KR20100014539A - 다이싱 및 다이 부착 접착제 - Google Patents

다이싱 및 다이 부착 접착제 Download PDF

Info

Publication number
KR20100014539A
KR20100014539A KR1020097019847A KR20097019847A KR20100014539A KR 20100014539 A KR20100014539 A KR 20100014539A KR 1020097019847 A KR1020097019847 A KR 1020097019847A KR 20097019847 A KR20097019847 A KR 20097019847A KR 20100014539 A KR20100014539 A KR 20100014539A
Authority
KR
South Korea
Prior art keywords
acrylate ester
multifunctional
adhesive
composition
thermosetting resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1020097019847A
Other languages
English (en)
Korean (ko)
Inventor
에릭 지 라르손
마이클 에이 크로프
데이비드 제이 플로트
체릴 엘 무어
Original Assignee
쓰리엠 이노베이티브 프로퍼티즈 컴파니
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 쓰리엠 이노베이티브 프로퍼티즈 컴파니 filed Critical 쓰리엠 이노베이티브 프로퍼티즈 컴파니
Publication of KR20100014539A publication Critical patent/KR20100014539A/ko
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7402—Wafer tapes, e.g. grinding or dicing support tapes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/08—Homopolymers or copolymers of acrylic acid esters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C08L2666/14—Macromolecular compounds according to C08L59/00 - C08L87/00; Derivatives thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00—Presence of (meth)acrylic polymer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2463/00—Presence of epoxy resin
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7416—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/013—Manufacture or treatment of die-attach connectors
    • H10W72/01331—Manufacture or treatment of die-attach connectors using blanket deposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07337—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy
    • H10W72/07338—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy hardening the adhesive by curing, e.g. thermosetting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H10W72/354—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics comprising polymers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2852—Adhesive compositions
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2852—Adhesive compositions
    • Y10T428/287—Adhesive compositions including epoxy group or epoxy polymer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2852—Adhesive compositions
    • Y10T428/2878—Adhesive compositions including addition polymer from unsaturated monomer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2852—Adhesive compositions
    • Y10T428/2878—Adhesive compositions including addition polymer from unsaturated monomer
    • Y10T428/2891—Adhesive compositions including addition polymer from unsaturated monomer including addition polymer from alpha-beta unsaturated carboxylic acid [e.g., acrylic acid, methacrylic acid, etc.] Or derivative thereof

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Die Bonding (AREA)
KR1020097019847A 2007-03-16 2008-03-07 다이싱 및 다이 부착 접착제 Ceased KR20100014539A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US89518907P 2007-03-16 2007-03-16
US60/895,189 2007-03-16

Publications (1)

Publication Number Publication Date
KR20100014539A true KR20100014539A (ko) 2010-02-10

Family

ID=39766343

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020097019847A Ceased KR20100014539A (ko) 2007-03-16 2008-03-07 다이싱 및 다이 부착 접착제

Country Status (7)

Country Link
US (1) US8022145B2 (enExample)
EP (1) EP2134800A4 (enExample)
JP (1) JP2010521555A (enExample)
KR (1) KR20100014539A (enExample)
CN (1) CN101636462B (enExample)
TW (1) TW200902664A (enExample)
WO (1) WO2008115711A1 (enExample)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20100122110A (ko) * 2008-03-07 2010-11-19 쓰리엠 이노베이티브 프로퍼티즈 컴파니 패턴화된 배킹이 있는 다이싱 테이프 및 다이 부착 접착제
JP2011014767A (ja) * 2009-07-03 2011-01-20 Nippon Electric Glass Co Ltd 発光デバイス及びその製造方法
CN101988961B (zh) * 2009-08-04 2013-01-02 武汉武大卓越科技有限责任公司 地理位置数据采集系统
JP5833809B2 (ja) * 2010-02-01 2015-12-16 デクセリアルズ株式会社 異方性導電フィルム、接合体及び接続方法
KR101576689B1 (ko) * 2010-11-24 2015-12-10 (주)엘지하우시스 터치패널용 점착제 조성물, 점착필름 및 터치패널
CN103797083B (zh) * 2011-07-28 2016-07-27 宝特威韩国株式会社 柔软的双马来酰亚胺、苯并嗪、环氧酐加合物混合粘合剂
US9056438B2 (en) 2012-05-02 2015-06-16 3M Innovative Properties Company Curable composition, articles comprising the curable composition, and method of making the same
CN103812048B (zh) * 2012-11-15 2017-10-27 国家电网公司 Gis备用间隔的检测系统及方法
WO2014092019A1 (ja) * 2012-12-12 2014-06-19 株式会社ニコン 組成物、積層体、積層体の製造方法、トランジスタおよびトランジスタの製造方法
JP6454580B2 (ja) 2015-03-30 2019-01-16 デクセリアルズ株式会社 熱硬化性接着シート、及び半導体装置の製造方法
EP3450479A1 (en) * 2017-09-01 2019-03-06 Henkel AG & Co. KGaA A latent, fast curing composition, a use thereof and an article having a cured composition obtainable therefrom
CN108276923A (zh) * 2018-02-02 2018-07-13 苏州城邦达力材料科技有限公司 一种uv减粘组合物、uv减粘膜及其制备方法
CN119391356A (zh) * 2024-11-22 2025-02-07 东莞市贝特利新材料有限公司 一种紫外光固化粘接剂及其制备方法

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4968559A (en) * 1985-02-14 1990-11-06 Bando Chemical Industries. Ltd. Pressure sensitive adhesive film with barrier layer
US5234730A (en) * 1986-11-07 1993-08-10 Tremco, Inc. Adhesive composition, process, and product
US5049085A (en) * 1989-12-22 1991-09-17 Minnesota Mining And Manufacturing Company Anisotropically conductive polymeric matrix
US5300788A (en) * 1991-01-18 1994-04-05 Kopin Corporation Light emitting diode bars and arrays and method of making same
EP0578498B1 (en) * 1992-07-10 1997-04-16 Nippon Shokubai Co., Ltd. Acrylic polymer, its use and process for producing it
US6048953A (en) * 1996-06-03 2000-04-11 Toyo Ink Manufacturing Co., Ltd. Curable liquid resin composition
US20020007910A1 (en) * 1996-11-12 2002-01-24 Greggory Scott Bennett Thermosettable pressure sensitive adhesive
DE19857237A1 (de) * 1997-12-23 1999-06-24 Henkel Kgaa Strahlenhärtbare Kaschierklebestoffe
US6265460B1 (en) * 1998-06-29 2001-07-24 3M Innovative Properties Company Hot-melt adhesive composition, heat-bonding film adhesive and adhering method using hot-melt adhesive composition
US6235850B1 (en) * 1998-12-11 2001-05-22 3M Immovative Properties Company Epoxy/acrylic terpolymer self-fixturing adhesive
US6180527B1 (en) * 1999-08-09 2001-01-30 Micron Technology, Inc. Method and apparatus for thinning article, and article
US6472065B1 (en) * 2000-07-13 2002-10-29 3M Innovative Properties Company Clear adhesive sheet
US6946366B2 (en) * 2000-12-05 2005-09-20 Analog Devices, Inc. Method and device for protecting micro electromechanical systems structures during dicing of a wafer
JP4699620B2 (ja) * 2001-03-05 2011-06-15 日立化成工業株式会社 感光性接着フィルムおよびその用途ならびに半導体装置の製造方法
WO2003089506A1 (en) * 2002-04-22 2003-10-30 Purdue Research Foundation Hydrogels having enhanced elasticity and mechanical strength properties
US7396869B2 (en) * 2002-12-04 2008-07-08 Denovus Llc Metallic acrylate curing agents and usage thereof in intermediate compositions
JP2004273895A (ja) * 2003-03-11 2004-09-30 Disco Abrasive Syst Ltd 半導体ウエーハの分割方法
JP4599631B2 (ja) * 2003-05-12 2010-12-15 株式会社東京精密 板状部材の分割方法及び分割装置
JP4027332B2 (ja) * 2004-03-19 2007-12-26 リンテック株式会社 半導体用粘接着シートおよび半導体装置の製造方法
US20060252234A1 (en) * 2004-07-07 2006-11-09 Lintec Corporation Hardenable pressure sensitive adhesive sheet for dicing/die-bonding and method for manufacturing semiconductor device
CA2578694C (en) * 2004-09-01 2014-02-25 Appleton Papers Inc. Encapsulated cure systems
JP4466397B2 (ja) * 2005-02-10 2010-05-26 住友ベークライト株式会社 半導体用接着フィルム及びこれを用いた半導体装置
KR20100122110A (ko) * 2008-03-07 2010-11-19 쓰리엠 이노베이티브 프로퍼티즈 컴파니 패턴화된 배킹이 있는 다이싱 테이프 및 다이 부착 접착제

Also Published As

Publication number Publication date
EP2134800A1 (en) 2009-12-23
EP2134800A4 (en) 2011-09-28
TW200902664A (en) 2009-01-16
WO2008115711A1 (en) 2008-09-25
US20100056725A1 (en) 2010-03-04
JP2010521555A (ja) 2010-06-24
CN101636462B (zh) 2013-03-13
US8022145B2 (en) 2011-09-20
CN101636462A (zh) 2010-01-27

Similar Documents

Publication Publication Date Title
KR20100014539A (ko) 다이싱 및 다이 부착 접착제
TWI664257B (zh) 半導體用黏著劑組成物、半導體用黏著膜以及切晶接合膜
JP6270736B2 (ja) 保護膜形成用フィルム
JP6566324B2 (ja) 粘着シート
JP5774322B2 (ja) 半導体用接着剤組成物、半導体用接着シートおよび半導体装置の製造方法
KR20000011479A (ko) 접착제조성물및접착시이트
JP6335173B2 (ja) 保護膜形成用複合シート、保護膜付きチップ、及び保護膜付きチップの製造方法
CN103597047A (zh) 再剥离用粘合带及其制造方法
JP6393449B2 (ja) 接着剤組成物、接着シートおよび半導体装置の製造方法
JP6833083B2 (ja) フィルム状接着剤、接着シートおよび半導体装置の製造方法
US20250243393A1 (en) Heat-curable adhesive composition, layered film, connected structure, and production method therefor
JPWO2014157520A1 (ja) 保護膜形成用複合シート、保護膜付きチップ、及び保護膜付きチップの製造方法
JP2019042976A (ja) 樹脂シート、半導体装置、および樹脂シートの使用方法
JP6334197B2 (ja) 保護膜形成用複合シート、保護膜付きチップ、及び保護膜付きチップの製造方法
JP5951106B2 (ja) 保護膜形成用フィルム
JP6642566B2 (ja) 保護膜形成用フィルム
JP5814487B1 (ja) 保護膜形成用フィルム
JP2003261838A (ja) 粘接着テープ
JP6353868B2 (ja) 保護膜形成用シート
JP2016105456A (ja) 保護膜形成用フィルム

Legal Events

Date Code Title Description
PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

A201 Request for examination
E13-X000 Pre-grant limitation requested

St.27 status event code: A-2-3-E10-E13-lim-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

E601 Decision to refuse application
PE0601 Decision on rejection of patent

St.27 status event code: N-2-6-B10-B15-exm-PE0601

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000