CN1875045A - 更韧的脂环族环氧树脂 - Google Patents

更韧的脂环族环氧树脂 Download PDF

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Publication number
CN1875045A
CN1875045A CNA2004800322989A CN200480032298A CN1875045A CN 1875045 A CN1875045 A CN 1875045A CN A2004800322989 A CNA2004800322989 A CN A2004800322989A CN 200480032298 A CN200480032298 A CN 200480032298A CN 1875045 A CN1875045 A CN 1875045A
Authority
CN
China
Prior art keywords
resin
epoxy
coating
coatings
cycloaliphatic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA2004800322989A
Other languages
English (en)
Chinese (zh)
Inventor
J·W·卡特
J·A·库克
K·T·兰姆
H·M·沙阿
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Union Carbide Chemicals and Plastics Technology LLC
Original Assignee
Union Carbide Chemicals and Plastics Technology LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Union Carbide Chemicals and Plastics Technology LLC filed Critical Union Carbide Chemicals and Plastics Technology LLC
Publication of CN1875045A publication Critical patent/CN1875045A/zh
Pending legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C08G59/681—Metal alcoholates, phenolates or carboxylates
    • C08G59/682—Alcoholates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/24—Di-epoxy compounds carbocyclic
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D303/00—Compounds containing three-membered rings having one oxygen atom as the only ring hetero atom
    • C07D303/02—Compounds containing oxirane rings
    • C07D303/12—Compounds containing oxirane rings with hydrocarbon radicals, substituted by singly or doubly bound oxygen atoms
    • C07D303/16—Compounds containing oxirane rings with hydrocarbon radicals, substituted by singly or doubly bound oxygen atoms by esterified hydroxyl radicals
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D303/00—Compounds containing three-membered rings having one oxygen atom as the only ring hetero atom
    • C07D303/02—Compounds containing oxirane rings
    • C07D303/38—Compounds containing oxirane rings with hydrocarbon radicals, substituted by carbon atoms having three bonds to hetero atoms with at the most one bond to halogen, e.g. ester or nitrile radicals
    • C07D303/40—Compounds containing oxirane rings with hydrocarbon radicals, substituted by carbon atoms having three bonds to hetero atoms with at the most one bond to halogen, e.g. ester or nitrile radicals by ester radicals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Engineering & Computer Science (AREA)
  • Wood Science & Technology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Epoxy Resins (AREA)
  • Paints Or Removers (AREA)
  • Epoxy Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
CNA2004800322989A 2003-11-03 2004-09-10 更韧的脂环族环氧树脂 Pending CN1875045A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US51687803P 2003-11-03 2003-11-03
US60/516,878 2003-11-03

Publications (1)

Publication Number Publication Date
CN1875045A true CN1875045A (zh) 2006-12-06

Family

ID=34572899

Family Applications (1)

Application Number Title Priority Date Filing Date
CNA2004800322989A Pending CN1875045A (zh) 2003-11-03 2004-09-10 更韧的脂环族环氧树脂

Country Status (9)

Country Link
US (1) US20070042191A1 (enExample)
EP (1) EP1682599A1 (enExample)
JP (1) JP2007510772A (enExample)
KR (1) KR20060113912A (enExample)
CN (1) CN1875045A (enExample)
AR (1) AR046438A1 (enExample)
BR (1) BRPI0415812A (enExample)
TW (1) TW200523288A (enExample)
WO (1) WO2005044890A1 (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101942073A (zh) * 2009-07-07 2011-01-12 日本化药株式会社 光半导体密封用固化性树脂组合物及其固化物
CN102892745A (zh) * 2010-05-21 2013-01-23 日本化药株式会社 二烯化合物、环氧树脂、可固化树脂组合物及其固化物
TWI471347B (zh) * 2009-12-24 2015-02-01 Nippon Kayaku Kk A thermosetting resin composition and a hardened product thereof, and an optical semiconductor device

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005330335A (ja) * 2004-05-18 2005-12-02 Nitto Denko Corp 光半導体素子封止用エポキシ樹脂組成物およびそれを用いた光半導体装置
US7288607B2 (en) * 2004-10-12 2007-10-30 E. I. Du Pont De Nemours & Co. High solids primer composition based on epoxy ring opening curing reaction
JP4683933B2 (ja) * 2005-01-19 2011-05-18 ダイセル化学工業株式会社 硬化性樹脂組成物および層間絶縁膜
JP4786200B2 (ja) * 2005-02-28 2011-10-05 ダイセル化学工業株式会社 紫外線硬化型缶用塗料組成物、塗装金属板、および塗装金属缶
JP2007039521A (ja) * 2005-08-02 2007-02-15 Stanley Electric Co Ltd 熱硬化性樹脂組成物、該組成物を熱硬化してなる透光性硬化物、該硬化物で封止された発光ダイオード
JP5319971B2 (ja) * 2008-06-27 2013-10-16 昭和電工株式会社 脂環式エポキシ基含有エステル化合物の製造方法
JP5196663B2 (ja) * 2009-04-03 2013-05-15 日本化薬株式会社 ジオレフィン化合物、エポキシ樹脂、硬化性樹脂組成物及びその硬化物
JP5505960B2 (ja) * 2009-10-09 2014-05-28 日本化薬株式会社 ジオレフィン化合物、エポキシ樹脂、硬化性樹脂組成物及びその硬化物
JP5615847B2 (ja) * 2009-12-24 2014-10-29 日本化薬株式会社 エポキシ樹脂組成物、硬化性樹脂組成物、およびその硬化物
BR112012033390A2 (pt) 2010-06-28 2016-11-22 Dow Global Technologies Llc composição curável por uv, processo para preparar uma composição de resina de dióxido de divinilareno curável e produto curado
US9861452B2 (en) 2013-08-09 2018-01-09 Dsm Ip Assets B.V. Low-viscosity liquid radiation curable dental aligner mold resin compositions for additive manufacturing

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US516878A (en) * 1894-03-20 Joseph sachs
JPS608246B2 (ja) * 1980-11-03 1985-03-01 ユニオン・カ−バイド・コ−ポレ−シヨン 硬化し得るエポキシ樹脂含有組成物
MX168518B (es) * 1982-09-30 1993-05-27 Union Carbide Corp Composiciones de modelo que contienen resina epoxida curable
CA1312040C (en) * 1985-12-19 1992-12-29 Joseph Victor Koleske Conformal coatings cured with actinic radiation
EP0286594A2 (de) * 1987-04-06 1988-10-12 Ciba-Geigy Ag Verfahren zur Herstellung von photostrukturierbaren Ueberzügen
JPH0418460A (ja) * 1990-05-11 1992-01-22 Kansai Paint Co Ltd カチオン電着塗料用樹脂組成物
US5268489A (en) * 1991-06-26 1993-12-07 Union Carbide Chemicals & Plastics Technology Corporation Production of unsaturated cycloaliphatic esters and derivatives thereof
US5948922A (en) * 1997-02-20 1999-09-07 Cornell Research Foundation, Inc. Compounds with substituted cyclic hydrocarbon moieties linked by secondary or tertiary oxycarbonyl containing moiety providing reworkable cured thermosets
EP0864594A1 (de) * 1997-03-06 1998-09-16 Ciba SC Holding AG Alpha-Glykolgruppen enthaltende Glycidylverbindungen
GB2344103B (en) * 1998-11-24 2003-04-16 Ciba Sc Holding Ag Piperazinone derivatives
US6437045B1 (en) * 1999-11-10 2002-08-20 Vantico Inc. Powder coating of carboxyl polyester or (poly)methacrylate and cycloaliphatic polyepoxide
US20030059618A1 (en) * 2001-03-23 2003-03-27 Hideyuke Takai Method of producing epoxy compound, epoxy resin composition and its applications, ultraviolet rays-curable can-coating composition and method of producing coated metal can
JP5226162B2 (ja) * 2001-05-14 2013-07-03 株式会社ダイセル 液状エポキシ樹脂組成物及びその用途
JP2002371073A (ja) * 2001-06-12 2002-12-26 Asahi Kasei Corp エポキシ含有脂環式エステルの製法
US6617401B2 (en) * 2001-08-23 2003-09-09 General Electric Company Composition comprising cycloaliphatic epoxy resin, 4-methylhexahydrophthalic anhydride curing agent and boron catalyst
US6916890B1 (en) * 2001-10-09 2005-07-12 Henkel Corporation Thermally reworkable epoxy resins and compositions based thereon
JP2003342268A (ja) * 2002-05-28 2003-12-03 Nippon Kasei Chem Co Ltd エポキシ基末端（メタ）アクリレートの製造方法
JP2004067947A (ja) * 2002-08-08 2004-03-04 Nippon Soda Co Ltd 光触媒層形成用塗布液および光触媒担持構造体

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101942073A (zh) * 2009-07-07 2011-01-12 日本化药株式会社 光半导体密封用固化性树脂组合物及其固化物
CN101942073B (zh) * 2009-07-07 2015-03-18 日本化药株式会社 光半导体密封用固化性树脂组合物及其固化物
TWI500650B (zh) * 2009-07-07 2015-09-21 日本化藥股份有限公司 用於封裝光半導體用硬化性樹脂組成物，及其硬化物
TWI471347B (zh) * 2009-12-24 2015-02-01 Nippon Kayaku Kk A thermosetting resin composition and a hardened product thereof, and an optical semiconductor device
CN102892745A (zh) * 2010-05-21 2013-01-23 日本化药株式会社 二烯化合物、环氧树脂、可固化树脂组合物及其固化物
CN102892745B (zh) * 2010-05-21 2014-10-15 日本化药株式会社 二烯化合物、环氧树脂、可固化树脂组合物及其固化物

Also Published As

Publication number Publication date
TW200523288A (en) 2005-07-16
KR20060113912A (ko) 2006-11-03
AR046438A1 (es) 2005-12-07
WO2005044890A1 (en) 2005-05-19
JP2007510772A (ja) 2007-04-26
EP1682599A1 (en) 2006-07-26
US20070042191A1 (en) 2007-02-22
BRPI0415812A (pt) 2006-12-26

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Open date: 20061206