CN1549843A - 助熔组合物 - Google Patents

助熔组合物 Download PDF

Info

Publication number
CN1549843A
CN1549843A CNA028171438A CN02817143A CN1549843A CN 1549843 A CN1549843 A CN 1549843A CN A028171438 A CNA028171438 A CN A028171438A CN 02817143 A CN02817143 A CN 02817143A CN 1549843 A CN1549843 A CN 1549843A
Authority
CN
China
Prior art keywords
group
composition
solder
alkyl
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA028171438A
Other languages
English (en)
Chinese (zh)
Inventor
Rj
R·J·金尼
M·A·克罗普
S·B·查尔斯
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Innovative Properties Co
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of CN1549843A publication Critical patent/CN1549843A/zh
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/29—Compounds containing one or more carbon-to-nitrogen double bonds
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/012—Manufacture or treatment of encapsulations on active surfaces of flip-chip devices, e.g. forming underfills
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3613—Polymers, e.g. resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3615—N-compounds
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3489—Composition of fluxes; Application thereof; Other processes of activating the contact surfaces
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/853—On the same surface
    • H10W72/856—Bump connectors and die-attach connectors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Adhesives Or Adhesive Processes (AREA)
CNA028171438A 2001-09-04 2002-07-03 助熔组合物 Pending CN1549843A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/946,013 US20030111519A1 (en) 2001-09-04 2001-09-04 Fluxing compositions
US09/946,013 2001-09-04

Publications (1)

Publication Number Publication Date
CN1549843A true CN1549843A (zh) 2004-11-24

Family

ID=25483831

Family Applications (1)

Application Number Title Priority Date Filing Date
CNA028171438A Pending CN1549843A (zh) 2001-09-04 2002-07-03 助熔组合物

Country Status (6)

Country Link
US (1) US20030111519A1 (https=)
EP (1) EP1423467A1 (https=)
JP (1) JP2005501725A (https=)
KR (1) KR20040044530A (https=)
CN (1) CN1549843A (https=)
WO (1) WO2003020816A1 (https=)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103056560A (zh) * 2012-12-28 2013-04-24 深圳市美克科技有限公司 软钎焊助焊剂
CN103459086A (zh) * 2011-03-28 2013-12-18 播磨化成株式会社 钎焊用焊剂及焊膏组合物
CN103517782A (zh) * 2011-05-25 2014-01-15 播磨化成株式会社 焊膏用焊剂和焊膏
CN104646861A (zh) * 2013-11-25 2015-05-27 刘现梅 一种含有噻二唑衍生物的助焊剂
CN105097567A (zh) * 2008-06-27 2015-11-25 台湾积体电路制造股份有限公司 堆叠器件的方法
CN112004889A (zh) * 2018-04-26 2020-11-27 三菱瓦斯化学株式会社 树脂组合物、层叠体、带树脂组合物层的半导体晶圆、带树脂组合物层的半导体搭载用基板和半导体装置
CN113579442A (zh) * 2021-09-27 2021-11-02 新恒汇电子股份有限公司 双界面模块电学连接材料及其制备方法和应用
CN114105812A (zh) * 2020-08-26 2022-03-01 中国石油化工股份有限公司 一种利用氯丙烯副产1,2-二氯丙烷合成n,n’-双水杨叉-1,2-丙二胺的方法

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WO2003101164A1 (en) * 2002-05-23 2003-12-04 3M Innovative Properties Company Nanoparticle filled underfill
US6796482B2 (en) * 2002-10-31 2004-09-28 Freescale Semiconductor, Inc. Phase separated system for fluxing
US7004375B2 (en) * 2003-05-23 2006-02-28 National Starch And Chemical Investment Holding Corporation Pre-applied fluxing underfill composition having pressure sensitive adhesive properties
JP4170839B2 (ja) * 2003-07-11 2008-10-22 日東電工株式会社 積層シート
US7213739B2 (en) * 2004-04-02 2007-05-08 Fry's Metals, Inc. Underfill fluxing curative
US20060025509A1 (en) * 2004-07-29 2006-02-02 Ruzhi Zhang Fluxing no-flow underfill composition containing benzoxazines
US7247683B2 (en) * 2004-08-05 2007-07-24 Fry's Metals, Inc. Low voiding no flow fluxing underfill for electronic devices
US7687119B2 (en) * 2005-04-04 2010-03-30 Henkel Ag & Co. Kgaa Radiation-curable desiccant-filled adhesive/sealant
US20060223978A1 (en) * 2005-04-04 2006-10-05 Shengqian Kong Radiation- or thermally-curable oxetane barrier sealants
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US20060272747A1 (en) * 2005-06-03 2006-12-07 Renyi Wang Fluxing compositions
US20070049665A1 (en) * 2005-08-25 2007-03-01 Musa Osama M Quinolinols and quinolinol derivatives as adhesion promoters in die attach adhesives
US7378523B2 (en) * 2005-08-25 2008-05-27 National Starch And Chemical Investment Holding Corporation Quinolinols as fluxing and accelerating agents for underfill compositions
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JP4757070B2 (ja) * 2006-03-27 2011-08-24 富士通株式会社 半田付け用フラックス及び半導体素子の接合方法
JP5394066B2 (ja) * 2006-10-03 2014-01-22 住友ベークライト株式会社 接着テープ
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US8835551B2 (en) * 2007-09-14 2014-09-16 3M Innovative Properties Company Ultra low viscosity iodine containing amorphous fluoropolymers
US20090283133A1 (en) * 2008-05-14 2009-11-19 3M Innovative Properties Company Solar concentrating mirror
US20090283144A1 (en) * 2008-05-14 2009-11-19 3M Innovative Properties Company Solar concentrating mirror
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US9523516B2 (en) 2008-12-30 2016-12-20 3M Innovative Properties Company Broadband reflectors, concentrated solar power systems, and methods of using the same
KR101197193B1 (ko) * 2010-01-05 2012-11-02 도레이첨단소재 주식회사 비유동성 언더필용 수지 조성물, 그를 이용한 비유동성 언더필 필름 및 그 비유동성 언더필 필름의 제조방법
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US8070044B1 (en) * 2010-12-02 2011-12-06 Rohm And Haas Electronic Materials Llc Polyamine flux composition and method of soldering
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US8070047B1 (en) * 2010-12-02 2011-12-06 Rohm And Haas Electronic Materials Llc Flux composition and method of soldering
US8070046B1 (en) * 2010-12-02 2011-12-06 Rohm And Haas Electronic Materials Llc Amine flux composition and method of soldering
JP6155261B2 (ja) 2011-07-15 2017-06-28 スリーエム イノベイティブ プロパティズ カンパニー 半導体パッケージ樹脂組成物及びその使用方法
US8430295B2 (en) 2011-09-30 2013-04-30 Rohm And Haas Electronic Materials Llc Curable flux composition and method of soldering
US8430293B2 (en) 2011-09-30 2013-04-30 Rohm And Haas Electronic Materials Llc Curable amine, carboxylic acid flux composition and method of soldering
US8434667B2 (en) 2011-09-30 2013-05-07 Rohm And Haas Electronic Materials Llc Polyamine, carboxylic acid flux composition and method of soldering
US8430294B2 (en) 2011-09-30 2013-04-30 Rohm And Haas Electronic Materials Llc Amine, carboxylic acid flux composition and method of soldering
US8434666B2 (en) 2011-09-30 2013-05-07 Rohm And Haas Electronic Materials Llc Flux composition and method of soldering
JP2014091744A (ja) 2012-10-31 2014-05-19 3M Innovative Properties Co アンダーフィル組成物、半導体装置およびその製造方法
US9631065B2 (en) * 2013-03-12 2017-04-25 Intel Corporation Methods of forming wafer level underfill materials and structures formed thereby
KR20170093891A (ko) 2014-12-08 2017-08-16 쓰리엠 이노베이티브 프로퍼티즈 캄파니 아크릴 폴리비닐 아세탈 필름, 조성물, 및 열 접합성 물품
CN107001549A (zh) 2014-12-08 2017-08-01 3M创新有限公司 基于丙烯酸系嵌段共聚物共混物的组合物
JP6709221B2 (ja) 2014-12-08 2020-06-10 スリーエム イノベイティブ プロパティズ カンパニー アクリル系ポリビニルアセタールフィルム及び組成物
WO2017112458A1 (en) 2015-12-22 2017-06-29 3M Innovative Properties Company Acrylic polyvinyl acetal graphic films
JP7030054B2 (ja) 2015-12-22 2022-03-04 スリーエム イノベイティブ プロパティズ カンパニー 接着剤層を備えたアクリルポリビニルアセタールフィルム
US11034830B2 (en) 2015-12-22 2021-06-15 3M Innovative Properties Company Acrylic polyvinyl acetal films comprising a second layer
CN108430766B (zh) 2015-12-22 2020-11-10 3M创新有限公司 包括结构化层的丙烯酸类膜
KR102437478B1 (ko) 2016-06-07 2022-08-30 쓰리엠 이노베이티브 프로퍼티즈 캄파니 광 지향 용품을 위한 아크릴 폴리비닐 아세탈 필름
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Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105097567A (zh) * 2008-06-27 2015-11-25 台湾积体电路制造股份有限公司 堆叠器件的方法
CN105097567B (zh) * 2008-06-27 2018-10-12 台湾积体电路制造股份有限公司 堆叠器件的方法
CN103459086A (zh) * 2011-03-28 2013-12-18 播磨化成株式会社 钎焊用焊剂及焊膏组合物
CN103459086B (zh) * 2011-03-28 2016-08-31 播磨化成株式会社 钎焊用焊剂及焊膏组合物
CN103517782A (zh) * 2011-05-25 2014-01-15 播磨化成株式会社 焊膏用焊剂和焊膏
CN103056560B (zh) * 2012-12-28 2015-03-11 深圳市美克科技有限公司 软钎焊助焊剂
CN103056560A (zh) * 2012-12-28 2013-04-24 深圳市美克科技有限公司 软钎焊助焊剂
CN104646861A (zh) * 2013-11-25 2015-05-27 刘现梅 一种含有噻二唑衍生物的助焊剂
CN112004889A (zh) * 2018-04-26 2020-11-27 三菱瓦斯化学株式会社 树脂组合物、层叠体、带树脂组合物层的半导体晶圆、带树脂组合物层的半导体搭载用基板和半导体装置
CN112004889B (zh) * 2018-04-26 2022-12-09 三菱瓦斯化学株式会社 树脂组合物、层叠体、带树脂组合物层的半导体晶圆、带树脂组合物层的半导体搭载用基板和半导体装置
TWI801565B (zh) * 2018-04-26 2023-05-11 日商三菱瓦斯化學股份有限公司 樹脂組成物、疊層體、附樹脂組成物層之半導體晶圓、附樹脂組成物層之半導體搭載用基板、以及半導體裝置
US11924979B2 (en) 2018-04-26 2024-03-05 Mitsubishi Gas Chemical Company, Inc. Resin composition, laminate, semiconductor wafer with resin composition layer, substrate for mounting semiconductor with resin composition layer and semiconductor device
CN114105812A (zh) * 2020-08-26 2022-03-01 中国石油化工股份有限公司 一种利用氯丙烯副产1,2-二氯丙烷合成n,n’-双水杨叉-1,2-丙二胺的方法
CN114105812B (zh) * 2020-08-26 2024-07-05 中国石油化工股份有限公司 一种利用氯丙烯副产1,2-二氯丙烷合成n,n’-双水杨叉-1,2-丙二胺的方法
CN113579442A (zh) * 2021-09-27 2021-11-02 新恒汇电子股份有限公司 双界面模块电学连接材料及其制备方法和应用

Also Published As

Publication number Publication date
WO2003020816A1 (en) 2003-03-13
KR20040044530A (ko) 2004-05-28
EP1423467A1 (en) 2004-06-02
US20030111519A1 (en) 2003-06-19
JP2005501725A (ja) 2005-01-20

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