JP2005053975A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2005053975A5 JP2005053975A5 JP2003206343A JP2003206343A JP2005053975A5 JP 2005053975 A5 JP2005053975 A5 JP 2005053975A5 JP 2003206343 A JP2003206343 A JP 2003206343A JP 2003206343 A JP2003206343 A JP 2003206343A JP 2005053975 A5 JP2005053975 A5 JP 2005053975A5
- Authority
- JP
- Japan
- Prior art keywords
- meth
- heat
- acrylate
- glycidyl
- monomers
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Priority Applications (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003206343A JP4610168B2 (ja) | 2003-08-06 | 2003-08-06 | 耐熱マスキングテープ |
| KR1020067002340A KR20060056362A (ko) | 2003-08-06 | 2004-06-24 | 내열성 마스킹 테이프 |
| US10/561,358 US7641967B2 (en) | 2003-08-06 | 2004-06-24 | Heat resistant masking tape |
| PCT/US2004/020326 WO2005017059A2 (en) | 2003-08-06 | 2004-06-24 | Heat resistant masking tape |
| CN2004800216509A CN1829783B (zh) | 2003-08-06 | 2004-06-24 | 耐热遮蔽带 |
| TW093120395A TWI367247B (en) | 2003-08-06 | 2004-07-07 | Heat resistant masking tape |
| MYPI20042957A MY144037A (en) | 2003-08-06 | 2004-07-22 | Heat resistant masking tape |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003206343A JP4610168B2 (ja) | 2003-08-06 | 2003-08-06 | 耐熱マスキングテープ |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2005053975A JP2005053975A (ja) | 2005-03-03 |
| JP2005053975A5 true JP2005053975A5 (enExample) | 2006-09-14 |
| JP4610168B2 JP4610168B2 (ja) | 2011-01-12 |
Family
ID=34190044
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2003206343A Expired - Fee Related JP4610168B2 (ja) | 2003-08-06 | 2003-08-06 | 耐熱マスキングテープ |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US7641967B2 (enExample) |
| JP (1) | JP4610168B2 (enExample) |
| KR (1) | KR20060056362A (enExample) |
| CN (1) | CN1829783B (enExample) |
| MY (1) | MY144037A (enExample) |
| TW (1) | TWI367247B (enExample) |
| WO (1) | WO2005017059A2 (enExample) |
Families Citing this family (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4107417B2 (ja) | 2002-10-15 | 2008-06-25 | 日東電工株式会社 | チップ状ワークの固定方法 |
| JP4283596B2 (ja) * | 2003-05-29 | 2009-06-24 | 日東電工株式会社 | チップ状ワークの固定方法 |
| JP4443962B2 (ja) * | 2004-03-17 | 2010-03-31 | 日東電工株式会社 | ダイシング・ダイボンドフィルム |
| US20080173886A1 (en) * | 2006-05-11 | 2008-07-24 | Evident Technologies, Inc. | Solid state lighting devices comprising quantum dots |
| US8941293B2 (en) | 2006-05-11 | 2015-01-27 | Samsung Electronics Co., Ltd. | Solid state lighting devices comprising quantum dots |
| CN101506948B (zh) * | 2006-09-12 | 2012-12-12 | 日东电工株式会社 | 切割/芯片焊接膜 |
| JP2008144047A (ja) * | 2006-12-11 | 2008-06-26 | Three M Innovative Properties Co | 耐熱性マスキングテープ及びその使用方法 |
| JP5138255B2 (ja) * | 2007-03-28 | 2013-02-06 | タツタ電線株式会社 | 保護フィルム |
| KR100919410B1 (ko) * | 2007-08-10 | 2009-09-29 | 김태진 | 마스킹 밴드 및 마스킹 밴드 제조 방법 |
| JP5551568B2 (ja) * | 2009-11-12 | 2014-07-16 | 日東電工株式会社 | 樹脂封止用粘着テープ及びこれを用いた樹脂封止型半導体装置の製造方法 |
| JP5366781B2 (ja) * | 2009-12-14 | 2013-12-11 | 日東電工株式会社 | 樹脂封止用耐熱性粘着テープ及びこれを用いた樹脂封止型半導体装置の製造方法 |
| BR112013026344B1 (pt) * | 2011-04-15 | 2021-02-09 | Basf Se | dispersão adesiva sensível à pressão, uso da mesma, e,fita adesiva |
| US8785517B2 (en) * | 2011-05-25 | 2014-07-22 | 3M Innovative Properties Company | Pressure-sensitive adhesives with onium-epdxy crosslinking system |
| KR101640106B1 (ko) * | 2012-12-14 | 2016-07-15 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | 접착제 조성물 및 정밀 페인트 선 생성용 마스킹 용품 |
| EP2970725A1 (en) | 2013-03-13 | 2016-01-20 | 3M Innovative Properties Company | Adhesives comprising epoxy-acid crosslinked groups and methods |
| US8852729B1 (en) * | 2013-03-15 | 2014-10-07 | Davinci Engineering & Consulting, Llc | Seep resistant masking material |
| US10676651B2 (en) * | 2016-03-09 | 2020-06-09 | Mitsubishi Chemical Corporation | Adhesive film and process for producing the same |
| CN108559427B (zh) * | 2018-05-23 | 2020-08-04 | 广东东立新材料科技股份有限公司 | 一种性能优异的耐高温压敏胶、压敏胶带及其制备方法 |
| JP7304345B2 (ja) * | 2018-05-28 | 2023-07-06 | デンカ株式会社 | 粘着テープ及びそれを用いた半導体装置の製造方法 |
| CN113004826A (zh) * | 2019-12-20 | 2021-06-22 | 3M创新有限公司 | 导电胶带、层压制品及一种制备制品的方法 |
| JPWO2022138132A1 (enExample) * | 2020-12-25 | 2022-06-30 | ||
| US20240174897A1 (en) * | 2021-04-02 | 2024-05-30 | 3M Innovative Properties Company | Transparent, heat resistive, adhesive tape with antistatic performance and method of use thereof |
| CN114149763A (zh) * | 2021-11-29 | 2022-03-08 | 东莞市龙美电子科技有限公司 | 一种耐电解液电容器用胶带及其制备方法 |
Family Cites Families (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3284423A (en) | 1963-12-20 | 1966-11-08 | Monsanto Co | Pressure-sensitive creep-resistant resin composition |
| US4038454A (en) * | 1965-05-19 | 1977-07-26 | Beiersdorf Aktiengesellschaft | Pressure sensitive adhesive coated sheet material |
| DE1719096B2 (de) * | 1967-10-31 | 1976-11-04 | Beiersdorf Ag, 2000 Hamburg | Verfahren zur herstellung von selbstklebebaendern oder -folien |
| US4762747A (en) | 1986-07-29 | 1988-08-09 | Industrial Technology Research Institute | Single component aqueous acrylic adhesive compositions for flexible printed circuits and laminates made therefrom |
| USH688H (en) * | 1988-06-16 | 1989-10-03 | E. I. Du Pont De Nemours And Company | Process for surface modification of polyethylene terephthalate film |
| US5229206A (en) * | 1990-05-17 | 1993-07-20 | Minnesota Mining And Manufacturing Company | Pressure-sensitive adhesive composition |
| JP2955095B2 (ja) | 1991-12-13 | 1999-10-04 | 日東電工株式会社 | 表面保護フィルム用粘着剤 |
| JPH08283678A (ja) * | 1995-04-11 | 1996-10-29 | Mitsui Toatsu Chem Inc | 表面保護用粘着フィルム及びその製造方法 |
| JPH1025456A (ja) | 1996-07-09 | 1998-01-27 | Toyo Chem Co Ltd | 半導体ウエハ固定用シート |
| EP1586615B1 (en) | 1999-06-18 | 2007-08-15 | Hitachi Chemical Company, Ltd. | Adhesive, adhesive member, interconnecting substrate for semiconductor mounting having adhesive member, and semiconductor device containing the same |
| DE19960467A1 (de) * | 1999-12-15 | 2001-09-20 | Beiersdorf Ag | Klebeband mit thermisch härtbarem Träger zum Maskieren einer KTL-Grundierung |
| DE19960466A1 (de) | 1999-12-15 | 2001-09-20 | Beiersdorf Ag | Klebeband, insbesondere zum Maskieren einer KTL-Grundierung |
| EP1167483A1 (en) * | 2000-06-20 | 2002-01-02 | Saehan Industries, Inc. | Adhesive tape for electronic parts |
| CN1256234C (zh) * | 2000-12-01 | 2006-05-17 | 3M创新有限公司 | 交联压敏粘合剂组合物和基于该组合物的用于高温应用的胶粘制品 |
| JP3779601B2 (ja) * | 2001-11-28 | 2006-05-31 | 株式会社巴川製紙所 | 半導体装置組立用マスクシート |
| JP3877146B2 (ja) * | 2001-12-19 | 2007-02-07 | 日東電工株式会社 | 再剥離型感圧接着剤およびその接着シート |
| JP2003238910A (ja) * | 2002-01-31 | 2003-08-27 | Three M Innovative Properties Co | 加熱剥離型熱硬化性粘着剤フィルム |
| JP4115711B2 (ja) * | 2002-02-14 | 2008-07-09 | 日東電工株式会社 | フレキシブルプリント配線板固定用接着シート及びフレキシブルプリント配線板への電子部品の実装方法 |
| JP3849978B2 (ja) * | 2002-06-10 | 2006-11-22 | 日東電工株式会社 | 半導体装置の製造方法及びこれに用いる耐熱性粘着テープ |
-
2003
- 2003-08-06 JP JP2003206343A patent/JP4610168B2/ja not_active Expired - Fee Related
-
2004
- 2004-06-24 CN CN2004800216509A patent/CN1829783B/zh not_active Expired - Fee Related
- 2004-06-24 US US10/561,358 patent/US7641967B2/en not_active Expired - Fee Related
- 2004-06-24 WO PCT/US2004/020326 patent/WO2005017059A2/en not_active Ceased
- 2004-06-24 KR KR1020067002340A patent/KR20060056362A/ko not_active Ceased
- 2004-07-07 TW TW093120395A patent/TWI367247B/zh not_active IP Right Cessation
- 2004-07-22 MY MYPI20042957A patent/MY144037A/en unknown