JP5138255B2 - 保護フィルム - Google Patents
保護フィルム Download PDFInfo
- Publication number
- JP5138255B2 JP5138255B2 JP2007083555A JP2007083555A JP5138255B2 JP 5138255 B2 JP5138255 B2 JP 5138255B2 JP 2007083555 A JP2007083555 A JP 2007083555A JP 2007083555 A JP2007083555 A JP 2007083555A JP 5138255 B2 JP5138255 B2 JP 5138255B2
- Authority
- JP
- Japan
- Prior art keywords
- protective film
- resin
- adhesive layer
- substrate
- thickness
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 230000001681 protective effect Effects 0.000 title claims description 43
- 239000010410 layer Substances 0.000 claims description 32
- 229920006015 heat resistant resin Polymers 0.000 claims description 20
- 239000004925 Acrylic resin Substances 0.000 claims description 15
- 229920000178 Acrylic resin Polymers 0.000 claims description 15
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims description 14
- 239000012948 isocyanate Substances 0.000 claims description 13
- 150000002513 isocyanates Chemical class 0.000 claims description 13
- 238000002156 mixing Methods 0.000 claims description 13
- 229920005989 resin Polymers 0.000 claims description 13
- 239000011347 resin Substances 0.000 claims description 13
- 239000003822 epoxy resin Substances 0.000 claims description 11
- 239000004088 foaming agent Substances 0.000 claims description 11
- 229920000647 polyepoxide Polymers 0.000 claims description 11
- 239000012790 adhesive layer Substances 0.000 claims description 7
- 229920006122 polyamide resin Polymers 0.000 claims description 5
- 239000004677 Nylon Substances 0.000 claims description 3
- 229920001778 nylon Polymers 0.000 claims description 3
- 239000000758 substrate Substances 0.000 description 24
- 238000000034 method Methods 0.000 description 18
- 230000000052 comparative effect Effects 0.000 description 10
- 239000000853 adhesive Substances 0.000 description 9
- 230000001070 adhesive effect Effects 0.000 description 9
- 229910000679 solder Inorganic materials 0.000 description 9
- 239000003153 chemical reaction reagent Substances 0.000 description 6
- 239000003431 cross linking reagent Substances 0.000 description 6
- 230000004907 flux Effects 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 239000011889 copper foil Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 239000000945 filler Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- OFBQJSOFQDEBGM-UHFFFAOYSA-N n-pentane Natural products CCCCC OFBQJSOFQDEBGM-UHFFFAOYSA-N 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 229920002799 BoPET Polymers 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 2
- 230000000740 bleeding effect Effects 0.000 description 2
- 238000013329 compounding Methods 0.000 description 2
- 239000006071 cream Substances 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 230000000873 masking effect Effects 0.000 description 2
- 229920005862 polyol Polymers 0.000 description 2
- 150000003077 polyols Chemical class 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000009736 wetting Methods 0.000 description 2
- SCYULBFZEHDVBN-UHFFFAOYSA-N 1,1-Dichloroethane Chemical compound CC(Cl)Cl SCYULBFZEHDVBN-UHFFFAOYSA-N 0.000 description 1
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- 241000894006 Bacteria Species 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-M Bicarbonate Chemical class OC([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-M 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 240000004808 Saccharomyces cerevisiae Species 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- -1 azide compounds Chemical class 0.000 description 1
- 125000000751 azo group Chemical group [*]N=N[*] 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 239000001273 butane Substances 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 150000002429 hydrazines Chemical class 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 description 1
- 239000000347 magnesium hydroxide Substances 0.000 description 1
- 229910001862 magnesium hydroxide Inorganic materials 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 1
- 239000003094 microcapsule Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- IJDNQMDRQITEOD-UHFFFAOYSA-N n-butane Chemical compound CCCC IJDNQMDRQITEOD-UHFFFAOYSA-N 0.000 description 1
- 150000002832 nitroso derivatives Chemical class 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920005749 polyurethane resin Polymers 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
Images
Landscapes
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
Description
2 耐熱性樹脂層
3 粘着剤層
Claims (4)
- フィルム状に形成された耐熱性樹脂層の片面に粘着剤層を形成してなることを特徴とする保護フィルムであって、
前記耐熱性樹脂層が、エポキシ変性ナイロン樹脂、又は、エポキシ樹脂とポリアミド樹脂とを配合したものであることを特徴とする保護フィルム。 - 前記粘着剤層が、アクリル樹脂とエポキシ樹脂とイソシアネート樹脂とを配合してなるもの、又は、アクリル樹脂とイソシアネート樹脂とを配合してなるものであることを特徴とする請求項1に記載の保護フィルム。
- 総厚みが10μm〜50μm、前記耐熱性樹脂層の厚みが5μm〜45μm、前記粘着剤層の厚みが5μm〜25μmであることを特徴とする請求項1又は2に記載の保護フィルム。
- 前記粘着剤層に発泡剤が含まれていることを特徴とする請求項1〜3のいずれか1項に記載の保護フィルム。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007083555A JP5138255B2 (ja) | 2007-03-28 | 2007-03-28 | 保護フィルム |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007083555A JP5138255B2 (ja) | 2007-03-28 | 2007-03-28 | 保護フィルム |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2008239834A JP2008239834A (ja) | 2008-10-09 |
JP5138255B2 true JP5138255B2 (ja) | 2013-02-06 |
Family
ID=39911557
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007083555A Active JP5138255B2 (ja) | 2007-03-28 | 2007-03-28 | 保護フィルム |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP5138255B2 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104263268B (zh) * | 2014-09-10 | 2016-02-10 | 宁波雅歌新材料科技有限公司 | 一种pet制程保护膜的制备方法 |
JP6456723B2 (ja) * | 2015-02-25 | 2019-01-23 | マクセルホールディングス株式会社 | 粘着テープ |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000230159A (ja) * | 1999-02-15 | 2000-08-22 | Sekisui Chem Co Ltd | 粘着テープ用基材 |
JP2003165959A (ja) * | 2001-11-30 | 2003-06-10 | Sekisui Chem Co Ltd | 粘着保護フィルム |
JP4219605B2 (ja) * | 2002-03-12 | 2009-02-04 | リンテック株式会社 | 半導体ウエハ加工用粘着シートおよびその使用方法 |
JP2004237517A (ja) * | 2003-02-05 | 2004-08-26 | Toray Ind Inc | プリント回路用基板及びそれを用いたプリント回路基板 |
JP2005019518A (ja) * | 2003-06-24 | 2005-01-20 | Nitto Denko Corp | 半導体ウエハ加工用保護シート及び半導体ウエハの裏面研削方法 |
JP4610168B2 (ja) * | 2003-08-06 | 2011-01-12 | スリーエム イノベイティブ プロパティズ カンパニー | 耐熱マスキングテープ |
JP2005239884A (ja) * | 2004-02-26 | 2005-09-08 | Nitto Denko Corp | 半導体ウエハ加工用粘着シート |
CN1929994A (zh) * | 2004-03-04 | 2007-03-14 | 东丽株式会社 | 耐热性树脂叠层膜与含其的覆金属层的叠层膜以及半导体器件 |
JP4743578B2 (ja) * | 2004-05-18 | 2011-08-10 | 日東電工株式会社 | 半導体ウェハ加工用保護シート、及び半導体ウェハの裏面研削方法 |
-
2007
- 2007-03-28 JP JP2007083555A patent/JP5138255B2/ja active Active
Also Published As
Publication number | Publication date |
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JP2008239834A (ja) | 2008-10-09 |
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