JP2006270077A5 - - Google Patents

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Publication number
JP2006270077A5
JP2006270077A5 JP2006045181A JP2006045181A JP2006270077A5 JP 2006270077 A5 JP2006270077 A5 JP 2006270077A5 JP 2006045181 A JP2006045181 A JP 2006045181A JP 2006045181 A JP2006045181 A JP 2006045181A JP 2006270077 A5 JP2006270077 A5 JP 2006270077A5
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JP
Japan
Prior art keywords
insulating film
transistors
cover
transistor
film
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Application number
JP2006045181A
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English (en)
Japanese (ja)
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JP5046529B2 (ja
JP2006270077A (ja
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Priority to JP2006045181A priority Critical patent/JP5046529B2/ja
Priority claimed from JP2006045181A external-priority patent/JP5046529B2/ja
Publication of JP2006270077A publication Critical patent/JP2006270077A/ja
Publication of JP2006270077A5 publication Critical patent/JP2006270077A5/ja
Application granted granted Critical
Publication of JP5046529B2 publication Critical patent/JP5046529B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2006045181A 2005-02-25 2006-02-22 半導体装置 Expired - Fee Related JP5046529B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2006045181A JP5046529B2 (ja) 2005-02-25 2006-02-22 半導体装置

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2005051867 2005-02-25
JP2005051867 2005-02-25
JP2006045181A JP5046529B2 (ja) 2005-02-25 2006-02-22 半導体装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2012122742A Division JP5509259B2 (ja) 2005-02-25 2012-05-30 電子機器

Publications (3)

Publication Number Publication Date
JP2006270077A JP2006270077A (ja) 2006-10-05
JP2006270077A5 true JP2006270077A5 (enExample) 2009-04-02
JP5046529B2 JP5046529B2 (ja) 2012-10-10

Family

ID=37205635

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006045181A Expired - Fee Related JP5046529B2 (ja) 2005-02-25 2006-02-22 半導体装置

Country Status (1)

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JP (1) JP5046529B2 (enExample)

Families Citing this family (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5350616B2 (ja) * 2006-09-22 2013-11-27 株式会社半導体エネルギー研究所 半導体装置
US7968382B2 (en) * 2007-02-02 2011-06-28 Semiconductor Energy Laboratory Co., Ltd. Method of manufacturing semiconductor device
US7973316B2 (en) 2007-03-26 2011-07-05 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing semiconductor device
TWI423519B (zh) * 2007-09-04 2014-01-11 Mitsubishi Electric Corp Radio frequency identification tag
US8047442B2 (en) * 2007-12-03 2011-11-01 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
CN103872002B (zh) * 2008-03-05 2017-03-01 伊利诺伊大学评议会 可拉伸和可折叠的电子器件
WO2009131132A1 (en) * 2008-04-25 2009-10-29 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
JP5679626B2 (ja) * 2008-07-07 2015-03-04 セイコーインスツル株式会社 半導体装置
TW202025500A (zh) 2008-11-07 2020-07-01 日商半導體能源研究所股份有限公司 半導體裝置和其製造方法
US8796700B2 (en) * 2008-11-17 2014-08-05 Global Oled Technology Llc Emissive device with chiplets
CN102422338B (zh) 2009-05-02 2015-04-01 株式会社半导体能源研究所 显示设备
US8766269B2 (en) 2009-07-02 2014-07-01 Semiconductor Energy Laboratory Co., Ltd. Light-emitting device, lighting device, and electronic device
KR100978387B1 (ko) 2010-03-23 2010-08-26 한국기계연구원 박막 트랜지스터 패널 및 그 제조 방법
WO2012164882A1 (ja) * 2011-05-31 2012-12-06 シャープ株式会社 表示装置用基板およびそれを備えた表示装置
KR101174834B1 (ko) * 2012-04-05 2012-08-17 주식회사 다보씨앤엠 공정필름을 이용한 필름형 디스플레이 기판의 제조방법 및 이에 사용되는 필름형 디스플레이 기판 제조용 공정필름
US9472507B2 (en) 2013-06-17 2016-10-18 Samsung Display Co., Ltd. Array substrate and organic light-emitting display including the same
KR102257119B1 (ko) * 2013-06-17 2021-05-31 삼성디스플레이 주식회사 어레이 기판 및 이를 포함하는 유기 발광 표시 장치
TWI653755B (zh) * 2013-09-12 2019-03-11 日商新力股份有限公司 顯示裝置、其製造方法及電子機器
TWI654736B (zh) * 2014-02-14 2019-03-21 日商半導體能源研究所股份有限公司 發光裝置
KR102799986B1 (ko) * 2014-11-28 2025-04-23 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치, 모듈, 및 전자 기기
JP6683503B2 (ja) * 2015-03-03 2020-04-22 株式会社半導体エネルギー研究所 半導体装置
US20180165996A1 (en) * 2015-06-18 2018-06-14 Sharp Kabushiki Kaisha Flexible electronic device and method for manufacturing flexible electronic device
JP6624917B2 (ja) * 2015-12-14 2019-12-25 株式会社ジャパンディスプレイ 表示装置
CN107808892B (zh) * 2016-09-08 2020-06-26 群创光电股份有限公司 显示设备
US10217957B2 (en) 2016-10-13 2019-02-26 Sharp Kabushiki Kaisha Organic EL display device and method of manufacturing organic EL display device
JPWO2018178793A1 (ja) * 2017-03-29 2020-02-06 株式会社半導体エネルギー研究所 半導体装置、半導体装置の作製方法
WO2019171198A1 (ja) * 2018-03-06 2019-09-12 株式会社半導体エネルギー研究所 半導体装置
JP2020035952A (ja) * 2018-08-31 2020-03-05 国立大学法人名古屋大学 電子デバイス
JP7467976B2 (ja) * 2019-03-04 2024-04-16 東レ株式会社 薄膜トランジスタ、その製造方法、ならびにそれを備えた半導体装置
US12376373B2 (en) 2019-11-01 2025-07-29 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
US20240397770A1 (en) * 2021-09-30 2024-11-28 Semiconductor Energy Laboratory Co., Ltd. Display apparatus

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JPH02263465A (ja) * 1988-11-05 1990-10-26 Mitsubishi Electric Corp 積層型半導体装置およびその製造方法
JP3662909B2 (ja) * 1990-12-25 2005-06-22 日本碍子株式会社 ウエハー吸着加熱装置及びウエハー吸着装置
JPH08222732A (ja) * 1995-02-15 1996-08-30 Hitachi Ltd 絶縁ゲート型半導体装置
JP3248388B2 (ja) * 1995-03-30 2002-01-21 富士電機株式会社 半導体装置およびその製造方法
JP2000183149A (ja) * 1998-12-10 2000-06-30 Sanyo Electric Co Ltd 半導体装置
JP4651777B2 (ja) * 1999-06-02 2011-03-16 株式会社半導体エネルギー研究所 半導体装置の作製方法
JP4748859B2 (ja) * 2000-01-17 2011-08-17 株式会社半導体エネルギー研究所 発光装置の作製方法
JP2001320057A (ja) * 2000-05-11 2001-11-16 Toshiba Corp 薄膜トランジスタ及び薄膜トランジスタの製造方法
WO2002067329A1 (en) * 2001-02-16 2002-08-29 Ignis Innovation Inc. Flexible display device
GB0108309D0 (en) * 2001-04-03 2001-05-23 Koninkl Philips Electronics Nv Matrix array devices with flexible substrates
JP3648466B2 (ja) * 2001-06-29 2005-05-18 株式会社東芝 電界効果トランジスタ、半導体基板、電界効果トランジスタの製造方法及び半導体基板の製造方法
JP2003197364A (ja) * 2001-12-27 2003-07-11 Goyo Paper Working Co Ltd 発光効率の高いｅｌ発光装置
JP4566578B2 (ja) * 2003-02-24 2010-10-20 株式会社半導体エネルギー研究所 薄膜集積回路の作製方法
JP2004342960A (ja) * 2003-05-19 2004-12-02 Sony Corp 半導体装置および半導体装置の製造方法

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