JP2007214166A5 - - Google Patents
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- Publication number
- JP2007214166A5 JP2007214166A5 JP2006029365A JP2006029365A JP2007214166A5 JP 2007214166 A5 JP2007214166 A5 JP 2007214166A5 JP 2006029365 A JP2006029365 A JP 2006029365A JP 2006029365 A JP2006029365 A JP 2006029365A JP 2007214166 A5 JP2007214166 A5 JP 2007214166A5
- Authority
- JP
- Japan
- Prior art keywords
- insulating layer
- ground electrode
- voltage
- electronic component
- composite electronic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000010410 layer Substances 0.000 claims description 113
- 239000000463 material Substances 0.000 claims description 55
- 230000001419 dependent effect Effects 0.000 claims description 49
- 239000004020 conductor Substances 0.000 claims description 48
- 239000002131 composite material Substances 0.000 claims description 31
- 229920005989 resin Polymers 0.000 claims description 21
- 239000011347 resin Substances 0.000 claims description 21
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 16
- 229910052751 metal Inorganic materials 0.000 claims description 13
- 239000002184 metal Substances 0.000 claims description 13
- 238000010304 firing Methods 0.000 claims description 11
- 239000003990 capacitor Substances 0.000 claims description 9
- 229910052759 nickel Inorganic materials 0.000 claims description 8
- 239000000843 powder Substances 0.000 claims description 8
- 238000004519 manufacturing process Methods 0.000 claims description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- 239000004593 Epoxy Substances 0.000 claims description 6
- 229910052782 aluminium Inorganic materials 0.000 claims description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 6
- 229910052802 copper Inorganic materials 0.000 claims description 6
- 239000010949 copper Substances 0.000 claims description 6
- 229910052710 silicon Inorganic materials 0.000 claims description 6
- 239000010703 silicon Substances 0.000 claims description 6
- 239000012790 adhesive layer Substances 0.000 claims description 4
- 238000000034 method Methods 0.000 claims description 4
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 4
- 239000005011 phenolic resin Substances 0.000 claims 1
- 230000006870 function Effects 0.000 description 24
- 230000000694 effects Effects 0.000 description 13
- 238000007747 plating Methods 0.000 description 11
- 238000000354 decomposition reaction Methods 0.000 description 5
- 230000005611 electricity Effects 0.000 description 5
- 230000003647 oxidation Effects 0.000 description 5
- 238000007254 oxidation reaction Methods 0.000 description 5
- 229910000859 α-Fe Inorganic materials 0.000 description 5
- 229910052709 silver Inorganic materials 0.000 description 4
- 239000004332 silver Substances 0.000 description 4
- 230000003068 static effect Effects 0.000 description 4
- 239000000696 magnetic material Substances 0.000 description 3
- 238000007639 printing Methods 0.000 description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000002241 glass-ceramic Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 230000009993 protective function Effects 0.000 description 2
- ZYUVGYBAPZYKSA-UHFFFAOYSA-N 5-(3-hydroxybutan-2-yl)-4-methylbenzene-1,3-diol Chemical compound CC(O)C(C)C1=CC(O)=CC(O)=C1C ZYUVGYBAPZYKSA-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- NHADDZMCASKINP-HTRCEHHLSA-N decarboxydihydrocitrinin Natural products C1=C(O)C(C)=C2[C@H](C)[C@@H](C)OCC2=C1O NHADDZMCASKINP-HTRCEHHLSA-N 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006029365A JP4725343B2 (ja) | 2006-02-07 | 2006-02-07 | 複合電子部品およびその製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006029365A JP4725343B2 (ja) | 2006-02-07 | 2006-02-07 | 複合電子部品およびその製造方法 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008286092A Division JP4985617B2 (ja) | 2008-11-07 | 2008-11-07 | 複合電子部品 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2007214166A JP2007214166A (ja) | 2007-08-23 |
| JP2007214166A5 true JP2007214166A5 (https=) | 2008-12-25 |
| JP4725343B2 JP4725343B2 (ja) | 2011-07-13 |
Family
ID=38492361
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006029365A Expired - Fee Related JP4725343B2 (ja) | 2006-02-07 | 2006-02-07 | 複合電子部品およびその製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4725343B2 (https=) |
Families Citing this family (25)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010015773A (ja) * | 2008-07-02 | 2010-01-21 | Murata Mfg Co Ltd | サージアブソーバ及びその製造方法 |
| JP2010028695A (ja) * | 2008-07-24 | 2010-02-04 | Murata Mfg Co Ltd | ノイズフィルタ部品及びコイル部品 |
| JP5232562B2 (ja) * | 2008-07-31 | 2013-07-10 | 東光株式会社 | 積層型電子部品 |
| JP4734428B2 (ja) * | 2008-09-30 | 2011-07-27 | Ｔｄｋ株式会社 | 複合電子部品及びその接続構造 |
| US8422190B2 (en) | 2008-09-30 | 2013-04-16 | Tdk Corporation | Composite electronic device, manufacturing method thereof, and connection structure of composite electronic device |
| JP5277918B2 (ja) * | 2008-12-10 | 2013-08-28 | 株式会社村田製作所 | サージアブソーバ及びその製造方法 |
| JP5339051B2 (ja) * | 2008-12-18 | 2013-11-13 | Ｔｄｋ株式会社 | 静電気対策素子及びその複合電子部品 |
| JP5196330B2 (ja) * | 2008-12-18 | 2013-05-15 | Ｔｄｋ株式会社 | 静電気対策素子及びその複合電子部品 |
| JP5544584B2 (ja) * | 2009-01-14 | 2014-07-09 | Ｔｄｋ株式会社 | 静電気対策素子及びその複合電子部品、並びに、複合基板の製造方法及び静電気対策素子の製造方法 |
| JP4835699B2 (ja) * | 2009-01-22 | 2011-12-14 | Ｔｄｋ株式会社 | 高速デジタル伝送回路 |
| JP5382091B2 (ja) * | 2009-07-02 | 2014-01-08 | Ｔｄｋ株式会社 | 複合電子部品 |
| JP4866952B2 (ja) * | 2009-07-02 | 2012-02-01 | Ｔｄｋ株式会社 | 複合電子部品 |
| JP4749482B2 (ja) | 2009-07-08 | 2011-08-17 | Ｔｄｋ株式会社 | 複合電子部品 |
| JP6005945B2 (ja) * | 2011-03-18 | 2016-10-12 | 日本碍子株式会社 | 複合電子部品 |
| JP5459291B2 (ja) * | 2011-10-28 | 2014-04-02 | Ｔｄｋ株式会社 | 複合電子部品 |
| JP5488567B2 (ja) * | 2011-10-28 | 2014-05-14 | Ｔｄｋ株式会社 | 複合電子部品 |
| JP5961813B2 (ja) * | 2011-10-31 | 2016-08-02 | パナソニックＩｐマネジメント株式会社 | コモンモードノイズフィルタ |
| KR20130117397A (ko) * | 2012-04-17 | 2013-10-28 | 주식회사 이노칩테크놀로지 | 회로 보호 소자 |
| KR20130117026A (ko) * | 2012-04-17 | 2013-10-25 | 주식회사 이노칩테크놀로지 | 회로 보호 소자 |
| JP6064860B2 (ja) * | 2013-10-09 | 2017-01-25 | 株式会社村田製作所 | 複合電子部品及び複合電子部品の製造方法 |
| KR20160024262A (ko) * | 2014-08-25 | 2016-03-04 | 삼성전기주식회사 | 공통 모드 필터 및 그 제조 방법 |
| JP6252425B2 (ja) * | 2014-10-03 | 2017-12-27 | 株式会社村田製作所 | 電子部品 |
| JP2016187005A (ja) * | 2015-03-27 | 2016-10-27 | Tdk株式会社 | 積層コモンモードフィルタ |
| JP6269574B2 (ja) * | 2015-05-21 | 2018-01-31 | 株式会社村田製作所 | 複合電子部品 |
| WO2018025695A1 (ja) | 2016-08-01 | 2018-02-08 | 株式会社村田製作所 | Ｅｓｄ保護機能付き実装型複合部品 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06124850A (ja) * | 1992-10-13 | 1994-05-06 | Taiyo Yuden Co Ltd | 積層複合電子部品 |
| US6191928B1 (en) * | 1994-05-27 | 2001-02-20 | Littelfuse, Inc. | Surface-mountable device for protection against electrostatic damage to electronic components |
| JPH10126193A (ja) * | 1996-10-14 | 1998-05-15 | Mitsubishi Materials Corp | Ｌｃフィルタ部品 |
| JP2000091868A (ja) * | 1998-09-09 | 2000-03-31 | Mitsubishi Materials Corp | バリスタ機能付ノイズフィルタ |
| JP2001060516A (ja) * | 1999-08-20 | 2001-03-06 | Murata Mfg Co Ltd | 積層型電子部品及びその製造方法 |
| JP2003123936A (ja) * | 2001-10-16 | 2003-04-25 | Matsushita Electric Ind Co Ltd | 電子部品およびその製造方法 |
| US6859351B2 (en) * | 2002-08-09 | 2005-02-22 | Hewlett-Packard Development Company, L.P. | Electrostatic discharge protection |
| CN101258565B (zh) * | 2005-09-07 | 2011-07-27 | 松下电器产业株式会社 | 复合电子元件 |
-
2006
- 2006-02-07 JP JP2006029365A patent/JP4725343B2/ja not_active Expired - Fee Related
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