JP4354823B2 - 非フローアンダーフィルカプセル封止材料 - Google Patents
非フローアンダーフィルカプセル封止材料 Download PDFInfo
- Publication number
- JP4354823B2 JP4354823B2 JP2003564930A JP2003564930A JP4354823B2 JP 4354823 B2 JP4354823 B2 JP 4354823B2 JP 2003564930 A JP2003564930 A JP 2003564930A JP 2003564930 A JP2003564930 A JP 2003564930A JP 4354823 B2 JP4354823 B2 JP 4354823B2
- Authority
- JP
- Japan
- Prior art keywords
- epoxy
- underfill
- resin
- flow underfill
- encapsulation material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
- C08L63/04—Epoxynovolacs
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/563—Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01019—Potassium [K]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01067—Holmium [Ho]
Description
実施例1.
50重量%のBis‐Fエポキシ樹脂 (8230E、CVCから入手可能である) 、22重量%のポリセバシン酸ポリ無水物 (PSPA、Lonzaから入手可能である) 、22重量%のメチルヘキサヒドロフタル酸無水物 (MHHPA、Lonzaから入手可能である) 、触媒として0.2重量%の1‐シアノエチル‐2‐エチル‐4‐メチル‐イミダゾール (Poly Organix, Inc. から入手可能である) および0.4重量%の界面活性剤を含有するアンダーフィルカプセル封止組成物を配合した。ステンレス鋼の容器にビスフェノール‐Fエポキシ樹脂を添加することによって、組成物を調製した。次いで、機械的に攪拌しながら、MHHPAを添加した。20ミクロンより小さい粒度を有する微小化粉末の形態のPSPAを攪拌しながら添加した。この組成物の温度を約20〜25℃に調節し、イミダゾール触媒を添加した。次に、界面活性剤を添加した。この組成物を約15分間混合し、真空下に脱泡した。
実施例1に記載するプロセスに従い、実施例2〜5ついてのアンダーフィル組成物を作った。各アンダーフィル材料の組成を表4に記載する:
Claims (6)
- 下記の成分を含んでなる非フローアンダーフィルカプセル封止材料:
a) 1種または複数種のエポキシ樹脂、
b) ポリセバシン酸ポリ無水物、および
c) 1種または複数種の触媒、
ここで前記材料は非線状ポリ無水物を含有しない。 - 前記エポキシ樹脂が、3,4‐エポキシシクロヘキシルメチル‐3,4‐エポキシシクロヘキサンカルボキシレート、ビニルシクロヘキセンジオキシド、3,4‐エポキシ‐6‐メチルシクロヘキシルメチル‐3,4‐エポキシシクロヘキサンカルボキシレート、ジシクロペンタジエンジオキシド、ビスフェノールA型樹脂、2,2‐ビス (4‐ヒドロキシフェニル) プロパン‐エピクロロヒドリンコポリマー、ビスフェノールF型樹脂、エポキシノボラック樹脂、ポリ(フェニルグリシジルエーテル)‐コ‐ホルムアルデヒド、ビフェニル型エポキシ樹脂、ジシクロペンタジエン‐フェノールエポキシ樹脂、ナフタレンエポキシ樹脂、エポキシ機能性ブタジエンアクリロニトリルコポリマー、エポキシ機能性ポリジメチルシロキサン、およびそれらの混合物から成る群から選択される、請求項1に記載の非フローアンダーフィルカプセル封止材料。
- 前記エポキシ樹脂が、1分子当たり1個より多くの1,2‐エポキシ基を含有するビスフェノール‐F型エポキシ樹脂を含んでなる、請求項2に記載の非フローアンダーフィルカプセル封止材料。
- 前記ポリセバシン酸ポリ無水物が、カプセル封止材料の5重量%〜35重量%の範囲を構成する、請求項1〜3のいずれか1項に記載の非フローアンダーフィルカプセル封止材料。
- 前記触媒が、遅延した反応性のためにブロックされているイミダゾールまたは保護されているイミダゾールである、請求項1〜4のいずれか1項に記載の非フローアンダーフィルカプセル封止材料。
- 前記触媒が、1‐シアノエチル‐2‐エチル‐4‐メチル‐イミダゾール、アルキル置換イミダゾール、トリフェニルホスフィン、イミダゾリウム塩、イミダゾールホスフェート、オニウムボレート、金属キレート、およびそれらの混合物から成る群から選択される、請求項1〜4のいずれか1項に記載の非フローアンダーフィルカプセル封止材料。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/062,906 US6624216B2 (en) | 2002-01-31 | 2002-01-31 | No-flow underfill encapsulant |
PCT/US2003/001677 WO2003065447A2 (en) | 2002-01-31 | 2003-01-21 | No-flow underfill encapsulant |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009024308A Division JP2009144169A (ja) | 2002-01-31 | 2009-02-04 | 非フローアンダーフィルカプセル封止材料 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005516115A JP2005516115A (ja) | 2005-06-02 |
JP4354823B2 true JP4354823B2 (ja) | 2009-10-28 |
Family
ID=27658618
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2003564930A Expired - Fee Related JP4354823B2 (ja) | 2002-01-31 | 2003-01-21 | 非フローアンダーフィルカプセル封止材料 |
JP2009024308A Pending JP2009144169A (ja) | 2002-01-31 | 2009-02-04 | 非フローアンダーフィルカプセル封止材料 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009024308A Pending JP2009144169A (ja) | 2002-01-31 | 2009-02-04 | 非フローアンダーフィルカプセル封止材料 |
Country Status (7)
Country | Link |
---|---|
US (1) | US6624216B2 (ja) |
EP (1) | EP1470584A2 (ja) |
JP (2) | JP4354823B2 (ja) |
KR (1) | KR20040090999A (ja) |
CN (1) | CN1643682A (ja) |
AU (1) | AU2003216074A1 (ja) |
WO (1) | WO2003065447A2 (ja) |
Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6624216B2 (en) * | 2002-01-31 | 2003-09-23 | National Starch And Chemical Investment Holding Corporation | No-flow underfill encapsulant |
US20060194064A1 (en) * | 2002-03-01 | 2006-08-31 | Xiao Allison Y | Underfill encapsulant for wafer packaging and method for its application |
US6800373B2 (en) * | 2002-10-07 | 2004-10-05 | General Electric Company | Epoxy resin compositions, solid state devices encapsulated therewith and method |
US7056978B2 (en) | 2002-11-06 | 2006-06-06 | National Starch And Chemical Investment Holding Corporation | Toughened epoxy-anhydride no-flow underfill encapsulant |
CN1802603A (zh) | 2003-07-17 | 2006-07-12 | 霍尼韦尔国际公司 | 用于高级微电子应用的平面化薄膜及其生产装置和方法 |
JP2006128567A (ja) * | 2004-11-01 | 2006-05-18 | Three M Innovative Properties Co | 半導体パッケージのプリント配線板への接続方法 |
US20060177966A1 (en) * | 2005-02-09 | 2006-08-10 | Jayesh Shah | Package or pre-applied foamable underfill for lead-free process |
US7446136B2 (en) * | 2005-04-05 | 2008-11-04 | Momentive Performance Materials Inc. | Method for producing cure system, adhesive system, and electronic device |
US7405246B2 (en) * | 2005-04-05 | 2008-07-29 | Momentive Performance Materials Inc. | Cure system, adhesive system, electronic device |
JP2006312702A (ja) * | 2005-04-08 | 2006-11-16 | Hitachi Chem Co Ltd | エポキシ樹脂用硬化剤、その製造方法、それを用いたエポキシ樹脂組成物、その硬化物及び光半導体 |
US20070095432A1 (en) | 2005-11-02 | 2007-05-03 | National Starch And Chemical Investment Holding Corporation | Fluxing compositions containing benzotriazoles |
TWI301657B (en) * | 2006-01-27 | 2008-10-01 | Siliconware Precision Industries Co Ltd | Flip-chip semiconductor device and method for fabricating the same |
DE102007044620A1 (de) | 2007-09-19 | 2009-04-16 | Semikron Elektronik Gmbh & Co. Kg | Anordnung mit einer Verbindungseinrichtung und mindestens einem Halbleiterbauelement |
DE102009000888B4 (de) * | 2009-02-16 | 2011-03-24 | Semikron Elektronik Gmbh & Co. Kg | Halbleiteranordnung |
WO2011090038A1 (ja) * | 2010-01-21 | 2011-07-28 | 積水化学工業株式会社 | 熱硬化性樹脂組成物、フリップチップ実装用接着剤、半導体装置の製造方法、及び、半導体装置 |
CN102516963B (zh) * | 2011-10-17 | 2013-07-31 | 中国石油天然气股份有限公司 | 用于油水井套管修复的化学复合树脂封固剂 |
EP3228641B1 (en) * | 2014-12-09 | 2019-07-03 | Tokyo Ohka Kogyo Co., Ltd. | Curable composition |
CN105802451B (zh) * | 2016-06-02 | 2018-08-28 | 湖南柯盛新材料有限公司 | 一种双组份环氧美缝剂及其制备方法 |
CN106190003B (zh) * | 2016-08-18 | 2018-12-28 | 苏州大乘环保新材有限公司 | 一种勾缝剂 |
US20210242102A1 (en) * | 2020-02-04 | 2021-08-05 | Intel Corporation | Underfill material for integrated circuit (ic) package |
CN111394053B (zh) * | 2020-03-03 | 2021-10-26 | 华南理工大学 | 一种带助焊功能非流动底部填充胶及其制备方法 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
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US3848045A (en) * | 1971-11-17 | 1974-11-12 | Ferro Corp | Pre-fabricated gel coats |
US4102851A (en) * | 1977-03-22 | 1978-07-25 | Westinghouse Electric Corp. | Alumina-thickened cycloaliphatic epoxy materials for use in atmospheres of arced sulfur hexafluoride and articles thereof |
JPS61261317A (ja) * | 1985-05-15 | 1986-11-19 | Hitachi Ltd | 可とう性エポキシ樹脂組成物及びその用途 |
US4732952A (en) * | 1986-12-05 | 1988-03-22 | Rohm And Haas Company | "B stageable" high service temperature epoxy thermosets |
JPH04178420A (ja) * | 1990-11-10 | 1992-06-25 | Mitsui Petrochem Ind Ltd | エポキシ樹脂組成物 |
US5356691A (en) * | 1991-09-30 | 1994-10-18 | Kabushiki Kaisha Kobe Seiko Sho | Flexible composite sheet for electric insulation |
JPH0593046A (ja) * | 1991-09-30 | 1993-04-16 | Kobe Steel Ltd | 可撓性エポキシ系樹脂組成物 |
EP0870329A1 (en) * | 1995-08-11 | 1998-10-14 | Kenneth J. Kirsten | Epoxy resin based solder paste |
US6180696B1 (en) | 1997-02-19 | 2001-01-30 | Georgia Tech Research Corporation | No-flow underfill of epoxy resin, anhydride, fluxing agent and surfactant |
US5948922A (en) * | 1997-02-20 | 1999-09-07 | Cornell Research Foundation, Inc. | Compounds with substituted cyclic hydrocarbon moieties linked by secondary or tertiary oxycarbonyl containing moiety providing reworkable cured thermosets |
GB9808587D0 (en) * | 1998-04-22 | 1998-06-24 | Craig Hugh P | Adhesive and encapsulating material with fluxing properties |
WO1999054372A1 (en) * | 1998-04-22 | 1999-10-28 | Multicore Solders Limited | Adhesive and encapsulating material with fluxing properties |
US6624216B2 (en) * | 2002-01-31 | 2003-09-23 | National Starch And Chemical Investment Holding Corporation | No-flow underfill encapsulant |
-
2002
- 2002-01-31 US US10/062,906 patent/US6624216B2/en not_active Expired - Fee Related
-
2003
- 2003-01-21 WO PCT/US2003/001677 patent/WO2003065447A2/en active Application Filing
- 2003-01-21 EP EP20030734968 patent/EP1470584A2/en not_active Withdrawn
- 2003-01-21 KR KR10-2004-7011759A patent/KR20040090999A/ko not_active Application Discontinuation
- 2003-01-21 AU AU2003216074A patent/AU2003216074A1/en not_active Abandoned
- 2003-01-21 CN CNA038066106A patent/CN1643682A/zh active Pending
- 2003-01-21 JP JP2003564930A patent/JP4354823B2/ja not_active Expired - Fee Related
-
2009
- 2009-02-04 JP JP2009024308A patent/JP2009144169A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
US20030149135A1 (en) | 2003-08-07 |
EP1470584A2 (en) | 2004-10-27 |
JP2009144169A (ja) | 2009-07-02 |
JP2005516115A (ja) | 2005-06-02 |
CN1643682A (zh) | 2005-07-20 |
AU2003216074A1 (en) | 2003-09-02 |
WO2003065447A2 (en) | 2003-08-07 |
US6624216B2 (en) | 2003-09-23 |
KR20040090999A (ko) | 2004-10-27 |
WO2003065447A3 (en) | 2004-03-25 |
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