JP2016088993A - 樹脂組成物及びフラックス - Google Patents
樹脂組成物及びフラックス Download PDFInfo
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- JP2016088993A JP2016088993A JP2014223126A JP2014223126A JP2016088993A JP 2016088993 A JP2016088993 A JP 2016088993A JP 2014223126 A JP2014223126 A JP 2014223126A JP 2014223126 A JP2014223126 A JP 2014223126A JP 2016088993 A JP2016088993 A JP 2016088993A
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
- C08G59/4014—Nitrogen containing compounds
- C08G59/4028—Isocyanates; Thioisocyanates
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
- B23K35/3613—Polymers, e.g. resins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/362—Selection of compositions of fluxes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/32—Epoxy compounds containing three or more epoxy groups
- C08G59/3236—Heterocylic compounds
- C08G59/3245—Heterocylic compounds containing only nitrogen as a heteroatom
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
- C08G59/423—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof containing an atom other than oxygen belonging to a functional groups to C08G59/42, carbon and hydrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G63/00—Macromolecular compounds obtained by reactions forming a carboxylic ester link in the main chain of the macromolecule
- C08G63/02—Polyesters derived from hydroxycarboxylic acids or from polycarboxylic acids and polyhydroxy compounds
- C08G63/06—Polyesters derived from hydroxycarboxylic acids or from polycarboxylic acids and polyhydroxy compounds derived from hydroxycarboxylic acids
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/09—Carboxylic acids; Metal salts thereof; Anhydrides thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L101/00—Compositions of unspecified macromolecular compounds
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- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Wire Bonding (AREA)
Abstract
【解決手段】樹脂組成物は、分子内に2個以上のカルボキシ基とヒドロキシル基を有するヒドロキシカルボン酸と熱硬化性樹脂の割合が1:3以上1:7以下である。また、フラックスは、分子内に2個以上のカルボキシ基とヒドロキシル基を有するヒドロキシカルボン酸を8.5質量%以上16質量%以下、熱硬化性樹脂を50質量%以上60質量%以下で含み、ヒドロキシカルボン酸と熱硬化性樹脂の割合が1:7以下である。
【選択図】無し
Description
(1)試料の作製
まず、ガラスエポキシ基板に実施例及び比較例のフラックスを印刷した。ガラスエポキシ基板は、縦横の寸法が37mm×37mm、厚さが1.5mm、重さが4.1±0.1gである。また、フラックスは、φ6.5mm、厚さ80μmで印刷した。
以上のように作成された実施例及び比較例の各試料を加熱用のホットプレートに載置し、250℃で1分加熱した。加熱の後、試料を表1に示す温度に加熱しておいた別のホットプレートに載置し、1分置いた。そして、チップをピンセットで摘み持ち上げ、ガラスエポキシ基板が一緒に持ち上がるかを確認した。なお、この試験は、試料をホットプレートに載せたまま行った。試験の結果、持ち上がったものを○、持ち上がらなかったものを×と評価した。
フラックス残渣の硬度の評価は、鉛筆硬度試験(JIS K5400)により行った。試験方法は、テスト基板に、実施例と比較例のフラックスを厚さ0.15mmで印刷した試料を作成し、試料をリフローした。リフロー条件は、昇温温度が1.46℃/sec(30−250℃)、ピーク温度が249℃、かつ、217℃以上で116sec保持、降下温度が1.0℃/sec、酸素濃度が100ppmとした。硬化温度確認試験は、上述した試験1と同様の評価で行い、150℃で硬化を確認したものを○とした。
試験方法は、銅板に実施例と比較例のフラックスを厚さ0.2mmで印刷した試料を作成し、試料をリフローした。リフロー条件は、ピーク温度が245℃、かつ、220℃以上で40sec保持、窒素濃度が500ppm以下とした。リフロー後、水を使用して超音波洗浄を1分間行い、エアブロー後、目視でフラックス残渣が残っていないか確認した。フラックス残渣の洗浄性の評価は、フラックス残渣を除去できたものを○とした。
Claims (6)
- 分子内に2個以上のカルボキシ基とヒドロキシル基を有するヒドロキシカルボン酸と熱硬化性樹脂の割合が1:3以上1:7以下である
ことを特徴とする樹脂組成物。 - 分子内に2個以上のカルボキシ基とヒドロキシル基を有するヒドロキシカルボン酸を8.5質量%以上16質量%以下、熱硬化性樹脂を50質量%以上60質量%以下で含み、ヒドロキシカルボン酸と熱硬化性樹脂の割合が1:7以下である
ことを特徴とするフラックス。 - ヒドロキシカルボン酸と熱硬化性樹脂の割合が1:3.75以上1:7以下である
ことを特徴とする請求項2に記載のフラックス。 - ヒドロキシカルボン酸が酒石酸、リンゴ酸、クエン酸、ヒドロキシマロン酸である
ことを特徴とする請求項2〜請求項3の何れか1項に記載のフラックス。 - 熱硬化性樹脂が、エポキシ樹脂、フェノール樹脂、ポリイミド系樹脂、ポリウレタン系樹脂、不飽和ポリエステル樹脂である
ことを特徴とする請求項2〜請求項4の何れか1項に記載のフラックス。 - 熱硬化性樹脂が、トリス−(2,3−エポキシプロピル)−イソシアヌレートである
ことを特徴とする請求項2〜請求項5の何れか1項に記載のフラックス。
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014223126A JP6374298B2 (ja) | 2014-10-31 | 2014-10-31 | フラックス及びフラックスを用いた接合方法 |
US15/522,883 US10160827B2 (en) | 2014-10-31 | 2015-10-14 | Resin composition and flux |
PCT/JP2015/079026 WO2016067919A1 (ja) | 2014-10-31 | 2015-10-14 | 樹脂組成物及びフラックス |
KR1020177014328A KR20170077187A (ko) | 2014-10-31 | 2015-10-14 | 수지 조성물 및 플럭스 |
EP15855383.4A EP3214138A4 (en) | 2014-10-31 | 2015-10-14 | Resin composition and flux |
CN201580059362.0A CN107109071A (zh) | 2014-10-31 | 2015-10-14 | 树脂组合物及助焊剂 |
TW104134164A TWI668259B (zh) | 2014-10-31 | 2015-10-19 | Resin composition and flux |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014223126A JP6374298B2 (ja) | 2014-10-31 | 2014-10-31 | フラックス及びフラックスを用いた接合方法 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2016088993A true JP2016088993A (ja) | 2016-05-23 |
JP2016088993A5 JP2016088993A5 (ja) | 2017-06-01 |
JP6374298B2 JP6374298B2 (ja) | 2018-08-15 |
Family
ID=55857260
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2014223126A Active JP6374298B2 (ja) | 2014-10-31 | 2014-10-31 | フラックス及びフラックスを用いた接合方法 |
Country Status (7)
Country | Link |
---|---|
US (1) | US10160827B2 (ja) |
EP (1) | EP3214138A4 (ja) |
JP (1) | JP6374298B2 (ja) |
KR (1) | KR20170077187A (ja) |
CN (1) | CN107109071A (ja) |
TW (1) | TWI668259B (ja) |
WO (1) | WO2016067919A1 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11833620B2 (en) | 2018-01-16 | 2023-12-05 | Senju Metal Industry Co., Ltd. | Flux and solder paste |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH107933A (ja) * | 1996-02-28 | 1998-01-13 | Cts Corp | 焼結性組成物及びそれを用いた多層電気的組立体並びにその製造方法 |
JP2005519168A (ja) * | 2002-03-01 | 2005-06-30 | ナショナル スターチ アンド ケミカル インベストメント ホールディング コーポレーション | ウェハーパッケージング用のアンダーフィル封入材及びその塗布方法 |
JP2012072213A (ja) * | 2010-09-27 | 2012-04-12 | Panasonic Corp | 熱硬化性樹脂組成物及び半導体部品実装基板 |
JP2012072211A (ja) * | 2010-09-27 | 2012-04-12 | Panasonic Corp | 熱硬化性樹脂組成物及び半導体部品実装基板 |
WO2012160722A1 (ja) * | 2011-05-25 | 2012-11-29 | ハリマ化成株式会社 | はんだペースト用フラックスおよびはんだペースト |
JP2013043931A (ja) * | 2011-08-24 | 2013-03-04 | Panasonic Corp | 熱硬化性樹脂組成物及び回路基板 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2646394B2 (ja) | 1989-06-15 | 1997-08-27 | 千住金属工業株式会社 | 水溶性はんだ付け用フラックス |
US4988395A (en) * | 1989-01-31 | 1991-01-29 | Senju Metal Industry Co., Ltd. | Water-soluble soldering flux and paste solder using the flux |
US5177134A (en) * | 1990-12-03 | 1993-01-05 | Motorola, Inc. | Tacking agent |
US20060194064A1 (en) | 2002-03-01 | 2006-08-31 | Xiao Allison Y | Underfill encapsulant for wafer packaging and method for its application |
JP4211828B2 (ja) | 2006-09-12 | 2009-01-21 | 株式会社日立製作所 | 実装構造体 |
CN101062536A (zh) * | 2007-06-01 | 2007-10-31 | 中南大学 | 无铅焊锡用无卤素免清洗助焊剂 |
JP2013256584A (ja) | 2012-06-12 | 2013-12-26 | Panasonic Corp | 熱硬化性樹脂組成物およびフラックス組成物とそれを用いた半導体装置 |
-
2014
- 2014-10-31 JP JP2014223126A patent/JP6374298B2/ja active Active
-
2015
- 2015-10-14 CN CN201580059362.0A patent/CN107109071A/zh active Pending
- 2015-10-14 WO PCT/JP2015/079026 patent/WO2016067919A1/ja active Application Filing
- 2015-10-14 US US15/522,883 patent/US10160827B2/en active Active
- 2015-10-14 EP EP15855383.4A patent/EP3214138A4/en not_active Withdrawn
- 2015-10-14 KR KR1020177014328A patent/KR20170077187A/ko not_active Application Discontinuation
- 2015-10-19 TW TW104134164A patent/TWI668259B/zh not_active IP Right Cessation
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH107933A (ja) * | 1996-02-28 | 1998-01-13 | Cts Corp | 焼結性組成物及びそれを用いた多層電気的組立体並びにその製造方法 |
JP2005519168A (ja) * | 2002-03-01 | 2005-06-30 | ナショナル スターチ アンド ケミカル インベストメント ホールディング コーポレーション | ウェハーパッケージング用のアンダーフィル封入材及びその塗布方法 |
JP2012072213A (ja) * | 2010-09-27 | 2012-04-12 | Panasonic Corp | 熱硬化性樹脂組成物及び半導体部品実装基板 |
JP2012072211A (ja) * | 2010-09-27 | 2012-04-12 | Panasonic Corp | 熱硬化性樹脂組成物及び半導体部品実装基板 |
WO2012160722A1 (ja) * | 2011-05-25 | 2012-11-29 | ハリマ化成株式会社 | はんだペースト用フラックスおよびはんだペースト |
JP2013043931A (ja) * | 2011-08-24 | 2013-03-04 | Panasonic Corp | 熱硬化性樹脂組成物及び回路基板 |
Also Published As
Publication number | Publication date |
---|---|
EP3214138A1 (en) | 2017-09-06 |
TW201629135A (zh) | 2016-08-16 |
WO2016067919A1 (ja) | 2016-05-06 |
KR20170077187A (ko) | 2017-07-05 |
US10160827B2 (en) | 2018-12-25 |
US20170321000A1 (en) | 2017-11-09 |
TWI668259B (zh) | 2019-08-11 |
JP6374298B2 (ja) | 2018-08-15 |
CN107109071A (zh) | 2017-08-29 |
EP3214138A4 (en) | 2018-06-06 |
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