Expired - Lifetime JP4539925B2 (ja) | 2003-12-22 | 2004-12-13 | 微小電子機器における銅の電着 |
Country Status (7)
| Country | Link |
|---|---|
| US (4) | US8002962B2 (enExample) |
| EP (1) | EP1697561B1 (enExample) |
| JP (1) | JP4539925B2 (enExample) |
| KR (1) | KR101157284B1 (enExample) |
| PT (1) | PT1697561T (enExample) |
| TW (1) | TWI266383B (enExample) |
| WO (1) | WO2005066391A1 (enExample) |
Families Citing this family (54)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8002962B2 (en) * | 2002-03-05 | 2011-08-23 | Enthone Inc. | Copper electrodeposition in microelectronics |
| TWI400365B (zh) * | 2004-11-12 | 2013-07-01 | Enthone | 微電子裝置上的銅電沈積 |
| JP4468191B2 (ja) * | 2005-01-27 | 2010-05-26 | 株式会社日立製作所 | 金属構造体及びその製造方法 |
| JP4665531B2 (ja) * | 2005-01-27 | 2011-04-06 | 日立電線株式会社 | 配線板の製造方法 |
| DE102005011708B3 (de) | 2005-03-11 | 2007-03-01 | Atotech Deutschland Gmbh | Polyvinylammoniumverbindung und Verfahren zu deren Herstellung sowie diese Verbindung enthaltende saure Lösung und Verfahren zum elektrolytischen Abscheiden eines Kupferniederschlages |
| US20060243599A1 (en) * | 2005-04-28 | 2006-11-02 | Taiwan Semiconductor Manufacturing Company, Ltd. | Electroplating additive for improved reliability |
| TWI328622B (en) * | 2005-09-30 | 2010-08-11 | Rohm & Haas Elect Mat | Leveler compounds |
| US20070075042A1 (en) * | 2005-10-05 | 2007-04-05 | Siddiqui Junaid A | Stabilizer-Fenton's reaction metal-vinyl pyridine polymer-surface-modified chemical mechanical planarization composition and associated method |
| JP4816901B2 (ja) * | 2005-11-21 | 2011-11-16 | 上村工業株式会社 | 電気銅めっき浴 |
| US20070178697A1 (en) * | 2006-02-02 | 2007-08-02 | Enthone Inc. | Copper electrodeposition in microelectronics |
| WO2008029376A2 (en) * | 2006-09-07 | 2008-03-13 | Enthone Inc. | Deposition of conductive polymer and metallization of non-conductive substrates |
| CN101796221B (zh) | 2007-05-21 | 2012-07-04 | 上村工业株式会社 | 铜电镀浴 |
| TWI341554B (en) * | 2007-08-02 | 2011-05-01 | Enthone | Copper metallization of through silicon via |
| US7905994B2 (en) * | 2007-10-03 | 2011-03-15 | Moses Lake Industries, Inc. | Substrate holder and electroplating system |
| US20090188553A1 (en) * | 2008-01-25 | 2009-07-30 | Emat Technology, Llc | Methods of fabricating solar-cell structures and resulting solar-cell structures |
| GB2457691A (en) * | 2008-02-21 | 2009-08-26 | Sharp Kk | Display with regions simultaneously operable in different viewing modes |
| US8388824B2 (en) * | 2008-11-26 | 2013-03-05 | Enthone Inc. | Method and composition for electrodeposition of copper in microelectronics with dipyridyl-based levelers |
| ES2461493T3 (es) * | 2009-01-30 | 2014-05-20 | Praxair S.T. Technology, Inc. | Objetivo tubular |
| US8058126B2 (en) * | 2009-02-04 | 2011-11-15 | Micron Technology, Inc. | Semiconductor devices and structures including at least partially formed container capacitors and methods of forming the same |
| US8262894B2 (en) | 2009-04-30 | 2012-09-11 | Moses Lake Industries, Inc. | High speed copper plating bath |
| JP5952738B2 (ja) * | 2009-11-27 | 2016-07-13 | ビーエーエスエフ ソシエタス・ヨーロピアBasf Se | 平滑化剤を含む金属電気メッキのための組成物 |
| TWI572750B (zh) | 2010-05-24 | 2017-03-01 | 安頌股份有限公司 | 直通矽穿孔之銅充填 |
| EP2392692A1 (en) | 2010-06-01 | 2011-12-07 | Basf Se | Composition for metal electroplating comprising leveling agent |
| CN102939339B (zh) | 2010-06-01 | 2016-02-17 | 巴斯夫欧洲公司 | 包含流平试剂的金属电镀用组合物 |
| KR20130108978A (ko) * | 2010-06-11 | 2013-10-07 | 알쉬메 | 구리 도금 조성물 및 이 조성물을 사용한 반도체 기판에서 공동을 충진하기 위한 공정 |
| US10233556B2 (en) | 2010-07-02 | 2019-03-19 | Lam Research Corporation | Dynamic modulation of cross flow manifold during electroplating |
| US9624592B2 (en) | 2010-07-02 | 2017-04-18 | Novellus Systems, Inc. | Cross flow manifold for electroplating apparatus |
| US10094034B2 (en) | 2015-08-28 | 2018-10-09 | Lam Research Corporation | Edge flow element for electroplating apparatus |
| US9523155B2 (en) | 2012-12-12 | 2016-12-20 | Novellus Systems, Inc. | Enhancement of electrolyte hydrodynamics for efficient mass transfer during electroplating |
| US8795480B2 (en) * | 2010-07-02 | 2014-08-05 | Novellus Systems, Inc. | Control of electrolyte hydrodynamics for efficient mass transfer during electroplating |
| KR101705734B1 (ko) * | 2011-02-18 | 2017-02-14 | 삼성전자주식회사 | 구리 도금 용액 및 이것을 이용한 구리 도금 방법 |
| US9184144B2 (en) * | 2011-07-21 | 2015-11-10 | Qualcomm Incorporated | Interconnect pillars with directed compliance geometry |
| US8454815B2 (en) | 2011-10-24 | 2013-06-04 | Rohm And Haas Electronics Materials Llc | Plating bath and method |
| FR2995912B1 (fr) * | 2012-09-24 | 2014-10-10 | Alchimer | Electrolyte et procede d'electrodeposition de cuivre sur une couche barriere |
| EP2902817B2 (en) * | 2012-09-28 | 2023-09-27 | Nikon-Essilor Co., Ltd. | Optical component and method for producing same |
| CN103060860B (zh) * | 2013-01-22 | 2016-01-20 | 中南大学 | 一种印制线路板酸性镀铜电镀液及其制备和应用方法 |
| CN103103587B (zh) * | 2013-02-22 | 2016-02-17 | 陕西师范大学 | 含巯基杂环化合物的电镀铜溶液 |
| US9449808B2 (en) | 2013-05-29 | 2016-09-20 | Novellus Systems, Inc. | Apparatus for advanced packaging applications |
| KR20160090306A (ko) | 2013-11-25 | 2016-07-29 | 엔쏜 인코포레이티드 | 구리 전착 |
| TWI710671B (zh) | 2014-09-15 | 2020-11-21 | 美商麥德美樂思公司 | 微電子技術中銅沈積用之平整劑 |
| CN104764777A (zh) * | 2015-03-31 | 2015-07-08 | 深圳崇达多层线路板有限公司 | 一种电镀填孔工艺用的电镀液的检测方法 |
| US10364505B2 (en) | 2016-05-24 | 2019-07-30 | Lam Research Corporation | Dynamic modulation of cross flow manifold during elecroplating |
| CN109952390A (zh) | 2016-09-22 | 2019-06-28 | 麦克德米德乐思公司 | 在微电子件中的铜的电沉积 |
| US11124888B2 (en) | 2016-09-22 | 2021-09-21 | Macdermid Enthone Inc. | Copper deposition in wafer level packaging of integrated circuits |
| EP3360988B1 (en) * | 2017-02-09 | 2019-06-26 | ATOTECH Deutschland GmbH | Pyridinium compounds, a synthesis method therefor, metal or metal alloy plating baths containing said pyridinium compounds and a method for use of said metal or metal alloy plating baths |
| US11001934B2 (en) | 2017-08-21 | 2021-05-11 | Lam Research Corporation | Methods and apparatus for flow isolation and focusing during electroplating |
| US10781527B2 (en) | 2017-09-18 | 2020-09-22 | Lam Research Corporation | Methods and apparatus for controlling delivery of cross flowing and impinging electrolyte during electroplating |
| KR102445636B1 (ko) | 2017-11-28 | 2022-09-22 | 솔브레인 주식회사 | 평탄화제 및 이를 포함하는 구리 도금 조성물 |
| JP6899062B1 (ja) * | 2020-05-18 | 2021-07-07 | 深▲せん▼市創智成功科技有限公司 | Icボードのスルーホールを充填するための電気銅めっき液およびその電気めっき方法 |
| CN114016094B (zh) * | 2021-09-29 | 2022-11-18 | 深圳市励高表面处理材料有限公司 | 一种整平剂及其制备方法 |
| KR20230112884A (ko) * | 2022-01-21 | 2023-07-28 | 동우 화인켐 주식회사 | 구리 도금용 조성물 및 이를 이용한 구리 함유 도전체의 제조 방법 |
| CN117659393A (zh) * | 2022-08-31 | 2024-03-08 | 华为技术有限公司 | 一种整平剂、组合物及其应用 |
| CN120051593A (zh) * | 2022-10-10 | 2025-05-27 | 麦克德米德乐思公司 | 用于纳米孪晶铜形成的组合物和方法 |
| CN116515021B (zh) * | 2023-05-19 | 2025-01-07 | 广东省科学院化工研究所 | 一种聚甲基丙烯酸(n,n-二烷基氨基乙酯)季铵盐及其制备方法和应用 |
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| DE1248415B (de) | 1964-03-07 | 1967-08-24 | Dehydag Gmbh | Saure galvanische Kupferbaeder |
| SE322956B (enExample) | 1966-08-20 | 1970-04-20 | Schering Ag | |
| GB1202497A (en) * | 1968-07-18 | 1970-08-19 | Midland Yorkshire Tar Distille | Preparation of quaternary vinyl pyridine salts and polymers thereof |
| ZA708430B (en) | 1970-02-12 | 1971-09-29 | Udylite Corp | Electrodeposition of copper from acidic baths |
| US3770598A (en) | 1972-01-21 | 1973-11-06 | Oxy Metal Finishing Corp | Electrodeposition of copper from acid baths |
| US4212764A (en) * | 1972-07-03 | 1980-07-15 | Petrolite Corporation | Quaternary polyvinyl heterocyclic compositions and use as corrosion inhibitors |
| US3940320A (en) * | 1972-12-14 | 1976-02-24 | M & T Chemicals Inc. | Electrodeposition of copper |
| US3956078A (en) * | 1972-12-14 | 1976-05-11 | M & T Chemicals Inc. | Electrodeposition of copper |
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| ES440918A1 (es) | 1975-03-11 | 1977-06-01 | Oxy Metal Industries Corp | Un metodo para la preparacion de una poli (sal de alcanol- amonio cuaternario). |
| JPS527819A (en) | 1975-07-10 | 1977-01-21 | Furukawa Electric Co Ltd:The | Process for smooth electrodeposition of copper |
| US4024328A (en) * | 1975-10-01 | 1977-05-17 | The Dow Chemical Company | Method for alkylating aminomethylacrylamide polymers |
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| DE2610705C3 (de) | 1976-03-13 | 1978-10-19 | Henkel Kgaa, 4000 Duesseldorf | Saure galvanische Kupferbäder |
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| US6224737B1 (en) | 1999-08-19 | 2001-05-01 | Taiwan Semiconductor Manufacturing Company | Method for improvement of gap filling capability of electrochemical deposition of copper |
| US6673216B2 (en) | 1999-08-31 | 2004-01-06 | Semitool, Inc. | Apparatus for providing electrical and fluid communication to a rotating microelectronic workpiece during electrochemical processing |
| JP4394234B2 (ja) | 2000-01-20 | 2010-01-06 | 日鉱金属株式会社 | 銅電気めっき液及び銅電気めっき方法 |
| JP2002004081A (ja) | 2000-06-16 | 2002-01-09 | Learonal Japan Inc | シリコンウエハーへの電気めっき方法 |
| EP1197587B1 (en) | 2000-10-13 | 2006-09-20 | Shipley Co. L.L.C. | Seed layer repair and electroplating bath |
| US6649038B2 (en) | 2000-10-13 | 2003-11-18 | Shipley Company, L.L.C. | Electroplating method |
| US6679983B2 (en) * | 2000-10-13 | 2004-01-20 | Shipley Company, L.L.C. | Method of electrodepositing copper |
| US20020090484A1 (en) | 2000-10-20 | 2002-07-11 | Shipley Company, L.L.C. | Plating bath |
| US6660153B2 (en) | 2000-10-20 | 2003-12-09 | Shipley Company, L.L.C. | Seed layer repair bath |
| EP1203950B1 (en) | 2000-11-02 | 2005-09-07 | Shipley Company LLC | Plating bath analysis |
| US6797146B2 (en) | 2000-11-02 | 2004-09-28 | Shipley Company, L.L.C. | Seed layer repair |
| JP2004518022A (ja) | 2000-11-03 | 2004-06-17 | ローム・アンド・ハース・エレクトロニック・マテリアルズ,エル.エル.シー. | 電子デバイス製造のための金属の電気化学的共析出 |
| DE10100954A1 (de) * | 2001-01-11 | 2002-07-18 | Raschig Gmbh | Verwendung von Polyolefinen mit basischen, aromatischen Substituenten als Hilfsmittel zur elektrolytischen Abscheidung von metallischen Schichten |
| JP2003105584A (ja) * | 2001-07-26 | 2003-04-09 | Electroplating Eng Of Japan Co | 微細配線埋め込み用銅メッキ液及びそれを用いた銅メッキ方法 |
| US8002962B2 (en) * | 2002-03-05 | 2011-08-23 | Enthone Inc. | Copper electrodeposition in microelectronics |
| US7316772B2 (en) * | 2002-03-05 | 2008-01-08 | Enthone Inc. | Defect reduction in electrodeposited copper for semiconductor applications |
| US20050072683A1 (en) * | 2003-04-03 | 2005-04-07 | Ebara Corporation | Copper plating bath and plating method |
| JP2005126803A (ja) * | 2003-10-27 | 2005-05-19 | Ebara Corp | めっき方法 |
| JP2005029818A (ja) * | 2003-07-09 | 2005-02-03 | Ebara Corp | めっき方法 |
| TWI328622B (en) | 2005-09-30 | 2010-08-11 | Rohm & Haas Elect Mat | Leveler compounds |
-
2004
- 2004-10-12 US US10/963,369 patent/US8002962B2/en not_active Expired - Lifetime
- 2004-12-13 WO PCT/US2004/041620 patent/WO2005066391A1/en not_active Ceased
- 2004-12-13 KR KR1020067014776A patent/KR101157284B1/ko not_active Expired - Lifetime
- 2004-12-13 JP JP2006547095A patent/JP4539925B2/ja not_active Expired - Lifetime
- 2004-12-13 EP EP04813876.2A patent/EP1697561B1/en not_active Expired - Lifetime
- 2004-12-13 PT PT04813876T patent/PT1697561T/pt unknown
- 2004-12-15 TW TW093138976A patent/TWI266383B/zh not_active IP Right Cessation
-
2011
- 2011-08-22 US US13/214,525 patent/US8608933B2/en not_active Expired - Lifetime
-
2013
- 2013-12-17 US US14/108,954 patent/US9493884B2/en not_active Expired - Fee Related
-
2016
- 2016-10-12 US US15/291,340 patent/US20170029972A1/en not_active Abandoned
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