JP2010521555A - ダイシング及びダイアタッチ接着剤 - Google Patents

ダイシング及びダイアタッチ接着剤 Download PDF

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Publication number
JP2010521555A
JP2010521555A JP2009553701A JP2009553701A JP2010521555A JP 2010521555 A JP2010521555 A JP 2010521555A JP 2009553701 A JP2009553701 A JP 2009553701A JP 2009553701 A JP2009553701 A JP 2009553701A JP 2010521555 A JP2010521555 A JP 2010521555A
Authority
JP
Japan
Prior art keywords
acrylate ester
acrylate
adhesive
thermosetting resin
polyfunctional
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2009553701A
Other languages
English (en)
Japanese (ja)
Other versions
JP2010521555A5 (enExample
Inventor
ジー． ラーソン，エリック
エー． クロップ，マイケル
ジェイ． プラウト，デイビッド
エル． ムーア，シェリル
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Innovative Properties Co
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of JP2010521555A publication Critical patent/JP2010521555A/ja
Publication of JP2010521555A5 publication Critical patent/JP2010521555A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7402—Wafer tapes, e.g. grinding or dicing support tapes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/08—Homopolymers or copolymers of acrylic acid esters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C08L2666/14—Macromolecular compounds according to C08L59/00 - C08L87/00; Derivatives thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00—Presence of (meth)acrylic polymer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2463/00—Presence of epoxy resin
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7416—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/013—Manufacture or treatment of die-attach connectors
    • H10W72/01331—Manufacture or treatment of die-attach connectors using blanket deposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07337—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy
    • H10W72/07338—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy hardening the adhesive by curing, e.g. thermosetting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H10W72/354—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics comprising polymers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2852—Adhesive compositions
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2852—Adhesive compositions
    • Y10T428/287—Adhesive compositions including epoxy group or epoxy polymer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2852—Adhesive compositions
    • Y10T428/2878—Adhesive compositions including addition polymer from unsaturated monomer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2852—Adhesive compositions
    • Y10T428/2878—Adhesive compositions including addition polymer from unsaturated monomer
    • Y10T428/2891—Adhesive compositions including addition polymer from unsaturated monomer including addition polymer from alpha-beta unsaturated carboxylic acid [e.g., acrylic acid, methacrylic acid, etc.] Or derivative thereof

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Die Bonding (AREA)
JP2009553701A 2007-03-16 2008-03-07 ダイシング及びダイアタッチ接着剤 Pending JP2010521555A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US89518907P 2007-03-16 2007-03-16
PCT/US2008/056178 WO2008115711A1 (en) 2007-03-16 2008-03-07 Dicing and die attach adhesive

Publications (2)

Publication Number Publication Date
JP2010521555A true JP2010521555A (ja) 2010-06-24
JP2010521555A5 JP2010521555A5 (enExample) 2011-04-28

Family

ID=39766343

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009553701A Pending JP2010521555A (ja) 2007-03-16 2008-03-07 ダイシング及びダイアタッチ接着剤

Country Status (7)

Country Link
US (1) US8022145B2 (enExample)
EP (1) EP2134800A4 (enExample)
JP (1) JP2010521555A (enExample)
KR (1) KR20100014539A (enExample)
CN (1) CN101636462B (enExample)
TW (1) TW200902664A (enExample)
WO (1) WO2008115711A1 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011014767A (ja) * 2009-07-03 2011-01-20 Nippon Electric Glass Co Ltd 発光デバイス及びその製造方法
WO2016158959A1 (ja) * 2015-03-30 2016-10-06 デクセリアルズ株式会社 熱硬化性接着シート、及び半導体装置の製造方法

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009114345A1 (en) * 2008-03-07 2009-09-17 3M Innovative Properties Company Dicing tape and die attach adhesive with patterned backing
CN101988961B (zh) * 2009-08-04 2013-01-02 武汉武大卓越科技有限责任公司 地理位置数据采集系统
JP5833809B2 (ja) * 2010-02-01 2015-12-16 デクセリアルズ株式会社 異方性導電フィルム、接合体及び接続方法
KR101576689B1 (ko) * 2010-11-24 2015-12-10 (주)엘지하우시스 터치패널용 점착제 조성물, 점착필름 및 터치패널
WO2013015469A1 (en) * 2011-07-28 2013-01-31 Protavic Korea Co., Ltd. Flexible bismaleimide, benzoxazine, epoxy-anhydride adduct hybrid adhesive
US9056438B2 (en) 2012-05-02 2015-06-16 3M Innovative Properties Company Curable composition, articles comprising the curable composition, and method of making the same
CN103812048B (zh) * 2012-11-15 2017-10-27 国家电网公司 Gis备用间隔的检测系统及方法
JP6274112B2 (ja) 2012-12-12 2018-02-07 株式会社ニコン 組成物、積層体、積層体の製造方法、トランジスタおよびトランジスタの製造方法
EP3450479A1 (en) * 2017-09-01 2019-03-06 Henkel AG & Co. KGaA A latent, fast curing composition, a use thereof and an article having a cured composition obtainable therefrom
CN108276923A (zh) * 2018-02-02 2018-07-13 苏州城邦达力材料科技有限公司 一种uv减粘组合物、uv减粘膜及其制备方法
CN119391356B (zh) * 2024-11-22 2026-06-19 东莞市贝特利新材料有限公司 一种紫外光固化粘接剂及其制备方法

Citations (3)

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JP2002256227A (ja) * 2001-03-05 2002-09-11 Hitachi Chem Co Ltd 感光性接着フィルムおよびその用途ならびに半導体装置の製造方法
US20050154089A1 (en) * 2002-12-04 2005-07-14 Denovus Llc Metallic acrylate curing agents and usage thereof in intermediate compositions
JP2006219589A (ja) * 2005-02-10 2006-08-24 Sumitomo Bakelite Co Ltd 半導体用接着フィルム及びこれを用いた半導体装置

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US5234730A (en) * 1986-11-07 1993-08-10 Tremco, Inc. Adhesive composition, process, and product
US5049085A (en) * 1989-12-22 1991-09-17 Minnesota Mining And Manufacturing Company Anisotropically conductive polymeric matrix
US5300788A (en) * 1991-01-18 1994-04-05 Kopin Corporation Light emitting diode bars and arrays and method of making same
DE69309795T2 (de) * 1992-07-10 1997-11-27 Nippon Catalytic Chem Ind Acrylat Polymer, seine Verwendung und Verfahren zu seiner Herstellung
US6048953A (en) * 1996-06-03 2000-04-11 Toyo Ink Manufacturing Co., Ltd. Curable liquid resin composition
US20020007910A1 (en) * 1996-11-12 2002-01-24 Greggory Scott Bennett Thermosettable pressure sensitive adhesive
DE19857237A1 (de) * 1997-12-23 1999-06-24 Henkel Kgaa Strahlenhärtbare Kaschierklebestoffe
US6265460B1 (en) * 1998-06-29 2001-07-24 3M Innovative Properties Company Hot-melt adhesive composition, heat-bonding film adhesive and adhering method using hot-melt adhesive composition
US6235850B1 (en) * 1998-12-11 2001-05-22 3M Immovative Properties Company Epoxy/acrylic terpolymer self-fixturing adhesive
US6180527B1 (en) * 1999-08-09 2001-01-30 Micron Technology, Inc. Method and apparatus for thinning article, and article
US6472065B1 (en) * 2000-07-13 2002-10-29 3M Innovative Properties Company Clear adhesive sheet
WO2002074686A2 (en) * 2000-12-05 2002-09-26 Analog Devices, Inc. A method and device for protecting micro electromechanical systems structures during dicing of a wafer
US6960617B2 (en) * 2002-04-22 2005-11-01 Purdue Research Foundation Hydrogels having enhanced elasticity and mechanical strength properties
JP2004273895A (ja) * 2003-03-11 2004-09-30 Disco Abrasive Syst Ltd 半導体ウエーハの分割方法
KR101121495B1 (ko) * 2003-05-12 2012-03-15 가부시키가이샤 토쿄 세이미쯔 판상부재의 분할방법 및 분할장치
JP4027332B2 (ja) * 2004-03-19 2007-12-26 リンテック株式会社 半導体用粘接着シートおよび半導体装置の製造方法
US20060252234A1 (en) * 2004-07-07 2006-11-09 Lintec Corporation Hardenable pressure sensitive adhesive sheet for dicing/die-bonding and method for manufacturing semiconductor device
EP1784302B1 (en) * 2004-09-01 2016-07-06 Encapsys, Llc Encapsulated cure systems
WO2009114345A1 (en) * 2008-03-07 2009-09-17 3M Innovative Properties Company Dicing tape and die attach adhesive with patterned backing

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002256227A (ja) * 2001-03-05 2002-09-11 Hitachi Chem Co Ltd 感光性接着フィルムおよびその用途ならびに半導体装置の製造方法
US20050154089A1 (en) * 2002-12-04 2005-07-14 Denovus Llc Metallic acrylate curing agents and usage thereof in intermediate compositions
JP2006219589A (ja) * 2005-02-10 2006-08-24 Sumitomo Bakelite Co Ltd 半導体用接着フィルム及びこれを用いた半導体装置

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011014767A (ja) * 2009-07-03 2011-01-20 Nippon Electric Glass Co Ltd 発光デバイス及びその製造方法
WO2016158959A1 (ja) * 2015-03-30 2016-10-06 デクセリアルズ株式会社 熱硬化性接着シート、及び半導体装置の製造方法
JP2016189380A (ja) * 2015-03-30 2016-11-04 デクセリアルズ株式会社 熱硬化性接着シート、及び半導体装置の製造方法
US10192769B2 (en) 2015-03-30 2019-01-29 Dexerials Corporation Thermosetting adhesive sheet and semiconductor device manufacturing method

Also Published As

Publication number Publication date
CN101636462B (zh) 2013-03-13
US20100056725A1 (en) 2010-03-04
EP2134800A1 (en) 2009-12-23
US8022145B2 (en) 2011-09-20
WO2008115711A1 (en) 2008-09-25
KR20100014539A (ko) 2010-02-10
CN101636462A (zh) 2010-01-27
TW200902664A (en) 2009-01-16
EP2134800A4 (en) 2011-09-28

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