CN101553545B - 粘合方法及粘合性树脂组合物 - Google Patents
粘合方法及粘合性树脂组合物 Download PDFInfo
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- CN101553545B CN101553545B CN2007800434441A CN200780043444A CN101553545B CN 101553545 B CN101553545 B CN 101553545B CN 2007800434441 A CN2007800434441 A CN 2007800434441A CN 200780043444 A CN200780043444 A CN 200780043444A CN 101553545 B CN101553545 B CN 101553545B
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- IUNMPGNGSSIWFP-UHFFFAOYSA-N dimethylaminopropylamine Chemical compound CN(C)CCCN IUNMPGNGSSIWFP-UHFFFAOYSA-N 0.000 description 1
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- 150000002170 ethers Chemical class 0.000 description 1
- ORBFAMHUKZLWSD-UHFFFAOYSA-N ethyl 2-(dimethylamino)benzoate Chemical compound CCOC(=O)C1=CC=CC=C1N(C)C ORBFAMHUKZLWSD-UHFFFAOYSA-N 0.000 description 1
- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical compound OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 description 1
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- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 1
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
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- PIOPQUSIEQSLNQ-UHFFFAOYSA-N n,2-dibenzylaniline Chemical compound C=1C=CC=CC=1CNC1=CC=CC=C1CC1=CC=CC=C1 PIOPQUSIEQSLNQ-UHFFFAOYSA-N 0.000 description 1
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- 239000011664 nicotinic acid Substances 0.000 description 1
- IOQPZZOEVPZRBK-UHFFFAOYSA-N octan-1-amine Chemical compound CCCCCCCCN IOQPZZOEVPZRBK-UHFFFAOYSA-N 0.000 description 1
- 150000007524 organic acids Chemical class 0.000 description 1
- YBSLUBPQYDULIZ-UHFFFAOYSA-N oxalic acid;urea Chemical compound NC(N)=O.OC(=O)C(O)=O YBSLUBPQYDULIZ-UHFFFAOYSA-N 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
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- 229940059574 pentaerithrityl Drugs 0.000 description 1
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- NQPDZGIKBAWPEJ-UHFFFAOYSA-N pentanoic acid group Chemical group C(CCCC)(=O)O NQPDZGIKBAWPEJ-UHFFFAOYSA-N 0.000 description 1
- CMOMUQUTZFSRKI-UHFFFAOYSA-N pentyl 2-(dimethylamino)benzoate Chemical compound CCCCCOC(=O)C1=CC=CC=C1N(C)C CMOMUQUTZFSRKI-UHFFFAOYSA-N 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 125000000951 phenoxy group Chemical group [H]C1=C([H])C([H])=C(O*)C([H])=C1[H] 0.000 description 1
- DGTNSSLYPYDJGL-UHFFFAOYSA-N phenyl isocyanate Chemical compound O=C=NC1=CC=CC=C1 DGTNSSLYPYDJGL-UHFFFAOYSA-N 0.000 description 1
- 229940067107 phenylethyl alcohol Drugs 0.000 description 1
- 229940081066 picolinic acid Drugs 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 150000008442 polyphenolic compounds Chemical class 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 150000003141 primary amines Chemical class 0.000 description 1
- 150000003142 primary aromatic amines Chemical class 0.000 description 1
- QCTJRYGLPAFRMS-UHFFFAOYSA-N prop-2-enoic acid;1,3,5-triazine-2,4,6-triamine Chemical compound OC(=O)C=C.NC1=NC(N)=NC(N)=N1 QCTJRYGLPAFRMS-UHFFFAOYSA-N 0.000 description 1
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 description 1
- WHMDPDGBKYUEMW-UHFFFAOYSA-N pyridine-2-thiol Chemical compound SC1=CC=CC=N1 WHMDPDGBKYUEMW-UHFFFAOYSA-N 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 150000003335 secondary amines Chemical class 0.000 description 1
- 125000000467 secondary amino group Chemical group [H]N([*:1])[*:2] 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- KDYFGRWQOYBRFD-UHFFFAOYSA-N succinic acid Chemical compound OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- UWHCKJMYHZGTIT-UHFFFAOYSA-N tetraethylene glycol Chemical compound OCCOCCOCCOCCO UWHCKJMYHZGTIT-UHFFFAOYSA-N 0.000 description 1
- BSYVTEYKTMYBMK-UHFFFAOYSA-N tetrahydrofurfuryl alcohol Chemical compound OCC1CCCO1 BSYVTEYKTMYBMK-UHFFFAOYSA-N 0.000 description 1
- IMFACGCPASFAPR-UHFFFAOYSA-N tributylamine Chemical compound CCCCN(CCCC)CCCC IMFACGCPASFAPR-UHFFFAOYSA-N 0.000 description 1
- YUYCVXFAYWRXLS-UHFFFAOYSA-N trimethoxysilane Chemical compound CO[SiH](OC)OC YUYCVXFAYWRXLS-UHFFFAOYSA-N 0.000 description 1
- YFTHZRPMJXBUME-UHFFFAOYSA-N tripropylamine Chemical compound CCCN(CCC)CCC YFTHZRPMJXBUME-UHFFFAOYSA-N 0.000 description 1
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
- C09J163/10—Epoxy resins modified by unsaturated compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
- C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2400/00—Presence of inorganic and organic materials
- C09J2400/10—Presence of inorganic materials
- C09J2400/14—Glass
- C09J2400/143—Glass in the substrate
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
Description
Claims (5)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
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JP2006257072 | 2006-09-22 | ||
JP257072/2006 | 2006-09-22 | ||
PCT/JP2007/068562 WO2008035791A1 (fr) | 2006-09-22 | 2007-09-25 | Procédé de collage et composition de résine adhésive |
Publications (2)
Publication Number | Publication Date |
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CN101553545A CN101553545A (zh) | 2009-10-07 |
CN101553545B true CN101553545B (zh) | 2012-07-18 |
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CN2007800434441A Active CN101553545B (zh) | 2006-09-22 | 2007-09-25 | 粘合方法及粘合性树脂组合物 |
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JP (1) | JP5522938B2 (zh) |
KR (1) | KR20090121271A (zh) |
CN (1) | CN101553545B (zh) |
TW (1) | TWI432544B (zh) |
WO (1) | WO2008035791A1 (zh) |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20110122343A1 (en) | 2008-07-16 | 2011-05-26 | Min Soo Park | Pressure-sensitive adhesive composition, polarization plate, and liquid crystal display |
CN102131881B (zh) * | 2008-08-20 | 2016-01-20 | Lg化学株式会社 | 粘合剂 |
CN102061065A (zh) * | 2009-11-12 | 2011-05-18 | 咸阳秦河复合材料有限责任公司 | 一种lcd密封用光敏固化超强树脂组合物及制备方法 |
KR20130055541A (ko) | 2011-11-18 | 2013-05-28 | 주식회사 엘지화학 | 유기전자장치 봉지용 광경화형 점접착 필름, 유기전자장치 및 그의 봉지 방법 |
CN103305131B (zh) * | 2012-03-06 | 2015-01-07 | 上海佑威新材料科技有限公司 | 一种高耐候性结构胶粘剂及其制备方法 |
CN103113832A (zh) * | 2013-03-01 | 2013-05-22 | 西安西光精细化工有限公司 | 一种用于光学小透镜粘接的uv固化胶粘剂及其制备方法 |
CN104559878B (zh) * | 2013-10-11 | 2018-06-22 | 威海联浪新材料科技有限公司 | 一种纳米技术耐热改性odf工艺lcd封框胶及其制备 |
JP6355422B2 (ja) * | 2014-05-16 | 2018-07-11 | 積水化学工業株式会社 | インクジェット用光及び熱硬化性接着剤、電子部品の製造方法及び電子部品 |
JP6464379B2 (ja) * | 2015-08-25 | 2019-02-06 | 協立化学産業株式会社 | 積層体の製造方法 |
JP6699145B2 (ja) * | 2015-11-30 | 2020-05-27 | 味の素株式会社 | 光および熱硬化性樹脂組成物 |
CN106147677A (zh) * | 2016-07-07 | 2016-11-23 | 昆山初本电子科技有限公司 | Led灯灯杯密封用导热型无影胶 |
CN106189969A (zh) * | 2016-07-07 | 2016-12-07 | 昆山初本电子科技有限公司 | Led灯灯杯密封用无影胶 |
KR102220313B1 (ko) | 2018-06-20 | 2021-02-25 | 주식회사 엘지화학 | 점착제 조성물 |
JP7431720B2 (ja) | 2018-12-26 | 2024-02-15 | 積水化学工業株式会社 | 可動部品固定用接着剤組成物、光学部品、電子部品、及び、電子モジュール |
US20220177748A1 (en) * | 2019-03-18 | 2022-06-09 | Threebond Co., Ltd. | Adhesive composition, cured product, and composite |
EP3950866A4 (en) * | 2019-05-31 | 2023-01-25 | Sekisui Chemical Co., Ltd. | ADHESIVE COMPOSITION, OPTICAL COMPONENT, ELECTRONIC COMPONENT AND ELECTRONIC MODULE |
EP4298176A1 (en) * | 2021-02-24 | 2024-01-03 | Henkel AG & Co. KGaA | Photocurable adhesive composition |
WO2023047579A1 (ja) * | 2021-09-27 | 2023-03-30 | 株式会社レゾナック | 一液型接着剤 |
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JP2004131529A (ja) * | 2002-10-08 | 2004-04-30 | Three Bond Co Ltd | 一液性複合硬化型樹脂組成物 |
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JP2006235010A (ja) * | 2005-02-23 | 2006-09-07 | Sony Corp | 電気光学表示装置及びその製造方法 |
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JP2003119249A (ja) * | 2001-10-17 | 2003-04-23 | Mitsui Chemicals Inc | 液晶封止用樹脂組成物 |
CN1682149A (zh) * | 2002-09-19 | 2005-10-12 | 三井化学株式会社 | 液晶密封剂组合物及使用它的液晶显示板的制造方法 |
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CN101553545A (zh) | 2009-10-07 |
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