JP2010521555A5 - - Google Patents

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Publication number
JP2010521555A5
JP2010521555A5 JP2009553701A JP2009553701A JP2010521555A5 JP 2010521555 A5 JP2010521555 A5 JP 2010521555A5 JP 2009553701 A JP2009553701 A JP 2009553701A JP 2009553701 A JP2009553701 A JP 2009553701A JP 2010521555 A5 JP2010521555 A5 JP 2010521555A5
Authority
JP
Japan
Prior art keywords
acrylate ester
thermosetting resin
polyfunctional
acrylate
adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2009553701A
Other languages
English (en)
Japanese (ja)
Other versions
JP2010521555A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/US2008/056178 external-priority patent/WO2008115711A1/en
Publication of JP2010521555A publication Critical patent/JP2010521555A/ja
Publication of JP2010521555A5 publication Critical patent/JP2010521555A5/ja
Pending legal-status Critical Current

Links

JP2009553701A 2007-03-16 2008-03-07 ダイシング及びダイアタッチ接着剤 Pending JP2010521555A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US89518907P 2007-03-16 2007-03-16
PCT/US2008/056178 WO2008115711A1 (en) 2007-03-16 2008-03-07 Dicing and die attach adhesive

Publications (2)

Publication Number Publication Date
JP2010521555A JP2010521555A (ja) 2010-06-24
JP2010521555A5 true JP2010521555A5 (enExample) 2011-04-28

Family

ID=39766343

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009553701A Pending JP2010521555A (ja) 2007-03-16 2008-03-07 ダイシング及びダイアタッチ接着剤

Country Status (7)

Country Link
US (1) US8022145B2 (enExample)
EP (1) EP2134800A4 (enExample)
JP (1) JP2010521555A (enExample)
KR (1) KR20100014539A (enExample)
CN (1) CN101636462B (enExample)
TW (1) TW200902664A (enExample)
WO (1) WO2008115711A1 (enExample)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20100122110A (ko) * 2008-03-07 2010-11-19 쓰리엠 이노베이티브 프로퍼티즈 컴파니 패턴화된 배킹이 있는 다이싱 테이프 및 다이 부착 접착제
JP2011014767A (ja) * 2009-07-03 2011-01-20 Nippon Electric Glass Co Ltd 発光デバイス及びその製造方法
CN101988961B (zh) * 2009-08-04 2013-01-02 武汉武大卓越科技有限责任公司 地理位置数据采集系统
JP5833809B2 (ja) * 2010-02-01 2015-12-16 デクセリアルズ株式会社 異方性導電フィルム、接合体及び接続方法
KR101576689B1 (ko) * 2010-11-24 2015-12-10 (주)엘지하우시스 터치패널용 점착제 조성물, 점착필름 및 터치패널
WO2013015469A1 (en) * 2011-07-28 2013-01-31 Protavic Korea Co., Ltd. Flexible bismaleimide, benzoxazine, epoxy-anhydride adduct hybrid adhesive
US9056438B2 (en) 2012-05-02 2015-06-16 3M Innovative Properties Company Curable composition, articles comprising the curable composition, and method of making the same
CN103812048B (zh) * 2012-11-15 2017-10-27 国家电网公司 Gis备用间隔的检测系统及方法
WO2014092019A1 (ja) 2012-12-12 2014-06-19 株式会社ニコン 組成物、積層体、積層体の製造方法、トランジスタおよびトランジスタの製造方法
JP6454580B2 (ja) * 2015-03-30 2019-01-16 デクセリアルズ株式会社 熱硬化性接着シート、及び半導体装置の製造方法
EP3450479A1 (en) * 2017-09-01 2019-03-06 Henkel AG & Co. KGaA A latent, fast curing composition, a use thereof and an article having a cured composition obtainable therefrom
CN108276923A (zh) * 2018-02-02 2018-07-13 苏州城邦达力材料科技有限公司 一种uv减粘组合物、uv减粘膜及其制备方法
CN119391356A (zh) * 2024-11-22 2025-02-07 东莞市贝特利新材料有限公司 一种紫外光固化粘接剂及其制备方法

Family Cites Families (23)

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Publication number Priority date Publication date Assignee Title
US4968559A (en) * 1985-02-14 1990-11-06 Bando Chemical Industries. Ltd. Pressure sensitive adhesive film with barrier layer
US5234730A (en) * 1986-11-07 1993-08-10 Tremco, Inc. Adhesive composition, process, and product
US5049085A (en) * 1989-12-22 1991-09-17 Minnesota Mining And Manufacturing Company Anisotropically conductive polymeric matrix
US5300788A (en) * 1991-01-18 1994-04-05 Kopin Corporation Light emitting diode bars and arrays and method of making same
EP0578498B1 (en) * 1992-07-10 1997-04-16 Nippon Shokubai Co., Ltd. Acrylic polymer, its use and process for producing it
WO1997046601A1 (en) * 1996-06-03 1997-12-11 Toyo Ink Manufacturing Co., Ltd. Curable liquid resin composition
US20020007910A1 (en) * 1996-11-12 2002-01-24 Greggory Scott Bennett Thermosettable pressure sensitive adhesive
DE19857237A1 (de) * 1997-12-23 1999-06-24 Henkel Kgaa Strahlenhärtbare Kaschierklebestoffe
US6265460B1 (en) * 1998-06-29 2001-07-24 3M Innovative Properties Company Hot-melt adhesive composition, heat-bonding film adhesive and adhering method using hot-melt adhesive composition
US6235850B1 (en) * 1998-12-11 2001-05-22 3M Immovative Properties Company Epoxy/acrylic terpolymer self-fixturing adhesive
US6180527B1 (en) * 1999-08-09 2001-01-30 Micron Technology, Inc. Method and apparatus for thinning article, and article
US6472065B1 (en) * 2000-07-13 2002-10-29 3M Innovative Properties Company Clear adhesive sheet
US6946326B2 (en) * 2000-12-05 2005-09-20 Analog Devices, Inc. Method and device for protecting micro electromechanical systems structures during dicing of a wafer
JP4699620B2 (ja) * 2001-03-05 2011-06-15 日立化成工業株式会社 感光性接着フィルムおよびその用途ならびに半導体装置の製造方法
US6960617B2 (en) * 2002-04-22 2005-11-01 Purdue Research Foundation Hydrogels having enhanced elasticity and mechanical strength properties
US7396869B2 (en) * 2002-12-04 2008-07-08 Denovus Llc Metallic acrylate curing agents and usage thereof in intermediate compositions
JP2004273895A (ja) * 2003-03-11 2004-09-30 Disco Abrasive Syst Ltd 半導体ウエーハの分割方法
DE112004000768B4 (de) * 2003-05-12 2015-07-23 Tokyo Seimitsu Co., Ltd. Verfahren zum Trennen eines plattenartigen Elements
JP4027332B2 (ja) * 2004-03-19 2007-12-26 リンテック株式会社 半導体用粘接着シートおよび半導体装置の製造方法
US20060252234A1 (en) * 2004-07-07 2006-11-09 Lintec Corporation Hardenable pressure sensitive adhesive sheet for dicing/die-bonding and method for manufacturing semiconductor device
JP5366291B2 (ja) * 2004-09-01 2013-12-11 アプヴィオン インコーポレイテッド カプセル化された硬化系
JP4466397B2 (ja) * 2005-02-10 2010-05-26 住友ベークライト株式会社 半導体用接着フィルム及びこれを用いた半導体装置
KR20100122110A (ko) * 2008-03-07 2010-11-19 쓰리엠 이노베이티브 프로퍼티즈 컴파니 패턴화된 배킹이 있는 다이싱 테이프 및 다이 부착 접착제

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