JP2005263987A5 - - Google Patents
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- Publication number
- JP2005263987A5 JP2005263987A5 JP2004078976A JP2004078976A JP2005263987A5 JP 2005263987 A5 JP2005263987 A5 JP 2005263987A5 JP 2004078976 A JP2004078976 A JP 2004078976A JP 2004078976 A JP2004078976 A JP 2004078976A JP 2005263987 A5 JP2005263987 A5 JP 2005263987A5
- Authority
- JP
- Japan
- Prior art keywords
- group
- acrylic acid
- photosensitizer
- weight
- resin composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 239000011342 resin composition Substances 0.000 claims description 12
- 125000005396 acrylic acid ester group Chemical group 0.000 claims description 10
- 239000003504 photosensitizing agent Substances 0.000 claims description 8
- -1 4,4′-diaminobenzophenone compound Chemical class 0.000 claims description 5
- 241001655798 Taku Species 0.000 claims description 4
- 239000007870 radical polymerization initiator Substances 0.000 claims description 4
- FHBXQJDYHHJCIF-UHFFFAOYSA-N (2,3-diaminophenyl)-phenylmethanone Chemical class NC1=CC=CC(C(=O)C=2C=CC=CC=2)=C1N FHBXQJDYHHJCIF-UHFFFAOYSA-N 0.000 claims description 2
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 claims description 2
- 150000001875 compounds Chemical class 0.000 claims description 2
- 125000000524 functional group Chemical group 0.000 claims description 2
- 125000000466 oxiranyl group Chemical group 0.000 claims description 2
- 239000003505 polymerization initiator Substances 0.000 claims description 2
- 125000001730 thiiranyl group Chemical group 0.000 claims description 2
- 125000004432 carbon atom Chemical group C* 0.000 claims 2
- 125000000217 alkyl group Chemical group 0.000 claims 1
- 238000006243 chemical reaction Methods 0.000 claims 1
- 125000000753 cycloalkyl group Chemical group 0.000 claims 1
- 125000005843 halogen group Chemical group 0.000 claims 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims 1
- 125000005397 methacrylic acid ester group Chemical group 0.000 claims 1
- 238000002844 melting Methods 0.000 description 9
- 230000008018 melting Effects 0.000 description 9
- 239000004973 liquid crystal related substance Substances 0.000 description 5
- 239000000203 mixture Substances 0.000 description 5
- 239000003795 chemical substances by application Substances 0.000 description 4
- 239000000565 sealant Substances 0.000 description 4
- 239000000945 filler Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- RUEBPOOTFCZRBC-UHFFFAOYSA-N (5-methyl-2-phenyl-1h-imidazol-4-yl)methanol Chemical compound OCC1=C(C)NC(C=2C=CC=CC=2)=N1 RUEBPOOTFCZRBC-UHFFFAOYSA-N 0.000 description 1
- ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 2-phenyl-1h-imidazole Chemical compound C1=CNC(C=2C=CC=CC=2)=N1 ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 0.000 description 1
- TYOXIFXYEIILLY-UHFFFAOYSA-N 5-methyl-2-phenyl-1h-imidazole Chemical compound N1C(C)=CN=C1C1=CC=CC=C1 TYOXIFXYEIILLY-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- IBVAQQYNSHJXBV-UHFFFAOYSA-N adipic acid dihydrazide Chemical compound NNC(=O)CCCCC(=O)NN IBVAQQYNSHJXBV-UHFFFAOYSA-N 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 239000012986 chain transfer agent Substances 0.000 description 1
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 229940079865 intestinal antiinfectives imidazole derivative Drugs 0.000 description 1
- 150000007524 organic acids Chemical class 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004078976A JP4241452B2 (ja) | 2004-03-18 | 2004-03-18 | 光硬化性樹脂組成物およびこれを含む液晶シール剤組成物 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004078976A JP4241452B2 (ja) | 2004-03-18 | 2004-03-18 | 光硬化性樹脂組成物およびこれを含む液晶シール剤組成物 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2005263987A JP2005263987A (ja) | 2005-09-29 |
| JP2005263987A5 true JP2005263987A5 (enExample) | 2007-02-15 |
| JP4241452B2 JP4241452B2 (ja) | 2009-03-18 |
Family
ID=35088862
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004078976A Expired - Lifetime JP4241452B2 (ja) | 2004-03-18 | 2004-03-18 | 光硬化性樹脂組成物およびこれを含む液晶シール剤組成物 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4241452B2 (enExample) |
Families Citing this family (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007178473A (ja) * | 2005-12-27 | 2007-07-12 | Mitsui Chemicals Inc | 液晶滴下工法用シール剤およびそれを用いた液晶表示パネルの製造方法 |
| CN101512421B (zh) * | 2006-09-07 | 2011-05-11 | 三井化学株式会社 | 液晶密封剂、使用其的液晶显示面板的制造方法、以及液晶显示面板 |
| CN101490850B (zh) | 2006-09-08 | 2012-01-11 | 夏普株式会社 | 半导体装置及其制造方法和电子装置 |
| CN101553545B (zh) * | 2006-09-22 | 2012-07-18 | 汉高公司 | 粘合方法及粘合性树脂组合物 |
| JP5060544B2 (ja) * | 2007-02-20 | 2012-10-31 | 三井化学株式会社 | 液晶シール用硬化性樹脂組成物および、これを使用した液晶表示パネルの製造方法 |
| KR101109906B1 (ko) | 2007-02-20 | 2012-02-08 | 미쓰이 가가쿠 가부시키가이샤 | 액정 밀봉용 경화성 수지 조성물 및 이를 사용한 액정 표시 패널의 제조 방법 |
| JP2008231347A (ja) * | 2007-03-23 | 2008-10-02 | Jsr Corp | 硬化性組成物、液晶シール剤及び液晶表示素子 |
| JP2009230095A (ja) * | 2008-02-25 | 2009-10-08 | Jsr Corp | 硬化性組成物、液晶シール剤及び液晶表示素子 |
| JP2010181483A (ja) * | 2009-02-03 | 2010-08-19 | Citizen Finetech Miyota Co Ltd | 液晶表示装置 |
| JP5152868B2 (ja) * | 2009-06-11 | 2013-02-27 | 日本化薬株式会社 | 可視光硬化性液晶シール剤及びそれを用いた液晶表示セル |
| KR101672580B1 (ko) | 2010-12-09 | 2016-11-03 | 교리쯔 가가꾸 산교 가부시키가이샤 | 광 중합 개시제에 적합한 화합물, 광 중합 개시제 및 광경화성 수지 조성물 |
| JP5953319B2 (ja) * | 2012-01-13 | 2016-07-20 | 日本化薬株式会社 | 光学部材及びその製造に用いる紫外線硬化型接着剤 |
| CN104334344B (zh) * | 2012-01-13 | 2016-10-19 | 日本化药株式会社 | 光学构件及用于制造该光学构件的紫外线固化型胶粘剂 |
| WO2013140472A1 (ja) | 2012-03-21 | 2013-09-26 | 日本化薬株式会社 | 光学部材及びその製造に用いる紫外線硬化型接着剤 |
| KR102031530B1 (ko) * | 2014-11-12 | 2019-10-14 | 데쿠세리아루즈 가부시키가이샤 | 광 경화계 이방성 도전 접착제, 접속체의 제조 방법 및 전자 부품의 접속 방법 |
| CN109661449B (zh) | 2016-08-26 | 2022-01-18 | 夏普株式会社 | 密封材料组成物、液晶单元以及液晶单元的制造方法 |
| CN109642145B (zh) * | 2016-08-26 | 2022-01-07 | 夏普株式会社 | 密封材料组成物、液晶单元以及液晶单元的制造方法 |
| JPWO2018225543A1 (ja) * | 2017-06-06 | 2020-04-09 | 日本化薬株式会社 | 化合物及びそれを用いた光硬化性組成物 |
-
2004
- 2004-03-18 JP JP2004078976A patent/JP4241452B2/ja not_active Expired - Lifetime
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