JP2006303426A - 圧電素子及びその製造方法、液体噴射ヘッド及びその製造方法並びに液体噴射装置 - Google Patents
圧電素子及びその製造方法、液体噴射ヘッド及びその製造方法並びに液体噴射装置 Download PDFInfo
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- JP2006303426A JP2006303426A JP2005359118A JP2005359118A JP2006303426A JP 2006303426 A JP2006303426 A JP 2006303426A JP 2005359118 A JP2005359118 A JP 2005359118A JP 2005359118 A JP2005359118 A JP 2005359118A JP 2006303426 A JP2006303426 A JP 2006303426A
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 30
- 239000007788 liquid Substances 0.000 title claims abstract description 26
- 239000000758 substrate Substances 0.000 claims abstract description 57
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 31
- 239000000654 additive Substances 0.000 claims abstract description 27
- 238000000034 method Methods 0.000 claims abstract description 27
- 230000000996 additive effect Effects 0.000 claims abstract description 26
- 239000002243 precursor Substances 0.000 claims abstract description 19
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 13
- 229910052712 strontium Inorganic materials 0.000 claims abstract description 13
- CIOAGBVUUVVLOB-UHFFFAOYSA-N strontium atom Chemical compound [Sr] CIOAGBVUUVVLOB-UHFFFAOYSA-N 0.000 claims abstract description 13
- 239000000203 mixture Substances 0.000 claims abstract description 8
- 229910052719 titanium Inorganic materials 0.000 claims abstract description 8
- 229910052726 zirconium Inorganic materials 0.000 claims abstract description 8
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 claims abstract description 7
- 229910052745 lead Inorganic materials 0.000 claims abstract description 6
- 238000010304 firing Methods 0.000 claims description 21
- 239000011572 manganese Substances 0.000 claims description 11
- 230000005684 electric field Effects 0.000 claims description 7
- 230000010287 polarization Effects 0.000 claims description 7
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 claims description 6
- 229910052748 manganese Inorganic materials 0.000 claims description 6
- 238000001354 calcination Methods 0.000 abstract 2
- 230000015556 catabolic process Effects 0.000 abstract 1
- 230000001681 protective effect Effects 0.000 description 18
- 238000006073 displacement reaction Methods 0.000 description 16
- 239000000463 material Substances 0.000 description 15
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 10
- 239000010936 titanium Substances 0.000 description 10
- 229910052451 lead zirconate titanate Inorganic materials 0.000 description 8
- 239000013078 crystal Substances 0.000 description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 5
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 5
- 238000004891 communication Methods 0.000 description 5
- 238000005238 degreasing Methods 0.000 description 5
- 239000010931 gold Substances 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 5
- 239000012212 insulator Substances 0.000 description 5
- 229910052710 silicon Inorganic materials 0.000 description 5
- 239000010703 silicon Substances 0.000 description 5
- 239000000377 silicon dioxide Substances 0.000 description 5
- 235000012239 silicon dioxide Nutrition 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 238000001035 drying Methods 0.000 description 4
- 229910052746 lanthanum Inorganic materials 0.000 description 4
- HFGPZNIAWCZYJU-UHFFFAOYSA-N lead zirconate titanate Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ti+4].[Zr+4].[Pb+2] HFGPZNIAWCZYJU-UHFFFAOYSA-N 0.000 description 4
- 238000000059 patterning Methods 0.000 description 4
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 4
- 238000007789 sealing Methods 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 229910052741 iridium Inorganic materials 0.000 description 3
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 description 3
- 239000004734 Polyphenylene sulfide Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- FZLIPJUXYLNCLC-UHFFFAOYSA-N lanthanum atom Chemical compound [La] FZLIPJUXYLNCLC-UHFFFAOYSA-N 0.000 description 2
- 229910052749 magnesium Inorganic materials 0.000 description 2
- 239000011777 magnesium Substances 0.000 description 2
- 229910044991 metal oxide Inorganic materials 0.000 description 2
- 150000004706 metal oxides Chemical class 0.000 description 2
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 2
- 229910052697 platinum Inorganic materials 0.000 description 2
- 229920000069 polyphenylene sulfide Polymers 0.000 description 2
- 230000000630 rising effect Effects 0.000 description 2
- 238000003980 solgel method Methods 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- DHEQXMRUPNDRPG-UHFFFAOYSA-N strontium nitrate Chemical compound [Sr+2].[O-][N+]([O-])=O.[O-][N+]([O-])=O DHEQXMRUPNDRPG-UHFFFAOYSA-N 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 229910001928 zirconium oxide Inorganic materials 0.000 description 2
- 238000000018 DNA microarray Methods 0.000 description 1
- 208000016169 Fish-eye disease Diseases 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 1
- 239000012670 alkaline solution Substances 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- NKZSPGSOXYXWQA-UHFFFAOYSA-N dioxido(oxo)titanium;lead(2+) Chemical compound [Pb+2].[O-][Ti]([O-])=O NKZSPGSOXYXWQA-UHFFFAOYSA-N 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000007772 electrode material Substances 0.000 description 1
- 229910002112 ferroelectric ceramic material Inorganic materials 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- MIVBAHRSNUNMPP-UHFFFAOYSA-N manganese(2+);dinitrate Chemical compound [Mn+2].[O-][N+]([O-])=O.[O-][N+]([O-])=O MIVBAHRSNUNMPP-UHFFFAOYSA-N 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000013212 metal-organic material Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 229910000480 nickel oxide Inorganic materials 0.000 description 1
- KBJMLQFLOWQJNF-UHFFFAOYSA-N nickel(ii) nitrate Chemical compound [Ni+2].[O-][N+]([O-])=O.[O-][N+]([O-])=O KBJMLQFLOWQJNF-UHFFFAOYSA-N 0.000 description 1
- 229910052758 niobium Inorganic materials 0.000 description 1
- 239000010955 niobium Substances 0.000 description 1
- 229910000484 niobium oxide Inorganic materials 0.000 description 1
- URLJKFSTXLNXLG-UHFFFAOYSA-N niobium(5+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Nb+5].[Nb+5] URLJKFSTXLNXLG-UHFFFAOYSA-N 0.000 description 1
- 150000002902 organometallic compounds Chemical class 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- GNRSAWUEBMWBQH-UHFFFAOYSA-N oxonickel Chemical compound [Ni]=O GNRSAWUEBMWBQH-UHFFFAOYSA-N 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- VSZWPYCFIRKVQL-UHFFFAOYSA-N selanylidenegallium;selenium Chemical compound [Se].[Se]=[Ga].[Se]=[Ga] VSZWPYCFIRKVQL-UHFFFAOYSA-N 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
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- H10N30/01—Manufacture or treatment
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- H10N30/077—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing by liquid phase deposition
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Abstract
【解決手段】基板上に下電極を形成する工程と、該下電極上にPb、Zr及びTiを含み、且つ焼成後の組成比がPb/(Zr+Ti)=1.0〜1.3となると共にマンガン、ニッケル及びストロンチウムからなる群から選択される少なくとも1つの添加物を添加した圧電体前駆体膜を形成し、該圧電体前駆体膜を650〜750℃で、0.5〜3時間焼成することで圧電体層を形成する工程と、前記圧電体層上に上電極を形成する工程とを具備する。
【選択図】なし
Description
かかる第1の態様では、過剰鉛を含有させると共に、焼成温度及び焼成時間を所定の温度、所定の時間にすることで、結晶性が良く、安定性の高い圧電素子を形成することができる。
また、所定の添加物を添加することで、所望の電気抵抗率及び耐電圧の圧電素子を得ることができると共に、耐久寿命を長くして信頼性を向上することができる。
かかる第2の態様では、添加量を所定の量にすることで、過剰な添加物によって圧電素子の変位特性が劣化するのを防止することができる。
かかる第3の態様では、所望の厚さの圧電体層を高精度に形成することができると共に、結晶性が良く、安定性の高い圧電体層を形成することができる。
かかる第4の態様では、耐久寿命を長くして信頼性を向上した液体噴射ヘッドを得ることができる。
かかる第5の態様では、圧電体層の電気抵抗率を所定の値にすることで、耐電圧を向上することができると共に、耐久寿命を長くすることができる。
また、所定の添加物を添加することで、所望の電気抵抗率及び耐電圧の圧電素子を得ることができると共に、耐久寿命を長くして信頼性を向上することができる。
かかる第6の態様では、圧電体層の耐電圧を所定の値にすることで、耐久寿命を長くすることができ、信頼性を向上することができる。
かかる第7の態様では、圧電体層のリーク電流を所定の値にすることで、耐久寿命を長くすることができ、信頼性を向上することができる。
かかる第8の態様では、圧電体層の結晶性が大幅に向上する。したがって、変位特性に優れると共に、耐電圧が高く耐久寿命の長い圧電素子を提供することができる。
かかる第9の態様では、圧電体層の結晶性がより優れたものとなり、圧電素子の変位特性及び耐久寿命がさらに向上する。
かかる第10の態様では、圧電体層の電気抵抗率、リーク電流及び耐電圧を所定の値にすることで、耐久寿命を長くすることができ、信頼性を向上することができる。
また、所定の添加物を添加することで、所望の電気抵抗率及び耐電圧の圧電素子を得ることができると共に、耐久寿命を長くして信頼性を向上することができる。
かかる第11の態様では、耐久寿命を向上して信頼性を向上した液体噴射ヘッドを得ることができる。
かかる第12の態様では、耐久寿命を向上して信頼性を向上した液体噴射装置を得ることができる。
(実施形態1)
図1は、本発明の実施形態1に係るインクジェット式記録ヘッドの分解斜視図であり、図2は、図1の平面図及びそのA−A′断面図である。
以上、本発明の実施形態1を説明したが、インクジェット式記録ヘッドの基本的構成は上述したものに限定されるものではない。例えば、上述した実施形態1では、圧電体層をゾル−ゲル法又はMOD法により形成したが、特にこれに限定されず、例えば、圧電体層をスパッタ法によって形成するようにしてもよい。このように圧電体層をスパッタ法によって形成する場合には、圧電体前駆体膜を650〜750℃で、0.5〜3時間ポストアニールすればよい。
Claims (12)
- 基板上に下電極を形成する工程と、該下電極上にPb、Zr及びTiを含み、且つ焼成後の組成比がPb/(Zr+Ti)=1.0〜1.3となると共にマンガン、ニッケル及びストロンチウムからなる群から選択される少なくとも1つの添加物を添加した圧電体前駆体膜を形成し、該圧電体前駆体膜を650〜750℃で、0.5〜3時間焼成することで圧電体層を形成する工程と、前記圧電体層上に上電極を形成する工程とを具備することを特徴とする圧電素子の製造方法。
- 前記添加物の添加量が10mol%以下であることを特徴とする請求項1記載の圧電素子の製造方法。
- 前記圧電体層を形成する工程では、複数の圧電体前駆体膜を焼成することで圧電体膜を形成する圧電体膜形成工程を繰り返し行って当該圧電体層を形成すると共に、各圧電体膜形成工程での前記圧電体膜の焼成時間が0.5時間以上で、且つ前記圧電体層の総焼成時間が3時間以内であることを特徴とする請求項1又は2に記載の圧電素子の製造方法。
- 請求項1〜3の何れかに記載の圧電素子の製造方法により製造することを特徴とする液体噴射ヘッドの製造方法。
- 基板上に設けられた下電極、圧電体層及び上電極からなり、且つ前記圧電体層が、マンガン、ニッケル及びストロンチウムからなる群から選択される少なくとも1つの添加物を有すると共に、当該圧電体層の電気抵抗率が20MΩ・cm以上であることを特徴とする圧電素子。
- 前記圧電体層の耐電圧が900kV/cm以上であることを特徴とする請求項5記載の圧電素子。
- 前記圧電体層のリーク電流が1×10−8A/cm2以下であることを特徴とする請求項5又は6に記載の圧電素子。
- 前記圧電体層の比誘電率が750〜1500であることを特徴とする請求項5〜7の何れかに記載の圧電素子。
- 前記圧電体層の抗電界が15〜30kV/cmであり且つ残留分極強度が10〜25μC/cm2であることを特徴とする請求項5〜8の何れかに記載の圧電素子。
- 基板上に設けられた下電極、圧電体層及び上電極からなり、且つ前記圧電体層が、マンガン、ニッケル及びストロンチウムからなる群から選択される少なくとも1つの添加物を有し、当該圧電体層の電気抵抗率が20MΩ・cm以上であると共に、リーク電流が1×10−8A/cm2以下で、且つ耐電圧が900kV/cm以上であることを特徴とする圧電素子。
- 請求項5〜10の何れかに記載の圧電素子と、前記圧電素子が振動板を介して設けられると共にノズル開口に連通する圧力発生室が設けられた流路形成基板とを具備することを特徴とする液体噴射ヘッド。
- 請求項11記載の液体噴射ヘッドを具備することを特徴とする液体噴射装置。
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EP20060005622 EP1705725A1 (en) | 2005-03-22 | 2006-03-20 | Piezoelectric element, method of manufacturing the same, liquid-jet head, method of manufacturing the same, and liquid-jet apparatus |
US11/384,324 US7362039B2 (en) | 2005-03-22 | 2006-03-21 | Piezoelectric element, method of manufacturing the same, liquid-jet head, method of manufacturing the same, and liquid-jet apparatus |
KR20060026069A KR100835036B1 (ko) | 2005-03-22 | 2006-03-22 | 압전 요소, 그 제조 방법, 액체 분사 헤드, 그 제조 방법,및 액체 분사 장치 |
US12/038,875 US7520038B2 (en) | 2005-03-22 | 2008-02-28 | Piezoelectric element, method of manufacturing the same, liquid-jet head, method of manufacturing the same, and liquid-jet apparatus |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014179468A (ja) * | 2013-03-14 | 2014-09-25 | Ricoh Co Ltd | 電気−機械変換素子、電気−機械変換素子の製造方法、液滴吐出ヘッド、液滴吐出装置 |
JP2020012159A (ja) * | 2018-07-18 | 2020-01-23 | 株式会社アルバック | Pzt素子、pzt素子製造方法 |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5170356B2 (ja) * | 2005-03-22 | 2013-03-27 | セイコーエプソン株式会社 | 圧電素子及び液体噴射ヘッド並びに液体噴射装置 |
JP4337833B2 (ja) * | 2006-03-24 | 2009-09-30 | セイコーエプソン株式会社 | 液滴吐出ヘッドおよび液滴吐出装置 |
JP2010131979A (ja) * | 2008-10-27 | 2010-06-17 | Seiko Epson Corp | 液体噴射装置、及び、液体噴射装置の制御方法 |
JP5884959B2 (ja) * | 2010-11-16 | 2016-03-15 | セイコーエプソン株式会社 | 圧電体膜の製造方法、圧電素子及び液体噴射ヘッド並びに液体噴射装置 |
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EP3196952B1 (en) | 2016-01-21 | 2019-06-19 | AT & S Austria Technologie & Systemtechnik Aktiengesellschaft | Mems piezoelectric transducer formed at a pcb support structure |
JP6990053B2 (ja) * | 2017-07-10 | 2022-01-12 | エスアイアイ・プリンテック株式会社 | 液体噴射ヘッド及び液体噴射装置 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5143199B2 (ja) * | 1971-09-25 | 1976-11-19 | ||
JPH11233733A (ja) * | 1998-02-13 | 1999-08-27 | Toshiba Corp | 電子部品及びその製造方法 |
WO1999045598A1 (en) * | 1998-03-04 | 1999-09-10 | Seiko Epson Corporation | Piezoelectric device, ink-jet recording head, method fo manufacture, and printer |
JP2001152360A (ja) * | 1999-11-25 | 2001-06-05 | Ricoh Co Ltd | セラミックス誘電体膜の形成方法、セラミックス誘電体膜/基板の積層構造体、及び電気−機械変換素子 |
JP2003055045A (ja) * | 2001-08-23 | 2003-02-26 | Murata Mfg Co Ltd | 積層圧電素子用圧電磁器組成物、積層圧電素子、積層圧電素子の製造方法および積層圧電装置 |
JP2004107181A (ja) * | 2002-09-20 | 2004-04-08 | Canon Inc | 圧電体素子形成用組成物、圧電体膜の製造方法、圧電体素子及びインクジェット記録ヘッド |
JP2004111835A (ja) * | 2002-09-20 | 2004-04-08 | Canon Inc | 圧電体素子の製造方法、圧電体素子及びインクジェット式記録ヘッド |
Family Cites Families (29)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB509838A (en) | 1938-01-21 | 1939-07-21 | Ass Equipment Co Ltd | Improvements in or relating to liquid-fuel injection internal-combustion engines |
US3110626A (en) | 1961-08-17 | 1963-11-12 | Minnesota Mining & Mfg | Apparatus for coating discrete solid material |
US3496323A (en) | 1965-12-20 | 1970-02-17 | Air Reduction | Gas shielded arc welding of steel |
US4397886A (en) * | 1981-05-06 | 1983-08-09 | Sprague Electric Company | Method for making a ceramic intergranular barrier-layer capacitor |
US4726099A (en) * | 1986-09-17 | 1988-02-23 | American Cyanamid Company | Method of making piezoelectric composites |
US4933230A (en) * | 1986-09-17 | 1990-06-12 | American Cyanamid | Piezoelectric composites |
US5112433A (en) * | 1988-12-09 | 1992-05-12 | Battelle Memorial Institute | Process for producing sub-micron ceramic powders of perovskite compounds with controlled stoichiometry and particle size |
US5219811A (en) * | 1989-08-31 | 1993-06-15 | Central Glass Company, Limited | Powder composition for sintering into modified barium titanate semiconductive ceramic |
GB9025706D0 (en) * | 1990-11-27 | 1991-01-09 | Xaar Ltd | Laminate for use in manufacture of ink drop printheads |
JP3327149B2 (ja) | 1995-12-20 | 2002-09-24 | セイコーエプソン株式会社 | 圧電体薄膜素子及びこれを用いたインクジェット式記録ヘッド |
US5969935A (en) * | 1996-03-15 | 1999-10-19 | Ramtron International Corporation | Use of calcium and strontium dopants to improve retention performance in a PZT ferroelectric film |
US6340621B1 (en) * | 1996-10-30 | 2002-01-22 | The Research Foundation Of State University Of New York | Thin film capacitor and method of manufacture |
US6203608B1 (en) * | 1998-04-15 | 2001-03-20 | Ramtron International Corporation | Ferroelectric thin films and solutions: compositions |
JP2000173301A (ja) * | 1998-12-10 | 2000-06-23 | Seiko Epson Corp | 圧電発光素子、表示装置およびそれらの製造方法 |
JP3671791B2 (ja) * | 1999-02-08 | 2005-07-13 | 株式会社村田製作所 | 圧電磁器組成物およびそれを用いた圧電セラミック素子 |
JP2001113705A (ja) | 1999-10-19 | 2001-04-24 | Casio Comput Co Ltd | ドライエッチング用金属マスク、これを備えたインクジェットプリンタヘッド及びその製造方法 |
JP3202012B1 (ja) | 2000-03-29 | 2001-08-27 | 松下電器産業株式会社 | 圧電アクチュエータ、インクジェットヘッド及びインクジェット式記録装置 |
JP2001302349A (ja) | 2000-04-19 | 2001-10-31 | Tokin Corp | 圧電磁器組成物 |
JP2001302348A (ja) | 2000-04-19 | 2001-10-31 | Tokin Corp | 圧電磁器組成物 |
JP2001302350A (ja) | 2000-04-19 | 2001-10-31 | Tokin Corp | 圧電磁器組成物 |
JP2002226266A (ja) | 2001-01-30 | 2002-08-14 | Nec Tokin Corp | 圧電磁器組成物 |
WO2003052840A1 (fr) | 2001-12-18 | 2003-06-26 | Matsushita Electric Industrial Co., Ltd. | Element piezoelectrique, tete d'impression a jet d'encre, capteur de vitesse angulaire, procede de fabrication, et appareil d'enregistrement a jet d'encre |
JP3971279B2 (ja) * | 2002-09-20 | 2007-09-05 | キヤノン株式会社 | 圧電体素子の製造方法 |
TWI230477B (en) * | 2002-09-20 | 2005-04-01 | Canon Kk | Composition for forming piezoelectric film, producing method for piezoelectric film, piezoelectric element and ink jet recording head |
JP2004235553A (ja) | 2003-01-31 | 2004-08-19 | Canon Inc | 圧電体膜成膜用支持基板、圧電体素子、インクジェット記録ヘッド |
JP2005082424A (ja) | 2003-09-05 | 2005-03-31 | Nec Tokin Corp | 圧電磁器組成物 |
US7132057B2 (en) * | 2003-10-15 | 2006-11-07 | Piezotech, Llc | Compositions for high power piezoelectric ceramics |
JP2006303425A (ja) * | 2005-03-22 | 2006-11-02 | Seiko Epson Corp | 圧電素子及び液体噴射ヘッド並びに液体噴射装置 |
JP5170356B2 (ja) * | 2005-03-22 | 2013-03-27 | セイコーエプソン株式会社 | 圧電素子及び液体噴射ヘッド並びに液体噴射装置 |
-
2005
- 2005-12-13 JP JP2005359118A patent/JP5170356B2/ja not_active Expired - Fee Related
-
2006
- 2006-03-20 EP EP20060005622 patent/EP1705725A1/en not_active Withdrawn
- 2006-03-21 US US11/384,324 patent/US7362039B2/en not_active Expired - Fee Related
- 2006-03-22 KR KR20060026069A patent/KR100835036B1/ko active IP Right Grant
-
2008
- 2008-02-28 US US12/038,875 patent/US7520038B2/en not_active Expired - Fee Related
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5143199B2 (ja) * | 1971-09-25 | 1976-11-19 | ||
JPH11233733A (ja) * | 1998-02-13 | 1999-08-27 | Toshiba Corp | 電子部品及びその製造方法 |
WO1999045598A1 (en) * | 1998-03-04 | 1999-09-10 | Seiko Epson Corporation | Piezoelectric device, ink-jet recording head, method fo manufacture, and printer |
JP2001152360A (ja) * | 1999-11-25 | 2001-06-05 | Ricoh Co Ltd | セラミックス誘電体膜の形成方法、セラミックス誘電体膜/基板の積層構造体、及び電気−機械変換素子 |
JP2003055045A (ja) * | 2001-08-23 | 2003-02-26 | Murata Mfg Co Ltd | 積層圧電素子用圧電磁器組成物、積層圧電素子、積層圧電素子の製造方法および積層圧電装置 |
JP2004107181A (ja) * | 2002-09-20 | 2004-04-08 | Canon Inc | 圧電体素子形成用組成物、圧電体膜の製造方法、圧電体素子及びインクジェット記録ヘッド |
JP2004111835A (ja) * | 2002-09-20 | 2004-04-08 | Canon Inc | 圧電体素子の製造方法、圧電体素子及びインクジェット式記録ヘッド |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014179468A (ja) * | 2013-03-14 | 2014-09-25 | Ricoh Co Ltd | 電気−機械変換素子、電気−機械変換素子の製造方法、液滴吐出ヘッド、液滴吐出装置 |
JP2020012159A (ja) * | 2018-07-18 | 2020-01-23 | 株式会社アルバック | Pzt素子、pzt素子製造方法 |
JP7194528B2 (ja) | 2018-07-18 | 2022-12-22 | 株式会社アルバック | Pzt素子、pzt素子製造方法 |
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JP5170356B2 (ja) | 2013-03-27 |
US20080213468A1 (en) | 2008-09-04 |
KR20060102521A (ko) | 2006-09-27 |
EP1705725A1 (en) | 2006-09-27 |
KR100835036B1 (ko) | 2008-06-03 |
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US20060244789A1 (en) | 2006-11-02 |
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