Classifications

• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
  • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
  • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
  • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
  • C09J163/10—Epoxy resins modified by unsaturated compounds
• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
  • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
  • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
  • C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
  • C09J2400/00—Presence of inorganic and organic materials
  • C09J2400/10—Presence of inorganic materials
  • C09J2400/14—Glass
  • C09J2400/143—Glass in the substrate

Definitions

• the present invention relates to a one-component adhesive resin composition for precise alignment, and more particularly to a composition that is permanently cured by heat after temporary fixing by light irradiation.
• thermosetting epoxy resin compositions are used in various applications because of their excellent performance and easy handling. For example, it is also used for packaging of image sensors, assembling of image sensor modules, mounting of optical devices, and assembly of precision parts such as main seals of liquid crystal displays. In one-pack type thermosetting epoxy resin compositions, misalignment may occur due to a sharp drop in resin viscosity before curing during heating for curing.
• Patent Document 1 describes a technique of positioning a photodiode and then temporarily using a small amount of an ultraviolet curable adhesive.
• a method is disclosed in which fixing is performed, and then a thermosetting adhesive is injected from the gap between the photodiode and the substrate, and the resultant is thermally cured and finally fixed.
• the application of two types of adhesives complicates the process and reduces productivity.
• JP-A-2002-90587 Patent Document 2
• Patent Document 2 JP-A-2002-90587
• this method requires a special irradiation device because the wavelength range is limited to the ultraviolet region.
• epoxy resin materials for UV curing since there are restrictions on the selection of epoxy resin materials for UV curing, a large degree of freedom in material design and an adhesive system are also required to support various applications. .
• a liquid crystal dropping process (OD F (one drop fill) process
• the two glass substrates are sealed with a UV curable adhesive, with the liquid crystal in between.
• OD F one drop fill
• Patent Document 1 JP 2002-342947 A
• Patent Document 2 JP 2002-90587 A
• the present invention provides an adhesive resin that bonds two articles (parts, etc.) without misalignment and has durability and reliability when assembling electronic products and optical products that require precise alignment.
• An object is to provide a composition.
• the present invention is a method of adhering at least two articles with an adhesive resin composition, wherein the composition is
• thermosetting resin component (a) thermosetting resin component
• the method comprises
• thermosetting resin component (a) a thermosetting resin component
• the present invention relates to an adhesive resin composition containing
• composition of the present invention is temporarily cured by light irradiation, and then the final strength is obtained by heating.
• thermosetting resin composition is excellent in durability and reliability in order to exhibit the original physical properties of the thermosetting resin composition after the final curing.
• composition according to one embodiment of the present invention is temporarily cured even by light irradiation in the visible light region, so that even if there is no special light irradiation device, for example, it is only necessary to expose the component to temporary light. Since it can be fixed, the product can be assembled easily and accurately.
• a method of adhering at least two articles with an adhesive resin composition comprising:
• thermosetting resin component (a) thermosetting resin component
• the method comprises
• thermosetting resin component thermosetting resin component
• photopolymerizable resin component a photopolymerizable resin component
• thermosetting resin component contains an epoxy resin
• photopolymerizable resin component contains an acrylic monomer or oligomer
• thermosetting resin component and the (c) photopolymerizable resin component As at least part of the (a) thermosetting resin component and the (c) photopolymerizable resin component, (a) a photopolymerizable resin having an (a) thermosetting resin component and (c) an unsaturated group. 6. The method according to any one of 1 to 5 above, which comprises a compound also serving as a resin component.
• thermosetting resin component (a) thermosetting resin component
• thermosetting resin component contains an epoxy resin
• composition according to any one of 8 to 11 above which is contained in a proportion of 5 to 500 parts by weight! /. [0024] 13.
• a method of bonding at least two articles comprising:
• a bonding method comprising:
• a method for producing an electronic component or an optical product comprising the bonding method according to 14 as one step.
• thermosetting resin component preferably contains an epoxy resin.
• Other thermosetting resin components may be contained, but the proportion of the epoxy resin in the thermosetting resin component is 50% (weight basis) or more, preferably 70% or more, particularly preferably 90% or more. Yes, 100% is also preferable.
• the epoxy resin component is preferably composed mainly of an epoxy resin having an aromatic ring.
• component (a) 50% (by weight) or more of thermosetting resin component, preferably 70% or more, In particular, it is preferably 90% or more, and preferably 100%. If necessary, it has an aromatic ring, it contains an epoxy resin!
• the epoxy resin having an aromatic ring includes bisphenol type epoxy resins such as bisphenol A type epoxy resin, bisphenol F type epoxy resin and bisphenol S type epoxy resin; phenol nopolac type epoxy resin and cresol nopolac Noplac type epoxy resins such as type epoxy resins; trade names Y X4000 and! / Manufactured by Japan Epoxy Resins Co., Ltd., and Tatsubiphenyl type epoxy resins.
• the epoxy resin having an aromatic ring usually has one or more epoxy groups in the molecule, and the epoxy equivalent can be appropriately selected.
• the epoxy resin having no aromatic ring includes a cyclohexene oxide structure in the molecule.
• cycloaliphatic epoxy resins having an epoxy group with a ring strain such as a cyclopentene oxide structure (for example, compounds represented by the following formulas (1) to (5))
• Hydrogenated bisphenol type epoxy resin bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin and other bisphenol type epoxy resins with hydrogenated benzene ring
• Dicyclopentagen type epoxy resins such as pentaglycenol nopolac glycidyl ether; cyclohexanedimethnanol aiglycidyl ether; Aliphatic alkyl mono- or diglycidyl ethers such as Noleite Nole and Arinoreglycidinole ether; alkyl glycidyl esters such as glycidyl methacrylate and tertiary carboxylic acid glycidyl ester; styrene oxide; Aromatic alcohols such as dil ether, cresyl glycidyl ether, ps butylphenyl daricidyl ether, nourphenyl daricidyl ether, etc .; te
• vinyl ethers, oxetane compounds, polyols and the like which may contain other known diluents can be used as appropriate in the epoxy resin component.
• Component (b) The latent curing agent cures the thermosetting resin component of component (a) when heated.
• Component (b) As the latent curing agent, one type of commercially available latent curing agent is used. Or multiple types can be selected and used. In particular, amine-based latent curing agents are preferred, and conventionally known amine compounds having latent properties and modified amines such as amine adducts can be mentioned. For the modified amines, a core-shell type hardener in which the surface of the core of the amine compound or amine adduct is surrounded by a shell of a modified amine compound (such as surface adduct formation), and these are mixed with an epoxy resin. Contains a masterbatch-type curing agent in the state.
• latent amine compounds include aromatic primary amines such as diaminodiphenylmethane and diaminodiphenylsulfone;
• 2-Heptadecylimidazole 1-Cyanoethyl-2-2-Undecylimidazolium trimellito, 2,4-Diamino-1-6- [2-Methylimidazolyl (1)] ethyl S-triazine, 1-Dodecyl-2-methyl 3 Imidazoles such as benzyl imidazolium chloride, 2 phenyl imidazolium isocyanurate, 2 phenyl 4-methyl-5 hydroxymethyl imidazole
• Dicyandiamide and derivatives of dicyandiamide, such as o tolyl biguanide and a-2,5-methylbiguanide;
• Organic acid hydrazides such as succinic acid dihydrazide and adipic acid dihydrazide;
• melamine derivatives such as melamine and diallyl melamine.
• Amine adducts are reaction products of amine compounds with epoxy compounds, isocyanate compounds and urea compounds. Usually in the form of a solid powder.
• the amine compound used for the production of amine adducts has at least one active hydrogen capable of undergoing an addition reaction with an epoxy group, isocyanate group, or urea compound in one molecule, and also has a primary amino group and a secondary amino group. Any one having at least one substituent selected from the group and the ability of a tertiary amino group in one molecule may be used.
• diethylenetriamine triethylenetetramine, n-propylamine, 2-hydroxyethylaminopropylamine, cyclohexylamine, dimethylaminopropylamine, dibutylaminopropylamine, dimethylaminoethylamine, Amine compounds such as tilaminoethylamine, N-methylbiperazine, etc .
• 2- Primary or secondary amines having a tertiary amino group in the molecule such as imidazole compounds such as methylimidazole, 2-ethylimidazole, 2-ethyl-4-methylimidazole, and 2-phenylimidazole;
• Minoethanol 1-methyl-2-dimethylaminoethanol, 1-phenoxymethyl-2-dimethylaminoethanol, 2-jetaminoethanol, 1-butoxymethyl-2-dimethylaminoethanol, 1- (2-hydride 1- (2 hydroxy-1-3-phenoxypropyl) 2-ethyl 4-methyl
• Epoxy compounds used as raw materials for producing amine adducts include, for example, polyhydric phenols such as bisphenol ⁇ , bisphenol F, force Teconole, resorcinol, polyhydric alcohols such as glycerin and polyethylene glycol, and epichlorohydrin.
• Polyglycidyl ether obtained by reacting with P glycidyl ether ester obtained by reacting hydroxycarboxylic acid such as hydroxy benzoic acid and ⁇ -hydroxy sinaphtoic acid with epichlorohydrin; such as phthalic acid and terephthalic acid
• Glycidyl ester obtained by reacting various polycarboxylic acids with epichlorohydrin glycidylamine compound obtained from 4, 4'-diaminodiphenyl methane and maminophenol; epoxidized phenol nopolac resin
• Epoxidized cresol Pollack resins polyfunctional epoxy compounds such as epoxidized Poriore fins or butyl Dali ether, Fuenirudarishi Examples thereof include monofunctional epoxy compounds such as dil ether and glycidyl metatalylate.
• Examples of the isocyanate compound used as a raw material for producing amine adducts include monofunctional isocyanate compounds such as n-butyl isocyanate, isopropyl isocyanate, phenyl isocyanate, benzyl isocyanate, and the like; Chirendiiso
• Polyfunctional isocyanate compounds such as nate, p-phenylene diisocyanate, 1,3,6-hexamethylene triisocyanate, bicycloheptane triisocyanate, etc .; and these polyfunctional isocyanate compounds and A terminal isocyanate group-containing compound obtained by a reaction with an active hydrogen compound can also be used.
• Examples of such a compound include a terminal isocyanate group obtained by a reaction of toluylene diisocyanate and trimethylolpropane.
• Examples of the addition reaction product may include.
• urea compounds used as raw materials for producing amine adducts include urea, urea phosphate, urea oxalate, urea acetate, dicetyl urea, dibenzoyl urea, trimethyl urea, and the like.
• ammine-epoxy adducts such as “Ade force hardener H 3613S” (trademark of Asahi Denka Kogyo Co., Ltd.), “Ade force hardener H — 3293S (Trademark of Asahi Denka Kogyo Co., Ltd.), “Amicure PN-23” (Trademark of Ajinomoto Co., Inc.), “Amicure MY-24” (Trademark of Ajinomoto Co., Inc.), “Cureduct P-505” ”(Trademark of Shikoku Kasei Kogyo Co., Ltd.), etc .; urea-type adducts such as“ Fujicure I FXE-1000 ”(Trademark of Fuji Kasei Kogyo Co., Ltd.),“ Fujicure IFXR-1036 ”(Fuji Kasei) (Industry Co., Ltd.
• the core-shell type curing agent is further treated with an acidic compound such as a carboxylic acid compound and a sulfonic acid compound, an isocyanate compound, an epoxy compound, or the like on the surface of an amine compound or amine adduct).
• an acidic compound such as a carboxylic acid compound and a sulfonic acid compound, an isocyanate compound, an epoxy compound, or the like
• a shell of a denatured product (adduct etc.) is formed on the surface.
• the masterbatch type curing agent is a state in which a core-shell type curing agent is mixed with an epoxy resin.
• the master batch type curing agent commercially available, for example, "Nobakiyua HX- 3722” (trademark of Asahi Kasei Epoxy Co.), “Nobakiyua HX- 37 42” (Asahi Kasei trademarks of Epoxy Co.), “Novaquia HX— 3613” (trademark of Asahi Kasei Epoxy Co., Ltd.)
• the photopolymerizable resin component having an unsaturated group may be any monomer or oligomer having a double bond that can be polymerized by irradiation with light, but those having fast curability are particularly preferred.
• CH CHR— C (O) — (where R is H or CH) (meta)
• Acrylic compounds are preferred, particularly those having an ester type bond. Either monofunctional having only one double bond or polyfunctional having a plurality of double bonds may be used. However, it is preferable that a polyfunctional monomer or oligomer is included.
• Examples of the monofunctional (meth) acrylic monomer include butanediol mono (meth) acrylate, cyclohexino acrylate (meth) acrylate, dicyclopentanino acrylate (meth) acrylate, di-cyclopentyl (meth) Atalylate, dicyclopentenyloxetyl (meth) atarylate, N 2, N-jetylaminoethyl (meth) acrylate, 2-ethoxyethyl (meth) acrylate, 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (Meth) attalylate, cap latataton modified 2-hydroxyethyl (meth) acrylate, isobornyl (meth) acrylate, lauryl (meth) acrylate, attaroyl morpholine, N-bur force prolatatum, nonyl phenoxy polyethylene Glycol (meth) Atarire , Noyulphen
• Examples of the polyfunctional (meth) acrylic monomer include 1,4 butanediol di (meth) acrylate, dicyclopentanyl di (meth) acrylate, ethylene glycol di (meth) acrylate, dipentaerythritol.
• Hexa (meth) acrylate force prolatatatone modified dipentaerythritol Hexa (meth) acrylate, 1, 6-hexanediol di (meth) acrylate, neopentyl glycol di (meth) acrylate, pentaerythritol tri (meta ) Atalylate, Polyethylene glycol di (meth) acrylate, Polypropylene glycol di (meth) ate relay , Tetraethylene glycol di (meth) acrylate, trimethylol propane tri (meth) acrylate, tris (atari mouth kichetil) isocyanurate, force prolatatone modified tris (atari mouth kichetil) isocyanurate, tris (methacryloxychetyl) isocyanurate And tricyclodecane dimethanol di (meth) acrylate.
• These monofunctional (meth) acrylic monomers and polyfunctional (meth) acrylic monomers may be used alone, in combination of two or more, or in combination of monofunctional and polyfunctional monomers. Good.
• the (meth) acryl oligomer has at least one (meth) attaroyl group, such as epoxy acrylate, urethane acrylate, polyester acrylate, polybutadiene acrylate, polyol acrylate, polyether. Examples thereof include acrylate, silicone resin acrylate, and melamine acrylate.
• the above-mentioned (meth) acrylic monomer particularly a polyfunctional (meth) acrylic monomer.
• the polyfunctional (meth) acrylic monomer can be 50% (by weight) or more of the component (c): photopolymerizable resin component.
• the photopolymerization initiator may be any compound that generates a radio canole upon irradiation with ultraviolet rays or visible rays.
• a visible light polymerization initiator By containing a visible light polymerization initiator, the composition of the present invention becomes a visible light curable composition (precisely, a visible light temporary curable thermosetting type).
• Examples of the ultraviolet polymerization initiator include: acetophenone initiators such as diethoxyacetophenone and benzyldimethylketal; benzoin ether initiators such as benzoin and benzoinethyl ether; benzophenone and o Examples thereof include benzophenone initiators such as methyl benzoylbenzoate, ⁇ -diketone initiators such as butanedione, benzyl and acetonaphthophenone, and thio compounds such as methylthioxanthone.
• acetophenone initiators such as diethoxyacetophenone and benzyldimethylketal
• benzoin ether initiators such as benzoin and benzoinethyl ether
• benzophenone and o Examples thereof include benzophenone initiators such as methyl benzoylbenzoate, ⁇ -diketone initiators such as butanedione, benzyl and acetonaphthophenone, and
• Visible light polymerization initiators include camphorquinone, 7,7 dimethyl-2,3 dioxobicyclo [2.2.1] heptane, 1-strength rubonic acid, 7,7 dimethyl-2,3 dioxobisulfate [2.2 1) heptane-1 carboxy-2 bromoethyl ester, 7, 7 dimethinole-2,3-dioxobicyclo [2.2.1] heptane-1 carboxy-2-methyl ester and 7,7 dimethyl-2,3-dioxobicyclo [2.2 1] Heptane 1 Camphorquinone compounds such as chloride, benzoyl diphenyl phosphine oxide, 2, 6 dimethyl benzoyl diphenyl phosphine oxide, 2, 4, 6 trimethyl benzoyl diphenyl phosphine oxide, Benzyljetoxyphosphine oxide, 2, 4, 6 Trimethylbenzoyldimethoxyphenylphosphine oxide, 2, 4, 6 Trimethylbenzoxyphen
• a visible light polymerization curing agent it is particularly preferable to use a visible light polymerization curing agent.
• a sensitizer may be used.
• the sensitizer may be classified as an ultraviolet polymerization initiator, but it may be capable of initiating visible light polymerization in combination with the sensitizer.
• the visible light region is in the range of 380 nm to 780 nm.
• amine compounds such as primary amine compounds such as n-butylamine, n-hexylamine, n-octylamine, and aniline; secondary amine compounds such as N-methylaniline, N-methyl-toluidine, dibutylamine, and diphenylamine; Triethylamine, Tributylamine, N, N, -Dimethylaniline, N, N, -Dibenzylaniline, N, N, -Dimethylaminoethyl methacrylate, p Dimethylaminobenzoic acid, p Dimethylaminobenzoic acid, p- Diethylaminobenzoate, N, N'-dimethylanthranic acid methyl ester, p Dimethylaminophenethyl alcohol, N, N 'di (/ 3-hydroxyethyl) p-totoreidine, N, N'-dim
• tertiary amine compounds particularly p-dimethylaminobenzoic acid and esters thereof (an alkenoquinone ester having 1 to 20 carbon atoms).
• N, N 'di (/ 3-hydroxyethinole) p tolureidine, N, N'-dimethyl-p toluidine, etc. a tertiary amine compound in which an amino group is directly linked to the benzene ring is used.
• Amamine compounds may be used alone or in combination of two or more compounds! /.
• the ratio of component (a): thermosetting resin component and component): photopolymerizable resin component is based on loo parts by weight of ⁇ thermosetting resin component.
• the photopolymerizable resin component is 5 to 500 parts by weight, preferably 10 to 100 parts by weight.
• thermosetting resin component With respect to 100 parts by weight, the latent curing agent is 0.5 to 500 parts by weight, preferably 2 to 200 parts by weight.
• the ratio of the component (c): the photopolymerizable resin component having an unsaturated group and the component (d): the photopolymerization initiator is such that the photopolymerization initiator is based on 100 parts by weight of the photopolymerizable resin component. Is 0.0;! To 25 parts by weight, preferably 0 .;! To 10 parts by weight.
• a compound that also serves as component (a): a thermosetting resin component and component (c): a photopolymerizable resin component having an unsaturated group may be contained.
• a compound that also serves as component (a): a thermosetting resin component and component (c): a photopolymerizable resin component having an unsaturated group may be contained.
• examples of such a compound include compounds having an epoxy group and an acryl group in the molecule, and examples thereof include (meth) atalinoleic acid-modified epoxy resins and urethane-modified (meth) acrylic epoxy resins.
• Examples of (meth) acrylic acid-modified epoxy resins include, for example, partially (meth) acrylated nopolac-type epoxy resins, bisphenol-type epoxy resins, etc .; biphenyl-type epoxy resins, naphthalene-type epoxy resins, tris (Hydroxyphenyl) alkyl type epoxy resin, tetrakis (hydroxyphenyl) alkyl type epoxy resin and the like are suitable.
• Examples of the epoxy resin used as a raw material for the above-mentioned (meth) acrylic acid-modified epoxy resin include, for example, phenol nopolac type, cresol nopolac type, biphenyl novolac type, trisphenol nopolac type, dicyclopentagenno Examples include bisphenol type, and bisphenol type A, bisphenol F type, 2, 2, monodiaryl bisphenol type A, bisphenol S type, hydrogenated bisphenol type, poly Examples include oxypropylene bisphenol A type.
• the partially (meth) acrylated product of the epoxy resin can be obtained, for example, by reacting an epoxy resin and (meth) attalinoleic acid in the presence of a basic catalyst according to a conventional method.
• An epoxy resin having a desired acrylate ratio can be obtained by appropriately changing the blending amount of the epoxy resin and (meth) acrylic acid.
• Such a compound is not an essential component of the composition of the present invention, but component (a) and component
• component (c) it may be present in the composition because of its good affinity with both (c).
• the ratio of the aforementioned components is calculated by adding to the weights of both the component (a) and the component (c). If component (a) and component (c) contain only an epoxy group-acrylic group-containing compound and other components (a) and (c) do not exist! / : Component (c) is 100 parts by weight: 100 parts by weight.
• the ratio of the epoxy group-acrylic group-containing compound as the component (a) is preferably not more than 80% (by weight) of the total component ⁇ , particularly preferably
• the proportion of the epoxy group-acrylic group-containing compound is preferably 80% (weight basis) or less, particularly preferably 60% of the total component (c). It is as follows.
• the composition of the present invention further comprises a silane coupling agent, a colorant (pigment, dye), a surfactant, a modifier, a storage stabilizer, a plasticizer, a lubricant, an antifoaming agent, and a leveling agent.
• a silane coupling agent e.g., silane, silane, silane, silane, etc.
• the silane coupling agent is not particularly limited, but ⁇ -aminopropyltrietrimethoxysilane, ⁇ -glycidoxypropinoretrimethoxysilane, SH6062, SZ6030 (above, Toray Dow Counging. Silicone Co., Ltd.), KBE903, KBM803 (above, Shin-Etsu Silicone Co., Ltd.).
• composition of the present invention is preferably used for assembling products that require precise alignment, such as image sensor packaging, module assembly, optical product potting, and liquid crystal display main seal.
• the bonding method of the present invention relates to a method for bonding at least two articles.
• the two products typically correspond to the parts of the product that require precise alignment for the assembly described above.
• the composition of the present invention is applied to at least one of two articles. Combine two items. At this time, precise alignment is performed if necessary.
• light is irradiated.
• the component (d) in the composition is activated, and the component (c) is overlapped by the generation of radicals to temporarily cure the composition and temporarily fix the two articles.
• temporary curing and temporary fixation are states in which the composition has been cured to such an extent that the position of the two articles can be maintained without flowing the composition during the next heating step. Or do not need to reach high strength.
• the light to be irradiated is ultraviolet light in the case of the ultraviolet curable type, and visible light in the case of the visible light curable type.
• the composition is preferably a visible light curable type.
• a dedicated visible light source may be used, but it is also preferable to temporarily fix the article by polymerization with ambient light at the production site. That is, in the case of a visible light curable type, temporary hardening proceeds only by placing it under ambient light without being aware of light irradiation.
• the light irradiation time is a force that depends on the energy of light.
• temporary curing may be performed over a long period of time. For example, temporary curing is performed for about 1 day or less, preferably within 2 hours, more preferably within 1 hour.
• “ambient light” means normal light at a work site, for example, indoor light having a fluorescent lamp or an incandescent lamp and bright enough to allow a person to work. Although not limited, indoor brightness is generally considered to be in the range of 10 lux to 2000 norletus, for example 50 to 1000 lettuce.
• the structure of the article, the irradiation method, and the like are selected so that the composition is irradiated with sufficient light to start temporary curing. It is preferable that light can be transmitted to the composition through a part of at least one of the two articles. That is, it is preferable that at least a part of one article is transparent.
• electronic parts such as CCD and CMOS, glass parts having a glass window in the package, optical parts, and main seals for liquid crystal displays.
• thermosetting resin component of component (a) is fully cured. Heating is required at the temperature normally required to cure the thermosetting resin component. What is necessary is just to perform for the required time, for example, 60-200 degreeC, Preferably it is 80-; The heating process provides the necessary strength and durability and completes the fixation. In the present invention, since it is temporarily fixed by light irradiation, there is no positional shift during the heating process, so that two articles can be bonded with high accuracy.
• a preferred application of the bonding method of the present invention is a main sealing process of two glass substrates of a liquid crystal display, and is applied to, for example, a liquid crystal dropping process (ODF process).
• ODF process liquid crystal dropping process
• a glass substrate on which an electrode, an active matrix element, a color filter, and / or an alignment film (orientation treatment) is formed is prepared.
• the composition of the present invention preferably a visible light curable type
• a liquid crystal is dropped near the center of the substrate to position the two substrates. Align.
• the adhesive composition of the present invention (mainly the peripheral part) and the liquid crystal are sandwiched between two substrates and kept indoors (in the factory) under light, the composition is temporarily fixed by temporary curing. Is made. In this state, the final strength of the composition is not obtained, but no positional shift or the like occurs. Then, the main part of the liquid crystal display panel is completed by heating and fully curing the composition.
• a special light irradiation device is not required, and it is not necessary to protect the liquid crystal part from ultraviolet rays, which is extremely advantageous for increasing the size of the substrate.
• the method of the present invention can be suitably used not only in the liquid crystal dropping process, but also in the process of assembling an empty cell by leaving the liquid crystal inlet first and sealing the periphery.
• Epoxy resin Bisphenol A type epoxy resin, manufactured by Nippon Kayaku Co., Ltd., RE-310S, 25. C (Koreete night (rice occupancy 13000 ⁇ ; 17000mPa-s), epoxy equivalent 175 ⁇ ; 190g / eq; Epoxy curing agent: Novacure HX-3722 Asahi Kasei Epoxy Co., Ltd .;
• Polyfunctional acrylate resin trimethylolpropane triacrylate
• Acrylic modified epoxy resin Bisphenol A partial acrylic ester resin of epoxy resin, manufactured by Uvacure 1561 UCB Radcure Inc .; Photoinitiator: irgacure 819, bis (2,4,6-trimethylbenzoino) phenylphosphine oxide.
• Example 1 The components shown in Table 1 were mixed to obtain a resin composition. Each resin composition was applied to a glass substrate, and another glass substrate was aligned and stacked to create a sample. This sample was left for 30 minutes under fluorescent light. Thereafter, it was cured by heating at 100 ° C. for 1 hour. In the composition of Example 1, a force with no displacement was observed. In the composition of Comparative Example 1, the viscosity decreased during heating and a displacement occurred.
• composition S of Example 1 was put in a light-shielding container and stored for 2 weeks at 30 ° C.
• the force S was a force that was not observed to noticeably increase in viscosity.

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