JP2006352085A - 波長変換型半導体発光デバイス - Google Patents
波長変換型半導体発光デバイス Download PDFInfo
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- JP2006352085A JP2006352085A JP2006109168A JP2006109168A JP2006352085A JP 2006352085 A JP2006352085 A JP 2006352085A JP 2006109168 A JP2006109168 A JP 2006109168A JP 2006109168 A JP2006109168 A JP 2006109168A JP 2006352085 A JP2006352085 A JP 2006352085A
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- light emitting
- phosphor
- ceramic body
- light
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- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
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- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
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Abstract
【解決手段】発光領域から蛍光体中に光を効率的に取り出すことを目的として、蛍光体などの材料が、n型領域とp型領域の間に配置された発光領域を含む半導体構造体に、光学的に結合される。蛍光体は、半導体構造体の表面に直接接触した蛍光体粒、又は、半導体構造体又はその上に半導体構造体が成長させられる薄い核生成構造体に接合されたセラミック蛍光体とすることができる。蛍光体は高吸収性で高効率であることが好ましい。半導体構造体がそのような高効率、高吸収性の蛍光体中に光を放射すると、蛍光体は構造体から効率的に光を取り出し、従来技術に存在している光学的損失を低減する。
【選択図】図5
Description
10:半導体層
12:半導体層
14:活性領域
16:透明上層(成長基板)
18、20、60、61:コンタクト
22、24:接続
26、28:基板コンタクト
30:蛍光体層
32:光学的結合媒体
34:蛍光体粒(蛍光体層)
36:エピタキシャル層
38:ホスト基板
50:金属層
52:セラミック蛍光体層
54、62:反射鏡
56:接合材
58:核生成層
72:水素注入部
76:準備層
78:再成長p+材料
100:放熱スラグ
102:反射キャップ
103:熱伝導性補助キャップ
104:発光デバイス・ダイ
105:充填プラスチック材料
106:リードフレーム
108:カバー
130:半導体構造体
132:パッケージ素子
134:金属インターフェース
Claims (37)
- セラミック体蛍光体が第一ピーク波長の光を吸収し第二ピーク波長の光を放射するように形成された蛍光体を含むセラミック体を準備するステップと、
前記セラミック体を核生成構造体に接合するステップと、
前記核生成構造体上に、n型領域とp型領域との間に配置されて前記第一ピーク波長の光を放射するように形成された発光領域を有する半導体構造体を成長させるステップと、
を含み、
前記核生成構造体は、成長前における厚さが100ミクロンより小さいことを特徴とする方法。 - 前記接合ステップが、実質的に金属又は接着剤のない接合を形成するステップを含むことを特徴とする請求項1に記載の方法。
- 前記接合ステップが、前記セラミック体と前記核生成構造体とを500℃より高い温度及び5psiより高い圧力において互いに圧着するステップを含むことを特徴とする請求項1に記載の方法。
- 前記核生成構造体が、GaN,AlN,SiC,及びAl2O3の群から選択されることを特徴とする請求項1に記載の方法。
- 基板上に形成された核生成構造体を準備するステップと、
接合後に前記基板を除去するステップと、
をさらに含むことを特徴とする請求項1に記載の方法。 - 前記n型領域及び前記p型領域の両方の一部を露出させるために、前記半導体構造体をエッチングするステップと、
前記n型領域及び前記p型領域のそれぞれの上にコンタクトを形成するステップと、
をさらに含むことを特徴とする請求項1に記載の方法。 - 前記コンタクトの少なくとも1つが反射性であることを特徴とする請求項6に記載の方法。
- 前記セラミック体をレンズに成型するステップをさらに含むことを特徴とする請求項1に記載の方法。
- 前記セラミック体の表面をテクスチャ加工又は粗面化するステップをさらに含むことを特徴とする請求項1に記載の方法。
- 前記セラミック体が透明であることを特徴とする請求項1に記載の方法。
- 前記セラミック体が不透明であることを特徴とする請求項1に記載の方法。
- 前記核生成構造体は、成長前における厚さが10ミクロンより小さいことを特徴とする請求項1に記載の方法。
- 前記核生成構造体は、成長前における厚さが1ミクロンより小さいことを特徴とする請求項1に記載の方法。
- 前記核生成構造体と前記セラミック構造体との間に接合層を生成するステップをさらに含むことを特徴とする請求項1に記載の方法。
- 第一ピーク波長の光を吸収し第二ピーク波長の光を放射するように形成された蛍光体を含むセラミック体を準備するステップと、
成長基板上に形成され、第一ピーク波長の光を放射するように形成された発光領域がn型領域とp型領域との間に配置された半導体構造体を準備するステップと、
前記セラミック体を前記半導体構造体の表面に接合するステップと、
接合後に成長基板を除去するステップと、
を含むことを特徴とする方法。 - 前記n型領域を成長させる前に前記p型領域が前記成長基板上に成長させられることを特徴とする請求項15に記載の方法。
- 前記成長基板の除去後に前記半導体構造体をアニールするステップをさらに含むことを特徴とする請求項16に記載の方法。
- 前記セラミック体に接合される前記半導体構造体の表面がn−型領域の表面であることを特徴とする請求項15に記載の方法。
- 前記半導体構造体と前記セラミック体との間に接合層を生成するステップをさらに含むことを特徴とする請求項15に記載の方法。
- n−型領域とp−型領域の間に挟まれた発光領域を有する複数の層を含む半導体構造体と、
前記複数の層の1つに直接接触する発光性材料と、
を備え、
前記発光領域によって放射される光の波長において、前記発光性材料の屈折率の虚数部kが0.01より大きいことを特徴とする発光デバイス。 - kが0.1より大きいことを特徴とする請求項20に記載の発光デバイス。
- 前記発光領域がIII−窒化物材料を含むことを特徴とする請求項20に記載の発光デバイス。
- 前記発光性材料が蛍光体を含むことを特徴とする請求項20に記載の発光デバイス。
- 前記発光性材料がセラミック蛍光体を含むことを特徴とする請求項23に記載の発光デバイス。
- 前記発光性材料が蛍光体粒を含むことを特徴とする請求項23に記載の発光デバイス。
- 前記蛍光体粒の上に配置され、1.7より大きな屈折率をもつ透明材料をさらに含むことを特徴とする請求項25に記載の発光デバイス。
- 前記透明材料がガラスを含むことを特徴とする請求項26に記載の発光デバイス。
- 前記ガラスがゾルーゲルガラスを含むことを特徴とする請求項27に記載の発光デバイス。
- 前記透明材料中に配置され、約2nmから約50nmまでの間の直径を有するナノ粒子をさらに含むことを特徴とする請求項26に記載の発光デバイス。
- 前記蛍光体粒に直接接触する複数の層の表面層が、テクスチャ加工されているか又は粗面化されていることを特徴とする請求項25に記載の発光デバイス。
- 前記半導体構造体が、前記半導体構造体の横方向の広がりを超えた広がりを有するパッケージ部品に接合されていることと、
前記パッケージ部品が前記発光性材料から100ミクロンより小さな距離だけ隔てられていることと、
を特徴とする請求項20に記載の発光デバイス。 - セラミック体と、
百ミクロンより薄い核生成構造体と、
前記セラミック体と前記核生成層の間に配置され、前記セラミック体を前記核生成構造に接続する接合インターフェースと、
を含む構造体であって、
前記核生成構造体が、前記核生成構造体上にエピタキシャル構造体が成長させられる ように形成されており、
前記セラミック体と前記核生成構造体の間のいかなる距離も100ミクロンより小さいこと、
を特徴とする構造体。 - 前記核生成構造体上に成長させられた半導体構造体をさらに含み、該半導体構造体がn−型領域とp−型領域の間に配置された発光領域を含み、前記発光領域が第一ピーク波長の光を放射するように形成されており、前記核生成構造体が前記半導体構造体と前記セラミック体との間に配置されたことを特徴とする請求項32に記載の構造体。
- 前記セラミック体が、第一ピーク波長の光を吸収し、第二ピーク波長の光を放射するように形成された蛍光体を含むことを特徴とする請求項33に記載の構造体。
- 前記核生成構造体が、GaN,AlN,SiC,及びAl2O3の群から選択されることを特徴とする請求項33に記載の構造体。
- パッケージ部品と、
セラミック体と、
前記セラミック体と前記パッケージ部品の間に配置され、それらに接続された半導体構造体と、
を含み、前記半導体構造体がn−型領域とp−型領域の間に配置され、前記発光領域が第一ピーク波長の光を放射するように形成された発光領域を有する構造体であって、
前記パッケージ部品がセラミック体から100ミクロンより小さな距離だけ離れ、前記パッケージ部品が、半導体構造体の横方向の広がりを超えた横方向の広がりを有する、
ことを特徴とする構造体。 - 前記セラミック体が、第一ピーク波長の光を吸収し、第二ピーク波長の光を放射するように形成された蛍光体を含むことを特徴とする請求項36に記載の構造体。
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JP2007150331A (ja) * | 2005-11-29 | 2007-06-14 | Philips Lumileds Lightng Co Llc | 発光デバイスのための発光セラミック素子 |
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WO2006097868A2 (en) | 2006-09-21 |
KR20120107535A (ko) | 2012-10-02 |
US20060202105A1 (en) | 2006-09-14 |
TWI513035B (zh) | 2015-12-11 |
EP1861883B8 (en) | 2018-08-15 |
KR20070116099A (ko) | 2007-12-06 |
TWI508320B (zh) | 2015-11-11 |
JP5744116B2 (ja) | 2015-07-01 |
WO2006097868A3 (en) | 2007-01-18 |
JP5373252B2 (ja) | 2013-12-18 |
CN101176212B (zh) | 2010-05-19 |
JP2010157774A (ja) | 2010-07-15 |
US8445929B2 (en) | 2013-05-21 |
CN101176212A (zh) | 2008-05-07 |
TW201547054A (zh) | 2015-12-16 |
TWI622186B (zh) | 2018-04-21 |
JP5451502B2 (ja) | 2014-03-26 |
TW200707797A (en) | 2007-02-16 |
TW201312787A (zh) | 2013-03-16 |
JP2013225692A (ja) | 2013-10-31 |
US20100200886A1 (en) | 2010-08-12 |
EP1861883B1 (en) | 2018-06-13 |
US7341878B2 (en) | 2008-03-11 |
KR101370324B1 (ko) | 2014-03-05 |
US20080121919A1 (en) | 2008-05-29 |
EP1861883A2 (en) | 2007-12-05 |
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