JP2005530024A5 - - Google Patents

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Publication number
JP2005530024A5
JP2005530024A5 JP2004515657A JP2004515657A JP2005530024A5 JP 2005530024 A5 JP2005530024 A5 JP 2005530024A5 JP 2004515657 A JP2004515657 A JP 2004515657A JP 2004515657 A JP2004515657 A JP 2004515657A JP 2005530024 A5 JP2005530024 A5 JP 2005530024A5
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JP
Japan
Prior art keywords
mass
curable monomer
precursor
ultraviolet curable
weight
Prior art date
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Application number
JP2004515657A
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English (en)
Japanese (ja)
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JP4624784B2 (ja
JP2005530024A (ja
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Publication date
Priority claimed from EP20020013604 external-priority patent/EP1375617A1/en
Application filed filed Critical
Publication of JP2005530024A publication Critical patent/JP2005530024A/ja
Publication of JP2005530024A5 publication Critical patent/JP2005530024A5/ja
Application granted granted Critical
Publication of JP4624784B2 publication Critical patent/JP4624784B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP2004515657A 2002-06-19 2003-05-01 放射線硬化性、無溶剤型および印刷可能な感圧接着剤前駆物質 Expired - Fee Related JP4624784B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP20020013604 EP1375617A1 (en) 2002-06-19 2002-06-19 Radiation-curable, solvent-free and printable precursor of a pressure-sensitive adhesive
PCT/US2003/013551 WO2004000961A1 (en) 2002-06-19 2003-05-01 Radiation-curable, solvent-free and printable precursor of a pressure-sensitive adhesive

Publications (3)

Publication Number Publication Date
JP2005530024A JP2005530024A (ja) 2005-10-06
JP2005530024A5 true JP2005530024A5 (enExample) 2006-06-15
JP4624784B2 JP4624784B2 (ja) 2011-02-02

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ID=29716793

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004515657A Expired - Fee Related JP4624784B2 (ja) 2002-06-19 2003-05-01 放射線硬化性、無溶剤型および印刷可能な感圧接着剤前駆物質

Country Status (8)

Country Link
US (1) US7268173B2 (enExample)
EP (2) EP1375617A1 (enExample)
JP (1) JP4624784B2 (enExample)
CN (1) CN1285689C (enExample)
AT (1) ATE334178T1 (enExample)
AU (1) AU2003232027A1 (enExample)
DE (1) DE60307113T3 (enExample)
WO (1) WO2004000961A1 (enExample)

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KR101351624B1 (ko) * 2010-12-31 2014-01-15 제일모직주식회사 광경화형 점착제 조성물 및 이를 이용한 모바일 폰의 모듈 조립 방법
JP5968426B2 (ja) * 2011-04-26 2016-08-10 スリーエム イノベイティブ プロパティズ カンパニー 混合光架橋系を含む感圧性接着剤
EP2527383A1 (en) 2011-05-27 2012-11-28 Henkel AG & Co. KGaA A process to manufacture thick layers of radiation cured adhesives
EP2548901A1 (en) * 2011-07-19 2013-01-23 Cytec Surface Specialties, S.A. Process for the preparation of radiation curable compositions
CN102321437B (zh) * 2011-07-25 2014-07-16 珠海保税区天然宝杰数码科技材料有限公司 一种uv固化装饰胶
CN102898958B (zh) * 2011-07-25 2016-11-02 汉高股份有限公司 一种粘合剂组合物
EP2551024B1 (en) 2011-07-29 2017-03-22 3M Innovative Properties Co. Multilayer film having at least one thin layer and continuous process for forming such a film
EP2551313A1 (en) 2011-07-29 2013-01-30 3M Innovative Properties Company Multilayer pressure-sensitive adhesive film
EP2557132B1 (en) 2011-08-10 2018-03-14 3M Innovative Properties Company Multilayer adhesive film, in particular for bonding optical sensors
EP2581423A1 (en) 2011-10-14 2013-04-17 3M Innovative Properties Company Primerless multilayer adhesive film for bonding glass substrates
JP6024748B2 (ja) 2012-04-27 2016-11-16 荒川化学工業株式会社 紫外線硬化型粘着剤組成物及び粘着層
EP2852487B8 (en) * 2012-05-22 2021-01-20 Henkel IP & Holding GmbH Process for binding substrates with a liquid optically clear photo-curable adhesive
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JP6312841B2 (ja) * 2014-09-26 2018-04-18 富士フイルム株式会社 活性エネルギー線硬化型粘着剤組成物、粘着シート
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JP6572417B2 (ja) * 2014-12-25 2019-09-11 三菱ケミカル株式会社 光硬化性接着剤組成物及び積層体
US10259632B2 (en) 2015-02-20 2019-04-16 Amcor Flexibles Burgdorf Gmbh Reclosable packaging
PL3259203T3 (pl) 2015-02-20 2020-05-18 Amcor Flexibles Burgdorf Gmbh Opakowanie do wielokrotnego zamykania
WO2016131740A1 (en) * 2015-02-20 2016-08-25 Amcor Flexibles Burgdorf Gmbh Reclosable packaging
TWI586780B (zh) 2015-03-23 2017-06-11 阿科瑪法國公司 壓敏性黏合劑
FR3036288B1 (fr) * 2015-05-21 2018-10-26 Bertrand Perrin Colles chirurgicales
WO2016203304A1 (ja) * 2015-06-15 2016-12-22 王子ホールディングス株式会社 粘着フィルム、積層体、及び加飾成形体
CN113103145B (zh) 2015-10-30 2023-04-11 应用材料公司 形成具有期望ζ电位的抛光制品的设备与方法
US10593574B2 (en) 2015-11-06 2020-03-17 Applied Materials, Inc. Techniques for combining CMP process tracking data with 3D printed CMP consumables
US10391605B2 (en) 2016-01-19 2019-08-27 Applied Materials, Inc. Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process
JP6898715B2 (ja) * 2016-08-01 2021-07-07 デクセリアルズ株式会社 光硬化性樹脂組成物、画像表示装置、及び画像表示装置の製造方法
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CN107030532A (zh) * 2017-04-06 2017-08-11 东莞市华茂电子集团有限公司 一种五金壳直线点胶喷砂工艺
WO2019016963A1 (ja) * 2017-07-21 2019-01-24 日本化薬株式会社 紫外線硬化型接着剤、それを用いた貼り合せ方法及び物品
US11471999B2 (en) 2017-07-26 2022-10-18 Applied Materials, Inc. Integrated abrasive polishing pads and manufacturing methods
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CN107603531A (zh) * 2017-08-30 2018-01-19 浙江欧丽数码喷绘材料有限公司 一种弱溶剂阻燃正喷灯片用阻燃胶水及其制备方法
US11591438B2 (en) * 2018-05-22 2023-02-28 3M Innovative Properties Company Process of processing a radiation-curable thiolen based composition with additive-manufacturing technology
CN108753242A (zh) * 2018-06-25 2018-11-06 江苏科琪高分子材料研究院有限公司 用于显示模组柔性线路板和芯片粘结的光固化粘合剂组合物
KR20210042171A (ko) 2018-09-04 2021-04-16 어플라이드 머티어리얼스, 인코포레이티드 진보한 폴리싱 패드들을 위한 제형들
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CN111548739B (zh) * 2019-02-11 2022-03-01 3M创新有限公司 紫外光固化胶粘剂
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CN110283539A (zh) * 2019-04-25 2019-09-27 中山布瑞特环保油墨有限公司 一种紫外光固化覆膜胶及其制备方法
US11878389B2 (en) 2021-02-10 2024-01-23 Applied Materials, Inc. Structures formed using an additive manufacturing process for regenerating surface texture in situ
PL4050045T3 (pl) * 2021-02-26 2024-03-11 Sika Technology Ag Klej akrylowy wrażliwy na nacisk i jego zastosowanie do wytwarzania samoprzylepnych urządzeń uszczelniających
TW202321401A (zh) * 2021-08-02 2023-06-01 日商三菱化學股份有限公司 黏著劑組成物、黏著劑及黏著片
CN114149780A (zh) * 2021-11-15 2022-03-08 珠海天威新材料股份有限公司 可喷印uv压敏胶及其喷印方法、制品
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