JP2005501725A - フラックス組成物 - Google Patents

フラックス組成物 Download PDF

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Publication number
JP2005501725A
JP2005501725A JP2003525081A JP2003525081A JP2005501725A JP 2005501725 A JP2005501725 A JP 2005501725A JP 2003525081 A JP2003525081 A JP 2003525081A JP 2003525081 A JP2003525081 A JP 2003525081A JP 2005501725 A JP2005501725 A JP 2005501725A
Authority
JP
Japan
Prior art keywords
composition
diyl
electrical component
solder
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
JP2003525081A
Other languages
English (en)
Japanese (ja)
Other versions
JP2005501725A5 (https=
Inventor
ジェイ． キニー，ロバート
エー． クロップ，マイケル
スコット ビー． チャールズ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Innovative Properties Co
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of JP2005501725A publication Critical patent/JP2005501725A/ja
Publication of JP2005501725A5 publication Critical patent/JP2005501725A5/ja
Ceased legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/29—Compounds containing one or more carbon-to-nitrogen double bonds
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/012—Manufacture or treatment of encapsulations on active surfaces of flip-chip devices, e.g. forming underfills
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3613—Polymers, e.g. resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3615—N-compounds
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3489—Composition of fluxes; Application thereof; Other processes of activating the contact surfaces
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/853—On the same surface
    • H10W72/856—Bump connectors and die-attach connectors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Adhesives Or Adhesive Processes (AREA)
JP2003525081A 2001-09-04 2002-07-03 フラックス組成物 Ceased JP2005501725A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/946,013 US20030111519A1 (en) 2001-09-04 2001-09-04 Fluxing compositions
PCT/US2002/021206 WO2003020816A1 (en) 2001-09-04 2002-07-03 Fluxing compositions

Publications (2)

Publication Number Publication Date
JP2005501725A true JP2005501725A (ja) 2005-01-20
JP2005501725A5 JP2005501725A5 (https=) 2006-01-05

Family

ID=25483831

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003525081A Ceased JP2005501725A (ja) 2001-09-04 2002-07-03 フラックス組成物

Country Status (6)

Country Link
US (1) US20030111519A1 (https=)
EP (1) EP1423467A1 (https=)
JP (1) JP2005501725A (https=)
KR (1) KR20040044530A (https=)
CN (1) CN1549843A (https=)
WO (1) WO2003020816A1 (https=)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006334669A (ja) * 2005-06-03 2006-12-14 Natl Starch & Chem Investment Holding Corp フラクシング組成物
WO2008044330A1 (en) * 2006-10-03 2008-04-17 Sumitomo Bakelite Co., Ltd. Adhesive tape
WO2019208615A1 (ja) * 2018-04-26 2019-10-31 三菱瓦斯化学株式会社 樹脂組成物、積層体、樹脂組成物層付き半導体ウェハ、樹脂組成物層付き半導体搭載用基板、及び半導体装置

Families Citing this family (56)

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WO2003101164A1 (en) * 2002-05-23 2003-12-04 3M Innovative Properties Company Nanoparticle filled underfill
US6796482B2 (en) * 2002-10-31 2004-09-28 Freescale Semiconductor, Inc. Phase separated system for fluxing
US7004375B2 (en) * 2003-05-23 2006-02-28 National Starch And Chemical Investment Holding Corporation Pre-applied fluxing underfill composition having pressure sensitive adhesive properties
JP4170839B2 (ja) * 2003-07-11 2008-10-22 日東電工株式会社 積層シート
US7213739B2 (en) * 2004-04-02 2007-05-08 Fry's Metals, Inc. Underfill fluxing curative
US20060025509A1 (en) * 2004-07-29 2006-02-02 Ruzhi Zhang Fluxing no-flow underfill composition containing benzoxazines
US7247683B2 (en) * 2004-08-05 2007-07-24 Fry's Metals, Inc. Low voiding no flow fluxing underfill for electronic devices
US7687119B2 (en) * 2005-04-04 2010-03-30 Henkel Ag & Co. Kgaa Radiation-curable desiccant-filled adhesive/sealant
US20060223978A1 (en) * 2005-04-04 2006-10-05 Shengqian Kong Radiation- or thermally-curable oxetane barrier sealants
US20060223937A1 (en) * 2005-04-04 2006-10-05 Herr Donald E Radiation curable cycloaliphatic barrier sealants
JP4883996B2 (ja) * 2005-05-24 2012-02-22 四国化成工業株式会社 水溶性プレフラックス及びその利用
US20070049665A1 (en) * 2005-08-25 2007-03-01 Musa Osama M Quinolinols and quinolinol derivatives as adhesion promoters in die attach adhesives
US7378523B2 (en) * 2005-08-25 2008-05-27 National Starch And Chemical Investment Holding Corporation Quinolinols as fluxing and accelerating agents for underfill compositions
US20130131007A1 (en) 2005-09-07 2013-05-23 Bebaas, Inc. Vitamin b12 compositions
US7468407B2 (en) * 2005-09-26 2008-12-23 National Starch And Chemical Investment Holding Copporation Metal salts of quinolinols and quinolinol derivatives in curable compositions
US20070095432A1 (en) * 2005-11-02 2007-05-03 National Starch And Chemical Investment Holding Corporation Fluxing compositions containing benzotriazoles
JP4757070B2 (ja) * 2006-03-27 2011-08-24 富士通株式会社 半田付け用フラックス及び半導体素子の接合方法
JP2008179698A (ja) * 2007-01-24 2008-08-07 Fujifilm Corp レーザー分解用樹脂組成物およびそれを用いるパターン形成材料
US8835551B2 (en) * 2007-09-14 2014-09-16 3M Innovative Properties Company Ultra low viscosity iodine containing amorphous fluoropolymers
US20090283133A1 (en) * 2008-05-14 2009-11-19 3M Innovative Properties Company Solar concentrating mirror
US20090283144A1 (en) * 2008-05-14 2009-11-19 3M Innovative Properties Company Solar concentrating mirror
ES2690653T3 (es) * 2008-06-16 2018-11-21 3M Innovative Properties Company Composiciones curables reforzadas
US8334170B2 (en) * 2008-06-27 2012-12-18 Taiwan Semiconductor Manufacturing Company, Ltd. Method for stacking devices
US9523516B2 (en) 2008-12-30 2016-12-20 3M Innovative Properties Company Broadband reflectors, concentrated solar power systems, and methods of using the same
KR101197193B1 (ko) * 2010-01-05 2012-11-02 도레이첨단소재 주식회사 비유동성 언더필용 수지 조성물, 그를 이용한 비유동성 언더필 필름 및 그 비유동성 언더필 필름의 제조방법
TWI500467B (zh) * 2010-01-08 2015-09-21 Arakawa Chem Ind 無鉛焊劑用助熔劑組成物及無鉛焊劑膏
US8070043B1 (en) * 2010-12-02 2011-12-06 Rohm And Haas Electronic Materials Llc Curable flux composition and method of soldering
US8070044B1 (en) * 2010-12-02 2011-12-06 Rohm And Haas Electronic Materials Llc Polyamine flux composition and method of soldering
US8070045B1 (en) * 2010-12-02 2011-12-06 Rohm And Haas Electronic Materials Llc Curable amine flux composition and method of soldering
US8070047B1 (en) * 2010-12-02 2011-12-06 Rohm And Haas Electronic Materials Llc Flux composition and method of soldering
US8070046B1 (en) * 2010-12-02 2011-12-06 Rohm And Haas Electronic Materials Llc Amine flux composition and method of soldering
JP5856747B2 (ja) * 2011-03-28 2016-02-10 ハリマ化成株式会社 はんだ付け用フラックスおよびはんだペースト組成物
JP4897932B1 (ja) * 2011-05-25 2012-03-14 ハリマ化成株式会社 はんだペースト用フラックスおよびはんだペースト
JP6155261B2 (ja) 2011-07-15 2017-06-28 スリーエム イノベイティブ プロパティズ カンパニー 半導体パッケージ樹脂組成物及びその使用方法
US8430295B2 (en) 2011-09-30 2013-04-30 Rohm And Haas Electronic Materials Llc Curable flux composition and method of soldering
US8430293B2 (en) 2011-09-30 2013-04-30 Rohm And Haas Electronic Materials Llc Curable amine, carboxylic acid flux composition and method of soldering
US8434667B2 (en) 2011-09-30 2013-05-07 Rohm And Haas Electronic Materials Llc Polyamine, carboxylic acid flux composition and method of soldering
US8430294B2 (en) 2011-09-30 2013-04-30 Rohm And Haas Electronic Materials Llc Amine, carboxylic acid flux composition and method of soldering
US8434666B2 (en) 2011-09-30 2013-05-07 Rohm And Haas Electronic Materials Llc Flux composition and method of soldering
JP2014091744A (ja) 2012-10-31 2014-05-19 3M Innovative Properties Co アンダーフィル組成物、半導体装置およびその製造方法
CN103056560B (zh) * 2012-12-28 2015-03-11 深圳市美克科技有限公司 软钎焊助焊剂
US9631065B2 (en) * 2013-03-12 2017-04-25 Intel Corporation Methods of forming wafer level underfill materials and structures formed thereby
CN104646861A (zh) * 2013-11-25 2015-05-27 刘现梅 一种含有噻二唑衍生物的助焊剂
KR20170093891A (ko) 2014-12-08 2017-08-16 쓰리엠 이노베이티브 프로퍼티즈 캄파니 아크릴 폴리비닐 아세탈 필름, 조성물, 및 열 접합성 물품
CN107001549A (zh) 2014-12-08 2017-08-01 3M创新有限公司 基于丙烯酸系嵌段共聚物共混物的组合物
JP6709221B2 (ja) 2014-12-08 2020-06-10 スリーエム イノベイティブ プロパティズ カンパニー アクリル系ポリビニルアセタールフィルム及び組成物
WO2017112458A1 (en) 2015-12-22 2017-06-29 3M Innovative Properties Company Acrylic polyvinyl acetal graphic films
JP7030054B2 (ja) 2015-12-22 2022-03-04 スリーエム イノベイティブ プロパティズ カンパニー 接着剤層を備えたアクリルポリビニルアセタールフィルム
US11034830B2 (en) 2015-12-22 2021-06-15 3M Innovative Properties Company Acrylic polyvinyl acetal films comprising a second layer
CN108430766B (zh) 2015-12-22 2020-11-10 3M创新有限公司 包括结构化层的丙烯酸类膜
KR102437478B1 (ko) 2016-06-07 2022-08-30 쓰리엠 이노베이티브 프로퍼티즈 캄파니 광 지향 용품을 위한 아크릴 폴리비닐 아세탈 필름
US11935803B2 (en) 2018-04-26 2024-03-19 Mitsubishi Gas Chemical Company, Inc. Resin composition, laminate, semiconductor wafer with resin composition layer, substrate for mounting semiconductor with resin composition layer and semiconductor device
US11618109B2 (en) * 2020-06-30 2023-04-04 Electronics And Telecommunications Research Institute Wire for electric bonding
CN114105812B (zh) * 2020-08-26 2024-07-05 中国石油化工股份有限公司 一种利用氯丙烯副产1,2-二氯丙烷合成n,n’-双水杨叉-1,2-丙二胺的方法
CN113579442B (zh) * 2021-09-27 2022-02-08 新恒汇电子股份有限公司 双界面模块电学连接材料及其制备方法和应用
CN115975087B (zh) * 2023-01-04 2023-12-19 哈尔滨工业大学（威海） 一种功能性席夫碱高分子聚合物及其制备方法与应用

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Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006334669A (ja) * 2005-06-03 2006-12-14 Natl Starch & Chem Investment Holding Corp フラクシング組成物
WO2008044330A1 (en) * 2006-10-03 2008-04-17 Sumitomo Bakelite Co., Ltd. Adhesive tape
US8597785B2 (en) 2006-10-03 2013-12-03 Sumitomo Bakelite Co., Ltd. Adhesive film
WO2019208615A1 (ja) * 2018-04-26 2019-10-31 三菱瓦斯化学株式会社 樹脂組成物、積層体、樹脂組成物層付き半導体ウェハ、樹脂組成物層付き半導体搭載用基板、及び半導体装置
KR20210004943A (ko) 2018-04-26 2021-01-13 미츠비시 가스 가가쿠 가부시키가이샤 수지 조성물, 적층체, 수지 조성물층이 형성된 반도체 웨이퍼, 수지 조성물층이 형성된 반도체 탑재용 기판, 및 반도체 장치
JPWO2019208615A1 (ja) * 2018-04-26 2021-05-27 三菱瓦斯化学株式会社 樹脂組成物、積層体、樹脂組成物層付き半導体ウェハ、樹脂組成物層付き半導体搭載用基板、及び半導体装置
JP7256967B2 (ja) 2018-04-26 2023-04-13 三菱瓦斯化学株式会社 樹脂組成物、積層体、樹脂組成物層付き半導体ウェハ、樹脂組成物層付き半導体搭載用基板、及び半導体装置
US11924979B2 (en) 2018-04-26 2024-03-05 Mitsubishi Gas Chemical Company, Inc. Resin composition, laminate, semiconductor wafer with resin composition layer, substrate for mounting semiconductor with resin composition layer and semiconductor device
KR102766027B1 (ko) * 2018-04-26 2025-02-10 미츠비시 가스 가가쿠 가부시키가이샤 수지 조성물, 적층체, 수지 조성물층이 형성된 반도체 웨이퍼, 수지 조성물층이 형성된 반도체 탑재용 기판, 및 반도체 장치

Also Published As

Publication number Publication date
WO2003020816A1 (en) 2003-03-13
KR20040044530A (ko) 2004-05-28
EP1423467A1 (en) 2004-06-02
US20030111519A1 (en) 2003-06-19
CN1549843A (zh) 2004-11-24

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