JP2007510772A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2007510772A5 JP2007510772A5 JP2006537988A JP2006537988A JP2007510772A5 JP 2007510772 A5 JP2007510772 A5 JP 2007510772A5 JP 2006537988 A JP2006537988 A JP 2006537988A JP 2006537988 A JP2006537988 A JP 2006537988A JP 2007510772 A5 JP2007510772 A5 JP 2007510772A5
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- formula
- hydrogen
- photocurable composition
- phenyl
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 claims 7
- 239000000203 mixture Substances 0.000 claims 5
- 239000003822 epoxy resin Substances 0.000 claims 4
- 229910052739 hydrogen Inorganic materials 0.000 claims 4
- 239000001257 hydrogen Substances 0.000 claims 4
- 229920000647 polyepoxide Polymers 0.000 claims 4
- 125000002009 alkene group Chemical group 0.000 claims 3
- 229910052799 carbon Inorganic materials 0.000 claims 3
- 150000002431 hydrogen Chemical class 0.000 claims 3
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims 3
- 150000001875 compounds Chemical class 0.000 claims 2
- 239000000047 product Substances 0.000 claims 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims 1
- -1 alicyclic epoxide carboxylic acid ester Chemical class 0.000 claims 1
- 125000002723 alicyclic group Chemical group 0.000 claims 1
- 239000007795 chemical reaction product Substances 0.000 claims 1
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- 239000011353 cycloaliphatic epoxy resin Substances 0.000 claims 1
- 239000008393 encapsulating agent Substances 0.000 claims 1
- 238000009472 formulation Methods 0.000 claims 1
- 125000004356 hydroxy functional group Chemical group O* 0.000 claims 1
- 239000003999 initiator Substances 0.000 claims 1
- 229920001187 thermosetting polymer Polymers 0.000 claims 1
- 0 CC(*)(C(C)(C(*)(C1(*)OC11*)N)*(C)=*)C1(N)NC=C Chemical compound CC(*)(C(C)(C(*)(C1(*)OC11*)N)*(C)=*)C1(N)NC=C 0.000 description 7
- NLWYHKMMNANWMZ-UHFFFAOYSA-N C#[IH]CCC(N)=[IH] Chemical compound C#[IH]CCC(N)=[IH] NLWYHKMMNANWMZ-UHFFFAOYSA-N 0.000 description 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US51687803P | 2003-11-03 | 2003-11-03 | |
| PCT/US2004/029996 WO2005044890A1 (en) | 2003-11-03 | 2004-09-10 | Tougher cycloaliphatic epoxide resins |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2007510772A JP2007510772A (ja) | 2007-04-26 |
| JP2007510772A5 true JP2007510772A5 (enExample) | 2007-10-25 |
Family
ID=34572899
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006537988A Pending JP2007510772A (ja) | 2003-11-03 | 2004-09-10 | より強靱な脂環式エポキシ樹脂 |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US20070042191A1 (enExample) |
| EP (1) | EP1682599A1 (enExample) |
| JP (1) | JP2007510772A (enExample) |
| KR (1) | KR20060113912A (enExample) |
| CN (1) | CN1875045A (enExample) |
| AR (1) | AR046438A1 (enExample) |
| BR (1) | BRPI0415812A (enExample) |
| TW (1) | TW200523288A (enExample) |
| WO (1) | WO2005044890A1 (enExample) |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005330335A (ja) * | 2004-05-18 | 2005-12-02 | Nitto Denko Corp | 光半導体素子封止用エポキシ樹脂組成物およびそれを用いた光半導体装置 |
| US7288607B2 (en) * | 2004-10-12 | 2007-10-30 | E. I. Du Pont De Nemours & Co. | High solids primer composition based on epoxy ring opening curing reaction |
| JP4683933B2 (ja) * | 2005-01-19 | 2011-05-18 | ダイセル化学工業株式会社 | 硬化性樹脂組成物および層間絶縁膜 |
| JP4786200B2 (ja) * | 2005-02-28 | 2011-10-05 | ダイセル化学工業株式会社 | 紫外線硬化型缶用塗料組成物、塗装金属板、および塗装金属缶 |
| JP2007039521A (ja) * | 2005-08-02 | 2007-02-15 | Stanley Electric Co Ltd | 熱硬化性樹脂組成物、該組成物を熱硬化してなる透光性硬化物、該硬化物で封止された発光ダイオード |
| JP5319971B2 (ja) * | 2008-06-27 | 2013-10-16 | 昭和電工株式会社 | 脂環式エポキシ基含有エステル化合物の製造方法 |
| JP5196663B2 (ja) * | 2009-04-03 | 2013-05-15 | 日本化薬株式会社 | ジオレフィン化合物、エポキシ樹脂、硬化性樹脂組成物及びその硬化物 |
| JP5348764B2 (ja) * | 2009-07-07 | 2013-11-20 | 日本化薬株式会社 | 光半導体封止用硬化性樹脂組成物、及びその硬化物 |
| JP5505960B2 (ja) * | 2009-10-09 | 2014-05-28 | 日本化薬株式会社 | ジオレフィン化合物、エポキシ樹脂、硬化性樹脂組成物及びその硬化物 |
| WO2011078322A1 (ja) * | 2009-12-24 | 2011-06-30 | 日本化薬株式会社 | エポキシ樹脂組成物、硬化性樹脂組成物、およびその硬化物 |
| WO2011078205A1 (ja) * | 2009-12-24 | 2011-06-30 | 日本化薬株式会社 | ジオレフィン化合物、エポキシ樹脂、硬化性樹脂組成物及びその硬化物、並びに光半導体装置 |
| KR20130093473A (ko) * | 2010-05-21 | 2013-08-22 | 닛뽄 가야쿠 가부시키가이샤 | 디올레핀 화합물, 에폭시 수지, 경화성 수지 조성물 및 그 경화물 |
| CA2804049A1 (en) | 2010-06-28 | 2012-01-19 | Dow Global Technologies Llc | Curable resin compositions |
| US9861452B2 (en) | 2013-08-09 | 2018-01-09 | Dsm Ip Assets B.V. | Low-viscosity liquid radiation curable dental aligner mold resin compositions for additive manufacturing |
Family Cites Families (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US516878A (en) * | 1894-03-20 | Joseph sachs | ||
| JPS608246B2 (ja) * | 1980-11-03 | 1985-03-01 | ユニオン・カ−バイド・コ−ポレ−シヨン | 硬化し得るエポキシ樹脂含有組成物 |
| JPS5981329A (ja) * | 1982-09-30 | 1984-05-11 | ユニオン、カーバイド、コーポレーシヨン | 硬化し得るエポキシ樹脂含有成形組成物 |
| CA1312040C (en) * | 1985-12-19 | 1992-12-29 | Joseph Victor Koleske | Conformal coatings cured with actinic radiation |
| EP0286594A2 (de) * | 1987-04-06 | 1988-10-12 | Ciba-Geigy Ag | Verfahren zur Herstellung von photostrukturierbaren Ueberzügen |
| JPH0418460A (ja) * | 1990-05-11 | 1992-01-22 | Kansai Paint Co Ltd | カチオン電着塗料用樹脂組成物 |
| US5268489A (en) * | 1991-06-26 | 1993-12-07 | Union Carbide Chemicals & Plastics Technology Corporation | Production of unsaturated cycloaliphatic esters and derivatives thereof |
| US5948922A (en) * | 1997-02-20 | 1999-09-07 | Cornell Research Foundation, Inc. | Compounds with substituted cyclic hydrocarbon moieties linked by secondary or tertiary oxycarbonyl containing moiety providing reworkable cured thermosets |
| EP0864594A1 (de) * | 1997-03-06 | 1998-09-16 | Ciba SC Holding AG | Alpha-Glykolgruppen enthaltende Glycidylverbindungen |
| GB2344103B (en) * | 1998-11-24 | 2003-04-16 | Ciba Sc Holding Ag | Piperazinone derivatives |
| US6437045B1 (en) * | 1999-11-10 | 2002-08-20 | Vantico Inc. | Powder coating of carboxyl polyester or (poly)methacrylate and cycloaliphatic polyepoxide |
| US20030059618A1 (en) * | 2001-03-23 | 2003-03-27 | Hideyuke Takai | Method of producing epoxy compound, epoxy resin composition and its applications, ultraviolet rays-curable can-coating composition and method of producing coated metal can |
| JP5226162B2 (ja) * | 2001-05-14 | 2013-07-03 | 株式会社ダイセル | 液状エポキシ樹脂組成物及びその用途 |
| JP2002371073A (ja) * | 2001-06-12 | 2002-12-26 | Asahi Kasei Corp | エポキシ含有脂環式エステルの製法 |
| US6617401B2 (en) * | 2001-08-23 | 2003-09-09 | General Electric Company | Composition comprising cycloaliphatic epoxy resin, 4-methylhexahydrophthalic anhydride curing agent and boron catalyst |
| US6916890B1 (en) * | 2001-10-09 | 2005-07-12 | Henkel Corporation | Thermally reworkable epoxy resins and compositions based thereon |
| JP2003342268A (ja) * | 2002-05-28 | 2003-12-03 | Nippon Kasei Chem Co Ltd | エポキシ基末端（メタ）アクリレートの製造方法 |
| JP2004067947A (ja) * | 2002-08-08 | 2004-03-04 | Nippon Soda Co Ltd | 光触媒層形成用塗布液および光触媒担持構造体 |
-
2004
- 2004-09-10 CN CNA2004800322989A patent/CN1875045A/zh active Pending
- 2004-09-10 JP JP2006537988A patent/JP2007510772A/ja active Pending
- 2004-09-10 KR KR1020067008596A patent/KR20060113912A/ko not_active Ceased
- 2004-09-10 EP EP04788740A patent/EP1682599A1/en not_active Withdrawn
- 2004-09-10 US US10/575,286 patent/US20070042191A1/en not_active Abandoned
- 2004-09-10 WO PCT/US2004/029996 patent/WO2005044890A1/en not_active Ceased
- 2004-09-10 BR BRPI0415812 patent/BRPI0415812A/pt not_active IP Right Cessation
- 2004-09-20 TW TW93128404A patent/TW200523288A/zh unknown
- 2004-11-02 AR ARP040104029 patent/AR046438A1/es not_active Application Discontinuation