JP2007510772A - より強靱な脂環式エポキシ樹脂 - Google Patents

より強靱な脂環式エポキシ樹脂 Download PDF

Info

Publication number
JP2007510772A
JP2007510772A JP2006537988A JP2006537988A JP2007510772A JP 2007510772 A JP2007510772 A JP 2007510772A JP 2006537988 A JP2006537988 A JP 2006537988A JP 2006537988 A JP2006537988 A JP 2006537988A JP 2007510772 A JP2007510772 A JP 2007510772A
Authority
JP
Japan
Prior art keywords
coating
resin
epoxy resin
reaction
epoxide
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2006537988A
Other languages
English (en)
Japanese (ja)
Other versions
JP2007510772A5 (enExample
Inventor
ウェールズ カーター,ジェイムズ
エー. クック,ジェシカ
ティー. ラム,キース
エム. シャー,ハーシャッド
Original Assignee
ユニオン・カーバイド・ケミカルズ・アンド・プラスティックス・テクノロジー・コーポレイション
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ユニオン・カーバイド・ケミカルズ・アンド・プラスティックス・テクノロジー・コーポレイション filed Critical ユニオン・カーバイド・ケミカルズ・アンド・プラスティックス・テクノロジー・コーポレイション
Publication of JP2007510772A publication Critical patent/JP2007510772A/ja
Publication of JP2007510772A5 publication Critical patent/JP2007510772A5/ja
Pending legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C08G59/681Metal alcoholates, phenolates or carboxylates
    • C08G59/682Alcoholates
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22Di-epoxy compounds
    • C08G59/24Di-epoxy compounds carbocyclic
    • CCHEMISTRY; METALLURGY
    • C07ORGANIC CHEMISTRY
    • C07DHETEROCYCLIC COMPOUNDS
    • C07D303/00Compounds containing three-membered rings having one oxygen atom as the only ring hetero atom
    • C07D303/02Compounds containing oxirane rings
    • C07D303/12Compounds containing oxirane rings with hydrocarbon radicals, substituted by singly or doubly bound oxygen atoms
    • C07D303/16Compounds containing oxirane rings with hydrocarbon radicals, substituted by singly or doubly bound oxygen atoms by esterified hydroxyl radicals
    • CCHEMISTRY; METALLURGY
    • C07ORGANIC CHEMISTRY
    • C07DHETEROCYCLIC COMPOUNDS
    • C07D303/00Compounds containing three-membered rings having one oxygen atom as the only ring hetero atom
    • C07D303/02Compounds containing oxirane rings
    • C07D303/38Compounds containing oxirane rings with hydrocarbon radicals, substituted by carbon atoms having three bonds to hetero atoms with at the most one bond to halogen, e.g. ester or nitrile radicals
    • C07D303/40Compounds containing oxirane rings with hydrocarbon radicals, substituted by carbon atoms having three bonds to hetero atoms with at the most one bond to halogen, e.g. ester or nitrile radicals by ester radicals
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D163/00Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/038Macromolecular compounds which are rendered insoluble or differentially wettable
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/31504Composite [nonstructural laminate]
    • Y10T428/31511Of epoxy ether

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Engineering & Computer Science (AREA)
  • Wood Science & Technology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Epoxy Resins (AREA)
  • Paints Or Removers (AREA)
  • Epoxy Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP2006537988A 2003-11-03 2004-09-10 より強靱な脂環式エポキシ樹脂 Pending JP2007510772A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US51687803P 2003-11-03 2003-11-03
PCT/US2004/029996 WO2005044890A1 (en) 2003-11-03 2004-09-10 Tougher cycloaliphatic epoxide resins

Publications (2)

Publication Number Publication Date
JP2007510772A true JP2007510772A (ja) 2007-04-26
JP2007510772A5 JP2007510772A5 (enExample) 2007-10-25

Family

ID=34572899

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006537988A Pending JP2007510772A (ja) 2003-11-03 2004-09-10 より強靱な脂環式エポキシ樹脂

Country Status (9)

Country Link
US (1) US20070042191A1 (enExample)
EP (1) EP1682599A1 (enExample)
JP (1) JP2007510772A (enExample)
KR (1) KR20060113912A (enExample)
CN (1) CN1875045A (enExample)
AR (1) AR046438A1 (enExample)
BR (1) BRPI0415812A (enExample)
TW (1) TW200523288A (enExample)
WO (1) WO2005044890A1 (enExample)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006241180A (ja) * 2005-02-28 2006-09-14 Daicel Chem Ind Ltd 紫外線硬化型缶用塗料組成物、塗装金属板、および塗装金属缶
JP2010241942A (ja) * 2009-04-03 2010-10-28 Nippon Kayaku Co Ltd ジオレフィン化合物、エポキシ樹脂、硬化性樹脂組成物及びその硬化物
JP2011016880A (ja) * 2009-07-07 2011-01-27 Nippon Kayaku Co Ltd 光半導体封止用硬化性樹脂組成物、及びその硬化物
JP2011079794A (ja) * 2009-10-09 2011-04-21 Nippon Kayaku Co Ltd ジオレフィン化合物、エポキシ樹脂、硬化性樹脂組成物及びその硬化物
WO2011078205A1 (ja) * 2009-12-24 2011-06-30 日本化薬株式会社 ジオレフィン化合物、エポキシ樹脂、硬化性樹脂組成物及びその硬化物、並びに光半導体装置
WO2011078322A1 (ja) * 2009-12-24 2011-06-30 日本化薬株式会社 エポキシ樹脂組成物、硬化性樹脂組成物、およびその硬化物
WO2011145733A1 (ja) * 2010-05-21 2011-11-24 日本化薬株式会社 ジオレフィン化合物、エポキシ樹脂、硬化性樹脂組成物及びその硬化物

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005330335A (ja) * 2004-05-18 2005-12-02 Nitto Denko Corp 光半導体素子封止用エポキシ樹脂組成物およびそれを用いた光半導体装置
US7288607B2 (en) * 2004-10-12 2007-10-30 E. I. Du Pont De Nemours & Co. High solids primer composition based on epoxy ring opening curing reaction
JP4683933B2 (ja) * 2005-01-19 2011-05-18 ダイセル化学工業株式会社 硬化性樹脂組成物および層間絶縁膜
JP2007039521A (ja) * 2005-08-02 2007-02-15 Stanley Electric Co Ltd 熱硬化性樹脂組成物、該組成物を熱硬化してなる透光性硬化物、該硬化物で封止された発光ダイオード
JP5319971B2 (ja) * 2008-06-27 2013-10-16 昭和電工株式会社 脂環式エポキシ基含有エステル化合物の製造方法
BR112012033390A2 (pt) 2010-06-28 2016-11-22 Dow Global Technologies Llc composição curável por uv, processo para preparar uma composição de resina de dióxido de divinilareno curável e produto curado
US9861452B2 (en) 2013-08-09 2018-01-09 Dsm Ip Assets B.V. Low-viscosity liquid radiation curable dental aligner mold resin compositions for additive manufacturing

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5981329A (ja) * 1982-09-30 1984-05-11 ユニオン、カーバイド、コーポレーシヨン 硬化し得るエポキシ樹脂含有成形組成物
JPS62230861A (ja) * 1985-12-19 1987-10-09 ユニオン・カ−バイド・コ−ポレ−シヨン 光硬化性相似被覆組成物
JPS63261259A (ja) * 1987-04-06 1988-10-27 チバ−ガイギー アクチエンゲゼルシヤフト 光構造性塗膜の製造方法
JPH10251375A (ja) * 1997-03-06 1998-09-22 Ciba Specialty Chem Holding Inc α−グリコール基含有グリシジル化合物
JP2000159764A (ja) * 1998-11-24 2000-06-13 Ciba Specialty Chem Holding Inc ピペラジノン誘導体
JP2001200200A (ja) * 1999-11-10 2001-07-24 Vantico Ag 硬化性組成物
JP2002338659A (ja) * 2001-05-14 2002-11-27 Daicel Chem Ind Ltd 液状エポキシ樹脂組成物及びその用途
JP2002371073A (ja) * 2001-06-12 2002-12-26 Asahi Kasei Corp エポキシ含有脂環式エステルの製法
JP2003176333A (ja) * 2001-08-23 2003-06-24 General Electric Co <Ge> エポキシ樹脂組成物、該組成物で封入された固体素子デバイス及び封入方法
JP2003342268A (ja) * 2002-05-28 2003-12-03 Nippon Kasei Chem Co Ltd エポキシ基末端(メタ)アクリレートの製造方法
JP2004067947A (ja) * 2002-08-08 2004-03-04 Nippon Soda Co Ltd 光触媒層形成用塗布液および光触媒担持構造体

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US516878A (en) * 1894-03-20 Joseph sachs
JPS608246B2 (ja) * 1980-11-03 1985-03-01 ユニオン・カ−バイド・コ−ポレ−シヨン 硬化し得るエポキシ樹脂含有組成物
JPH0418460A (ja) * 1990-05-11 1992-01-22 Kansai Paint Co Ltd カチオン電着塗料用樹脂組成物
US5268489A (en) * 1991-06-26 1993-12-07 Union Carbide Chemicals & Plastics Technology Corporation Production of unsaturated cycloaliphatic esters and derivatives thereof
US5948922A (en) * 1997-02-20 1999-09-07 Cornell Research Foundation, Inc. Compounds with substituted cyclic hydrocarbon moieties linked by secondary or tertiary oxycarbonyl containing moiety providing reworkable cured thermosets
US20030059618A1 (en) * 2001-03-23 2003-03-27 Hideyuke Takai Method of producing epoxy compound, epoxy resin composition and its applications, ultraviolet rays-curable can-coating composition and method of producing coated metal can
US6916890B1 (en) * 2001-10-09 2005-07-12 Henkel Corporation Thermally reworkable epoxy resins and compositions based thereon

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5981329A (ja) * 1982-09-30 1984-05-11 ユニオン、カーバイド、コーポレーシヨン 硬化し得るエポキシ樹脂含有成形組成物
JPS62230861A (ja) * 1985-12-19 1987-10-09 ユニオン・カ−バイド・コ−ポレ−シヨン 光硬化性相似被覆組成物
JPS63261259A (ja) * 1987-04-06 1988-10-27 チバ−ガイギー アクチエンゲゼルシヤフト 光構造性塗膜の製造方法
JPH10251375A (ja) * 1997-03-06 1998-09-22 Ciba Specialty Chem Holding Inc α−グリコール基含有グリシジル化合物
JP2000159764A (ja) * 1998-11-24 2000-06-13 Ciba Specialty Chem Holding Inc ピペラジノン誘導体
JP2001200200A (ja) * 1999-11-10 2001-07-24 Vantico Ag 硬化性組成物
JP2002338659A (ja) * 2001-05-14 2002-11-27 Daicel Chem Ind Ltd 液状エポキシ樹脂組成物及びその用途
JP2002371073A (ja) * 2001-06-12 2002-12-26 Asahi Kasei Corp エポキシ含有脂環式エステルの製法
JP2003176333A (ja) * 2001-08-23 2003-06-24 General Electric Co <Ge> エポキシ樹脂組成物、該組成物で封入された固体素子デバイス及び封入方法
JP2003342268A (ja) * 2002-05-28 2003-12-03 Nippon Kasei Chem Co Ltd エポキシ基末端(メタ)アクリレートの製造方法
JP2004067947A (ja) * 2002-08-08 2004-03-04 Nippon Soda Co Ltd 光触媒層形成用塗布液および光触媒担持構造体

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006241180A (ja) * 2005-02-28 2006-09-14 Daicel Chem Ind Ltd 紫外線硬化型缶用塗料組成物、塗装金属板、および塗装金属缶
JP2010241942A (ja) * 2009-04-03 2010-10-28 Nippon Kayaku Co Ltd ジオレフィン化合物、エポキシ樹脂、硬化性樹脂組成物及びその硬化物
JP2011016880A (ja) * 2009-07-07 2011-01-27 Nippon Kayaku Co Ltd 光半導体封止用硬化性樹脂組成物、及びその硬化物
JP2011079794A (ja) * 2009-10-09 2011-04-21 Nippon Kayaku Co Ltd ジオレフィン化合物、エポキシ樹脂、硬化性樹脂組成物及びその硬化物
WO2011078205A1 (ja) * 2009-12-24 2011-06-30 日本化薬株式会社 ジオレフィン化合物、エポキシ樹脂、硬化性樹脂組成物及びその硬化物、並びに光半導体装置
WO2011078322A1 (ja) * 2009-12-24 2011-06-30 日本化薬株式会社 エポキシ樹脂組成物、硬化性樹脂組成物、およびその硬化物
JP5559207B2 (ja) * 2009-12-24 2014-07-23 日本化薬株式会社 ジオレフィン化合物、エポキシ樹脂、硬化性樹脂組成物及びその硬化物、並びに光半導体装置
JP5615847B2 (ja) * 2009-12-24 2014-10-29 日本化薬株式会社 エポキシ樹脂組成物、硬化性樹脂組成物、およびその硬化物
WO2011145733A1 (ja) * 2010-05-21 2011-11-24 日本化薬株式会社 ジオレフィン化合物、エポキシ樹脂、硬化性樹脂組成物及びその硬化物
JP5878865B2 (ja) * 2010-05-21 2016-03-08 日本化薬株式会社 ジオレフィン化合物、エポキシ樹脂、硬化性樹脂組成物及びその硬化物

Also Published As

Publication number Publication date
TW200523288A (en) 2005-07-16
KR20060113912A (ko) 2006-11-03
AR046438A1 (es) 2005-12-07
WO2005044890A1 (en) 2005-05-19
CN1875045A (zh) 2006-12-06
EP1682599A1 (en) 2006-07-26
US20070042191A1 (en) 2007-02-22
BRPI0415812A (pt) 2006-12-26

Similar Documents

Publication Publication Date Title
JP2007510772A (ja) より強靱な脂環式エポキシ樹脂
JP6100825B2 (ja) オレフィン化合物からエポキシドを製造する方法
TWI298065B (enExample)
EP2702029B1 (en) Bisphenol a (bpa) free epoxy resins
JP2926262B2 (ja) 新規な脂環式化合物からなる組成物およびその製造方法
TWI629307B (zh) Polyoxymethylene modified epoxy resin and its composition and hardened material
JP2014173090A (ja) エポキシ樹脂組成物、同組成物を製造する方法、およびその物品
US6201070B1 (en) Method for enhancing the toughness of cycloaliphatic epoxide-based coatings
JP6413796B2 (ja) 架橋性組成物、硬化物の製造方法、および硬化物
EP0458296B1 (en) Modified epoxy resins having acetylenically unsaturated functions
JPH0717917A (ja) 三官能性不飽和化合物及びその誘導体
JP2915212B2 (ja) 脂環式エポキシドの製造方法
US5244985A (en) Epoxidized polyesters and method of production thereof
JPS59120619A (ja) 樹脂質化合物の製造方法、それによつて製造された化合物および熱硬化性コ−テイング組成物におけるその使用
JPH05271128A (ja) 置換1,5−ペンタンジオール及びその製造方法
JP2012236805A (ja) (メタ)アクリル酸エステルの製造方法
JPH09151237A (ja) 活性エネルギー線硬化性樹脂組成物およびその用途
JPS62178542A (ja) (メタ)アクリル酸エステル及びコ−テイング又は印刷インキ用反応性化合物
JPH10306088A (ja) エポキシ化合物、その合成前駆体及び該化合物を含有する硬化性組成物
US20070167645A1 (en) Radiation-cured substances
JPH06207126A (ja) 熱硬化性粉体塗料用樹脂組成物
JPH09151238A (ja) 新規な(メタ)アクリル基を側鎖に有する化合物およびその用途
JPH04275320A (ja) 硬化性樹脂組成物及びその硬化方法
JP2009286829A (ja) イミド(メタ)アクリル酸エステルの製造方法とこれを用いた硬化性樹脂組成物
JPH0228211A (ja) エポキシ樹脂

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20070907

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20070907

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20100225

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20100803

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20110104