BRPI0415812A - método para intensificar a resistência de um revestimento sobre um artigo, composição fotocurável e composição de formulação de encapsulante de led curável termicamente - Google Patents

método para intensificar a resistência de um revestimento sobre um artigo, composição fotocurável e composição de formulação de encapsulante de led curável termicamente

Info

Publication number
BRPI0415812A
BRPI0415812A BRPI0415812A BRPI0415812A BR PI0415812 A BRPI0415812 A BR PI0415812A BR PI0415812 A BRPI0415812 A BR PI0415812A BR PI0415812 A BRPI0415812 A BR PI0415812A
Authority
BR
Brazil
Prior art keywords
composition
article
coating
enhancing
thermally curable
Prior art date
Application number
Other languages
English (en)
Portuguese (pt)
Inventor
James Wells Carter
Jessica A Cook
Keith T Lamb
Harshad M Shah
Original Assignee
Union Carbide Chem Plastic
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Union Carbide Chem Plastic filed Critical Union Carbide Chem Plastic
Publication of BRPI0415812A publication Critical patent/BRPI0415812A/pt

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C08G59/681—Metal alcoholates, phenolates or carboxylates
    • C08G59/682—Alcoholates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/24—Di-epoxy compounds carbocyclic
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D303/00—Compounds containing three-membered rings having one oxygen atom as the only ring hetero atom
    • C07D303/02—Compounds containing oxirane rings
    • C07D303/12—Compounds containing oxirane rings with hydrocarbon radicals, substituted by singly or doubly bound oxygen atoms
    • C07D303/16—Compounds containing oxirane rings with hydrocarbon radicals, substituted by singly or doubly bound oxygen atoms by esterified hydroxyl radicals
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D303/00—Compounds containing three-membered rings having one oxygen atom as the only ring hetero atom
    • C07D303/02—Compounds containing oxirane rings
    • C07D303/38—Compounds containing oxirane rings with hydrocarbon radicals, substituted by carbon atoms having three bonds to hetero atoms with at the most one bond to halogen, e.g. ester or nitrile radicals
    • C07D303/40—Compounds containing oxirane rings with hydrocarbon radicals, substituted by carbon atoms having three bonds to hetero atoms with at the most one bond to halogen, e.g. ester or nitrile radicals by ester radicals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Engineering & Computer Science (AREA)
  • Wood Science & Technology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Epoxy Resins (AREA)
  • Paints Or Removers (AREA)
  • Epoxy Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
BRPI0415812 2003-11-03 2004-09-10 método para intensificar a resistência de um revestimento sobre um artigo, composição fotocurável e composição de formulação de encapsulante de led curável termicamente BRPI0415812A (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US51687803P 2003-11-03 2003-11-03
PCT/US2004/029996 WO2005044890A1 (en) 2003-11-03 2004-09-10 Tougher cycloaliphatic epoxide resins

Publications (1)

Publication Number Publication Date
BRPI0415812A true BRPI0415812A (pt) 2006-12-26

Family

ID=34572899

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI0415812 BRPI0415812A (pt) 2003-11-03 2004-09-10 método para intensificar a resistência de um revestimento sobre um artigo, composição fotocurável e composição de formulação de encapsulante de led curável termicamente

Country Status (9)

Country Link
US (1) US20070042191A1 (enExample)
EP (1) EP1682599A1 (enExample)
JP (1) JP2007510772A (enExample)
KR (1) KR20060113912A (enExample)
CN (1) CN1875045A (enExample)
AR (1) AR046438A1 (enExample)
BR (1) BRPI0415812A (enExample)
TW (1) TW200523288A (enExample)
WO (1) WO2005044890A1 (enExample)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005330335A (ja) * 2004-05-18 2005-12-02 Nitto Denko Corp 光半導体素子封止用エポキシ樹脂組成物およびそれを用いた光半導体装置
US7288607B2 (en) * 2004-10-12 2007-10-30 E. I. Du Pont De Nemours & Co. High solids primer composition based on epoxy ring opening curing reaction
JP4683933B2 (ja) * 2005-01-19 2011-05-18 ダイセル化学工業株式会社 硬化性樹脂組成物および層間絶縁膜
JP4786200B2 (ja) * 2005-02-28 2011-10-05 ダイセル化学工業株式会社 紫外線硬化型缶用塗料組成物、塗装金属板、および塗装金属缶
JP2007039521A (ja) * 2005-08-02 2007-02-15 Stanley Electric Co Ltd 熱硬化性樹脂組成物、該組成物を熱硬化してなる透光性硬化物、該硬化物で封止された発光ダイオード
JP5319971B2 (ja) * 2008-06-27 2013-10-16 昭和電工株式会社 脂環式エポキシ基含有エステル化合物の製造方法
JP5196663B2 (ja) * 2009-04-03 2013-05-15 日本化薬株式会社 ジオレフィン化合物、エポキシ樹脂、硬化性樹脂組成物及びその硬化物
JP5348764B2 (ja) * 2009-07-07 2013-11-20 日本化薬株式会社 光半導体封止用硬化性樹脂組成物、及びその硬化物
JP5505960B2 (ja) * 2009-10-09 2014-05-28 日本化薬株式会社 ジオレフィン化合物、エポキシ樹脂、硬化性樹脂組成物及びその硬化物
JP5615847B2 (ja) * 2009-12-24 2014-10-29 日本化薬株式会社 エポキシ樹脂組成物、硬化性樹脂組成物、およびその硬化物
JP5559207B2 (ja) * 2009-12-24 2014-07-23 日本化薬株式会社 ジオレフィン化合物、エポキシ樹脂、硬化性樹脂組成物及びその硬化物、並びに光半導体装置
JP5878865B2 (ja) * 2010-05-21 2016-03-08 日本化薬株式会社 ジオレフィン化合物、エポキシ樹脂、硬化性樹脂組成物及びその硬化物
BR112012033390A2 (pt) 2010-06-28 2016-11-22 Dow Global Technologies Llc composição curável por uv, processo para preparar uma composição de resina de dióxido de divinilareno curável e produto curado
US9861452B2 (en) 2013-08-09 2018-01-09 Dsm Ip Assets B.V. Low-viscosity liquid radiation curable dental aligner mold resin compositions for additive manufacturing

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US516878A (en) * 1894-03-20 Joseph sachs
JPS608246B2 (ja) * 1980-11-03 1985-03-01 ユニオン・カ−バイド・コ−ポレ−シヨン 硬化し得るエポキシ樹脂含有組成物
MX168518B (es) * 1982-09-30 1993-05-27 Union Carbide Corp Composiciones de modelo que contienen resina epoxida curable
CA1312040C (en) * 1985-12-19 1992-12-29 Joseph Victor Koleske Conformal coatings cured with actinic radiation
EP0286594A2 (de) * 1987-04-06 1988-10-12 Ciba-Geigy Ag Verfahren zur Herstellung von photostrukturierbaren Ueberzügen
JPH0418460A (ja) * 1990-05-11 1992-01-22 Kansai Paint Co Ltd カチオン電着塗料用樹脂組成物
US5268489A (en) * 1991-06-26 1993-12-07 Union Carbide Chemicals & Plastics Technology Corporation Production of unsaturated cycloaliphatic esters and derivatives thereof
US5948922A (en) * 1997-02-20 1999-09-07 Cornell Research Foundation, Inc. Compounds with substituted cyclic hydrocarbon moieties linked by secondary or tertiary oxycarbonyl containing moiety providing reworkable cured thermosets
EP0864594A1 (de) * 1997-03-06 1998-09-16 Ciba SC Holding AG Alpha-Glykolgruppen enthaltende Glycidylverbindungen
GB2344103B (en) * 1998-11-24 2003-04-16 Ciba Sc Holding Ag Piperazinone derivatives
US6437045B1 (en) * 1999-11-10 2002-08-20 Vantico Inc. Powder coating of carboxyl polyester or (poly)methacrylate and cycloaliphatic polyepoxide
US20030059618A1 (en) * 2001-03-23 2003-03-27 Hideyuke Takai Method of producing epoxy compound, epoxy resin composition and its applications, ultraviolet rays-curable can-coating composition and method of producing coated metal can
JP5226162B2 (ja) * 2001-05-14 2013-07-03 株式会社ダイセル 液状エポキシ樹脂組成物及びその用途
JP2002371073A (ja) * 2001-06-12 2002-12-26 Asahi Kasei Corp エポキシ含有脂環式エステルの製法
US6617401B2 (en) * 2001-08-23 2003-09-09 General Electric Company Composition comprising cycloaliphatic epoxy resin, 4-methylhexahydrophthalic anhydride curing agent and boron catalyst
US6916890B1 (en) * 2001-10-09 2005-07-12 Henkel Corporation Thermally reworkable epoxy resins and compositions based thereon
JP2003342268A (ja) * 2002-05-28 2003-12-03 Nippon Kasei Chem Co Ltd エポキシ基末端（メタ）アクリレートの製造方法
JP2004067947A (ja) * 2002-08-08 2004-03-04 Nippon Soda Co Ltd 光触媒層形成用塗布液および光触媒担持構造体

Also Published As

Publication number Publication date
TW200523288A (en) 2005-07-16
KR20060113912A (ko) 2006-11-03
AR046438A1 (es) 2005-12-07
WO2005044890A1 (en) 2005-05-19
CN1875045A (zh) 2006-12-06
JP2007510772A (ja) 2007-04-26
EP1682599A1 (en) 2006-07-26
US20070042191A1 (en) 2007-02-22

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Legal Events

Date Code Title Description
B25D Requested change of name of applicant approved

Owner name: UNION CARBIDE CHEMICALS AND PLASTICS TECHNOLOGY LL

Free format text: ALTERADO DE: UNION CARBIDE CHEMICALS AND PLASTICS TECHNOLOGY CORPORATION

B25G Requested change of headquarter approved

Owner name: UNION CARBIDE CHEMICALS AND PLASTICS TECHNOLOGY LL

Free format text: SEDE ALTERADA CONFORME SOLICITADO NA PETICAO NO 018100014982/SP DE 28/04/2010.

B08F Application fees: application dismissed [chapter 8.6 patent gazette]

Free format text: REFERENTE A 8A ANUIDADE.

B08K Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette]

Free format text: REFERENTE AO DESPACHO 8.6 PUBLICADO NA RPI 2166 DE 10/07/2012.