JP2005501725A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2005501725A5 JP2005501725A5 JP2003525081A JP2003525081A JP2005501725A5 JP 2005501725 A5 JP2005501725 A5 JP 2005501725A5 JP 2003525081 A JP2003525081 A JP 2003525081A JP 2003525081 A JP2003525081 A JP 2003525081A JP 2005501725 A5 JP2005501725 A5 JP 2005501725A5
- Authority
- JP
- Japan
- Prior art keywords
- diyl
- hydroxyphenyl
- composition
- electrical component
- cyclohexyl
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
- -1 glycidyl ester Chemical class 0.000 claims 23
- 239000000203 mixture Substances 0.000 claims 12
- 229910052751 metal Inorganic materials 0.000 claims 6
- 239000002184 metal Substances 0.000 claims 6
- 125000003118 aryl group Chemical group 0.000 claims 5
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 claims 5
- 229920005989 resin Polymers 0.000 claims 5
- 239000011347 resin Substances 0.000 claims 5
- 125000000217 alkyl group Chemical group 0.000 claims 4
- 125000000753 cycloalkyl group Chemical group 0.000 claims 4
- 125000001072 heteroaryl group Chemical group 0.000 claims 4
- 125000000623 heterocyclic group Chemical group 0.000 claims 4
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims 4
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 claims 3
- 125000004208 3-hydroxyphenyl group Chemical group [H]OC1=C([H])C([H])=C([H])C(*)=C1[H] 0.000 claims 2
- 125000004203 4-hydroxyphenyl group Chemical group [H]OC1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 2
- 125000004450 alkenylene group Chemical group 0.000 claims 2
- 125000002947 alkylene group Chemical group 0.000 claims 2
- 125000000732 arylene group Chemical group 0.000 claims 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 claims 2
- 239000003795 chemical substances by application Substances 0.000 claims 2
- 150000001875 compounds Chemical class 0.000 claims 2
- 125000005724 cycloalkenylene group Chemical group 0.000 claims 2
- 125000002993 cycloalkylene group Chemical group 0.000 claims 2
- 230000004907 flux Effects 0.000 claims 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims 2
- 229920000647 polyepoxide Polymers 0.000 claims 2
- 229910000679 solder Inorganic materials 0.000 claims 2
- 238000005476 soldering Methods 0.000 claims 2
- 239000000758 substrate Substances 0.000 claims 2
- POILWHVDKZOXJZ-ARJAWSKDSA-M (z)-4-oxopent-2-en-2-olate Chemical compound C\C([O-])=C\C(C)=O POILWHVDKZOXJZ-ARJAWSKDSA-M 0.000 claims 1
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 claims 1
- CPHGOBGXZQKCKI-UHFFFAOYSA-N 4,5-diphenyl-1h-imidazole Chemical compound N1C=NC(C=2C=CC=CC=2)=C1C1=CC=CC=C1 CPHGOBGXZQKCKI-UHFFFAOYSA-N 0.000 claims 1
- WFCQTAXSWSWIHS-UHFFFAOYSA-N 4-[bis(4-hydroxyphenyl)methyl]phenol Chemical compound C1=CC(O)=CC=C1C(C=1C=CC(O)=CC=1)C1=CC=C(O)C=C1 WFCQTAXSWSWIHS-UHFFFAOYSA-N 0.000 claims 1
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 claims 1
- 239000000853 adhesive Substances 0.000 claims 1
- 230000001070 adhesive effect Effects 0.000 claims 1
- 150000001336 alkenes Chemical class 0.000 claims 1
- 150000001412 amines Chemical class 0.000 claims 1
- 239000003054 catalyst Substances 0.000 claims 1
- 239000004643 cyanate ester Substances 0.000 claims 1
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 claims 1
- 238000010438 heat treatment Methods 0.000 claims 1
- 150000002460 imidazoles Chemical class 0.000 claims 1
- JBFYUZGYRGXSFL-UHFFFAOYSA-N imidazolide Chemical compound C1=C[N-]C=N1 JBFYUZGYRGXSFL-UHFFFAOYSA-N 0.000 claims 1
- 229910001507 metal halide Inorganic materials 0.000 claims 1
- 150000005309 metal halides Chemical class 0.000 claims 1
- 150000002739 metals Chemical class 0.000 claims 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 claims 1
- AFEQENGXSMURHA-UHFFFAOYSA-N oxiran-2-ylmethanamine Chemical compound NCC1CO1 AFEQENGXSMURHA-UHFFFAOYSA-N 0.000 claims 1
- 229920003192 poly(bis maleimide) Polymers 0.000 claims 1
- 239000000377 silicon dioxide Substances 0.000 claims 1
- 229920005992 thermoplastic resin Polymers 0.000 claims 1
- 229920001187 thermosetting polymer Polymers 0.000 claims 1
- GMMSTIGHDDLCMI-UHFFFAOYSA-N zinc;imidazol-3-ide Chemical compound [Zn+2].C1=C[N-]C=N1.C1=C[N-]C=N1 GMMSTIGHDDLCMI-UHFFFAOYSA-N 0.000 claims 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US09/946,013 US20030111519A1 (en) | 2001-09-04 | 2001-09-04 | Fluxing compositions |
| PCT/US2002/021206 WO2003020816A1 (en) | 2001-09-04 | 2002-07-03 | Fluxing compositions |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2005501725A JP2005501725A (ja) | 2005-01-20 |
| JP2005501725A5 true JP2005501725A5 (https=) | 2006-01-05 |
Family
ID=25483831
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2003525081A Ceased JP2005501725A (ja) | 2001-09-04 | 2002-07-03 | フラックス組成物 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20030111519A1 (https=) |
| EP (1) | EP1423467A1 (https=) |
| JP (1) | JP2005501725A (https=) |
| KR (1) | KR20040044530A (https=) |
| CN (1) | CN1549843A (https=) |
| WO (1) | WO2003020816A1 (https=) |
Families Citing this family (59)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2003101164A1 (en) * | 2002-05-23 | 2003-12-04 | 3M Innovative Properties Company | Nanoparticle filled underfill |
| US6796482B2 (en) * | 2002-10-31 | 2004-09-28 | Freescale Semiconductor, Inc. | Phase separated system for fluxing |
| US7004375B2 (en) * | 2003-05-23 | 2006-02-28 | National Starch And Chemical Investment Holding Corporation | Pre-applied fluxing underfill composition having pressure sensitive adhesive properties |
| JP4170839B2 (ja) * | 2003-07-11 | 2008-10-22 | 日東電工株式会社 | 積層シート |
| US7213739B2 (en) * | 2004-04-02 | 2007-05-08 | Fry's Metals, Inc. | Underfill fluxing curative |
| US20060025509A1 (en) * | 2004-07-29 | 2006-02-02 | Ruzhi Zhang | Fluxing no-flow underfill composition containing benzoxazines |
| US7247683B2 (en) * | 2004-08-05 | 2007-07-24 | Fry's Metals, Inc. | Low voiding no flow fluxing underfill for electronic devices |
| US7687119B2 (en) * | 2005-04-04 | 2010-03-30 | Henkel Ag & Co. Kgaa | Radiation-curable desiccant-filled adhesive/sealant |
| US20060223978A1 (en) * | 2005-04-04 | 2006-10-05 | Shengqian Kong | Radiation- or thermally-curable oxetane barrier sealants |
| US20060223937A1 (en) * | 2005-04-04 | 2006-10-05 | Herr Donald E | Radiation curable cycloaliphatic barrier sealants |
| JP4883996B2 (ja) * | 2005-05-24 | 2012-02-22 | 四国化成工業株式会社 | 水溶性プレフラックス及びその利用 |
| US20060272747A1 (en) * | 2005-06-03 | 2006-12-07 | Renyi Wang | Fluxing compositions |
| US20070049665A1 (en) * | 2005-08-25 | 2007-03-01 | Musa Osama M | Quinolinols and quinolinol derivatives as adhesion promoters in die attach adhesives |
| US7378523B2 (en) * | 2005-08-25 | 2008-05-27 | National Starch And Chemical Investment Holding Corporation | Quinolinols as fluxing and accelerating agents for underfill compositions |
| US20130131007A1 (en) | 2005-09-07 | 2013-05-23 | Bebaas, Inc. | Vitamin b12 compositions |
| US7468407B2 (en) * | 2005-09-26 | 2008-12-23 | National Starch And Chemical Investment Holding Copporation | Metal salts of quinolinols and quinolinol derivatives in curable compositions |
| US20070095432A1 (en) * | 2005-11-02 | 2007-05-03 | National Starch And Chemical Investment Holding Corporation | Fluxing compositions containing benzotriazoles |
| JP4757070B2 (ja) * | 2006-03-27 | 2011-08-24 | 富士通株式会社 | 半田付け用フラックス及び半導体素子の接合方法 |
| JP5394066B2 (ja) * | 2006-10-03 | 2014-01-22 | 住友ベークライト株式会社 | 接着テープ |
| JP2008179698A (ja) * | 2007-01-24 | 2008-08-07 | Fujifilm Corp | レーザー分解用樹脂組成物およびそれを用いるパターン形成材料 |
| US8835551B2 (en) * | 2007-09-14 | 2014-09-16 | 3M Innovative Properties Company | Ultra low viscosity iodine containing amorphous fluoropolymers |
| US20090283133A1 (en) * | 2008-05-14 | 2009-11-19 | 3M Innovative Properties Company | Solar concentrating mirror |
| US20090283144A1 (en) * | 2008-05-14 | 2009-11-19 | 3M Innovative Properties Company | Solar concentrating mirror |
| ES2690653T3 (es) * | 2008-06-16 | 2018-11-21 | 3M Innovative Properties Company | Composiciones curables reforzadas |
| US8334170B2 (en) * | 2008-06-27 | 2012-12-18 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method for stacking devices |
| US9523516B2 (en) | 2008-12-30 | 2016-12-20 | 3M Innovative Properties Company | Broadband reflectors, concentrated solar power systems, and methods of using the same |
| KR101197193B1 (ko) * | 2010-01-05 | 2012-11-02 | 도레이첨단소재 주식회사 | 비유동성 언더필용 수지 조성물, 그를 이용한 비유동성 언더필 필름 및 그 비유동성 언더필 필름의 제조방법 |
| TWI500467B (zh) * | 2010-01-08 | 2015-09-21 | Arakawa Chem Ind | 無鉛焊劑用助熔劑組成物及無鉛焊劑膏 |
| US8070043B1 (en) * | 2010-12-02 | 2011-12-06 | Rohm And Haas Electronic Materials Llc | Curable flux composition and method of soldering |
| US8070044B1 (en) * | 2010-12-02 | 2011-12-06 | Rohm And Haas Electronic Materials Llc | Polyamine flux composition and method of soldering |
| US8070045B1 (en) * | 2010-12-02 | 2011-12-06 | Rohm And Haas Electronic Materials Llc | Curable amine flux composition and method of soldering |
| US8070047B1 (en) * | 2010-12-02 | 2011-12-06 | Rohm And Haas Electronic Materials Llc | Flux composition and method of soldering |
| US8070046B1 (en) * | 2010-12-02 | 2011-12-06 | Rohm And Haas Electronic Materials Llc | Amine flux composition and method of soldering |
| JP5856747B2 (ja) * | 2011-03-28 | 2016-02-10 | ハリマ化成株式会社 | はんだ付け用フラックスおよびはんだペースト組成物 |
| JP4897932B1 (ja) * | 2011-05-25 | 2012-03-14 | ハリマ化成株式会社 | はんだペースト用フラックスおよびはんだペースト |
| JP6155261B2 (ja) | 2011-07-15 | 2017-06-28 | スリーエム イノベイティブ プロパティズ カンパニー | 半導体パッケージ樹脂組成物及びその使用方法 |
| US8430295B2 (en) | 2011-09-30 | 2013-04-30 | Rohm And Haas Electronic Materials Llc | Curable flux composition and method of soldering |
| US8430293B2 (en) | 2011-09-30 | 2013-04-30 | Rohm And Haas Electronic Materials Llc | Curable amine, carboxylic acid flux composition and method of soldering |
| US8434667B2 (en) | 2011-09-30 | 2013-05-07 | Rohm And Haas Electronic Materials Llc | Polyamine, carboxylic acid flux composition and method of soldering |
| US8430294B2 (en) | 2011-09-30 | 2013-04-30 | Rohm And Haas Electronic Materials Llc | Amine, carboxylic acid flux composition and method of soldering |
| US8434666B2 (en) | 2011-09-30 | 2013-05-07 | Rohm And Haas Electronic Materials Llc | Flux composition and method of soldering |
| JP2014091744A (ja) | 2012-10-31 | 2014-05-19 | 3M Innovative Properties Co | アンダーフィル組成物、半導体装置およびその製造方法 |
| CN103056560B (zh) * | 2012-12-28 | 2015-03-11 | 深圳市美克科技有限公司 | 软钎焊助焊剂 |
| US9631065B2 (en) * | 2013-03-12 | 2017-04-25 | Intel Corporation | Methods of forming wafer level underfill materials and structures formed thereby |
| CN104646861A (zh) * | 2013-11-25 | 2015-05-27 | 刘现梅 | 一种含有噻二唑衍生物的助焊剂 |
| KR20170093891A (ko) | 2014-12-08 | 2017-08-16 | 쓰리엠 이노베이티브 프로퍼티즈 캄파니 | 아크릴 폴리비닐 아세탈 필름, 조성물, 및 열 접합성 물품 |
| CN107001549A (zh) | 2014-12-08 | 2017-08-01 | 3M创新有限公司 | 基于丙烯酸系嵌段共聚物共混物的组合物 |
| JP6709221B2 (ja) | 2014-12-08 | 2020-06-10 | スリーエム イノベイティブ プロパティズ カンパニー | アクリル系ポリビニルアセタールフィルム及び組成物 |
| WO2017112458A1 (en) | 2015-12-22 | 2017-06-29 | 3M Innovative Properties Company | Acrylic polyvinyl acetal graphic films |
| JP7030054B2 (ja) | 2015-12-22 | 2022-03-04 | スリーエム イノベイティブ プロパティズ カンパニー | 接着剤層を備えたアクリルポリビニルアセタールフィルム |
| US11034830B2 (en) | 2015-12-22 | 2021-06-15 | 3M Innovative Properties Company | Acrylic polyvinyl acetal films comprising a second layer |
| CN108430766B (zh) | 2015-12-22 | 2020-11-10 | 3M创新有限公司 | 包括结构化层的丙烯酸类膜 |
| KR102437478B1 (ko) | 2016-06-07 | 2022-08-30 | 쓰리엠 이노베이티브 프로퍼티즈 캄파니 | 광 지향 용품을 위한 아크릴 폴리비닐 아세탈 필름 |
| US11935803B2 (en) | 2018-04-26 | 2024-03-19 | Mitsubishi Gas Chemical Company, Inc. | Resin composition, laminate, semiconductor wafer with resin composition layer, substrate for mounting semiconductor with resin composition layer and semiconductor device |
| EP3786233B1 (en) * | 2018-04-26 | 2025-04-23 | Mitsubishi Gas Chemical Company, Inc. | Resin composition, laminate, semiconductor wafer with resin composition layer, substrate for mounting semiconductor with resin composition layer and semiconductor device |
| US11618109B2 (en) * | 2020-06-30 | 2023-04-04 | Electronics And Telecommunications Research Institute | Wire for electric bonding |
| CN114105812B (zh) * | 2020-08-26 | 2024-07-05 | 中国石油化工股份有限公司 | 一种利用氯丙烯副产1,2-二氯丙烷合成n,n’-双水杨叉-1,2-丙二胺的方法 |
| CN113579442B (zh) * | 2021-09-27 | 2022-02-08 | 新恒汇电子股份有限公司 | 双界面模块电学连接材料及其制备方法和应用 |
| CN115975087B (zh) * | 2023-01-04 | 2023-12-19 | 哈尔滨工业大学（威海） | 一种功能性席夫碱高分子聚合物及其制备方法与应用 |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3791027A (en) * | 1971-06-30 | 1974-02-12 | Ibm | Soldering method |
| DE2245559A1 (de) * | 1972-09-16 | 1974-04-04 | Basf Ag | Verfahren zum verkleben oder be-schichten von metallen |
| US4611046A (en) * | 1985-03-15 | 1986-09-09 | Ford Motor Company | Hydroxyl terminated azomethines and high glass transition temperature polyether products produced therefrom |
| US4737564A (en) * | 1987-06-25 | 1988-04-12 | Ashland Oil, Inc. | Polyphenate salts of triethylene diamine and their use in polymerizing a polyisocyanate and a polyepoxide |
| US5376403A (en) * | 1990-02-09 | 1994-12-27 | Capote; Miguel A. | Electrically conductive compositions and methods for the preparation and use thereof |
| US5062902A (en) * | 1990-03-30 | 1991-11-05 | Air Products And Chemicals, Inc. | Fluxing agents comprising β-diketone and β-ketoimine ligands and a process for using the same |
| US5128746A (en) * | 1990-09-27 | 1992-07-07 | Motorola, Inc. | Adhesive and encapsulant material with fluxing properties |
| KR100254927B1 (ko) * | 1994-12-07 | 2000-05-01 | 오까베 히로시 | 납땜용 플럭스, 땜납 페이스트 및 이것을 사용한 납땜 방법 |
| US5648407A (en) * | 1995-05-16 | 1997-07-15 | Minnesota Mining And Manufacturing Company | Curable resin sols and fiber-reinforced composites derived therefrom |
| US5814401A (en) * | 1997-02-04 | 1998-09-29 | Motorola, Inc. | Selectively filled adhesive film containing a fluxing agent |
| US6180696B1 (en) * | 1997-02-19 | 2001-01-30 | Georgia Tech Research Corporation | No-flow underfill of epoxy resin, anhydride, fluxing agent and surfactant |
| US5883193A (en) * | 1997-07-01 | 1999-03-16 | Minnesota Mining And Manufacturing Company | Adhesive compositions with durability under conditions of high humidity |
| JP2001510944A (ja) * | 1997-07-21 | 2001-08-07 | アギラ テクノロジーズ インコーポレイテッド | 半導体フリップチップ・パッケージおよびその製造方法 |
| US6017634A (en) * | 1997-07-21 | 2000-01-25 | Miguel Albert Capote | Carboxyl-containing polyunsaturated fluxing agent and carboxyl-reactive neutralizing agent as adhesive |
-
2001
- 2001-09-04 US US09/946,013 patent/US20030111519A1/en not_active Abandoned
-
2002
- 2002-07-03 EP EP02740016A patent/EP1423467A1/en not_active Withdrawn
- 2002-07-03 KR KR10-2004-7003183A patent/KR20040044530A/ko not_active Ceased
- 2002-07-03 CN CNA028171438A patent/CN1549843A/zh active Pending
- 2002-07-03 WO PCT/US2002/021206 patent/WO2003020816A1/en not_active Ceased
- 2002-07-03 JP JP2003525081A patent/JP2005501725A/ja not_active Ceased
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2005501725A5 (https=) | ||
| JP3797990B2 (ja) | 熱硬化性フラックス及びはんだペースト | |
| EP1701361B1 (en) | Low stress conductive adhesive | |
| US5985456A (en) | Carboxyl-containing polyunsaturated fluxing adhesive for attaching integrated circuits | |
| US9802275B2 (en) | Rosin-free thermosetting flux formulations | |
| JP5935947B2 (ja) | 導電性接合剤およびはんだ継手 | |
| CN1768099A (zh) | 导热性粘合剂组合物和器件连接工艺 | |
| KR101818960B1 (ko) | 언더필용 에폭시 솔더링 플럭스, 에폭시 솔더 페이스트 및 이를 이용한 반도체 소자 실장 방법 | |
| JP2001510205A (ja) | 重合性フラックス剤と当該フラックス剤を用いたフラックス性接着剤組成物 | |
| US7041771B1 (en) | Encapsulant with fluxing properties and method of use in flip-chip surface mount reflow soldering | |
| JP4354823B2 (ja) | 非フローアンダーフィルカプセル封止材料 | |
| WO2010134306A1 (ja) | 電子部品実装方法および電子部品実装構造 | |
| CN111745324A (zh) | 焊膏和安装结构体 | |
| JP2003082064A (ja) | 封止充填剤用液状エポキシ樹脂組成物 | |
| WO2020189359A1 (ja) | 金属粒子含有組成物及び導電性接着フィルム | |
| JP2003305588A (ja) | 接合材料 | |
| JP2010232388A (ja) | 半導体パッケージ及び半導体部品の実装構造 | |
| JP2000141084A (ja) | はんだをその場所でカプセルに包むための重合性フラックス組成物 | |
| JP4467120B2 (ja) | 導電性樹脂組成物 | |
| JP2004303874A (ja) | 半導体装置の製造方法及び半導体装置 | |
| JP2016088993A (ja) | 樹脂組成物及びフラックス | |
| JP2020170591A (ja) | 導電材料及び接続構造体 | |
| JPH06181227A (ja) | 接着剤及び半導体装置 | |
| Li | Study of thermally reworkable epoxy materials and thermal conductivity enhancement using carbon fiber for electronics packaging | |
| JP2021096903A (ja) | 導電材料、接続構造体及び接続構造体の製造方法 |