CN113004826A - 导电胶带、层压制品及一种制备制品的方法 - Google Patents
导电胶带、层压制品及一种制备制品的方法 Download PDFInfo
- Publication number
- CN113004826A CN113004826A CN201911333416.4A CN201911333416A CN113004826A CN 113004826 A CN113004826 A CN 113004826A CN 201911333416 A CN201911333416 A CN 201911333416A CN 113004826 A CN113004826 A CN 113004826A
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- Prior art keywords
- major surface
- acrylate
- substrate
- electrically conductive
- sensitive adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000002390 adhesive tape Substances 0.000 title claims description 12
- 238000004519 manufacturing process Methods 0.000 title claims description 6
- 239000000758 substrate Substances 0.000 claims abstract description 75
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims abstract description 45
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims abstract description 43
- 239000000178 monomer Substances 0.000 claims abstract description 41
- 239000010410 layer Substances 0.000 claims abstract description 39
- 230000000873 masking effect Effects 0.000 claims abstract description 32
- 239000003431 cross linking reagent Substances 0.000 claims abstract description 21
- 125000000217 alkyl group Chemical group 0.000 claims abstract description 19
- 239000000203 mixture Substances 0.000 claims abstract description 18
- 229920001519 homopolymer Polymers 0.000 claims abstract description 16
- 239000011231 conductive filler Substances 0.000 claims abstract description 15
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- 238000000034 method Methods 0.000 claims description 49
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- 239000010935 stainless steel Substances 0.000 claims description 16
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 13
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- 239000007787 solid Substances 0.000 claims description 6
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- 229910052782 aluminium Inorganic materials 0.000 claims description 4
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- 239000011541 reaction mixture Substances 0.000 claims description 4
- GOXQRTZXKQZDDN-UHFFFAOYSA-N 2-Ethylhexyl acrylate Chemical compound CCCCC(CC)COC(=O)C=C GOXQRTZXKQZDDN-UHFFFAOYSA-N 0.000 claims description 3
- NJRHMGPRPPEGQL-UHFFFAOYSA-N 2-hydroxybutyl prop-2-enoate Chemical compound CCC(O)COC(=O)C=C NJRHMGPRPPEGQL-UHFFFAOYSA-N 0.000 claims description 3
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 claims description 3
- HFCUBKYHMMPGBY-UHFFFAOYSA-N 2-methoxyethyl prop-2-enoate Chemical compound COCCOC(=O)C=C HFCUBKYHMMPGBY-UHFFFAOYSA-N 0.000 claims description 3
- DXPPIEDUBFUSEZ-UHFFFAOYSA-N 6-methylheptyl prop-2-enoate Chemical compound CC(C)CCCCCOC(=O)C=C DXPPIEDUBFUSEZ-UHFFFAOYSA-N 0.000 claims description 3
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- PQJYXFVJBSRUPG-UHFFFAOYSA-N [3-(2-methylaziridine-1-carbonyl)phenyl]-(2-methylaziridin-1-yl)methanone Chemical compound CC1CN1C(=O)C1=CC=CC(C(=O)N2C(C2)C)=C1 PQJYXFVJBSRUPG-UHFFFAOYSA-N 0.000 description 3
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- NOWKCMXCCJGMRR-UHFFFAOYSA-N Aziridine Chemical compound C1CN1 NOWKCMXCCJGMRR-UHFFFAOYSA-N 0.000 description 1
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Images
Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
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- C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
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- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/12—Esters of monohydric alcohols or phenols
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Abstract
本发明题为“导电遮蔽胶带”。导电遮蔽胶带包括导电背衬和导电压敏粘合剂层。压敏粘合剂包含丙烯酸酯类共聚物基质、交联剂、导电填料和至少一种抗氧化剂。丙烯酸酯类共聚物基质为可聚合混合物的反应产物,该可聚合混合物包含至少一种均聚物Tg小于‑50℃的第一(甲基)丙烯酸烷基酯单体以及至少一种均聚物Tg小于‑10℃的羟基官能(甲基)丙烯酸烷基酯。导电胶带能够被层压到基底表面并且在经受苛刻条件(诸如等离子体气相沉积条件)之后自该基底表面干净地移除。
Description
技术领域
本公开涉及导电遮蔽胶带和使用导电遮蔽胶带来制备电子制品的方法。
背景技术
粘合剂已用于多种标记、固定、保护、密封和掩蔽用途。粘合剂经常作为胶带提供,所述胶带通常包括背衬或基底以及粘合剂。用于制造制品以在加工期间保护制品的部件或将其暂时保持在适当位置的粘合胶带有时被称为加工胶带。加工胶带不保留在最终制品中,而是在一个或多个加工步骤之后被移除。加工胶带的示例包括遮蔽胶带,其中将遮蔽胶带施加到表面以覆盖它并在某一工艺(诸如涂漆)期间保护它,并且在涂漆工艺之后将遮蔽胶带移除以获得具有涂漆和未涂漆的相邻区域的表面。
发明内容
本公开涉及导电遮蔽胶带和使用导电遮蔽胶带来制备电子制品的方法。在一些实施方案中,导电胶带包括具有第一主表面和第二主表面的导电背衬,以及具有第一主表面和第二主表面的导电压敏粘合剂层,其中压敏粘合剂层的第二主表面与导电背衬的第一主表面接触。压敏粘合剂包含丙烯酸酯类共聚物基质、交联剂、导电填料和至少一种抗氧化剂。丙烯酸酯类共聚物基质包括可聚合混合物的反应产物,该可聚合混合物包含至少一种第一(甲基)丙烯酸酯单体以及至少一种第二(甲基)丙烯酸酯单体,所述至少一种第一(甲基)丙烯酸酯单体包括均聚物Tg小于-50℃的(甲基)丙烯酸烷基酯,所述至少一种第二(甲基)丙烯酸酯单体包括均聚物Tg小于-10℃的羟基官能(甲基)丙烯酸烷基酯。其中导电胶带能够被层压到基底表面并且在经受以下条件中的至少一个之后自该基底表面干净地移除,所述条件包括:在50℃至90℃的温度下暴露于碱性清洁溶液至少30分钟;以及经受等离子体气相沉积条件,这包括暴露于最高200℃的温度24小时以上。
在全部加工步骤中,导电胶带保持导电背衬与基底之间的导电性,所述导电胶带通过导电压敏粘合剂层而被施加到基底。导电背衬用于在加工期间保护基底。导电压敏粘合剂确保在加工时导电背衬地接到基底。这有助于确保基底不经历与未地接的导电背衬相关的不良结果。导电压敏粘合剂不仅确保导电胶带的地接性能,而且还抵抗苛刻的加工环境,并且提供加工后自基底表面的干净移除。例如,导电背衬需要在等离子体气相沉积加工期间地接,或者沉积到胶带附近基底上的气相沉积材料将经历不均匀的施加结果(厚度、外观、均匀度等)。
还公开了制备制品的方法。在一些实施方案中,所述方法包括:提供基底,该基底具有将进行等离子体气相沉积的表面;提供如上所述的导电胶带制品;用碱性溶液清洁遮蔽表面,这包括在50°至100°的温度下施用pH为13至14的碱性清洁溶液30分钟至60分钟;使遮蔽表面暴露于等离子体气相沉积,这包括使表面暴露于100℃至200℃的温度2小时至24小时;以及自基底表面干净地移除导电胶带制品。
本发明还公开了层压制品。在一些实施方案中,所述层压制品包括:三维基底,该三维基底具有限定体积的至少第一主表面、第二主表面和第三主表面,该三维基底至少部分地包含基底材料;以及如上所述的导电胶带,其中压敏粘合剂层的第一主表面与基底的第一主表面和任选地第二主表面的至少一部分接触以包封基底的体积的一部分。
附图说明
参照以下结合附图对本公开的各种实施方案的详细说明,可更全面地理解本申请。
图1示出了本公开导电胶带制品的实施方案的剖视图。
图2示出了将被遮蔽以形成本公开层压体制品的制品的剖视图。
图3示出了本公开的层压体制品的剖视图。
图4示出了本公开的另一层压体制品的剖视图。
在所示实施方案的以下描述中,参考了附图并通过举例说明的方式在这些附图中示出了其中可实践本公开的各种实施方案。应当理解,在不脱离本公开的范围的情况下,可利用实施方案并且可进行结构上的改变。图未必按照比例绘制。图中使用的相似数字指代相似的部件。然而,应当理解,在给定图中使用数字指代部件不旨在限制另一图中用相同数字标记的部件。
具体实施方式
粘合剂已用于多种标记、固定、保护、密封和掩蔽用途。粘合剂经常作为胶带提供,所述胶带通常包括背衬或基底以及粘合剂。用于制造制品以在加工期间保护制品的部件或将其暂时保持在适当位置的粘合胶带有时被称为加工胶带。加工胶带不保留在最终制品中,而是在一个或多个加工步骤之后被移除。在一些情况下,加工带经受极端条件诸如高温、高压、暴露于化学品诸如溶剂、研磨剂、蚀刻材料等,并且仍然预期它们在加工步骤期间保持粘附而不流动、滴落或滑动并且也可在加工步骤完成后移除。加工胶带的示例包括遮蔽胶带,其中将遮蔽胶带施加到表面以覆盖它并保护它免于某一工艺(诸如被涂漆),施加漆料,并且将遮蔽胶带移除以获得具有涂漆和未涂漆的相邻区域的表面。
可能需要遮蔽的工艺之一为物理气相沉积(PVD)。PVD涂覆涉及多种薄膜沉积技术,其中将固体材料在真空环境中气化并作为纯材料或合金组合物涂料沉积在基底上。
由于该方法将涂覆材料作为单个原子转移或者在分子水平上转移,故其可提供极纯且高性能的涂层,这对于许多应用而言可优于所使用的其他方法。在每个微芯片、以及半导体器件、耐用保护膜、光学透镜、太阳能板和许多医疗器件的心脏处,PVD涂层为最终产品提供关键性能属性。它用于广泛多种行业,如从眼镜到自清洁有色窗的光学应用、用于太阳能的光伏应用、器件应用(如计算机芯片、显示器和通信)、以及从耐用硬保护性膜到亮金、铂或铬电镀的功能性或装饰性修整。
两种最常见的物理气相沉积涂覆方法为溅镀和热蒸镀。溅镀涉及用高能电荷轰击被称为目标的涂覆材料,从而致使其“溅镀”下沉积在基底如硅晶圆或太阳能板上的原子或分子。热蒸镀涉及将涂覆材料在高真空环境中升高至沸点,从而致使蒸气流在真空室中上升,然后冷凝在基底上。
由于PVD工艺的高能条件,遮蔽经常通过将遮蔽工具物理地附接到表面或者通过由涂布和固化方法在基底表面上形成遮蔽来进行。使用金属工具遮蔽设计,因为它们在PVD加工中更持久,并且还需要地接以确保它们不会影响PVD加工。这些方法中的每一个均具有缺陷。物理附接可能是笨重且缓慢的遮蔽表面的方法,并且涂覆和固化方法需要移除遮蔽,这可能是困难且耗时的。由于制品的制造商期望具有更少步骤的更快方法,故这些遮蔽方法变得越来越不理想。因此,需要一种更快速且更容易的遮蔽基底表面的方法以用于高能工艺诸如PVD。
在本公开中,描述了导电遮蔽胶带,其具有以下期望特性组合:粘附到基底表面,甚至在PVD工艺所需的苛刻条件期间保持粘附,在加工期间提供将胶带地接到基底以最小化胶带在PVD加工中的负面影响,并且还有在PVD工艺完成时可干净地移除。可干净地移除是指在移除时基本上没有来自胶带的残余物留在基底表面上。这是一个重要的特征,因为如果留下残余物,则需要清洁步骤来将其移除。来自胶带的残余物可由多种来源造成。残余物的来源包括:PVD工艺期间的粘合剂流;PVD工艺期间的粘附力建立,这使得胶带不易被移除;或者粘合剂聚合物降解,这导致降解产物在胶带移除时留在基底表面上。
因此,本公开的导电遮蔽胶带具有以下特性:强烈粘附到基底表面,胶带的粘合剂层在加工期间不流动,并且还有粘附力不会建立到胶带不能自基底表面干净地移除的这种程度。另外,胶带能够遮蔽具有三维表面的基底。在本公开中,三维表面是指不完全平坦但包含从基底表面突出的元素的表面。胶带能够包封这些三维表面,使得基底表面的三维特征结构被胶带覆盖和保护。该胶带还被设计成提供尖细清洁的遮蔽线,使得在移除时,完成的PVD加工在基底表面上留下达到所需规格界限的尖细清洁无缺陷的边缘。可以在各种放大级别下检查PVD边缘,以确保符合所需外观要求。基于应用需要,可在1x、2x、5x、10x、100x放大下检查所得遮蔽边缘。
导电遮蔽胶带包括导电背衬和压敏粘合剂层,其中压敏粘合剂层包含(甲基)丙烯酸酯类基质、交联剂、导电填料和抗氧化剂。导电遮蔽胶带能够粘附到基底表面,经由导电压敏粘合剂层将胶带的导电背衬地接到基底,以及在暴露于碱性清洁溶液、PVD工艺的高温条件或它们的组合之后可干净地移除。
本发明还公开了包括基底的层压制品,该基底具有设置在基底表面的至少一部分上的导电遮蔽胶带。基底表面可具有从表面突出的三维特征结构,其中导电遮蔽胶带包封表面和三维特征结构。
本发明还公开了制备制品的方法,该方法包括将导电遮蔽胶带施加到表面,使表面暴露于PVD工艺条件,以及将遮蔽胶带干净地移除。
除非另外指明,否则说明书和权利要求书中所使用的表达结构尺寸、量和物理性质的所有数字在所有情况下均应理解成由术语“约”修饰。因此,除非有相反的说明,否则在上述说明书和所附权利要求书中列出的数值参数均为近似值,这些近似值可根据本领域的技术人员利用本文所公开的教导内容来寻求获得的期望特性而变化。用端值来表述的数值范围包括该范围内所包含的所有数字(如1至5包括1、1.5、2、2.75、3、3.80、4和5)及该范围内的任何范围。
除非内容另外明确指明,否则如本说明书和所附权利要求书中所使用的,单数形式“一个”、“一种”和“所述”涵盖了具有多个指代物的实施方案。例如,对“一层”的引用涵盖了具有一个层、两个层或更多个层的实施方案。除非上下文另外明确指明,否则如本说明和所附权利要求书中所使用的,术语“或”一般以包括“和/或”的意义使用。
如本文所用,术语“粘合剂”是指可用于将两个粘附体粘附在一起的聚合物组合物。粘合剂的示例为压敏粘合剂。
本领域的普通技术人员熟知压敏粘合剂组合物具有包括如下在内的性质:(1)有力且持久的粘着性,(2)用手指按压就能进行粘附,(3)足够的固定到粘附体上的能力,和(4)足够的内聚强度以从粘附体上干净地移除。经发现良好地用作压敏粘合剂的材料为经设计和配制而表现出所需粘弹特性,从而使得粘性、剥离粘附力和剪切保持力达到期望平衡的聚合物。获得特性的适当平衡不是简单的方法。
术语“(甲基)丙烯酸酯”是指醇的单体丙烯酸酯或甲基丙烯酸酯。丙烯酸酯和甲基丙烯酸酯单体或低聚物在本文中通称为“(甲基)丙烯酸酯”。当用于描述聚合物时,术语“(甲基)丙烯酸酯类”是指由(甲基)丙烯酸酯单体或包含(甲基)丙烯酸酯官能团的反应性材料(诸如(甲基)丙烯酸酯低聚物)制备的聚合物。这些聚合物可只包含(甲基)丙烯酸酯单体或者它们包含与(甲基)丙烯酸酯共同反应的单体。
如本文所用,术语“导电性”意指电荷在材料内和/或穿过材料移动的能力的量度。
如本文所用,术语“聚合物”是指为均聚物或共聚物的聚合物材料。如本文所用,术语“均聚物”是指为一种单体的反应产物的聚合物材料。如本文所用,术语“共聚物”是指为至少两种不同单体的反应产物的聚合物材料。
术语“烷基”是指为烷烃的基团的一价基团,该烷烃为饱和烃。烷基可为直链的、支链的、环状的或它们的组合,并且通常具有1至20个碳原子。在一些实施方案中,烷基基团含有1至18个、1至12个、1至10个、1至8个、1至6个或1至4个碳原子。烷基基团的示例包括但不限于甲基、乙基、正丙基、异丙基、正丁基、异丁基、叔丁基、正戊基、正已基、环己基、正庚基、正辛基和乙基己基。
术语“室温”和“环境温度”可互换使用并且是指20℃至25℃的温度。
术语“重量%”、“重量百分比”、“质量%”和“质量百分比”可互换使用,并且当涉及可固化组合物的组分时是指该组分的重量相对于整个可固化组合物的100%重量的百分比。
术语“Tg”和“玻璃化转变温度”可互换使用并且是指聚合物组合物的玻璃化转变温度。除非另外指明,否则玻璃化转变温度(如果测量的话)通过DSC(差示扫描量热法)使用很好理解的技术(通常以10℃/分钟的加热时间)测量。更典型地,使用熟知且理解的Fox方程计算Tg,其中单体Tg值由单体供应商提供,如聚合物领域的技术人员很好理解的。
本文公开了导电胶带,尤其是导电遮蔽胶带,其包括:具有第一主表面和第二主表面的导电背衬;以及具有第一主表面和第二主表面的导电压敏粘合剂层,其中压敏粘合剂层的第二主表面与导电背衬的第一主表面接触。导电胶带能够被层压到基底表面并且在经受严苛加工条件之后自该基底表面干净地移除。在一些实施方案中,严苛加工条件包括以下条件中的至少一个,所述条件包括:在50℃至90℃的温度下暴露于碱性清洁溶液至少30分钟;以及经受等离子体气相沉积条件,这包括暴露于最高200℃的温度24小时以上。
广泛的导电背衬适用于本公开的导电胶带。导电背衬的选择可取决于许多因素,诸如导电胶带的所需用途。合适的导电背衬的示例包括箔诸如铜箔和铝箔、以及金属化聚合物膜。金属化聚合物膜的示例包括聚合物膜,诸如具有金属涂层的聚酰亚胺膜,该金属涂层可包括单个金属层或多个金属层。一个或多个金属层可以是金属原子或金属合金,并且可以通过例如溅镀、电镀或其他粗粉蒸镀和沉积技术而涂覆在聚合物膜上。
导电压敏粘合剂包含丙烯酸酯类共聚物基质、导电填料和至少一种抗氧化剂。该基质包括可聚合混合物的反应产物,该可聚合混合物包含至少一种第一(甲基)丙烯酸酯单体以及至少一种第二(甲基)丙烯酸酯单体,所述至少一种第一(甲基)丙烯酸酯单体包括均聚物Tg小于-50℃的(甲基)丙烯酸烷基酯,所述至少一种第二(甲基)丙烯酸酯单体包括均聚物Tg小于-10℃的羟基官能(甲基)丙烯酸烷基酯;以及交联剂。
通常,该基质通过(甲基)丙烯酸酯单体的自由基聚合以及通过使用羟基反应性交联剂进行交联而形成。多种(甲基)丙烯酸酯单体和羟基反应性交联剂是合适的,如下所述。
宽泛范围的第一(甲基)丙烯酸酯单体是合适的。合适的第一单体的示例为(甲基)丙烯酸烷基酯和烷氧基取代的(甲基)丙烯酸烷基酯。合适的第一单体的示例包括丙烯酸丁酯、丙烯酸-2-乙基己酯、丙烯酸异辛酯、甲基丙烯酸硬脂酯、丙烯酸-2-甲氧基乙酯、丙烯酸乙氧基乙氧基乙酯以及它们的组合。
广泛的羟基官能第二(甲基)丙烯酸酯单体是合适的。合适的单体的示例包括丙烯酸-2-羟丁酯和丙烯酸-2-羟乙酯。
在一些实施方案中,基于100重量%的可自由基聚合组分计,可聚合混合物的可自由基聚合组分包含85重量%至95重量%的第一单体以及5重量%至15重量%的第二单体。
该反应混合物还包含交联剂。如上所述,交联剂通常包括羟基反应性交联剂。此类交联剂的示例包括多官能的氮丙啶、异氰酸酯以及环氧化合物。氮丙啶型交联剂的示例包括例如1,4-双(乙撑亚胺基羰基氨基)苯、4,4′-双(乙撑亚胺基羰基氨基)二苯甲烷、1,8-双(乙撑亚胺基羰基氨基)辛烷和1,1′-(1,3-亚苯基二羰基)-双-(2-甲基氮丙啶)。常常被称为“双酰胺”的氮丙啶交联剂1,1′-(1,3-亚苯基二羰基)-双-(2-甲基氮丙啶)(CASNo.7652-64-4)是尤其可用的。常见的多官能异氰酸酯交联剂包括例如三羟甲基丙烷甲苯二异氰酸酯、甲苯二异氰酸酯以及六亚甲基二异氰酸酯。在一些实施方案中,交联剂构成压敏粘合剂层的总固体含量的0.04重量%至0.90重量%。
导电压敏粘合剂层还包含至少一种导电填料。导电填料的水平可广泛变化,通常压敏粘合剂层构成压敏粘合剂层的总固体含量的5重量%至19重量%。广泛的导电填料是合适的,并且基于用导电遮蔽胶带遮蔽的最终产品,可用宽广范围重量百分比的填料。导电填料典型地在0.5至50重量%的范围内,更典型地1至30%%,或甚至5重量%至19重量%。合适的导电填料的示例包括镍粉、银粉和涂有镍的石墨颗粒,诸如提交于2019年1月3日的美国序列号16/239122中所描述的那些。
导电压敏粘合剂层还包含至少一种抗氧化剂。宽泛范围的抗氧化剂是合适的。可用的抗氧化剂包括但不限于四[亚甲基3-(3′,5′-二叔丁基-4’-羟苯基)丙酸酯]甲烷(可以IRGANOX 1010获得),三(2,4-二叔丁基苯基)亚磷酸酯(可以IRGAFOS 168获得),二烷基硫代丙酸酯(可以IRGAFOS P800从BASF获得),以及受阻胺(可以TINUVIN 622获得)。
导电胶带还可包括与导电压敏粘合剂层的第一主表面接触的隔离衬件。存在隔离衬件以保护压敏粘合剂层,直到胶带被使用。示例性隔离衬件包括由纸材(例如,牛皮纸)或聚合物材料(例如,聚烯烃诸如聚乙烯或聚丙烯、乙烯-乙酸乙烯酯、聚氨酯、聚酯诸如聚对苯二甲酸乙二酯等以及它们的组合)制备的那些。至少一些隔离衬件涂覆有隔离剂层,诸如硅酮、含氟硅酮的材料、或含碳氟化合物的材料。
导电胶带具有以下期望特性:强烈粘附到将遮蔽的表面,以及在进行一个或多个加工步骤之后可移除。表征粘合剂特性的一种方法借助在使粘附胶带暴露于加工步骤的条件之前和之后测量对标准基底诸如不锈钢基底的180°剥离粘附力。应当理解,对不锈钢基底的180°剥离粘附力是表征胶带特性的方法,并且它并不意味着该胶带仅适用于不锈钢。这样,通过使用标准化测试程序,该方法能够表征胶带的特性。在一些实施方案中,对不锈钢基底的初始180°剥离粘附力在0.1牛顿/毫米至0.3牛顿/毫米的范围内。在这些实施方案的一些中,对不锈钢基底的老化180°剥离粘附力在0.3牛顿/毫米至0.5牛顿/毫米的范围内,其中老化包括在50℃至90℃的温度下暴露于碱性清洁溶液至少30分钟;以及暴露于最高200℃的温度24小时以上。
本文还公开了层压制品。层压制品包括:三维基底,该三维基底具有限定体积的至少第一主表面、第二主表面和第三主表面,该三维基底至少部分地包含基底材料;以及导电胶带。导电胶带已在上文中有所描述,并且包括具有第一主表面和第二主表面的导电背衬,以及具有第一主表面和第二主表面的导电压敏粘合剂层。压敏粘合剂层的第二主表面与导电背衬的第一主表面接触。压敏粘合剂包含:丙烯酸酯类共聚物基质,该基质包括反应混合物的反应产物,该反应混合物包含:至少一种第一(甲基)丙烯酸酯单体,其包括均聚物Tg小于-50℃的(甲基)丙烯酸烷基酯;以及至少一种第二(甲基)丙烯酸酯单体,其包括均聚物Tg小于-10℃的羟基官能(甲基)丙烯酸烷基酯;交联剂;导电填料;以及至少一种抗氧化剂。压敏粘合剂层的第一主表面与基底的第一主表面和任选地第二主表面的至少一部分接触以包封所述基底的体积的一部分。
在一些实施方案中,第一主表面包括弯曲表面。在一些实施方案中,导电胶带包封三维基底的整个三维体积的至少5%。
在一些实施方案中,基底还包括至少一个附加特征结构,其中附加特征结构为具有至少第四主表面和第五主表面的三维特征结构。
还公开了制备制品的方法。在一些实施方案中,所述方法包括:提供基底,该基底具有将进行等离子体气相沉积的表面;提供如上所述具有第一主表面和第二主表面的导电胶带制品;使导电胶带制品的第一主表面接触基底表面的一部分以提供遮蔽表面;用碱性溶液清洁遮蔽表面;使遮蔽表面暴露于等离子体气相沉积;以及自基底表面干净地移除导电胶带制品。
在一些实施方案中,用碱性溶液清洁遮蔽表面包括在50°至100°的温度下施用pH为13至14的碱性清洁溶液30分钟至60分钟。
在一些实施方案中,使遮蔽表面暴露于等离子体气相沉积包括使表面暴露于100℃至200℃的温度2小时至24小时。
可参考附图来进一步理解当前公开。图1示出了导电胶带100的剖视图。导电胶带100包括导电粘合剂层110、导电背衬120和隔离衬件130。
图2示出了将被遮蔽的三维制品200的透视图。制品200包括第一主表面250、第二主表面260、第三主表面270、第四主表面280和第五主表面290。第四主表面280和第五主表面290形成次级三维结构。
图3示出了遮蔽的三维制品的透视图。制品300包括第一主表面350(未示出,其被具有暴露导电背衬320的导电胶带遮蔽)、第二主表面360(其可任选地被导电胶带的重叠部分遮蔽)、第三主表面370、第四主表面380和第五主表面390。第四主表面380和第五主表面390形成次级三维结构。
图4示出了遮蔽的三维制品的透视图。制品400包括第一主表面450(未示出,其被具有暴露导电背衬420的导电胶带遮蔽)、第二主表面460(未示出,其也被具有暴露导电背衬420的导电胶带遮蔽)、第三主表面470、第四主表面480和第五主表面490。第四主表面480和第五主表面490形成次级三维结构。
实施例
本公开的目的和优点通过以下比较性和例示性实施例进一步说明。除非另外指明,否则实施例和说明书其它部分中的所有份数、百分比、比例等均按重量计,并且实施例中使用的所有试剂均获自或可得自一般化学品供应商,诸如美国密苏里州圣路易斯的西格玛奥德里奇公司(Sigma-Aldrich Corp.,Saint Louis,MO,US),或者可以通过常规的方法合成。
本文使用以下缩写:min=分钟,hr=小时,kg=千克,μm=微米(10-6m),mm=毫米,℃=摄氏度,N=牛顿=kg-m/sec2。
样本制备过程
表1:材料
丙烯酸酯类无规共聚物溶液的制备
将表2中所示量的100重量份的单体加入玻璃瓶中,然后加入适量的乙酸乙酯溶剂以获得固体材料的目标重量百分比。然后加入适量的偶氮二异丁腈作为引发剂和异丙醇(IPA)作为链转移剂。将混合物用氮气吹扫至少2分钟以移除氧气并紧密密封。将瓶在60℃至70℃下置于LAUNDER-OMETER机(可得自中国南山的锡莱亚太拉斯公司(SDL Atlas,Nanshan,China))中24小时以用于混合物的聚合,以获得丙烯酸系无规共聚物溶液。
表2:丙烯酸酯类共聚物溶液的组成
胶带的制备:
将表3和4中所示量的组分混合以制备粘合剂溶液。表3和4中的所有粘合剂溶液具有25重量%的固体含量。然后将粘合剂溶液涂覆到50μm厚PET衬件上。测量厚度之后将来自表3的样本在70℃下干燥10分钟。以2m/min的线速度使表4的胶带分别于温度为40℃、80℃、100℃、120℃的一系列烘箱中干燥。然后用12μm厚的Cu箔覆盖粘合剂。将所有样本在室温下保持一周以获得合适的交联程度。
表3:比较性和示例性导电胶带的组成*
*所有量均以重量百分比提供
表4:示例性导电胶带的组成*
*所有量均以重量百分比提供
测试方法
剥离测试样本制备:使用大力手压方式,用被异丙醇润湿的薄纸将不锈钢板擦拭三次。将经清洁的板干燥10分钟。将25.4mm×200mm的粘合胶带样本置于不锈钢板上,并且使1kg的橡胶辊在胶带顶部上来回滚动一次,以将胶带样本粘附到不锈钢板的表面。
老化条件:将胶带样本切成1英寸(25.4mm)宽的条,然后将该条粘附到如上所述的不锈钢板的表面。在室温下将测试板放入烘箱中。然后将烘箱升热至150℃,并且将样本在150℃下保持8小时。
清洁条件:将1英寸(25.4mm)宽的胶带条粘附到如上所述的不锈钢板的表面。制备pH为13至14的NaOH水溶液,并且将其加热至85℃至90℃。将测试板浸入加热的碱性溶液中30分钟,然后用水冲洗。
180°剥离力测试(23℃,60%相对湿度):在室温下进行剥离测试之前,将所有样本在23℃的温度和60%的相对湿度下保持20分钟。室温剥离力测试的程序如ASTM国际标准D3330-04(2018),“压敏胶带剥离粘附力的标准测试方法(Standard Test Method forPeel Adhesion of Pressure-Sensitive Tape)”中所描述。使用INSTRON拉伸测试仪(可得自美国马塞诸塞州诺伍德的英斯特龙公司(Instron,Norwood,MA,US))以304.8mm/min的剥离速度来执行剥离强度测试。对于这些实施例的目的,当剥离强度小于0.6N/mm时,胶带被认为是“可容易移除的”。
可移除性:通过检查测试后不锈钢上残余物的量来评估粘合剂的可移除性。可移除性等级标度在0(在整个粘附区域的表面上留下大量粘合剂)至5(在不锈钢表面上未保留可见残余物)的范围内。对于4的可移除性等级,不锈表面上的残余粘合剂为总粘附区域的大约0%至5%。对于3、2和1的可移除性等级,不锈表面上的残余粘合剂分别为粘附区域的5%至10%、10%至15%和>15%。
导电性(通过粘合剂的XY轴电阻):将导电胶带条(10mm×50mm)以粘合剂侧在下置于在特殊PCB电路板上的电极之间。电极为镀金的铜表面(ENIG:无电镀镍浸金)。PCB电路板的尺寸为50(X轴)mm×75(Y轴)mm,并且厚度为1.6mm。电路板上的电极具有10mm的宽度。电极之间的距离为30mm。在初始手动层压以提供胶带和电极之间10mm×10mm的接触区域之后,将2kg橡胶辊横跨胶带施加一次。这些施加方法模拟可用于将胶带施加到表面的典型制造方法。在20分钟的停留时间之后,用微欧姆计测量电极之间的直流电阻。在5~30秒后将电阻结果记录为初始电阻。
对于所示导电性测试方法和基底,接触电阻的优选范围为<2000mΩ,优选地<700mΩ,并且最优选的电阻为<300mΩ且甚至<50mΩ。导电性水平和优选范围可基于表面类型以及若所提测试方法的表面改变为不同的金属而变化。改变(诸如将镀金表面(ENIG)更换为无附加电镀的316不锈钢表面)将导致导电性值自当前测试方法基底的值以某一比率偏移,并且将涉及基于被遮蔽的用于具体应用的确切基底而使用具有不同测试基底(例如,316不锈钢、304不锈钢、铝、钛等相对于当前所用ENIG基底)的更新测试方法。
结果
表5总结了在85C至90C的NaOH溶液中清洁之前和之后以及在150℃下老化8小时之后的样本上的剥离测试结果。粘附力在高温清洁后增加,但仍保持在可容易移除的范围内。此外,对于实施例7-10中的任一个,表面上均未保留粘合剂残余物。
表5:在于高温碱性溶液中清洁之后不锈钢上的180°剥离力
表6总结了在150℃下老化8小时之后样本的剥离强度和可移除性等级。在高温老化之后,比较例CE1-CE4的剥离力增加到1.3N/mm至1.4N/mm,并且在剥离测试之后,在不锈钢基底上保留显著量的残余粘合剂。实施例1-10包括不包含丙烯酸单体的共聚物A和B,并且使用各种类型和水平的交联剂而制备。将剥离强度减小至0.3N/mm与0.4N/mm之间,并且实施例1-10示出了具有低残余粘合剂的可接受可移除性。比较例CE5和CE6分别包含20%和25%的导电镍粉,并且展现残余粘合剂。实施例9和10分别包含13%和15%的导电镍粉,并且展现可接受的剥离力和良好的可移除性。
表6:高温老化之后的180°剥离力和可移除性等级
Ex. | 剥离力(N/dm) | 可移除性等级 |
CE1 | 1.38 | 0 |
CE2 | 1.33 | 1 |
CE3 | 1.43 | 0 |
CE4 | 1.38 | 0 |
CE5 | 0.30 | 1 |
CE6 | 0.32 | 0 |
1 | 0.52 | 2 |
2 | 0.52 | 2 |
3 | 0.45 | 3 |
4 | 0.40 | 4 |
5 | 0.39 | 5 |
6 | 0.34 | 5 |
7 | 0.44 | 5 |
8 | 0.37 | 5 |
9 | 0.32 | 5 |
10 | 0.30 | 5 |
使用上文所述测试方法测试若干样本的通过粘合剂层的电阻。结果呈现于表7中。
表7:通过粘合剂的XY轴电阻的导电性
Ex. | 电阻(mΩ) |
5 | <200 |
6 | <200 |
7 | <200 |
8 | <200 |
9 | <200 |
10 | <200 |
在不脱离本公开的范围和实质的情况下,对本公开进行的各种变型和更改对于本领域的技术人员而言将变得显而易见。应当理解,本公开并不旨在受本文中示出的例示性实施方案和实施例的不当限制,并且此类实施例和实施方案仅以举例的方式呈现,本公开的范围旨在仅受本文中如下示出的权利要求书的限制。
Claims (21)
1.一种导电胶带,所述导电胶带包括:
具有第一主表面和第二主表面的导电背衬;以及
具有第一主表面和第二主表面的导电压敏粘合剂层,其中所述压敏粘合剂层的第二主表面与所述导电背衬的第一主表面接触,其中所述压敏粘合剂包含:
丙烯酸酯类共聚物基质,所述基质包括可聚合混合物的反应产物,所述可聚合混合物包含:
至少一种第一(甲基)丙烯酸酯单体,其包括均聚物Tg小于-50℃的(甲基)丙烯酸烷基酯;以及
至少一种第二(甲基)丙烯酸酯单体,其包括均聚物Tg小于-10℃的羟基官能(甲基)丙烯酸烷基酯;
交联剂;
导电填料;以及
至少一种抗氧化剂,
其中所述导电胶带能够被层压到基底表面并且在经受以下条件中的至少一个之后自所述基底表面干净地移除,所述条件包括:
在50℃至90℃的温度下暴露于碱性清洁溶液至少30分钟;以及
经受等离子体气相沉积条件,这包括暴露于最高200℃的温度24小时以上。
2.根据权利要求1所述的导电胶带,其中所述导电背衬包括铜箔、铝箔、或金属化聚合物膜。
3.根据权利要求1所述的导电胶带,其中所述可聚合混合物包含85重量%至95重量%的第一单体以及5重量%至15重量%的第二单体。
4.根据权利要求1所述的导电胶带,其中所述第一单体包括丙烯酸丁酯、丙烯酸-2-乙基己酯、丙烯酸异辛酯、甲基丙烯酸硬脂酯、丙烯酸-2-甲氧基乙酯、丙烯酸乙氧基乙氧基乙酯以及它们的组合。
5.根据权利要求1所述的导电胶带,其中所述第二单体包括丙烯酸-2-羟丁酯或丙烯酸-2-羟乙酯。
6.根据权利要求1所述的导电胶带,其中所述交联剂包括羟基反应性交联剂。
7.根据权利要求1所述的导电胶带,其中所述交联剂构成所述压敏粘合剂层的总固体含量的0.04重量%至0.90重量%。
8.根据权利要求1所述的导电胶带,其中所述导电填料构成所述压敏粘合剂层的总固体含量的5重量%至19重量%,并且包括镍粉、银粉和涂有镍的石墨颗粒中的至少一种。
9.根据权利要求1所述的导电胶带,还包括与所述导电压敏粘合剂层的第一主表面接触的隔离衬件。
10.根据权利要求1所述的导电胶带,其中对不锈钢基底的初始180°剥离粘附力在0.1牛顿/毫米至0.3牛顿/毫米的范围内。
11.根据权利要求1所述的导电胶带,其中对不锈钢基底的老化180°剥离粘附力在0.3牛顿/毫米至0.5牛顿/毫米的范围内,其中老化包括在50℃至90℃的温度下暴露于碱性清洁溶液至少30分钟;以及暴露于最高200℃的温度24小时以上。
12.一种制备制品的方法,所述方法包括:
提供基底,所述基底具有将进行等离子体气相沉积的表面;
提供导电胶带制品,其中所述导电胶带制品包括:
具有第一主表面和第二主表面的导电背衬;以及
具有第一主表面和第二主表面的导电压敏粘合剂层,其中所述压敏粘合剂层的第二主表面与所述导电背衬的第一主表面接触,其中所述压敏粘合剂包含:
丙烯酸酯类共聚物基质,所述基质包括反应混合物的反应产物,所述反应混合物包含:
至少一种第一(甲基)丙烯酸酯单体,其包括均聚物Tg小于-50℃的(甲基)丙烯酸烷基酯;以及
至少一种第二(甲基)丙烯酸酯单体,其包括均聚物Tg小于-10℃的羟基官能(甲基)丙烯酸烷基酯;
交联剂;
导电填料;以及
至少一种抗氧化剂;
使所述导电胶带制品的第一主表面接触基底表面的一部分以提供遮蔽表面;
用碱性溶液清洁所述遮蔽表面,这包括在50°至100°的温度下施用pH为13至14的碱性清洁溶液30分钟至60分钟;
使所述遮蔽表面暴露于等离子体气相沉积,这包括使所述表面暴露于100℃至200℃的温度2小时至24小时;以及
自所述基底表面干净地移除所述导电胶带制品。
13.根据权利要求12所述的方法,其中所述导电背衬包括铜箔、铝箔、或金属化聚合物膜。
14.根据权利要求12所述的方法,其中所述可聚合混合物包含85重量%至95重量%的第一单体以及5重量%至15重量%的第二单体。
15.根据权利要求12所述的方法,其中所述第一单体包括丙烯酸丁酯、丙烯酸-2-乙基己酯、丙烯酸异辛酯、甲基丙烯酸硬脂酯、丙烯酸-2-甲氧基乙酯、丙烯酸乙氧基乙氧基乙酯以及它们的组合,并且所述第二单体包括丙烯酸-2-羟丁酯或丙烯酸-2-羟乙酯。
16.根据权利要求12所述的方法,其中所述交联剂包括羟基反应性交联剂。
17.根据权利要求12所述的方法,其中所述导电填料构成所述压敏粘合剂层的总固体含量的5重量%至19重量%,并且包括镍粉、银粉和涂有镍的石墨颗粒。
18.一种层压制品,所述层压制品包括:
三维基底,所述三维基底具有限定体积的至少第一主表面、第二主表面和第三主表面,所述三维基底至少部分地包含基底材料;以及
导电胶带,所述导电胶带包括:
具有第一主表面和第二主表面的导电背衬;以及
具有第一主表面和第二主表面的导电压敏粘合剂层,其中所述压敏粘合剂层的第二主表面与所述导电背衬的第一主表面接触,其中所述压敏粘合剂包含:
丙烯酸酯类共聚物基质,所述基质包括反应混合物的反应产物,所述反应混合物包含:
至少一种第一(甲基)丙烯酸酯单体,其包括均聚物Tg小于-50℃的(甲基)丙烯酸烷基酯;以及
至少一种第二(甲基)丙烯酸酯单体,其包括均聚物Tg小于-10℃的羟基官能(甲基)丙烯酸烷基酯;
交联剂;
导电填料;以及
至少一种抗氧化剂;其中所述压敏粘合剂层的第一主表面与所述基底的第一主表面和任选地第二主表面的至少一部分接触以包封所述基底的体积的一部分。
19.根据权利要求18所述的层压制品,其中所述第一主表面包括弯曲表面。
20.根据权利要求18所述的层压制品,其中所述导电胶带包封所述基底的整个三维体积的至少5%。
21.根据权利要求18所述的层压制品,其中所述基底还包括至少一个附加特征结构,其中所述至少一个附加特征结构为具有至少第四主表面和第五主表面的三维特征结构。
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PCT/IB2020/061981 WO2021124115A1 (en) | 2019-12-20 | 2020-12-15 | Electrically conductive masking tape |
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CN116145117A (zh) * | 2023-02-09 | 2023-05-23 | 浙江合特光电有限公司 | 一种缓解绕镀的镀膜工艺 |
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CN1829783A (zh) * | 2003-08-06 | 2006-09-06 | 3M创新有限公司 | 耐热遮蔽带 |
CN105542673A (zh) * | 2015-12-22 | 2016-05-04 | 宁波大榭开发区综研化学有限公司 | 一种具有强屏蔽性能的遮光导电胶黏剂和胶带及制备方法 |
JP6607330B1 (ja) * | 2019-03-27 | 2019-11-20 | 東洋インキScホールディングス株式会社 | 粘着剤および粘着シート |
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JP2014234444A (ja) * | 2013-05-31 | 2014-12-15 | 日東電工株式会社 | 導電性両面粘着テープ |
JP6605846B2 (ja) * | 2015-06-03 | 2019-11-13 | 日東電工株式会社 | マスキング用粘着テープ |
JP6420906B2 (ja) * | 2015-06-15 | 2018-11-07 | 株式会社寺岡製作所 | 粘着剤組成物及び粘着テープ |
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CN105542673A (zh) * | 2015-12-22 | 2016-05-04 | 宁波大榭开发区综研化学有限公司 | 一种具有强屏蔽性能的遮光导电胶黏剂和胶带及制备方法 |
JP6607330B1 (ja) * | 2019-03-27 | 2019-11-20 | 東洋インキScホールディングス株式会社 | 粘着剤および粘着シート |
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CN115368845A (zh) * | 2022-08-26 | 2022-11-22 | 3M中国有限公司 | 含有纳米粒子添加剂的导电压敏粘合剂 |
CN115368845B (zh) * | 2022-08-26 | 2023-11-14 | 3M中国有限公司 | 含有纳米粒子添加剂的导电压敏粘合剂 |
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