CN101636462A - 切片和晶片附连粘合剂 - Google Patents

切片和晶片附连粘合剂 Download PDF

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CN101636462A
CN101636462A CN200880008680A CN200880008680A CN101636462A CN 101636462 A CN101636462 A CN 101636462A CN 200880008680 A CN200880008680 A CN 200880008680A CN 200880008680 A CN200880008680 A CN 200880008680A CN 101636462 A CN101636462 A CN 101636462A
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acrylic ester
thermosetting resin
acrylate
composition according
ester polymer
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CN101636462B (zh
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埃里克·G·拉森
迈克尔·A·克罗普
大卫·J·普劳特
谢里尔·L·摩尔
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3M Innovative Properties Co
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Abstract

本发明提供了一种单层粘合剂，所述单层粘合剂提供晶片切割功能所需的粘合力和干净释放之间的适当平衡，并且还在后续的晶片附连步骤中提供了所需的必要粘合。所述粘合剂组合物包含具有官能团的丙烯酸酯聚合物、多官能热固性树脂、多官能丙烯酸酯、丙烯酸酯聚合反应催化剂或固化剂、适用于固化所述多官能热固性树脂的潜热催化剂，以及丙烯酸盐，其中所述丙烯酸酯聚合物和所述热固性树脂能够相互反应。

Description

切片和晶片附连粘合剂
相关专利申请的交叉引用
本申请要求于2007年3月16日提交的美国临时专利申请No.60/895,189的优先权，藉此将该专利的公开内容以引用方式全文并入本文。
技术领域
本发明整体涉及一种单层粘合剂，在半导体器件制造中，该单层粘合剂用作切割带，并且还用作晶片附连粘合剂，以用于切割薄晶片和后续的切割芯片的晶片附连操作。
背景技术
其上形成有集成电路的半导体材料(例如硅和砷化镓)的晶片具有相对较大的直径。在集成电路(IC)的制备中，这种晶片被粘附至压敏粘合剂条带(有时又称作切割带)，并被切割成IC芯片。然后，从切割带移出IC芯片(单个晶片或多个晶片)，将粘合剂涂覆至芯片或基板上，将该芯片设置在基板上并使粘合剂固化以将晶片附连至基板上。
在将晶片切割成单个芯片的步骤中，切割带必须为半导体晶片提供强效粘附力。然而，切割带随后还应当为晶片提供充分低的粘附力，以允许各芯片从该条带快速、干净、容易地移出。也就是说，当移出芯片时，切割带具有降低的粘附力是有用的，并且在芯片上不应该有来自切割带的残余物。因此，已经制备了与晶片的粘附力具有这样一种平衡的切割带：在切片步骤中强效粘附，然而在将芯片从条带移出时该条带也可从各芯片释放而未在芯片上留下残余物。一些已经制备的切割带在暴露于紫外光之后可以去粘性化，以改善各个芯片的干净移出。如果粘附力失衡，则很难进行切割晶片以及拾取和布置各个芯片的步骤。当从切割带移出各个芯片时，如果切割带的粘附力不平衡并且一些粘合剂保留在各个芯片上，那么就需要额外的步骤来将粘合剂残余从芯片移除。这些额外的步骤通常包括使用有机溶剂。
在切割操作和芯片分离完成之后，随后必须将第二粘合剂设置在芯片和基板之间，以将芯片在基板上牢固地保持就位。该第二粘合剂(通常称为晶片附连粘合剂)可以被涂覆在芯片与电路相对的表面上，或者其可以直接被涂覆到芯片将要粘合的基板上。使用单独的晶片附连粘合剂需要额外的步骤和设备，以将粘合剂放置在芯片或者基板上。一些单独的晶片附连粘合剂已经为环氧树脂，其可以在芯片已设置在基板上后被固化。
发明内容
已经存在对这样一种单层粘合剂膜的需要，这种粘合剂膜提供晶片切割功能所需的粘合力和干净释放之间的适当平衡，使得在分离后能将粘合剂从薄膜背衬转移，并且在后续的晶片附连步骤中提供所需的必要粘合。
因此，在一个实施例中，本发明涉及一种粘合剂组合物，其包含具有官能团的丙烯酸酯聚合物、多官能热固性树脂、多官能丙烯酸酯、丙烯酸酯聚合反应催化剂或固化剂，适于固化多官能热固性树脂的潜热催化剂以及丙烯酸盐，其中所述丙烯酸酯聚合物和热固性树脂能够相互反应。针对本发明的这个目的，术语“丙烯酸酯”和“丙烯酸树脂”包含丙烯酸和甲基丙烯酸的衍生物。提及具有官能团的丙烯酸酯聚合物应该理解为描述具有至少一个不是丙烯酰基或甲基丙烯酰基的官能团。
在其它实施例中，本发明涉及一种粘合剂，其包含至少约50重量百分比(wt％)的含官能团的丙烯酸酯聚合物、约20重量％至约40重量％的多官能热固性树脂、有效量的多官能丙烯酸酯、用于固化该丙烯酸酯聚合物的催化剂、用于固化该多官能热固性树脂的潜热催化剂或固化剂，以及丙烯酸盐，其中该丙烯酸酯聚合物和热固性树脂能够形成粘合剂反应产物。
在另外的实施例中，本发明涉及一种制备粘合剂的方法，包括提供具有官能团的丙烯酸酯聚合物，提供多官能热固性树脂(其中所述丙烯酸酯聚合物和所述热固性树脂能够相互反应)，提供多官能丙烯酸酯，提供丙烯酸酯聚合反应催化剂或固化剂，提供适于固化所述多官能热固性树脂的潜热催化剂，提供丙烯酸盐(可任选为金属盐)，将聚合物、热固性树脂、多官能丙烯酸酯、潜热催化剂和丙烯酸盐混合以形成混合物，以及任选地对混合物进行除气处理。
具体实施方式
所表述的数值范围包括该范围内的所有数值(例如，1至5包括1、1.5、2、2.75、3、3.80、4和5)。假定本文所有数字均被术语“约”修饰。
在一个实施例中，提供的是一种粘合剂组合物，其包含具有官能团的丙烯酸酯聚合物、多官能热固性树脂、在一起的多官能丙烯酸酯、丙烯酸酯聚合物催化剂或固化剂，适于固化所述多官能热固性树脂的潜热催化剂，以及丙烯酸盐，其中所述丙烯酸酯聚合物和所述热固性树脂能够相互反应。
具有官能团的合适的丙烯酸酯聚合物包括，例如，直链或支链的单官能不饱和丙烯酸酯或非叔烷基醇的甲基丙烯酸酯的共聚物，其烷基具有1至14个，特别是4至12个碳原子，并且一个或多个(甲基)丙烯酸酯官能单体具有另外的官能团。通常采用的单官能单体包括(甲基)丙烯酸丁酯、(甲基)丙烯酸2-乙基己酯、(甲基)丙烯酸乙酯、(甲基)丙烯酸甲酯、(甲基)丙烯酸正丙酯、(甲基)丙烯酸异丙酯、(甲基)丙烯酸叔丁酯、(甲基)丙烯酸戊酯、(甲基)丙烯酸正辛酯、(甲基)丙烯酸异辛酯、(甲基)丙烯酸异壬酯和(甲基)丙烯酸2-乙基丁酯。具有额外官能团的(甲基)丙烯酸酯官能单体包括上述单体，其中所述(甲基)丙烯酸酯还具有一个或多个选自羧基、羟基、缩水甘油基、酰胺基和酐基的取代基。在一些实施例中，尤其优选的是具有另外的官能团的(甲基)丙烯酸酯单体，该(甲基)丙烯酸酯单体可以是丙烯酸、甲基丙烯酸、丙烯酸羟乙酯、甲基丙烯酸羟乙酯、丙烯酸羟丙酯、甲基丙烯酸羟丙酯、丙烯酸羟基丁酯、甲基丙烯酸羟基丁酯、丙烯酸缩水甘油酯或甲基丙烯酸缩水甘油酯和N-羟甲基丙烯酰胺中的一者或多者。
合适的多官能热固性树脂包括(例如)聚环氧官能团树脂及其氮丙啶类似物。存在于本发明的粘合剂组合物中的多官能缩水甘油醚环氧树脂的含量为约15重量％至约40重量％。在其它实施例中，存在于所述粘合剂组合物中的多官能缩水甘油醚环氧树脂的含量为约23重量％至约37重量％。本发明的其他粘合剂组合物可以包含在15重量％和40重量％之间的任何数量或任何数量范围的多官能缩水甘油醚环氧树脂。
优选的多官能缩水甘油醚环氧树脂包括平均每个分子具有两个以上缩水甘油基的那些环氧树脂。缩水甘油醚环氧树脂的具体实例包括多官能酚醛型环氧树脂(由酚醛与环氧氯丙烷的反应合成)、甲酚醛环氧树脂和双酚A醛环氧树脂。市售的多官能缩水甘油醚环氧树脂的实例包括可得自俄亥俄州哥伦布市的Hexion Specialty Chemicals公司的商品名为Epon 1050、Epon 160、Epon 164、Epon 1031、Epon SU-2.5、Epon SU-3和Epon SU-8的那些环氧树脂；可得自Dow Chemical Co.，Midland MI(密歇根州米德兰市的道尔化学公司)的“DEN”系列环氧树脂；以及可得自Huntsman Chemical，East Lansing，MI(密歇根州东兰辛市的Huntsman化学公司)的Tactix 756和Tactix 556环氧树脂。
在一些实施例中，可用的多官能缩水甘油醚环氧树脂(其为双酚A的二缩水甘油醚)包括(但不限于)：可得自Hexion Specialty Chemicals的商品名为Epon Resins 825、826和828的那些；可得自Dow ChemicalCo.(道尔化学公司)的D.E.R.330、331和332树脂；以及可得自CibaSpecialty Chemicals，Tarrytown，NY(纽约州塔利顿村的汽巴精化有限公司)的Araldite GY 6008、GY 6010和GY 2600树脂。
可用的多官能缩水甘油醚环氧树脂的实例(其为双酚F的二缩水甘油醚)包括(但不限于)：可得自Hexion Specialty Chemicals的商品名为EPON Resin 862的那些；以及可得自Ciba Specialty Chemicals(汽巴精化有限公司)的Araldite GY 281、GY 282、GY 285、PY 306和PY 307树脂。
该多官能缩水甘油醚环氧树脂的环氧当量通常为约170至约500，在其它实施例中，为约170至约350，并且在其他实施例中为约170至约250。环氧官能团的平均范围为1.5至10。
该丙烯酸酯聚合物和热固性树脂能够相互发生反应(通常通过开环反应或缩合反应进行)，使得反应产物为链延长的聚合物和/或交联聚合物。
合适的多官能丙烯酸酯包括(例如)二、三、四羟基化合物的(甲基)丙烯酸酯，例如二丙烯酸乙二醇酯、二丙烯酸聚乙二醇酯、二甲基丙烯酸乙二醇酯、二丙烯酸己二醇酯、二丙烯酸三乙二醇酯、三羟甲基丙烷三丙烯酸酯、三丙烯酸甘油酯、三丙烯酸季戊四醇酯、三甲基丙烯酸季戊四醇酯、四丙烯酸季戊四醇酯和四甲基丙烯酸季戊四醇酯。高支化多元醇的丙烯酸酯(例如可得自Sartomer Co，Exton PA(宾夕法尼亚州Exton的Sartomer公司)的CN2301、2302、2303、2304)也是可用的。三羟甲基丙烷三丙烯酸酯特别适用于通过光化学诱导的聚合反应来减少粘合剂的粘性。
合适的丙烯酸酯聚合反应催化剂包括(例如)光引发剂和热引发剂，在特别需要延长的储藏期限的应用中光引发剂通常是优选的。合适的紫外光激活的光引发剂的实例是IrgacureTM651、Irgacure 184、Irgacure 369、Irgacure 819和DarocurTM 1173(全部是Ciba SpecialtyChemicals Co.(汽巴精化有限公司)的产品)，以及LucirinTM TPO-L(BASF Corp.(巴斯夫公司)的产品)。
在一些实施例中，可以使用热引发剂。热引发剂包括有机过氧化物(例如，过氧化苯甲酰)、偶氮化合物、苯醌、亚硝基化合物、酰卤、腙、巯基化合物、吡喃鎓化合物、咪唑、氯三嗪、安息香、安息香烷基醚、二酮、苯酮，以及它们的混合物。合适的热引发剂的实例是作为Vazo 52、Vazo 64和Vazo 67偶氮化合物热引发剂销售的那些，这些全部来自DuPont(杜邦公司)。
适用于固化所述多官能热固性树脂的合适的潜热催化剂包括，例如，可用于一部分环氧树脂粘结剂的潜在催化剂。示例性的催化剂包括：嵌段咪唑MZ-A、MA-OK和PHZ-S(Air产品)，以及聚合物键合的咪唑例如Intelimer 7004(Landec Inc.)。在一些实施例中，可以使用咪唑催化剂(特别是固体)，例如1、3二烷基咪唑盐、咪唑衍生物-过度金属络合物、2-乙基-4-甲基咪唑、2-苯基-4-甲基咪唑、2、4-二氨基-6-[2′-甲基咪唑-(1)′]乙基-s-三嗪等等。催化剂(如果实施例中存在)占组合物的至少约0.01重量％、优选至少约0.1重量％。在其它实施例中，催化剂可以不超过组合物的约5重量％，优选不超过约10重量％。
合适的丙烯酸盐包括(例如)含通过一个或多个多价金属盐桥连接的低聚物单元的(甲基)丙烯酸。这种盐桥可以在高于环境温度时分离，从而改善粘合剂组合物的流动特性。合适的丙烯酸盐包括SartomerCN2404(聚酯丙烯酸盐低聚物)和CN2405(一种聚氨酯丙烯酸盐低聚物)。
在一些实施例中，多官能热固性树脂为环氧树脂。在一些实施例中，丙烯酸酯聚合物为丙烯酸丁酯和甲基丙烯酸缩水甘油酯的共聚物。在另外一些实施例中，多官能丙烯酸酯包括三羟甲基丙烷三丙烯酸酯。
在一些实施例中，聚合物催化剂或固化剂为光引发的自由基固化剂。在一些实施例中，潜热催化剂为咪唑促进剂。在另外一些实施例中，丙烯酸盐为丙烯酸金属盐。
在一些实施例中，半导体晶片具有活性表面、基板表面以及与基板表面相邻的粘合剂层。半导体晶片的活性表面为具有集成电路的区域，而基板表面不具有集成电路。在其它实施例中，半导体芯片具有活性表面、基板表面以及与基板表面相邻的固化粘合剂的区域。在一些实施例中，粘合剂具有背衬。在另外一些实施例中，将粘合剂的组分混合并涂覆至防粘衬里上以形成粘合带前体。在一些实施例中，将粘合带前体加热以形成条带。在其它实施例中，将粘合带前体层合至合适的背衬。所述背衬(如果存在的话)可以是弹性体，例如离子键聚合物乙丙橡胶(EPR)，如DuPont(杜邦公司)的
Figure G2008800086804D00071
等等。在其他实施例中，将所述条带层合至晶片。
通过以下实例进一步说明本发明的目的和优点，但不应该将在这些实例中列举的具体材料及其用量以及其它的条件和细节理解为对本发明的不当限制。
实例
材料清单
Figure G2008800086804D00081
测试方法
剥离粘接强度测试
将50μm厚的
Figure G2008800086804D00082
膜层合至粘合剂膜涂层。将层叠薄膜切削成25毫米的带。将有机硅防粘衬里从粘合剂膜带移除，并用2.0kg的橡胶辊(进行四次)将粘合剂层合至经过抛光的有机硅晶片。通过用庚烷擦拭表面三次来清洁有机硅晶片。使用I-Mass SP-2000测试仪(马萨诸塞州Accord的IMASS Inc.)测量以180度角将粘合剂膜带从有机硅晶片移除的力。以30.5厘米/分钟的剥离速度测量该力。在样品已通过Fusion Systems UV Curing Unit(H灯，0.5J/cm2)(马里兰州的盖塞斯堡市)一次后，测量从有机硅晶片移除一些样品的力。
粘合剂膜的特性
使用动态机械分析仪(特拉华州纽卡斯尔市的TA InstrumentsInc.)，在25℃下测量紫外光照射和热固化的粘合剂膜的模量。当粘合剂膜以10℃/分钟进行加热时，用可购自TA Instruments，Inc.的差示扫描量热仪(DSC)测量放热化学处理的峰值温度。用DSC测量固化的粘合剂膜的玻璃化转变温度(Tg)。
胶层空隙测试
用手持橡胶辊将粘合剂膜样品层合至玻璃显微镜盖片。将层合的膜样品用紫外线辐照(Fusion Systems H灯，0.5J/cm2)进行处理。将
Figure G2008800086804D00091
膜从辐照处理过的粘合剂膜移除。将具有粘合剂膜样品的玻璃显微镜盖片布置在加热至100℃的热的板上，并将第二个玻璃显微镜盖片小心地布置在粘合剂膜样品上并用手操作2.3千克的橡胶辊来实现层合。在设定为160℃的烘箱中加热层合样品一小时。用设定为30倍放大的显微镜看不到任何空隙。
制备丙烯酸丁酯/甲基丙烯酸缩水甘油酯(BA/GMA)共聚物
将以下物质加入946毫升的瓶中：72.0克丙烯酸丁酯(密歇根州米德兰市的道尔化学公司)、48.0克甲基丙烯酸缩水甘油酯(美国宾夕法尼亚州伊斯顿的Sartomer Co.Inc.)、0.18克2，2′-偶氮二(2-甲基丁腈)(美国特拉华州威尔明顿市的杜邦公司)、140克乙酸乙酯和140克甲苯。将溶液以每分钟一升的速率用氮吹扫两分钟。将瓶密封并置于维持在60℃的水浴中24小时。反应混合物为29.5重量％的固体，测得的特性粘度为0.78dL/g，而Brookfield粘度为0.7帕斯卡-秒。
实例1
将所有组分在广口瓶中混合，然后在处于室温的真空烘箱中于减压条件下进行大约三分钟的除气处理。当涂层在85℃下于强制通风烘箱中加热7分钟后，用刮刀式涂胶机将粘合剂涂层溶液施加至经有机硅处理的聚对苯二甲酸乙二醇酯(PET)膜，以生成25μm厚的粘合剂。
实例1-6
Figure G2008800086804D00101
(a)乙酸乙酯/甲苯(1∶1)中的30％的聚合物溶液的重量
比较例-来自Hitachi Chem.Co.America，Ltd.(美国日立化工有限公司)的FH8000粘合膜
表1-比较例和实例1的测试结果
  实例1   比较例
  从硅晶片初始剥离(N/25mm)   4(在粘合剂和晶片之间失效) 1.4
  紫外辐照后从硅晶片剥离(N/25mm)   0.15(在粘合剂和Surlyn之间失效) 0.2
  25℃时的模量(MPa)   240   280
  DSC放热曲线的峰值温度(℃)   175   190
  玻璃化转变温度(℃)   125   180
表2-实例2-6的测试结果
  从硅晶片初始剥离(N/25mm)(a)   紫外辐照后从硅晶片剥离(N/25mm)(b)
  实例2   7.29   2.53
  实例3   2.21   0.30
  实例4   1.35   0.25
  实例5   4.75   0.37
  实例6   4.22   0.22
剥离方式-初始剥离测试过程中粘合剂与晶片分层
剥离方式-UV暴露后的剥离测试过程中Surlyn背衬与粘合剂分层。
在不背离本发明的范围和原则的前提下，本发明的各种修改和更改对本领域的技术人员来说将是显而易见的，并且应该理解，本发明不应不当地限于上文所述的示例性实施例。

Claims (20)

1.一种粘合剂组合物，其包含：
具有官能团的丙烯酸酯聚合物；
多官能热固性树脂；
多官能丙烯酸酯；
丙烯酸酯聚合反应催化剂或固化剂；
适用于固化所述多官能热固性树脂的潜热催化剂；以及
丙烯酸盐，
其中所述丙烯酸酯聚合物和所述热固性树脂能够相互反应。
2.根据权利要求1所述的组合物，其中所述多官能热固性树脂包含环氧树脂。
3.根据权利要求1所述的组合物，其中所述丙烯酸酯聚合物包含丙烯酸丁酯和甲基丙烯酸缩水甘油酯的共聚物。
4.根据权利要求1所述的组合物，其中所述多官能丙烯酸酯包含三羟甲基丙烷三丙烯酸酯。
5.根据权利要求1所述的组合物，其中所述聚合反应催化剂或固化剂包含光引发的自由基固化剂。
6.根据权利要求1所述的组合物，其中所述潜热催化剂包含咪唑促进剂。
7.根据权利要求1所述的组合物，其中所述丙烯酸盐包含多价金属离子。
8.一种适用于连续用作切割带和晶片附连粘合剂的粘合剂转移切割带，其包括：根据权利要求1所述的粘合剂组合物；以及背衬。
9.一种粘合剂，其包含：
至少约50重量百分比(重量％)的含官能团的丙烯酸酯聚合物；
约20重量％至约40重量％的多官能热固性树脂；
有效量的多官能丙烯酸酯；
用于固化所述丙烯酸酯聚合物的催化剂；
用于固化所述多官能热固性树脂的潜热催化剂；以及
丙烯酸盐，
其中所述丙烯酸酯聚合物和所述热固性树脂能够形成粘合剂反应产物。
10.根据权利要求9所述的组合物，其中所述多官能丙烯酸酯的含量大于0重量％且小于约10重量％。
11.根据权利要求9所述的组合物，其中所述潜热催化剂的含量大于0重量％且小于约10重量％。
12.根据权利要求9所述的组合物，其中所述丙烯酸盐包含多价金属离子。
13.根据权利要求9所述的组合物，其还包括背衬。
14.一种半导体晶片，其包括活性表面和基板表面，以及与所述基板表面相邻的根据权利要求9所述的粘合剂组合物的层。
15.一种半导体芯片，其包括活性表面和基板表面，以及与所述基板表面相邻的根据权利要求9所述的粘合剂组合物的层。
16.一种半导体芯片，其包括活性表面和基板表面以及固化的粘合剂的区域，所述固化的粘合剂的区域包含与所述基板表面相邻的根据权利要求9所述的反应产物。
17.一种制备粘合剂的方法，其包括：
提供具有官能团的丙烯酸酯聚合物；
提供多官能热固性树脂；
提供多官能丙烯酸酯；
提供丙烯酸酯聚合物催化剂或固化剂；
提供适用于固化所述多官能热固性树脂的潜热催化剂；
提供丙烯酸盐；
将所述聚合物、热固性树脂、多官能丙烯酸酯、丙烯酸酯聚合物催化剂或固化剂、潜热催化剂和丙烯酸盐混合以形成混合物；以及
任选地对所述混合物进行除气处理，
其中所述丙烯酸酯聚合物和所述热固性树脂能够相互反应。
18.根据权利要求17所述的方法，其还包括将所述混合物涂覆至防粘衬里上以形成粘合带前体。
19.根据权利要求18所述的方法，其还包括任选在将所述粘合带前体与背衬层合后，加热所述粘合带前体以形成条带。
20.根据权利要求19所述的方法，其还包括将所述条带层合至晶片上。
CN2008800086804A 2007-03-16 2008-03-07 切片和晶片附连粘合剂 Expired - Fee Related CN101636462B (zh)

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103237861A (zh) * 2010-11-24 2013-08-07 乐金华奥斯有限公司 触控面板用粘结剂组合物、粘结膜和触控面板
CN103797083A (zh) * 2011-07-28 2014-05-14 宝特威韩国株式会社 柔软的双马来亚酰胺、苯并嗪、环氧酐加合物混合粘合剂
CN107431003A (zh) * 2015-03-30 2017-12-01 迪睿合株式会社 热固化性粘接片及半导体装置的制造方法
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Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20100122110A (ko) * 2008-03-07 2010-11-19 쓰리엠 이노베이티브 프로퍼티즈 컴파니 패턴화된 배킹이 있는 다이싱 테이프 및 다이 부착 접착제
JP2011014767A (ja) * 2009-07-03 2011-01-20 Nippon Electric Glass Co Ltd 発光デバイス及びその製造方法
CN101988961B (zh) * 2009-08-04 2013-01-02 武汉武大卓越科技有限责任公司 地理位置数据采集系统
JP5833809B2 (ja) * 2010-02-01 2015-12-16 デクセリアルズ株式会社 異方性導電フィルム、接合体及び接続方法
US9056438B2 (en) 2012-05-02 2015-06-16 3M Innovative Properties Company Curable composition, articles comprising the curable composition, and method of making the same
CN103812048B (zh) * 2012-11-15 2017-10-27 国家电网公司 Gis备用间隔的检测系统及方法
WO2014092019A1 (ja) 2012-12-12 2014-06-19 株式会社ニコン 組成物、積層体、積層体の製造方法、トランジスタおよびトランジスタの製造方法
EP3450479A1 (en) * 2017-09-01 2019-03-06 Henkel AG & Co. KGaA A latent, fast curing composition, a use thereof and an article having a cured composition obtainable therefrom

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4968559A (en) 1985-02-14 1990-11-06 Bando Chemical Industries. Ltd. Pressure sensitive adhesive film with barrier layer
US5234730A (en) * 1986-11-07 1993-08-10 Tremco, Inc. Adhesive composition, process, and product
US5049085A (en) 1989-12-22 1991-09-17 Minnesota Mining And Manufacturing Company Anisotropically conductive polymeric matrix
US5300788A (en) 1991-01-18 1994-04-05 Kopin Corporation Light emitting diode bars and arrays and method of making same
EP0578498B1 (en) 1992-07-10 1997-04-16 Nippon Shokubai Co., Ltd. Acrylic polymer, its use and process for producing it
WO1997046601A1 (fr) 1996-06-03 1997-12-11 Toyo Ink Manufacturing Co., Ltd. Composition de resine liquide solidifiable
US20020007910A1 (en) 1996-11-12 2002-01-24 Greggory Scott Bennett Thermosettable pressure sensitive adhesive
DE19857237A1 (de) * 1997-12-23 1999-06-24 Henkel Kgaa Strahlenhärtbare Kaschierklebestoffe
US6265460B1 (en) 1998-06-29 2001-07-24 3M Innovative Properties Company Hot-melt adhesive composition, heat-bonding film adhesive and adhering method using hot-melt adhesive composition
US6235850B1 (en) 1998-12-11 2001-05-22 3M Immovative Properties Company Epoxy/acrylic terpolymer self-fixturing adhesive
US6180527B1 (en) 1999-08-09 2001-01-30 Micron Technology, Inc. Method and apparatus for thinning article, and article
US6472065B1 (en) * 2000-07-13 2002-10-29 3M Innovative Properties Company Clear adhesive sheet
US7022546B2 (en) 2000-12-05 2006-04-04 Analog Devices, Inc. Method and device for protecting micro electromechanical systems structures during dicing of a wafer
JP4699620B2 (ja) * 2001-03-05 2011-06-15 日立化成工業株式会社 感光性接着フィルムおよびその用途ならびに半導体装置の製造方法
WO2003089506A1 (en) * 2002-04-22 2003-10-30 Purdue Research Foundation Hydrogels having enhanced elasticity and mechanical strength properties
US7396869B2 (en) * 2002-12-04 2008-07-08 Denovus Llc Metallic acrylate curing agents and usage thereof in intermediate compositions
JP2004273895A (ja) 2003-03-11 2004-09-30 Disco Abrasive Syst Ltd 半導体ウエーハの分割方法
US7410831B2 (en) 2003-05-12 2008-08-12 Tokyo Seimitsu Co., Ltd. Method and device for dividing plate-like member
JP4027332B2 (ja) * 2004-03-19 2007-12-26 リンテック株式会社 半導体用粘接着シートおよび半導体装置の製造方法
US20060252234A1 (en) 2004-07-07 2006-11-09 Lintec Corporation Hardenable pressure sensitive adhesive sheet for dicing/die-bonding and method for manufacturing semiconductor device
EP1784302B1 (en) 2004-09-01 2016-07-06 Encapsys, Llc Encapsulated cure systems
JP4466397B2 (ja) * 2005-02-10 2010-05-26 住友ベークライト株式会社 半導体用接着フィルム及びこれを用いた半導体装置
KR20100122110A (ko) * 2008-03-07 2010-11-19 쓰리엠 이노베이티브 프로퍼티즈 컴파니 패턴화된 배킹이 있는 다이싱 테이프 및 다이 부착 접착제

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103237861A (zh) * 2010-11-24 2013-08-07 乐金华奥斯有限公司 触控面板用粘结剂组合物、粘结膜和触控面板
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CN103797083B (zh) * 2011-07-28 2016-07-27 宝特威韩国株式会社 柔软的双马来酰亚胺、苯并嗪、环氧酐加合物混合粘合剂
CN107431003A (zh) * 2015-03-30 2017-12-01 迪睿合株式会社 热固化性粘接片及半导体装置的制造方法
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