JP2010521555A - ダイシング及びダイアタッチ接着剤 - Google Patents
ダイシング及びダイアタッチ接着剤 Download PDFInfo
- Publication number
- JP2010521555A JP2010521555A JP2009553701A JP2009553701A JP2010521555A JP 2010521555 A JP2010521555 A JP 2010521555A JP 2009553701 A JP2009553701 A JP 2009553701A JP 2009553701 A JP2009553701 A JP 2009553701A JP 2010521555 A JP2010521555 A JP 2010521555A
- Authority
- JP
- Japan
- Prior art keywords
- acrylate ester
- acrylate
- adhesive
- thermosetting resin
- polyfunctional
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 title claims abstract description 43
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 41
- -1 acrylate ester Chemical class 0.000 claims abstract description 52
- 229920005989 resin Polymers 0.000 claims abstract description 35
- 239000011347 resin Substances 0.000 claims abstract description 35
- 229920000642 polymer Polymers 0.000 claims abstract description 32
- 229920001187 thermosetting polymer Polymers 0.000 claims abstract description 31
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims abstract description 29
- 239000000203 mixture Substances 0.000 claims abstract description 29
- 239000003054 catalyst Substances 0.000 claims abstract description 22
- 125000000524 functional group Chemical group 0.000 claims abstract description 14
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 12
- 239000002685 polymerization catalyst Substances 0.000 claims abstract description 9
- 238000000034 method Methods 0.000 claims abstract description 8
- 239000003822 epoxy resin Substances 0.000 claims description 19
- 229920000647 polyepoxide Polymers 0.000 claims description 19
- 239000000758 substrate Substances 0.000 claims description 19
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 claims description 11
- 239000004065 semiconductor Substances 0.000 claims description 9
- 150000001252 acrylic acid derivatives Chemical class 0.000 claims description 8
- 239000002390 adhesive tape Substances 0.000 claims description 6
- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 claims description 6
- 239000002243 precursor Substances 0.000 claims description 6
- DAKWPKUUDNSNPN-UHFFFAOYSA-N Trimethylolpropane triacrylate Chemical compound C=CC(=O)OCC(CC)(COC(=O)C=C)COC(=O)C=C DAKWPKUUDNSNPN-UHFFFAOYSA-N 0.000 claims description 4
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 claims description 4
- 239000007795 chemical reaction product Substances 0.000 claims description 4
- 229920001577 copolymer Polymers 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 claims description 4
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 238000007872 degassing Methods 0.000 claims description 3
- 238000002156 mixing Methods 0.000 claims description 2
- 150000003254 radicals Chemical class 0.000 claims description 2
- 238000010030 laminating Methods 0.000 claims 2
- 229910021645 metal ion Inorganic materials 0.000 claims 2
- 238000010438 heat treatment Methods 0.000 claims 1
- 239000002313 adhesive film Substances 0.000 abstract description 13
- 230000008569 process Effects 0.000 abstract description 5
- 239000002356 single layer Substances 0.000 abstract description 3
- 235000012431 wafers Nutrition 0.000 description 16
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 13
- 238000001723 curing Methods 0.000 description 11
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 11
- 239000000126 substance Substances 0.000 description 7
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 5
- 239000003999 initiator Substances 0.000 description 5
- 239000000178 monomer Substances 0.000 description 5
- 229910052710 silicon Inorganic materials 0.000 description 5
- 239000010703 silicon Substances 0.000 description 5
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 4
- 229920003182 Surlyn® Polymers 0.000 description 4
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 4
- 229920001971 elastomer Polymers 0.000 description 4
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical group N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical class CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 3
- 239000005035 Surlyn® Substances 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 150000002460 imidazoles Chemical class 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 150000003839 salts Chemical class 0.000 description 3
- INQDDHNZXOAFFD-UHFFFAOYSA-N 2-[2-(2-prop-2-enoyloxyethoxy)ethoxy]ethyl prop-2-enoate Chemical compound C=CC(=O)OCCOCCOCCOC(=O)C=C INQDDHNZXOAFFD-UHFFFAOYSA-N 0.000 description 2
- KUDUQBURMYMBIJ-UHFFFAOYSA-N 2-prop-2-enoyloxyethyl prop-2-enoate Chemical compound C=CC(=O)OCCOC(=O)C=C KUDUQBURMYMBIJ-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 229920000181 Ethylene propylene rubber Polymers 0.000 description 2
- IMNFDUFMRHMDMM-UHFFFAOYSA-N N-Heptane Chemical compound CCCCCCC IMNFDUFMRHMDMM-UHFFFAOYSA-N 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- 244000028419 Styrax benzoin Species 0.000 description 2
- 235000000126 Styrax benzoin Nutrition 0.000 description 2
- 235000008411 Sumatra benzointree Nutrition 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- 230000004927 fusion Effects 0.000 description 2
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 2
- 235000019382 gum benzoic Nutrition 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229920003986 novolac Polymers 0.000 description 2
- 239000004843 novolac epoxy resin Substances 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- QNODIIQQMGDSEF-UHFFFAOYSA-N (1-hydroxycyclohexyl)-phenylmethanone Chemical compound C=1C=CC=CC=1C(=O)C1(O)CCCCC1 QNODIIQQMGDSEF-UHFFFAOYSA-N 0.000 description 1
- 229920002818 (Hydroxyethyl)methacrylate Polymers 0.000 description 1
- MYWOJODOMFBVCB-UHFFFAOYSA-N 1,2,6-trimethylphenanthrene Chemical compound CC1=CC=C2C3=CC(C)=CC=C3C=CC2=C1C MYWOJODOMFBVCB-UHFFFAOYSA-N 0.000 description 1
- VOBUAPTXJKMNCT-UHFFFAOYSA-N 1-prop-2-enoyloxyhexyl prop-2-enoate Chemical compound CCCCCC(OC(=O)C=C)OC(=O)C=C VOBUAPTXJKMNCT-UHFFFAOYSA-N 0.000 description 1
- PUGOMSLRUSTQGV-UHFFFAOYSA-N 2,3-di(prop-2-enoyloxy)propyl prop-2-enoate Chemical compound C=CC(=O)OCC(OC(=O)C=C)COC(=O)C=C PUGOMSLRUSTQGV-UHFFFAOYSA-N 0.000 description 1
- AVTLBBWTUPQRAY-UHFFFAOYSA-N 2-(2-cyanobutan-2-yldiazenyl)-2-methylbutanenitrile Chemical compound CCC(C)(C#N)N=NC(C)(CC)C#N AVTLBBWTUPQRAY-UHFFFAOYSA-N 0.000 description 1
- KUBDPQJOLOUJRM-UHFFFAOYSA-N 2-(chloromethyl)oxirane;4-[2-(4-hydroxyphenyl)propan-2-yl]phenol Chemical compound ClCC1CO1.C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 KUBDPQJOLOUJRM-UHFFFAOYSA-N 0.000 description 1
- UHFFVFAKEGKNAQ-UHFFFAOYSA-N 2-benzyl-2-(dimethylamino)-1-(4-morpholin-4-ylphenyl)butan-1-one Chemical compound C=1C=C(N2CCOCC2)C=CC=1C(=O)C(CC)(N(C)C)CC1=CC=CC=C1 UHFFVFAKEGKNAQ-UHFFFAOYSA-N 0.000 description 1
- QCBSYPYHCJMQGB-UHFFFAOYSA-N 2-ethyl-1,3,5-triazine Chemical compound CCC1=NC=NC=N1 QCBSYPYHCJMQGB-UHFFFAOYSA-N 0.000 description 1
- 125000006176 2-ethylbutyl group Chemical group [H]C([H])([H])C([H])([H])C([H])(C([H])([H])*)C([H])([H])C([H])([H])[H] 0.000 description 1
- IEVADDDOVGMCSI-UHFFFAOYSA-N 2-hydroxybutyl 2-methylprop-2-enoate Chemical compound CCC(O)COC(=O)C(C)=C IEVADDDOVGMCSI-UHFFFAOYSA-N 0.000 description 1
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- GNSFRPWPOGYVLO-UHFFFAOYSA-N 3-hydroxypropyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCCO GNSFRPWPOGYVLO-UHFFFAOYSA-N 0.000 description 1
- QZPSOSOOLFHYRR-UHFFFAOYSA-N 3-hydroxypropyl prop-2-enoate Chemical compound OCCCOC(=O)C=C QZPSOSOOLFHYRR-UHFFFAOYSA-N 0.000 description 1
- DBCAQXHNJOFNGC-UHFFFAOYSA-N 4-bromo-1,1,1-trifluorobutane Chemical compound FC(F)(F)CCCBr DBCAQXHNJOFNGC-UHFFFAOYSA-N 0.000 description 1
- RTNUTCOTGVKVBR-UHFFFAOYSA-N 4-chlorotriazine Chemical class ClC1=CC=NN=N1 RTNUTCOTGVKVBR-UHFFFAOYSA-N 0.000 description 1
- NDWUBGAGUCISDV-UHFFFAOYSA-N 4-hydroxybutyl prop-2-enoate Chemical compound OCCCCOC(=O)C=C NDWUBGAGUCISDV-UHFFFAOYSA-N 0.000 description 1
- TYOXIFXYEIILLY-UHFFFAOYSA-N 5-methyl-2-phenyl-1h-imidazole Chemical compound N1C(C)=CN=C1C1=CC=CC=C1 TYOXIFXYEIILLY-UHFFFAOYSA-N 0.000 description 1
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 1
- 229920003319 Araldite® Polymers 0.000 description 1
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- 239000004342 Benzoyl peroxide Substances 0.000 description 1
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 1
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- WOBHKFSMXKNTIM-UHFFFAOYSA-N Hydroxyethyl methacrylate Chemical compound CC(=C)C(=O)OCCO WOBHKFSMXKNTIM-UHFFFAOYSA-N 0.000 description 1
- CNCOEDDPFOAUMB-UHFFFAOYSA-N N-Methylolacrylamide Chemical compound OCNC(=O)C=C CNCOEDDPFOAUMB-UHFFFAOYSA-N 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 1
- 239000007983 Tris buffer Substances 0.000 description 1
- 238000003848 UV Light-Curing Methods 0.000 description 1
- JUDXBRVLWDGRBC-UHFFFAOYSA-N [2-(hydroxymethyl)-3-(2-methylprop-2-enoyloxy)-2-(2-methylprop-2-enoyloxymethyl)propyl] 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCC(CO)(COC(=O)C(C)=C)COC(=O)C(C)=C JUDXBRVLWDGRBC-UHFFFAOYSA-N 0.000 description 1
- 150000001266 acyl halides Chemical class 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 125000005233 alkylalcohol group Chemical group 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 125000003368 amide group Chemical group 0.000 description 1
- 150000008064 anhydrides Chemical group 0.000 description 1
- 150000001541 aziridines Chemical class 0.000 description 1
- 125000000751 azo group Chemical group [*]N=N[*] 0.000 description 1
- 229960002130 benzoin Drugs 0.000 description 1
- 235000019400 benzoyl peroxide Nutrition 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 125000002843 carboxylic acid group Chemical group 0.000 description 1
- 238000001311 chemical methods and process Methods 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- ISAOCJYIOMOJEB-UHFFFAOYSA-N desyl alcohol Natural products C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 description 1
- 125000004386 diacrylate group Chemical group 0.000 description 1
- 125000005594 diketone group Chemical group 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 229920006332 epoxy adhesive Polymers 0.000 description 1
- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical compound OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- STVZJERGLQHEKB-UHFFFAOYSA-N ethylene glycol dimethacrylate Substances CC(=C)C(=O)OCCOC(=O)C(C)=C STVZJERGLQHEKB-UHFFFAOYSA-N 0.000 description 1
- 238000009501 film coating Methods 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 150000007857 hydrazones Chemical class 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 125000002883 imidazolyl group Chemical group 0.000 description 1
- 229920000554 ionomer Polymers 0.000 description 1
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- CDOSHBSSFJOMGT-UHFFFAOYSA-N linalool Chemical compound CC(C)=CCCC(C)(O)C=C CDOSHBSSFJOMGT-UHFFFAOYSA-N 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 125000005395 methacrylic acid group Chemical group 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 125000004123 n-propyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 150000002832 nitroso derivatives Chemical class 0.000 description 1
- 150000001451 organic peroxides Chemical class 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- RPQRDASANLAFCM-UHFFFAOYSA-N oxiran-2-ylmethyl prop-2-enoate Chemical compound C=CC(=O)OCC1CO1 RPQRDASANLAFCM-UHFFFAOYSA-N 0.000 description 1
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 1
- 125000001147 pentyl group Chemical group C(CCCC)* 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 229920005862 polyol Polymers 0.000 description 1
- 150000003077 polyols Chemical class 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- WVIICGIFSIBFOG-UHFFFAOYSA-N pyrylium Chemical class C1=CC=[O+]C=C1 WVIICGIFSIBFOG-UHFFFAOYSA-N 0.000 description 1
- 150000004053 quinones Chemical class 0.000 description 1
- 239000011541 reaction mixture Substances 0.000 description 1
- 238000007363 ring formation reaction Methods 0.000 description 1
- 238000007142 ring opening reaction Methods 0.000 description 1
- 125000001424 substituent group Chemical group 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 229910052723 transition metal Inorganic materials 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C09J133/08—Homopolymers or copolymers of acrylic acid esters
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/27—Manufacturing methods
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
- C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
- C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
- C08L2666/14—Macromolecular compounds according to C08L59/00 - C08L87/00; Derivatives thereof
-
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Abstract
Description
本出願は、2007年3月16日に出願された米国特許仮出願第60/895,189号の利益を主張し、その開示内容全体が参照として本明細書に組み込まれる。
本発明は一般に、薄型ウエファーをダイシングするためのダイシングテープとして及びダイアタッチ接着剤としても機能する単層接着剤、及び半導体素子の製作において引き続き行われるダイシングされたチップのダイアタッチ作業に関する。
剥離接着試験
厚さ50μmのサーリン(Surlyn)(登録商標)フィルムを接着フィルムコーティングに積層した。フィルム積層体を25mmのストリップに切断した。シリコン剥離ライナーを接着フィルムストリップから剥離し、接着剤を、2.0kgのゴムローラーを4回通過させて研磨されたシリコンウエファーに積層した。ヘプタンで表面を3回拭いてシリコンウエファーを清浄しておいた。接着フィルムストリップをシリコンウエファーから180度の角度で剥離するための力を、I−Mass SP−2000試験装置(アイマス社(IMASS Inc.)、マサチューセッツ州アコード(Accord))を用いて測定した。力は、剥離速度30.5cm/分で測定した。シリコンウエファーからいくつかの試料を剥離するための力を、試料を、フュージョンシステムズ(Fusion Systems)紫外線硬化装置(Hランプ、0.5J/2)(メリーランド州ゲイサーズバーグ(Gaithersburg))に1回通過させた後で測定した。
紫外線照射硬化及び熱硬化された接着フィルムの弾性率を、25℃で、動的機械分析器(TAインスツルメンツ社(TA Instruments Inc.)、デラウエア州ニューカッスル(New Castle))を用いて測定した。接着フィルムを10℃/分で加熱する際の発熱化学プロセスのピーク温度を、TAインスツルメンツ社(TA Instruments Inc.)から入手した示差走査熱量計(DSC)で測定した。硬化した接着フィルムのガラス転移温度(Tg)をDSCで測定した。
接着フィルム試料を、手持ち式のゴムローラーを使用してガラスの顕微鏡用カバースリップに積層した。積層フィルム試料を紫外線照射で処理した(フュージョンシステムズ(Fusion Systems)Hランプ、0.5J/cm2)。サーリン(Surlyn)(登録商標)を照射した接着フィルム試料から剥離した。接着フィルムサンプルの付いたガラスの顕微鏡用カバースリップを、100℃に加熱したホットプレート上に定置し、第2のガラスの顕微鏡用カバースリップを接着フィルムサンプルの上に注意深く定置して2.3Kgのゴムローラーを使用して手で積層した。積層した試料を160℃のオーブンで1時間加熱した。30倍に設定した顕微鏡で空隙は見られなかった。
946mLの瓶に次を加える:ブチルアクリレート(ダウケミカル社(Dow Chemical Co.)、ミシガン州ミッドランド(Midland))72.0g、グリシジルメタクリレート(サートマー社(Sartomer Co)、ペンシルベニア州イーストン(Easton))48.0g、2,2’−アゾビス(2−メチルブタンニトリル)(デュポン(DuPont)、デラウエア州ウィルミントン(Wilmington))0.18g、エチルアセテート140g、及びトルエン140g。溶液を、1リットル/分の速度で2分間窒素パージした。瓶を密封し、60℃に維持された水浴中に24時間定置した。反応混合物は29.5重量%の固体であり、測定固有粘度0.78dL/g及びブルックフィールド粘度0.7パスカル秒を有していた。
構成成分の全てを瓶の中で混合し、続いて、室温の真空のオーブンの中で約3分間、減圧下で脱気した。接着剤コーティング溶液を、シリコン処理したポリエチレンテレフタレート(PET)フィルムにナイフコーターを用いて塗布し、コーティングを強制空気オーブン中で85℃で7分間加熱した後、25μm厚さの接着剤を生成した。
Claims (20)
- 官能基を有するアクリレートエステルポリマーと、
多官能熱硬化性樹脂と、
多官能アクリレートエステルと、
アクリレートエステルの重合触媒又は硬化剤と、
多官能熱硬化性樹脂を硬化するのに好適な熱潜在性触媒と、
アクリル酸塩と、を含み、
アクリレートエステルポリマーと熱硬化性樹脂とが互いに反応可能である、接着剤組成物。 - 前記多官能熱硬化性樹脂が、エポキシ樹脂を含む、請求項1に記載の組成物。
- 前記アクリレートエステルポリマーが、ブチルアクリレート及びグリシジルメタクリレートのコポリマーを含む、請求項1に記載の組成物。
- 前記多官能アクリレートエステルが、トリメチロールプロパントリアクリレートを含む、請求項1に記載の組成物。
- 前記重合触媒又は硬化剤が、光開始フリーラジカル硬化剤を含む、請求項1に記載の組成物。
- 前記熱潜在性触媒が、イミダゾール促進剤を含む、請求項1に記載の組成物。
- 前記アクリル酸塩が、多価金属イオンを含む、請求項1に記載の組成物。
- 請求項1に記載の接着剤組成物と裏材とを含むダイシングテープ及びダイアタッチ接着剤として、連続使用に好適な接着剤転写ダイシングテープ。
- 少なくとも約50重量%の官能基含有アクリレートエステルポリマーと、
約20重量%〜約40重量%の多官能熱硬化性樹脂と、
有効量の多官能アクリレートエステルと、
前記アクリレートエステルポリマーを硬化するための触媒と、
前記多官能熱硬化性樹脂を硬化するための熱潜在性触媒と、
アクリル酸塩と、を含み、
前記アクリレートエステルポリマーと前記熱硬化性樹脂とが接着剤反応生成物を生成することが可能である、接着剤。 - 前記多官能アクリレートエステルが、約0重量%を超過しかつ約10重量%未満である量で提供される、請求項9に記載の組成物。
- 前記熱潜在性触媒が、約0重量%を超過しかつ約10重量%未満である量で提供される、請求項9に記載の組成物。
- 前記アクリル酸塩が、多価金属イオンを含む、請求項9に記載の組成物。
- 裏材を更に含む、請求項9に記載の組成物。
- 活性表面と、基板表面と、該基板表面に近接した請求項9に記載の接着剤組成物の層と、を備える半導体ウエファー。
- 活性表面と、基板表面と、該基板表面に近接した請求項9に記載の前記接着剤組成物の層と、を備える半導体チップ。
- 活性表面と、基板表面と、該基板表面に近接した請求項9に記載の前記反応生成物を含む硬化した接着剤の領域と、を備える半導体チップ。
- 官能基を有するアクリレートエステルポリマーを提供する工程と、
多官能熱硬化性樹脂を提供する工程と、
多官能アクリレートエステルを提供する工程と、
アクリレートエステルポリマーの重合触媒又は硬化剤を提供する工程と、
前記多官能熱硬化性樹脂を硬化するのに好適な熱潜在性触媒を提供する工程と、
アクリル酸塩を提供する工程と、
前記ポリマーと、熱硬化性樹脂と、多官能アクリレートエステルと、アクリレートエステルポリマーの重合触媒又は硬化剤と、熱潜在性触媒と、アクリル酸塩とを混合し、混合物を生成する工程と、
任意に前記混合物を脱気する工程と、を含み、
前記アクリレートエステルポリマーと前記熱硬化性樹脂とが互いに反応可能である、接着剤の製造方法。 - 剥離ライナーの上に前記混合物をコーティングし、接着剤テープ前駆体を形成する工程を更に含む、請求項17に記載の方法。
- 任意に前記接着剤テープ前駆体を裏材に積層した後に、前記接着剤テープ前駆体を加熱してテープを形成する工程を更に含む、請求項18に記載の方法。
- 前記テープをウエファーに積層する工程を更に含む、請求項19に記載の方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US89518907P | 2007-03-16 | 2007-03-16 | |
PCT/US2008/056178 WO2008115711A1 (en) | 2007-03-16 | 2008-03-07 | Dicing and die attach adhesive |
Publications (2)
Publication Number | Publication Date |
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JP2010521555A true JP2010521555A (ja) | 2010-06-24 |
JP2010521555A5 JP2010521555A5 (ja) | 2011-04-28 |
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EP (1) | EP2134800A4 (ja) |
JP (1) | JP2010521555A (ja) |
KR (1) | KR20100014539A (ja) |
CN (1) | CN101636462B (ja) |
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WO (1) | WO2008115711A1 (ja) |
Cited By (2)
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JP2011014767A (ja) * | 2009-07-03 | 2011-01-20 | Nippon Electric Glass Co Ltd | 発光デバイス及びその製造方法 |
WO2016158959A1 (ja) * | 2015-03-30 | 2016-10-06 | デクセリアルズ株式会社 | 熱硬化性接着シート、及び半導体装置の製造方法 |
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KR20100122110A (ko) * | 2008-03-07 | 2010-11-19 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | 패턴화된 배킹이 있는 다이싱 테이프 및 다이 부착 접착제 |
CN101988961B (zh) * | 2009-08-04 | 2013-01-02 | 武汉武大卓越科技有限责任公司 | 地理位置数据采集系统 |
JP5833809B2 (ja) * | 2010-02-01 | 2015-12-16 | デクセリアルズ株式会社 | 異方性導電フィルム、接合体及び接続方法 |
KR101576689B1 (ko) * | 2010-11-24 | 2015-12-10 | (주)엘지하우시스 | 터치패널용 점착제 조성물, 점착필름 및 터치패널 |
KR101722208B1 (ko) * | 2011-07-28 | 2017-05-02 | 주식회사 프로타빅 코리아 | 하이브리드 열경화 접착제 조성물 |
US9056438B2 (en) | 2012-05-02 | 2015-06-16 | 3M Innovative Properties Company | Curable composition, articles comprising the curable composition, and method of making the same |
CN103812048B (zh) * | 2012-11-15 | 2017-10-27 | 国家电网公司 | Gis备用间隔的检测系统及方法 |
JP6274112B2 (ja) * | 2012-12-12 | 2018-02-07 | 株式会社ニコン | 組成物、積層体、積層体の製造方法、トランジスタおよびトランジスタの製造方法 |
EP3450479A1 (en) * | 2017-09-01 | 2019-03-06 | Henkel AG & Co. KGaA | A latent, fast curing composition, a use thereof and an article having a cured composition obtainable therefrom |
CN108276923A (zh) * | 2018-02-02 | 2018-07-13 | 苏州城邦达力材料科技有限公司 | 一种uv减粘组合物、uv减粘膜及其制备方法 |
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- 2008-03-07 WO PCT/US2008/056178 patent/WO2008115711A1/en active Application Filing
- 2008-03-07 JP JP2009553701A patent/JP2010521555A/ja active Pending
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Also Published As
Publication number | Publication date |
---|---|
US8022145B2 (en) | 2011-09-20 |
WO2008115711A1 (en) | 2008-09-25 |
TW200902664A (en) | 2009-01-16 |
KR20100014539A (ko) | 2010-02-10 |
EP2134800A4 (en) | 2011-09-28 |
US20100056725A1 (en) | 2010-03-04 |
CN101636462B (zh) | 2013-03-13 |
CN101636462A (zh) | 2010-01-27 |
EP2134800A1 (en) | 2009-12-23 |
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