CN112004889A - 树脂组合物、层叠体、带树脂组合物层的半导体晶圆、带树脂组合物层的半导体搭载用基板和半导体装置 - Google Patents
树脂组合物、层叠体、带树脂组合物层的半导体晶圆、带树脂组合物层的半导体搭载用基板和半导体装置 Download PDFInfo
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- CN112004889A CN112004889A CN201980027934.5A CN201980027934A CN112004889A CN 112004889 A CN112004889 A CN 112004889A CN 201980027934 A CN201980027934 A CN 201980027934A CN 112004889 A CN112004889 A CN 112004889A
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- NMOALOSNPWTWRH-UHFFFAOYSA-N tert-butyl 7,7-dimethyloctaneperoxoate Chemical compound CC(C)(C)CCCCCC(=O)OOC(C)(C)C NMOALOSNPWTWRH-UHFFFAOYSA-N 0.000 description 1
- GSECCTDWEGTEBD-UHFFFAOYSA-N tert-butylperoxycyclohexane Chemical compound CC(C)(C)OOC1CCCCC1 GSECCTDWEGTEBD-UHFFFAOYSA-N 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 125000003718 tetrahydrofuranyl group Chemical group 0.000 description 1
- 125000001712 tetrahydronaphthyl group Chemical group C1(CCCC2=CC=CC=C12)* 0.000 description 1
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- 125000005958 tetrahydrothienyl group Chemical group 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 125000000335 thiazolyl group Chemical group 0.000 description 1
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- 125000001544 thienyl group Chemical group 0.000 description 1
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- UKRDPEFKFJNXQM-UHFFFAOYSA-N vinylsilane Chemical compound [SiH3]C=C UKRDPEFKFJNXQM-UHFFFAOYSA-N 0.000 description 1
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Classifications
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- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
- H05K3/305—Affixing by adhesive
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
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- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
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- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
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- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
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- C08L39/04—Homopolymers or copolymers of monomers containing heterocyclic rings having nitrogen as ring member
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- C09D4/00—Coating compositions, e.g. paints, varnishes or lacquers, based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; Coating compositions, based on monomers of macromolecular compounds of groups C09D183/00 - C09D183/16
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- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
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Abstract
提供:兼顾优异的助焊剂活性与高的绝缘可靠性、具备良好的保存稳定性、进一步作为层叠体使用时具有作业性良好的挠性的树脂组合物。本发明的树脂组合物含有:螯合助焊剂(A)、热自由基聚合引发剂(B)和自由基重合性化合物(C)。
Description
技术领域
本发明涉及树脂组合物、使用树脂组合物的层叠体、带树脂组合物层的半导体晶圆、带树脂组合物层的半导体搭载用基板和半导体装置。详细而言,本发明涉及作为粘接剂用有用的树脂组合物。
背景技术
近年来,随着半导体装置的小型化和高性能化,作为将半导体芯片(以下,有时简记作“芯片”)搭载于半导体搭载用基板(以下,有时简记作“基板”)的方法,倒装芯片安装受到关注。倒装芯片安装中,使芯片与基板接合后,在芯片与基板的间隙填充底部填充材料并使其固化的工艺是通常的。然而,随着半导体装置的小型化、高性能化,排列于芯片的电极的窄间距化、电极间的窄间隙化推进,底部填充材料的填充的长时间化所导致的作业性的恶化、未填充等填充不良的发生成为问题。针对于此,研究了如下工艺:对芯片或基板供给预施底部填充材料后,同时进行芯片与基板的接合和底部填充材料的填充。
借助容易被氧化的金属、例如焊料、铜进行芯片与基板的接合的情况下,出于从接合部去除成为接合的妨碍因素的氧化膜,得到良好的金属接合的目的,有时在预施底部填充材料中添加源自羧酸等的助焊剂成分。
源自羧酸等的助焊剂成分在安装半导体封装体后也存在,存在如下担心:腐蚀固化后的底部填充材料中的焊料、铜的相互连接使其劣化,或促进焊料、铜的离子化,引起其迁移所导致的接合部间的短路不良。
专利文献1中记载了一种包含具有三嗪骨架的酚醛树脂的薄膜状粘接剂。三嗪与铜离子、由焊料产生的锡离子等金属离子进行络合形成,因此有如下优点;通过在粘接剂中掺入具有相同骨架的树脂,能够抑制由金属离子的迁移引起的电气不良情况。
专利文献2中记载了一种含有热固化性树脂和螯合助焊剂的树脂组合物。通过使用螯合助焊剂,从而螯合助焊剂捕捉固化物中的金属离子,从而可以抑制由金属离子的迁移引起的电气不良情况,形成有可靠性的接合。
专利文献3中记载了一种使用自由基聚合性单体和热自由基引发剂而得到的预施底部填充材料。通过使用热自由基引发剂,从而无需长时间的树脂组合物的固化时间。
现有技术文献
专利文献
专利文献1:日本特开2011-052109号公报
专利文献2:日本特表2005-501725号公报
专利文献3:日本特表2015-503220号公报
发明内容
发明要解决的问题
然而,专利文献1中,粘接剂中不含有助焊剂成分,因此,接合时无法去除接合部的氧化膜,无法得到良好的金属接合。
另外,专利文献2中记载了含有螯合助焊剂和环氧树脂的树脂组合物,有如下缺点:在比倒装芯片安装中的接合温度低的温度下,环氧树脂与螯合助焊剂所具有的酚羟基的反应进行,无法得到良好的接合。
专利文献3中,不含有助焊剂成分,因此,无法去除接合部的氧化膜,无法得到良好的金属接合。由此,在使用底部填充材料前,需要预先去除接合部的金属氧化膜的工序,因此,作业工序复杂化。
本发明是鉴于这样的课题而作出的,其提供如下树脂组合物:兼顾用于去除氧化膜从而得到金属接合的充分优异的助焊剂活性与高的绝缘可靠性,具备良好的保存稳定性,进一步具有作为层叠体使用时作业性良好的挠性。
用于解决问题的方案
本发明人等为了解决前述问题进行了深入研究,结果发现:含有螯合助焊剂(A)、热自由基聚合引发剂(B)和自由基聚合性化合物(C)的树脂组合物可以解决前述课题,完成了本发明。
即,本发明包括以下的内容。
[1]一种树脂组合物,其含有:螯合助焊剂(A)、热自由基聚合引发剂(B)、和自由基聚合性化合物(C)。
[2]根据[1]所述的树脂组合物,其中,前述螯合助焊剂(A)的熔点为235℃以下。
[3]根据[1]或[2]所述的树脂组合物,其中,前述螯合助焊剂(A)的分子量为150以上且500以下。
[4]根据[1]~[3]中任一项所述的树脂组合物,其中,使用前述螯合助焊剂(A)在下述的焊料润湿性试验中得到的、焊料球的接触角低于1.20弧度。
(焊料润湿性试验)
在厚度12μm的铜箔的光泽面涂布前述螯合助焊剂,在前述螯合助焊剂上放置直径0.5mm的焊料球。之后,在保持为235℃的热板上加热1分钟,使焊料熔融后,冷却至室温。在冷却后,测定在前述铜箔上铺开的、焊料球的半径(a)和焊料球的高度(b),根据下式算出接触角。
焊料球的接触角=2arctan{(b)/(a)}。
[5]根据[1]~[4]中任一项所述的树脂组合物,其中,前述螯合助焊剂(A)含有下述式(1)所示的化合物和/或下述式(2)所示的亚胺化合物。
(式中,Q为亚芳基、亚烷基、亚烯基、环亚烷基、环亚烯基、亚杂环基、或亚杂芳基,R1和R2各自独立地为氢原子、甲基、乙基、丙基、丁基、戊基或己基,R3和R4各自独立地为烷基、环烷基、芳基、杂芳基、或杂环基。对于亚芳基、亚烷基、亚烯基、环亚烷基、环亚烯基、亚杂环基、亚杂芳基、烷基、环烷基、芳基和杂芳基,键合于基团的氢原子任选被羟基或巯基所取代。)
(式中,R5为氢原子、甲基、乙基、丙基、丁基、戊基、或己基,R6和R7各自独立地为烷基、环烷基、芳基、杂芳基、或杂环基,对于烷基、环烷基、芳基、杂芳基、和杂环基,键合于基团的氢原子任选被羟基或巯基所取代。)
[6]根据[5]所述的树脂组合物,其中,前述式(1)所示的亚胺化合物中的R3和R4为2-羟基苯基。
[7]根据[1]~[6]中任一项所述的树脂组合物,其中,前述螯合助焊剂(A)含有选自由N,N’-双(亚水杨基)-1,2-丙二胺、N,N’-双(亚水杨基)乙二胺、N,N’-双(亚水杨基)-1,3-丙二胺、和N,N’-双(亚水杨基)-1,2-苯二胺组成的组中的至少一种。
[8]根据[1]~[7]中任一项所述的树脂组合物,其中,前述螯合助焊剂(A)含有N,N’-双(亚水杨基)-1,2-丙二胺和/或N,N’-双(亚水杨基)-1,3-丙二胺。
[9]根据[1]~[8]中任一项所述的树脂组合物,其中,前述热自由基聚合引发剂(B)为有机过氧化物。
[10]根据[9]所述的树脂组合物,其中,前述热自由基聚合引发剂(B)的10小时半衰期温度为100℃以上。
[11]根据[9]或[10]所述的树脂组合物,其中,前述热自由基聚合引发剂(B)为二烷基过氧化物和/或氢过氧化物。
[12]根据[9]~[11]中任一项所述的树脂组合物,其中,前述热自由基聚合引发剂(B)含有选自由过氧化二异丙苯、二(2-叔丁基过氧化异丙基)苯、二叔丁基过氧化物、1,1,3,3-四甲基丁基氢过氧化物、2,5-二甲基-2,5-二(叔丁基过氧化)-3-己炔、2,5-二甲基-2,5-二(叔丁基过氧化)己烷、二叔己基过氧化物、叔丁基枯基过氧化物、二叔戊基过氧化物、叔戊基过氧化氢、叔丁基过氧化氢、氢过氧化枯烯、过氧化氢二异丙苯、和对薄荷烷过氧化物组成的组中的至少一种。
[13]根据[9]~[12]中任一项所述的树脂组合物,其中,前述热自由基聚合引发剂(B)含有选自由过氧化二异丙苯、氢过氧化枯烯、过氧化氢二异丙苯、二(2-叔丁基过氧化异丙基)苯、和对薄荷烷过氧化物组成的组中的至少一种。
[14]根据[1]~[13]中任一项所述的树脂组合物,其中,前述自由基聚合性化合物(C)为含有选自由马来酰亚胺基、(甲基)丙烯酰基、丙烯基、和乙烯基组成的组中的至少一种官能团的化合物。
[15]根据[14]所述的树脂组合物,其中,前述自由基聚合性化合物(C)为含有马来酰亚胺基的化合物。
[16]
根据[14]或[15]所述的树脂组合物,其中,前述自由基聚合性化合物(C)含有选自由2,2-双{4-(4-马来酰亚胺苯氧基)苯基}丙烷、1,2-双(马来酰亚胺)乙烷、1,4-双(马来酰亚胺)丁烷、1,6-双(马来酰亚胺)己烷、N,N’-1,3-亚苯基二马来酰亚胺、N,N’-1,4-亚苯基二马来酰亚胺、N-苯基马来酰亚胺、下述式(3)所示的马来酰亚胺化合物、下述式(4)所示的马来酰亚胺化合物、和下述式(5)所示的马来酰亚胺化合物组成的组中的至少一种。
(式(3)中,R8各自独立地表示氢原子或甲基,n1表示1以上的整数。)
(式(4)中,n2的平均值为1以上且30以下。)
(式(5)中,R9和R10各自独立地表示氢原子、甲基或乙基,R11各自独立地表示氢原子或甲基。)
[17]根据[14]~[16]中任一项所述的树脂组合物,其中,前述自由基聚合性化合物(C)含有选自由前述2,2-双{4-(4-马来酰亚胺苯氧基)苯基}丙烷、前述式(3)所示的马来酰亚胺化合物、前述式(4)所示的马来酰亚胺化合物、和前述式(5)所示的马来酰亚胺化合物组成的组中的至少一种马来酰亚胺化合物。
[18]根据[1]~[17]中任一项所述的树脂组合物,其中,前述树脂组合物中的前述螯合助焊剂(A)的含量相对于前述自由基聚合性化合物(C)的总计量100质量份为5质量份以上且50质量份以下。
[19]根据[1]~[18]中任一项所述的树脂组合物,其中,前述树脂组合物中的前述热自由基聚合引发剂(B)的含量相对于前述自由基聚合性化合物(C)的总计量100质量份为0.005质量份以上且5质量份以下。
[20]根据[1]~[19]中任一项所述的树脂组合物,其中,还含有无机填充材料(D)。
[21]根据[20]所述的树脂组合物,其中,前述无机填充材料(D)具有电绝缘性。
[22]根据[20]或[21]所述的树脂组合物,其中,前述无机填充材料(D)含有选自由二氧化硅、氢氧化铝、氧化铝、勃姆石、氮化硼、氮化铝、氧化镁、和氢氧化镁组成的组中的至少1种。
[23]根据[20]~[22]中任一项所述的树脂组合物,其中,前述无机填充材料(D)的平均粒径为3μm以下。
[24]根据[20]~[23]中任一项所述的树脂组合物,其中,前述树脂组合物中的前述无机填充材料(D)的含量相对于前述自由基聚合性化合物(C)的总计量100质量份为300质量份以下。
[25]根据[1]~[24]中任一项所述的树脂组合物,其中,还含有挠性赋予成分(E)。
[26]根据[25]所述的树脂组合物,其中,前述挠性赋予成分(E)含有热塑性的高分子化合物,
前述高分子化合物的重均分子量为1000以上且1000000以下。
[27]根据[25]或[26]所述的树脂组合物,其中,前述挠性赋予成分(E)为(甲基)丙烯酸类低聚物和/或(甲基)丙烯酸类聚合物。
[28]根据[1]~[27]中任一项所述的树脂组合物,其用于预施底部填充材料。
[29]
一种层叠体,其具备:支撑基材;和,层叠于前述支撑基材上的含有[1]~[28]中任一项所述的树脂组合物的层。
[30]
一种带树脂组合物层的半导体晶圆,其具备:半导体晶圆;和,层叠于前述半导体晶圆的[29]所述的层叠体,含有前述树脂组合物的层层叠于前述半导体晶圆。
[31]
一种带树脂组合物层的半导体搭载用基板,其具备:半导体搭载用基板;和,层叠于前述半导体搭载用基板的[29]所述的层叠体,含有前述树脂组合物的层层叠于前述半导体搭载用基板。
[32]一种半导体装置,其具备:[30]所述的带树脂组合物层的半导体晶圆和/或[31]所述的带树脂组合物层的半导体搭载用基板。
发明的效果
根据本发明,可以得到:兼顾优异的助焊剂活性与高的绝缘可靠性、具备良好的保存稳定性、进一步具有作为层叠体使用时作业性良好的挠性的树脂组合物。另外,通过将树脂组合物涂布于支撑基材上,可以提供具有助焊剂活性、绝缘可靠性和保存稳定性优异的树脂组合物层的层叠体。
具体实施方式
以下,对用于实施本发明的方式(以下,简称为“本实施方式”)详细地进行说明。需要说明的是,以下的本实施方式为用于说明本发明的示例,本发明不仅限定于本实施方式。
本说明书中的“(甲基)丙烯酰基”是指“丙烯酰基”和对应于其的“甲基丙烯酰基”这两者。“(甲基)丙烯酸”是指“丙烯酸”和对应于其的“甲基丙烯酸”这两者。“(甲基)丙烯酸酯”是指“丙烯酸酯”和对应于其的“甲基丙烯酸酯”这两者。
本实施方式的一方式的树脂组合物含有:螯合助焊剂(A)、热自由基聚合引发剂(B)和自由基聚合性化合物(C)。本实施方式的树脂组合物作为预施底部填充材料是有用的。
本实施方式的另一方式的树脂组合物在前述各成分的基础上,还含有无机填充材料(D)。
本实施方式的另一方式的树脂组合物在前述各成分的基础上,还含有挠性赋予成分(E)。
本实施方式的另一方式还提供:使用本实施方式的树脂组合物得到的层叠体(以下,也称为“树脂层叠体”)、使用层叠体制作的带树脂组合物层的半导体晶圆、使用层叠体制作的带树脂组合物层的半导体搭载用基板、和使用本实施方式的树脂组合物制作的半导体装置。
〔I.树脂组合物〕
本实施方式的树脂组合物含有:螯合助焊剂(A)、热自由基聚合引发剂(B)和自由基聚合性化合物(C)。本实施方式的树脂组合物作为芯片的倒装芯片安装中使用的粘接剂是有用的。本实施方式的树脂组合物可以还包含无机填充材料(D)和/或挠性赋予成分(E)。
〔I-1.螯合助焊剂(A)〕
通过使用本实施方式的螯合助焊剂(A),从而与以往的羧酸系的助焊剂成分相比,可以达成弱氧化,可以期待绝缘可靠性的改善。
对于本实施方式的螯合助焊剂(A),从在倒装芯片安装中,在焊料的熔点以下提高助焊剂的运动性从而体现用于充分去除金属氧化膜的助焊剂活性的观点出发,例如,焊料种类成为锡-银合金的情况下,螯合助焊剂的单独的状态下的熔点优选235℃以下、更优选180℃以下。下限没有特别限定,为-50℃。
另外,对于本实施方式的螯合助焊剂(A),在倒装芯片安装中,需要防止在体现助焊剂活性前会挥发,即,防止在去除接合部的氧化膜前螯合助焊剂(A)挥发,分子量优选150以上,更优选200以上。另外,对于本实施方式的螯合助焊剂(A),从在树脂组合物中也具有高的运动性从而可以得到充分的助焊剂活性的方面出发,分子量优选500以下、更优选400以下。
对于本实施方式的螯合助焊剂(A),从能实现倒装芯片安装中的连接端子间的良好的接合的观点出发,使用螯合助焊剂单独,在下述焊料润湿性试验中得到的、焊料球的接触角优选低于1.20弧度、更优选低于1.10弧度。需要说明的是,关于具体的试验方法,如实施例中记载。
(焊料润湿性试验)
在厚度12μm的铜箔的光泽面涂布前述螯合助焊剂,在前述螯合助焊剂上放置直径0.5mm的焊料球。之后,在保持为235℃的热板上加热1分钟,使焊料熔融后,冷却至室温。在冷却后,测定在前述铜箔上铺开的、焊料球的半径(a)和焊料球的高度(b),根据下述式算出接触角。
焊料球的接触角=2arctan{(b)/(a)}
本实施方式的螯合助焊剂(A)只要是作为金属离子捕捉剂发挥功能的助焊剂就没有特别限定,优选为下述式(1)和/或下述式(2)所示的亚胺化合物。通过使用这样的亚胺化合物,从而可以有效地捕捉铜离子等金属离子,可以期待迁移的诱发所导致的短路不良等抑制效果。
式(1)所示的亚胺化合物中,Q为亚芳基、亚烷基、亚烯基、环亚烷基、环亚烯基、亚杂环基、或亚杂芳基,R1和R2各自独立地为氢原子、甲基、乙基、丙基、丁基、戊基、或己基,R3和R4各自独立地为烷基、环烷基、芳基、杂芳基、或杂环基。对于亚芳基、亚烷基、亚烯基、环亚烷基、环亚烯基、亚杂环基、亚杂芳基、烷基、环烷基、芳基、和杂芳基,键合于基团的氢原子任选被羟基或巯基所取代。
作为亚芳基,没有特别限定,例如可以举出亚苯基(邻亚苯基、间亚苯基、对亚苯基)、亚联苯基、亚萘基、亚联萘基、亚蒽基、和亚菲基。
作为亚烷基,没有特别限定,例如可以举出亚甲基、亚乙基、三亚甲基、四亚甲基、五亚甲基、六亚甲基、七亚甲基、八亚甲基、九亚甲基、十亚甲基、十一亚甲基、十二亚甲基、十三亚甲基、十四亚甲基、十五亚甲基、和十六亚甲基等直链状亚烷基;甲基亚乙基、甲基亚丙基、乙基亚乙基、1,2-二甲基亚乙基、1,1-二甲基亚乙基、1-乙基亚丙基、2-乙基亚丙基、1,2-二甲基亚丙基、2,2-二甲基亚丙基、1-丙基亚丙基、2-丙基亚丙基、1-甲基-1-乙基亚丙基、1-甲基-2-乙基-亚丙基、1-乙基-2-甲基-亚丙基、2-甲基-2-乙基-亚丙基、1-甲基亚丁基、2-甲基亚丁基、3-甲基亚丁基、2-乙基亚丁基、甲基亚戊基、乙基亚戊基、甲基亚己基、甲基亚庚基、甲基亚辛基、甲基亚壬基、甲基亚癸基、甲基亚十一烷基、甲基亚十二烷基、甲基亚十四烷基、和甲基亚十八烷基等支链状亚烷基。
作为亚烯基,没有特别限定,例如可以举出亚乙烯基、1-甲基亚乙烯基、亚丙烯基、1-亚丁烯基、2-亚丁烯基、1-亚戊烯基、和2-亚戊烯基。
作为环亚烷基,没有特别限定,例如可以举出环亚丙基、环亚丁基、环亚戊基、环亚己基、环亚庚基、环亚辛基、环亚己烯基、1,2-环亚己基双(亚甲基)、1,3-环亚己基双(亚甲基)、和1,4-环亚己基双。
作为环亚烯基,没有特别限定,例如可以举出环亚丙烯基、环亚丁烯基、环亚戊烯基、环亚己烯基、和环亚辛烯基。
作为亚杂环基,没有特别限定,例如可以举出四氢呋喃-2,5-二基、吗啉-2,3-二基、吡喃-2,4-二基、1,4-二氧杂环己烷-2,3-二基、1,3-二氧杂环己烷-2,4-二基、哌啶-2,4-二基、哌啶-1,4-二基、吡咯烷-1,3-二基、吗啉-2,4-二基、和哌嗪-1,4-二基。
作为亚杂芳基,没有特别限定,为前述亚芳基的碳原子中的一个以上的碳原子被氧原子、硫原子、氮原子、磷原子那样的杂原子所取代的基团。具体而言,可以举出:使菲、吡咯、吡嗪、吡啶、嘧啶、吲哚啉(indoline)、异吲哚啉、喹啉、异喹啉、喹喔啉、咔唑、苯基咔唑、菲啶、吖啶、呋喃、苯并呋喃、异苯并呋喃、二苯并呋喃、苯基二苯并呋喃、二苯基二苯并呋喃、噻吩、苯基噻吩、二苯基噻吩、苯并噻吩、二苯并噻吩、苯基苯并噻吩、二苯基苯并噻吩、苯基二苯并噻吩、和苯并噻唑形成2价的基团者。
作为烷基,没有特别限定,例如可以举出甲基、乙基、正丙基、异丙基、正丁基、2-丁基、异丁基、叔丁基、正戊基、2-戊基、叔戊基、2-甲基丁基、3-甲基丁基、2,2-二甲基丙基、正己基、2-己基、3-己基、2-甲基戊基、3-甲基戊基、4-甲基戊基、和2-甲基戊烷-3-基。
作为环烷基,没有特别限定,例如可以举出环丙基、环丁基、环戊基、和环己基。
作为芳基,没有特别限定,例如可以举出苯基、萘基、蒽基、菲基、和联苯基。
作为杂芳基,没有特别限定,可以举出2-氧杂吡咯烷基、哌啶基、哌嗪基、吗啉基、四氢呋喃基、四氢吡喃基、四氢噻吩基、全氢萘基、吡咯基、呋喃基、噻吩基、吡啶基、嘧啶基、吡唑基、哒嗪基、吡唑基、咪唑基、噁唑基、噻唑基、吲哚基、苯并呋喃基、苯并噻吩基、喹啉基、异喹啉基、喹喔啉基、phthalazyl group(フタラジル基)、喹唑基、亚萘啶基(naphthylidyl)、噌啉基、苯并咪唑基、苯并噁唑基、苯并噻唑基、和四氢萘基。
式(2)所示的亚胺化合物中,R5为氢原子、甲基、乙基、丙基、丁基、戊基、或己基,R6和R7各自独立地为烷基、环烷基、芳基、杂芳基、或杂环基。对于烷基、环烷基、芳基、杂芳基、和杂环基,键合于基团的氢原子任选被羟基或巯基所取代。对于烷基、环烷基、芳基、杂芳基、和杂环基,与前述同样。
式(1)所示的亚胺化合物中,从体现优异的助焊剂活性、效率良好地捕捉金属离子的观点出发,R3和R4优选2-羟基苯基。
对于式(1)所示的亚胺化合物,从在倒装芯片安装中,在焊料的熔点以下提高助焊剂的运动性从而体现用于充分去除金属氧化膜的助焊剂活性的观点出发,例如优选N,N’-双(亚水杨基)-1,2-丙二胺、N,N’-双(亚水杨基)乙二胺、N,N’-双(亚水杨基)-1,3-丙二胺、和N,N’-双(亚水杨基)-1,2-苯二胺,从安装时体现优异的助焊剂活性、兼顾抑制安装时的挥发成分的观点出发,例如更优选N,N’-双(亚水杨基)-1,2-丙二胺和/或N,N’-双(亚水杨基)-1,3-丙二胺。
这些螯合助焊剂可以单独使用1种或组合2种以上而使用。
作为螯合助焊剂(A),可以使用市售的产品。
本实施方式的树脂组合物中的螯合助焊剂(A)的含量没有特别限定,从兼顾树脂组合物的助焊剂活性与清漆和树脂组合物的保存稳定性的观点出发,相对于后述的自由基聚合性化合物(C)的总计量100质量份,优选5质量份以上且50质量份以下,从确保室温下的清漆的保存稳定性的观点出发,更优选10质量份以上且35质量份以下。
〔I-2.热自由基聚合引发剂(B)〕
本实施方式的热自由基聚合引发剂(B)只要促进自由基聚合性化合物(C)的自由基聚合反应就没有特别限定,可以使用公知的物质。其中,从清漆和树脂组合物的保存稳定性、和倒装芯片安装中的温度区域的观点出发,优选有机过氧化物。
作为有机过氧化物,例如可以举出二酰基过氧化物、过氧化二碳酸酯、过氧化酯、过氧化缩酮、二烷基过氧化物、和氢过氧化物。
作为二酰基过氧化物,例如可以举出二异丁酰基过氧化物、二(3,5,5-三甲基己酰基)过氧化物、二月桂酰基过氧化物、二琥珀酸过氧化物、二-(3-甲基苯甲酰基)过氧化物、苯甲酰基(3-甲基苯甲酰基)过氧化物、二苯甲酰基过氧化物。
作为过氧化碳酸酯,例如可以举出过氧化二碳酸二正丙酯、过氧化二碳酸二异丙酯、过氧化二碳酸二(4-叔丁基环己基)酯、过氧化二碳酸二(2-乙基己基)酯、过氧化二碳酸二仲丁酯。
作为过氧化酯,例如可以举出过氧化新癸酸枯酯、过氧化新癸酸1,1,3,3-四甲基丁酯、过氧化新癸酸叔己酯、过氧化新癸酸叔丁酯、过氧化新戊酸叔己酯、过氧化新戊酸叔丁酯、1,1,3,3-四甲基丁基过氧化-2-乙基己酸酯、2,5-二甲基-2,5-二(2-乙基己酰基过氧化)己烷、叔己基过氧化-2-乙基己酸酯、叔丁基过氧化-2-乙基己酸酯、叔己基过氧化异丙基单碳酸酯、叔丁基过氧化-3,5,5-三甲基己酸酯、过氧化月桂酸叔丁酯、叔丁基过氧化异丙基单碳酸酯、叔丁基过氧化-2-乙基己基单碳酸酯、过氧化苯甲酸叔己酯、2,5-二甲基-2,5-二(苯甲酰基过氧化)己烷、过氧化乙酸叔丁酯、叔丁基过氧化-3-甲基苯甲酸酯、过氧化苯甲酸叔丁酯。
作为过氧化缩酮,例如可以举出1,1-二(叔己基过氧化)环己烷、1,1-二(叔丁基过氧化)环己烷、2,2-二(叔丁基过氧化)丁烷、正丁基-4,4-二-(叔丁基过氧化)戊酸酯、2,2-二(4,4-二-(叔丁基过氧化)环己基)丙烷。
作为二烷基过氧化物,例如可以举出二(2-叔丁基过氧化异丙基)苯、过氧化二异丙苯、2,5-二甲基-2,5-二(叔丁基过氧化)己烷、叔丁基枯基过氧化物、二叔己基过氧化物、二叔丁基过氧化物、二叔戊基过氧化物、2,5-二甲基-2,5-二(叔丁基过氧化)-3-己炔。
作为氢过氧化物,例如可以举出对薄荷烷氢过氧化物、二异丙基苯氢过氧化物、1,1,3,3-四甲基丁基氢过氧化物、氢过氧化枯烯、叔丁基氢过氧化物、叔戊基氢过氧化物。
对于本实施方式的热自由基聚合引发剂(B),从将有机溶剂中溶解或分散有树脂组合物的清漆干燥后、树脂组合物中的热自由基聚合引发剂(B)也良好地具有反应性的观点出发,10小时半衰期温度优选100℃以上,更优选110℃以上。上限没有特别限定,例如为250℃。10小时半衰期温度是指,溶解于溶剂(例如苯)时的、热自由基聚合引发剂的浓度减少至初始值的一半为止的时间(半衰期)成为10小时的温度。10小时半衰期温度例如可以如下测定。首先,使热自由基聚合引发剂溶解于苯,得到浓度0.1mol/L的溶液。将该溶液封入至预先利用氮置换了内部的空气的玻璃管内。接着,使玻璃管浸渍于设定为规定温度的恒温槽,从而使热自由基聚合引发剂热分解。此处,将分解速度常数设为k、时间设为t、热自由基聚合引发剂的初始浓度设为[PO]0、时间t后的热自由基聚合引发剂的浓度设为[PO]t时,成立kt=ln[PO]0/[PO]t的关系。因此,如果在曲线图中标绘时间t与ln[PO]0/[PO]t的关系,则可以由其斜率求出分解速度常数k。在半衰期时间t1/2下,[PO]0/[PO]t=2的关系成立,因此,根据t1/2=ln2/k的关系式,可以求出某个温度下的半衰期时间t1/2。对于多个温度,求出半衰期时间t1/2,在曲线图中标绘lnt1/2与1/T的关系,从而可以得到10小时半衰期温度。T为绝对温度(单位:K)。需要说明的是,也可以利用热自由基聚合引发剂的制造公司发行的目录、技术资料中记载的10小时半衰期温度的数据。
作为热自由基聚合引发剂(B),从将有机溶剂中溶解或分散有树脂组合物的清漆干燥后也更良好地具有反应性的方面出发,优选二烷基过氧化物和/或氢过氧化物。
其中,从溶剂溶解性的观点出发,更优选过氧化二异丙苯、二(2-叔丁基过氧化异丙基)苯、二叔丁基过氧化物、1,1,3,3-四甲基丁基氢过氧化物、2,5-二甲基-2,5-二(叔丁基过氧化)-3-己炔、2,5-二甲基-2,5-二(叔丁基过氧化)己烷、二叔己基过氧化物、叔丁基枯基过氧化物、二叔戊基过氧化物、叔戊基氢过氧化物、叔丁基氢过氧化物、氢过氧化枯烯、二异丙基苯氢过氧化物、和对薄荷烷过氧化物,从可以适合地抑制清漆干燥时和安装时的挥发成分的方面出发,进一步优选过氧化二异丙苯、氢过氧化枯烯、二异丙基苯氢过氧化物、二(2-叔丁基过氧化异丙基)苯、和对薄荷烷氢过氧化物。
作为本实施方式的热自由基聚合引发剂(B),可以使用市售品,例如可以举出日本油脂株式会社制的、Perbutyl H、Percumyl H、Perocta H,Percumyl P、Permenta H(以上,氢过氧化物)、Perhexine 25B、Perbutyl D、Perbutyl C、Perhexa 25B、Perhexyl D、Percumyl D、Perbutyl P(以上,二烷基过氧化物)、Perhexa V、Perhexa 22(以上,过氧化缩酮)、Perbutyl Z、和Perbutyl A(以上,过氧化酯);Arkema Yoshitomi Co.,Ltd.制的、Luperox TAH、Luperox TBH(以上,氢过氧化物)、和Luperox DTA(以上,二烷基过氧化物)。
这些热自由基聚合引发剂(B)可以单独使用1种或组合2种以上而使用。
本实施方式的树脂组合物中的热自由基聚合引发剂(B)的含量没有特别限定,从对自由基聚合性化合物(C)赋予充分的固化性的观点出发,相对于自由基聚合性化合物(C)的总计量100质量份,优选0.005质量份以上且5质量份以下,从抑制挥发成分、抑制固化中的空隙(void)的观点出发,更优选0.05质量份以上且3质量份以下。
〔I-3.自由基聚合性化合物(C)〕
本实施方式的自由基聚合性化合物(C)只要为通过自由基聚合反应而进行聚合的化合物就没有特别限定。其中,优选含有选自由马来酰亚胺基、(甲基)丙烯酰基、丙烯基、和乙烯基组成的组中的至少一种官能团的化合物,从绝缘可靠性、和耐热性的观点出发,更优选含有马来酰亚胺基的化合物。
作为含有马来酰亚胺基的化合物,只要为在分子中具有1个以上马来酰亚胺基的化合物就没有特别限定。例如可以举出N-苯基马来酰亚胺、N-羟基苯基马来酰亚胺、双(4-马来酰亚胺苯基)甲烷、4,4-二苯基甲烷双马来酰亚胺、双(3,5-二甲基-4-马来酰亚胺苯基)甲烷、双(3-乙基-5-甲基-4-马来酰亚胺苯基)甲烷、双(3,5-二乙基-4-马来酰亚胺苯基)甲烷、苯基甲烷马来酰亚胺、邻亚苯基双马来酰亚胺、间亚苯基双马来酰亚胺、对亚苯基双马来酰亚胺、邻亚苯基双柠康酰亚胺、间亚苯基双柠康酰亚胺、对亚苯基双柠康酰亚胺、2,2-双(4-(4-马来酰亚胺苯氧基)-苯基)丙烷、3,3-二甲基-5,5-二乙基-4,4-二苯基甲烷双马来酰亚胺、4-甲基-1,3-亚苯基双马来酰亚胺、1,6-双马来酰亚胺-(2,2,4-三甲基)己烷、4,4-二苯醚双马来酰亚胺、4,4-二苯基砜双马来酰亚胺、1,3-双(3-马来酰亚胺苯氧基)苯、1,3-双(4-马来酰亚胺苯氧基)苯、4,4-二苯基甲烷双柠康酰亚胺、2,2-双[4-(4-柠康酰亚胺苯氧基)苯基]丙烷、双(3,5-二甲基-4-柠康酰亚胺苯基)甲烷、双(3-乙基-5-甲基-4-柠康酰亚胺苯基)甲烷、双(3,5-二乙基-4-柠康酰亚胺苯基)甲烷、多苯基甲烷马来酰亚胺、酚醛清漆型马来酰亚胺化合物、联苯芳烷基型马来酰亚胺化合物、2,2-双{4-(4-马来酰亚胺苯氧基)苯基}丙烷、1,2-双(马来酰亚胺)乙烷、1,4-双(马来酰亚胺)丁烷、1,6-双(马来酰亚胺)己烷、N,N’-1,3-亚苯基二马来酰亚胺、N,N’-1,4-亚苯基二马来酰亚胺、N-苯基马来酰亚胺、下述式(3)所示的马来酰亚胺化合物、下述式(4)所示的马来酰亚胺化合物、和下述式(5)所示的马来酰亚胺化合物。这些含有马来酰亚胺基的化合物可以单独使用1种或组合2种以上而使用。其中,从在有机溶剂中的溶解性的观点出发,优选2,2-双{4-(4-马来酰亚胺苯氧基)苯基}丙烷、下述式(3)所示的马来酰亚胺化合物、下述式(4)所示的马来酰亚胺化合物、和下述式(5)所示的马来酰亚胺化合物。
需要说明的是,也可以以使这些马来酰亚胺化合物聚合而得到的预聚物、或使马来酰亚胺化合物与胺化合物等其他化合物聚合而得到的预聚物等形式配混,这些化合物可以单独使用1种或组合2种以上而使用。
式(3)中,R8各自独立地表示氢原子或甲基。另外,式(3)中,n1表示1以上的整数,n1的上限值通常为10,从在有机溶剂中的溶解性的观点出发,优选7。
需要说明的是,也可以为式(3)的n1不同的化合物的混合物。
式(4)中,n2的平均值为7以上且30以下的范围。
需要说明的是,也可以为式(4)的n2不同的化合物的混合物。
式(5)中,R9和R10各自独立地表示氢原子、甲基或乙基。
式(5)中,R11各自独立地表示氢原子或甲基。
另外,作为本实施方式中的自由基聚合性化合物(C),从在有机溶剂中的溶解性、和确保挠性的观点出发,更优选包含前述式(4)所示的马来酰亚胺化合物、且与其一起组合使用选自由2,2-双{4-(4-马来酰亚胺苯氧基)苯基}丙烷、前述式(3)所示的马来酰亚胺化合物、和前述式(5)所示的马来酰亚胺化合物组成的组中的至少1种以上的马来酰亚胺化合物。
作为含有马来酰亚胺基的化合物也可以使用市售品,例如可以举出大和化成工业株式会社制BMI-2300(前述式(3)中的、R8全部为氢原子、n1为1以上且3以下的马来酰亚胺化合物);K·I Chemical Industry Co.,LTD.制BMI-70(前述式(5)中的、R9为甲基、R10为乙基、R11为氢原子的马来酰亚胺化合物、双-(3-乙基-5-甲基-4-马来酰亚胺苯基)甲烷)、BMI-80(2,2-双{4-(4-马来酰亚胺苯氧基)苯基}丙烷)、BMI-1000P(前述式(4)中的、n2为14(平均值)的马来酰亚胺化合物)、BMI-650P(前述式(4)中的、n2为9(平均值)的马来酰亚胺化合物)。
作为含有(甲基)丙烯酰基的化合物,只要为在分子中具有1个以上(甲基)丙烯酰基的化合物就没有特别限定。例如可以举出(甲基)丙烯酸甲酯、(甲基)丙烯酸乙酯、(甲基)丙烯酸异丙酯、(甲基)丙烯酸异丁酯、乙二醇二(甲基)丙烯酸酯、二乙二醇二(甲基)丙烯酸酯、三羟甲基丙烷三(甲基)丙烯酸酯、四羟甲基甲烷四(甲基)丙烯酸酯、2-羟基-1,3-二(甲基)丙烯酰氧基丙烷、2,2-双[4-((甲基)丙烯酰氧基甲氧基)苯基]丙烷、2,2-双[4-((甲基)丙烯酰氧基聚乙氧基)苯基]丙烷、(甲基)丙烯酸二环戊烯酯、(甲基)丙烯酸三环癸基酯、三((甲基)丙烯酰氧基乙基)异氰脲酸酯、和氨基甲酸酯(甲基)丙烯酸酯,可以使用1种或适宜混合2种以上而使用。
作为含有丙烯基的化合物,只要为在分子中具有1个以上丙烯基的化合物就没有特别限定。例如可以举出丙烯基苯、丙烯基萘、丙烯基蒽、丙烯基苯酚、邻丙烯基苯氧基苯等一官能丙烯基化合物;双丙烯基苯醚、2,2-双[4-(邻丙烯基苯氧基)苯基]丙烷、双[4-(邻丙烯基苯氧基)苯基]醚、双[4-(邻丙烯基苯氧基)苯基]砜、4,4’-双(邻丙烯基苯氧基)二苯甲酮、2,2-双[4-(邻丙烯基苯氧基)苯基]壬烷、2,2-双[3-叔丁基-4-(邻丙烯基苯氧基)苯基]丙烷、2,2-双[3-仲丁基-4-(邻丙烯基苯氧基)苯基]丙烷、1,1-双[4-(邻丙烯基苯氧基)苯基]癸烷、1,1-双[2-甲基-4-(邻丙烯基苯氧基)-5-叔丁基苯基]-2-甲基丙烷、4,4’-环己叉基-双[1-(邻丙烯基苯氧基)-2-(1,1-二甲基乙基)苯]、4,4’-亚甲基-双[1-(邻丙烯基苯氧基)-2,6-双(1,1-二甲基乙基)苯]、4,4’-亚甲基-双[1-(邻丙烯基苯氧基)-2,6-二仲丁基苯]、4,4’-环己叉基-双[1-(邻丙烯基苯氧基)-2-环己基苯]、4,4’-亚甲基-双[1-(邻丙烯基苯氧基)-2-壬基苯]、4,4’-(1-甲基乙叉基)-双[1-(邻丙烯基苯氧基)-2,6-双(1,1-二甲基乙基)苯、4,4’-(2-乙基己叉基)-双[1-(邻丙烯基苯氧基)-苯]、4,4’-(1-甲基庚叉基)-双[1-(邻丙烯基苯氧基)-苯]、4,4’-环己叉基-双[1-(邻丙烯基苯氧基)-3-甲基苯]、2,2-双[4-(邻丙烯基苯氧基)苯基]-丙烷、2,2-双[4-(邻丙烯基苯氧基)苯基]-六氟丙烷、2,2-双[3-甲基-4-(邻丙烯基苯氧基)苯基]-丙烷、2,2-双[3-甲基-4-(邻丙烯基苯氧基)苯基]-六氟丙烷、2,2-双[3,5-二甲基-4-(邻丙烯基苯氧基)苯基]-丙烷、2,2-双[3,5-二甲基-4-(邻丙烯基苯氧基)苯基]-六氟丙烷、2,2-双[3-乙基-4-(邻丙烯基苯氧基)苯基]-丙烷、2,2-双[3-乙基-4-(邻丙烯基苯氧基)苯基]-六氟丙烷、双[3-甲基-(邻丙烯基苯氧基)苯基]-甲烷、双[3,5-二甲基-(邻丙烯基苯氧基)苯基]-甲烷、双[3-乙基-(邻丙烯基苯氧基)苯基]-甲烷、3,8-双[4-(邻丙烯基苯氧基)苯基]-三环-[5,2,1,02.6]癸烷、4,8-双[4-(邻丙烯基苯氧基)苯基]-三环-[5,2,1,02.6]癸烷、3,9-双[4-(邻丙烯基苯氧基)苯基]-三环-[5,2,1,02.6]癸烷、4,9-双[4-(邻丙烯基苯氧基)苯基]-三环-[5,2,1,02.6]癸烷、1,8-双[4-(邻丙烯基苯氧基)苯基]-薄荷烷、1,8-双[3-甲基-4-(邻丙烯基苯氧基)苯基]-薄荷烷、1,8-双[3,5-二甲基-4-(邻丙烯基苯氧基)苯基]-薄荷烷,可以使用1种或适宜混合2种以上而使用。
作为含有乙烯基的化合物,只要为在分子中具有1个以上乙烯基的化合物就没有特别限定。例如可以举出乙基乙烯醚、丙基乙烯醚、羟基乙基乙烯醚、乙二醇二乙烯醚、具有乙烯基的2官能性苯醚低聚物的乙烯醚类,可以使用1种或适宜混合2种以上而使用。
本实施方式中的树脂组合物没有特别限定,从良好的助焊剂活性、和确保薄膜的强度的观点出发,相对于螯合助焊剂(A)20质量份,使自由基聚合性化合物(C)的总计量优选为50质量份以上且200质量份以下,从得到良好的薄膜形成性的观点出发,更优选80质量份以上且150质量份以下。
其中,含有马来酰亚胺基的化合物优选在自由基聚合性化合物(C)中含有50~100%。
对于含有马来酰亚胺基的化合物,从均衡性良好地具有优异的助焊剂活性、优异的挠性、和低的热膨胀率的观点出发,相对于自由基聚合性化合物(C)的整体量100质量份,优选含有前述式(3)所示的马来酰亚胺基化合物5质量份以上且50质量份以下,优选含有前述式(4)所示的马来酰亚胺基化合物5质量份以上且70质量份以下,优选含有前述式(5)所示的马来酰亚胺化合物5质量份以上且50质量份以下,优选含有2,2-双{4-(4-马来酰亚胺苯氧基)苯基}丙烷5质量份以上且50质量份以下。
〔I-4.无机填充材料(D)〕
本实施方式中,为了耐燃性的改善、导热率的改善、和热膨胀率的降低,可以含有无机填充材料(D)。作为无机填充材料(D)的种类,没有特别限定,例如可以举出熔融二氧化硅等二氧化硅;勃姆石、氢氧化铝、和氧化铝等铝化合物;氧化镁、和氢氧化镁等镁化合物;碳酸钙等钙化合物;氧化钼、和钼酸锌等钼化合物;天然滑石、和焙烧滑石等滑石;云母;短纤维状玻璃、球状玻璃、和微粉末玻璃(例如E玻璃、T玻璃、D玻璃)等玻璃。这些无机填充材料(D)可以单独使用1种或组合2种以上而使用。
它们之中,从树脂组合物的耐燃性的改善、和热膨胀率的降低的观点出发,作为无机填充材料(D),优选二氧化硅,其中,进一步优选熔融二氧化硅。作为熔融二氧化硅,例如可以举出Denka Co.,Ltd.制的SFP-120MC、Admatechs Co.,Ltd.制的SC1050、SC2050、SE1030、SE1050、SE2050。另外,在底部填充材料用途中使用的情况下,优选使用低α射线等级的二氧化硅,例如可以举出Admatechs Co.,Ltd.制的SV-EM1、SX-EM1。
无机填充材料(D)的平均粒径没有特别限定,使用本实施方式的树脂组合物作为预施底部填充材料的情况下,从应对排列于芯片的电极的窄间距化、电极间的窄间隙化的观点出发,优选3μm以下,电极间的间距成为60μm以下的情况下,更优选1μm以下。
需要说明的是,本说明书中,无机填充材料(D)的“平均粒径”是指,无机填充材料(D)的中值粒径。此处中值粒径是指,以某个粒径为基准,将粉体的粒度分布一分为二的情况下,粒径更大一侧的颗粒的个数、或质量、和粒径更小一侧的个数、或质量占全部粉体的各50%的粒径。无机填充材料(D)的平均粒径(中值粒径)通过湿式激光衍射/散射法而测定。
本实施方式中,对于使用无机填充材料(D)时的含量,从树脂组合物的耐燃性的改善、和热膨胀率的降低、且确保预施底部填充材料接合时的流动性的观点出发,相对于树脂组合物中的自由基聚合性化合物(C)的总计量100质量份,优选设为300质量份以下,更优选设为200质量份以下。另外,无机填充材料(D)的含量相对于前述含量100质量份,优选设为10质量份以上,进一步优选设为50质量份以上。需要说明的是,组合使用2种以上的无机填充材料(D)的情况下,优选它们的总计量满足前述含量的范围。
〔I-5.挠性赋予成分(E)〕
本实施方式中的挠性赋予成分(E)没有特别限制,例如可以举出聚酰亚胺、聚酰胺酰亚胺、聚苯乙烯、聚烯烃、苯乙烯-丁二烯橡胶(SBR)、异戊二烯橡胶(IR)、丁二烯橡胶(BR)、丙烯腈丁二烯橡胶(NBR)、聚氨酯、聚丙烯、(甲基)丙烯酸类低聚物、(甲基)丙烯酸类聚合物、有机硅树脂、和苯氧基树脂那样的热塑性的高分子化合物。这些挠性赋予成分(E)可以单独使用1种或组合2种以上而使用。
它们之中,从在制造树脂组合物时使用的有机溶剂中的溶解性、与马来酰亚胺化合物的相容性、树脂组合物的熔融粘度的控制性、和挠性赋予的观点出发,作为挠性赋予成分(E),优选选自由(甲基)丙烯酸类低聚物和(甲基)丙烯酸类聚合物组成的组中的至少1种。作为(甲基)丙烯酸类低聚物和(甲基)丙烯酸类聚合物,例如可以举出东亚合成株式会社的“ARUFON”系列、综研化学株式会社的“Actflow”系列、根上工业株式会社的“PARACRON”系列、Kuraray Co.,Ltd.的“KURARITY”系列。
挠性赋予成分(E)的分子量没有限定,从对树脂组合物赋予挠性的观点出发,重均分子量优选1000以上,从固化物的柔软性和赋予良好的韧性的观点出发,更优选2000以上。另外,作为预施底部填充材料使用的情况下,为了在金属接合部内无树脂组合物的夹入、得到更良好且稳定的形状的接合,优选控制树脂组合物的熔融粘度为较低、确保接合时的树脂组合物的流动性。从这样的观点出发,挠性赋予成分(E)的重均分子量优选1000000以下、更优选800000以下、进一步优选100000以下,从溶剂溶解性的观点出发,进一步更优选10000以下。通过使用具有该优选范围的重均分子量的挠性赋予成分(E),从而可以兼顾树脂组合物的挠性、与作为预施底部填充材料使用时的接合性。
本实施方式中,对于使用挠性赋予成分(E)时的含量,从熔融粘度的控制性的观点出发,相对于树脂组合物中的前述自由基聚合性化合物(C)的总计量100质量份,优选设为100质量份以下,更优选设为50质量份以下,进一步优选设为30质量份以下。另外,对于挠性赋予成分(E)的树脂组合物中的含量,从更有效且确实地发挥使用挠性赋予成分(E)而产生的作用效果的观点出发,相对于树脂组合物中的前述自由基聚合性化合物(C)的总计量100质量份,优选设为1质量份以上,更优选设为5质量份以上。需要说明的是,组合使用2种以上的挠性赋予成分(E)的情况下,优选它们的总计量为前述含量的范围内。
〔I-6.其他成分〕
本实施方式的树脂组合物除螯合助焊剂(A)、热自由基聚合引发剂(B)、自由基聚合性化合物(C)、无机填充材料(D)、和挠性赋予成分(E)之外还可以包含1种或2种以上的其他成分。
例如,出于改善吸湿耐热性、和改善芯片与树脂组合物的粘接性的目的,本实施方式的树脂组合物可以包含硅烷偶联剂。作为硅烷偶联剂,只要为通常用于无机物的表面处理者、且与螯合助焊剂(A)的反应性低的硅烷偶联剂就没有限定。例如可以举出:乙烯基硅烷系硅烷偶联剂(例如γ-甲基丙烯酰氧基丙基三甲氧基硅烷)、苯基氨基硅烷系硅烷偶联剂(例如N-苯基-3-氨基丙基三乙氧基硅烷)、苯基硅烷系硅烷偶联剂、咪唑硅烷系硅烷偶联剂。这些硅烷偶联剂可以单独使用1种或组合2种以上而使用。
使用硅烷偶联剂的情况下,其添加量没有限定。但是,从吸湿耐热性改善、和倒装芯片安装时的挥发量降低的观点出发,其含量相对于树脂组合物中的前述自由基聚合性化合物(C)的总计量100质量份,优选0.05质量份以上且20质量份以下、更优选0.1质量份以上且15质量份以下。需要说明的是,组合使用2种以上的硅烷偶联剂的情况下,优选它们的总计量为前述含量的范围内。
出于改善层叠体的制造性等目的,本实施方式的树脂组合物可以含有湿润分散剂。作为湿润分散剂,只要为通常用于涂料等的湿润分散剂就没有限定。例如可以举出BYKJapan株式会社制的Disperbyk-110、Disperbyk-111、Disperbyk-180、Disperbyk-161、BYK-W996、BYK-W9010、BYK-W903。这些湿润分散剂可以单独使用1种或组合2种以上而使用。
使用湿润分散剂的情况下,树脂组合物中的其含量没有限定,从改善层叠体的制造性的观点出发,相对于自由基聚合性化合物(C)100质量份,优选使湿润分散剂的比率为0.1质量份以上且5质量份以下、更优选为0.5质量份以上且3质量份以下。需要说明的是,组合使用2种以上的湿润分散剂的情况下,优选它们的总计量为前述含量的范围内。
出于赋予粘接性等目的,本实施方式的树脂组合物可以含有苯并噁嗪化合物。作为苯并噁嗪化合物,只要作为通过热而进行开环聚合的化合物是公知的、通常使用的物质就没有特别限定。例如可以举出下述式(6)、下述式(7)、和下述式(8)所示的化合物。
式(6)所示的化合物中,R11各自独立地表示氢原子、芳基、芳烷基、烯丙基、烷基或环烷基,R12各自独立地表示氢原子、芳基、芳烷基、烯丙基、烷基或环烷基,X1表示亚烷基、下述式(9)所示的基团、式“-SO2-”所示的基团、式“-CO-”所示的基团、氧原子或单键。
作为芳基,没有特别限定,例如可以举出苯基、萘基、蒽基、菲基、和联苯基。
作为芳烷基,没有特别限定,例如可以举出苄基、和苯乙基。
作为烷基,没有特别限定,例如可以举出甲基、乙基、正丙基、异丙基、正丁基、2-丁基、异丁基、叔丁基、正戊基、2-戊基、叔戊基、2-甲基丁基、3-甲基丁基、2,2-二甲基丙基、正己基、2-己基、3-己基、2-甲基戊基、3-甲基戊基、4-甲基戊基、和2-甲基戊烷-3-基。
作为环烷基,没有特别限定,例如可以举出环丙基、环丁基、环戊基、和环己基。
作为亚烷基,没有特别限定,例如可以举出亚甲基、亚乙基、三亚甲基、四亚甲基、五亚甲基、六亚甲基、七亚甲基、八亚甲基、九亚甲基、十亚甲基、十一亚甲基、十二亚甲基、十三亚甲基、十四亚甲基、十五亚甲基、和十六亚甲基等直链状亚烷基;甲基亚乙基、甲基亚丙基、乙基亚乙基、1,2-二甲基亚乙基、1,1-二甲基亚乙基、1-乙基亚丙基、2-乙基亚丙基、1,2-二甲基亚丙基、2,2-二甲基亚丙基、1-丙基亚丙基、2-丙基亚丙基、1-甲基-1-乙基亚丙基、1-甲基-2-乙基-亚丙基、1-乙基-2-甲基-亚丙基、2-甲基-2-乙基-亚丙基、1-甲基亚丁基、2-甲基亚丁基、3-甲基亚丁基、2-乙基亚丁基、甲基亚戊基、乙基亚戊基、甲基亚己基、甲基亚庚基、甲基亚辛基、甲基亚壬基、甲基亚癸基、甲基亚十一烷基、甲基亚十二烷基、甲基亚十四烷基、和甲基亚十八烷基等支链状亚烷基。
式(7)所示的化合物中,R13各自独立地表示氢原子、芳基、芳烷基、烯丙基、烷基或环烷基,R14各自独立地表示氢原子、芳基、芳烷基、烯丙基、烷基或环烷基,X2表示亚烷基、下述式(9)所示的基团、式“-SO2-”所示的基团、式“-CO-”所示的基团、氧原子或单键。
对于芳基、芳烷基、烷基、环烷基、和亚烷基,如前述。
式(8)所示的化合物中,R15各自独立地表示氢原子、芳基、芳烷基、烯丙基、烷基或环烷基,R16各自独立地表示氢原子、芳基、芳烷基、烯丙基、烷基或环烷基,X3表示亚烷基、下述式(9)所示的基团、式“-SO2-”所示的基团、式“-CO-”所示的基团、氧原子或单键。
对于芳基、芳烷基、烷基、环烷基、和亚烷基,如前述。
式(9)所示的化合物中,Y为亚烷基或具有芳香族环的碳数6以上且30以下的烃基,n3表示1以上的整数。
对于亚烷基,如前述。
作为具有芳香族环的碳数6以上且30以下的烃基,没有特别限定,例如可以举出:从苯、联苯基、萘、蒽、芴、菲、茚二烯、三联苯、苊烯、非那烯的具有芳香族性的化合物的核去除了2个氢原子而得到的2价的基团。
作为具体例,可以举出下述式(10)所示的化合物、下述式(11)所示的化合物、下述式(12)所示的化合物、下述式(13)所示的化合物、下述式(14)所示的化合物、下述式(15)所示的化合物、和下述式(16)所示的化合物。这些苯并噁嗪化合物可以单独使用1种或组合2种以上而使用。
本实施方式中,使用苯并噁嗪时的含量没有限定,从确保与芯片的充分的粘接性的观点出发,相对于自由基聚合性化合物(C)的总计量100质量份,优选包含苯并噁嗪化合物5质量份以上且60质量份以下、更优选包含25质量份以上且45质量份以下。需要说明的是,组合使用2种以上的苯并噁嗪化合物的情况下,优选它们的总计量为前述含量的范围内。
本实施方式的树脂组合物中,在不有损所期望的特性的范围内,根据各种目的,可以含有各种添加剂。作为添加剂,例如可以举出紫外线吸收剂、抗氧化剂、荧光增白剂、染料、颜料、增稠剂、润滑剂、消泡剂、流平剂、光泽剂、和阻燃剂。这些添加剂可以单独使用1种或组合2种以上而使用。
本实施方式的树脂组合物中,其他添加剂的含量没有特别限定,通常,相对于树脂组合物中的前述自由基聚合性化合物(C)的总计量100质量份,分别为0.01质量份以上且10质量份以下。
本实施方式的树脂组合物通过将螯合助焊剂(A)、热自由基聚合引发剂(B)、自由基聚合性化合物(C)、无机填充材料(D)、挠性赋予成分(E)、和其他成分混合而制备。根据需要,还可以形成在有机溶剂中溶解或分散有这些成分的清漆的形态。本实施方式的树脂组合物的清漆可以适合作为制作下述本实施方式的层叠体时的清漆使用。有机溶剂只要可以使前述成分分别适当地溶解或分散、且不有损本实施方式的树脂组合物的所期望的效果就没有限定。作为有机溶剂,例如可以举出甲醇、乙醇、和丙醇等醇类;丙酮、甲乙酮、和甲基异丁基酮等酮类;二甲基乙酰胺、和二甲基甲酰胺等酰胺类;甲苯、和二甲苯等芳香族烃类。这些有机溶剂可以单独使用1种或组合2种以上而使用。
本实施方式的树脂组合物的助焊剂活性、挠性、和绝缘可靠性优异。另外,通过将树脂组合物涂布于支撑基材上,从而可以提供具有助焊剂活性优异的树脂层的层叠体。作为以层叠体的形态使用本实施方式的树脂组合物的预施底部填充材料而使用的情况下,助焊剂活性、挠性、和绝缘可靠性优异,此外,还能发挥倒装芯片安装中的接合性、吸湿耐热性和与芯片的粘接性也优异等其他适宜的效果。如此,本实施方式的树脂组合物具有各种优异的特征,特别是可以以高水平兼顾助焊剂活性、挠性和绝缘可靠性,因此,作为底部填充材料是极有用的。
〔II.层叠体、使用层叠体制作的带树脂组合物层的半导体晶圆、使用层叠体制作的带树脂组合物层的基板和半导体装置〕
本实施方式的层叠体、带树脂组合物层的半导体晶圆、带树脂组合物层的基板和半导体装置均是使用前述本实施方式的树脂组合物而形成的。
〔II-1.层叠体〕
本实施方式的层叠体是将前述本实施方式的树脂组合物添着于支撑基材而得到的。支撑基材没有特别限定,可以使用高分子薄膜。作为高分子薄膜的材质,例如可以举出含有选自由聚氯乙烯、聚偏二氯乙烯、聚丁烯、聚丁二烯、聚氨酯、乙烯-氧化乙烯共聚物、聚对苯二甲酸乙二醇酯、聚萘二甲酸乙二醇酯和聚对苯二甲酸丁二醇酯的聚酯、聚乙烯、聚丙烯、乙烯-丙烯共聚物、聚甲基戊烯、聚酰亚胺和聚酰胺组成的组中的至少1种以上的树脂的薄膜、以及在这些薄膜的表面涂布有脱模剂的脱模薄膜,它们之中,特别优选聚酯、聚酰亚胺、聚酰胺,其中,特别优选作为聚酯的1种的、聚对苯二甲酸乙二醇酯。
本实施方式的支撑基材的厚度没有限定,从层叠体的制造性、例如在支撑基材上涂布树脂组合物时的涂布厚的稳定性的观点出发,优选10μm以上且100μm以下。另外,从层叠体的输送性的观点出发,优选10μm以上且100μm以下。另外,作为其厚度的下限,从确保制造层叠体时的成品率的观点出发,进一步优选12μm以上、特别优选25μm以上、尤其优选30μm以上。而且,作为其厚度的上限,由于支撑基材最终不作为半导体装置的构成构件存在、在工序的中途被剥离,从层叠体的制造成本的观点出发,优选80μm以下、进一步优选50mm以下。
在前述支撑基材上,形成由本实施方式的树脂组合物形成的层(以下,也简称为“树脂组合物层”)制造本实施方式的层叠体的方法没有限定,例如可以举出如下方法等:将在有机溶剂中溶解或分散有本实施方式的树脂组合物的清漆涂布于前述支撑基材的表面,在加热和/或减压下进行干燥,去除溶剂,使本实施方式的树脂组合物固化,形成树脂组合物层。干燥条件没有特别限定,关于有机溶剂相对于树脂组合物层的含有比率,以相对于树脂组合物层的总量(100质量%)、通常成为10质量%以下、优选成为5质量%以下的方式使其干燥。达成干燥的条件根据清漆中的有机溶剂的种类和配混量也不同,例如,相对于包含螯合助焊剂(A)、热自由基聚合引发剂(B)和自由基聚合性化合物(C)的树脂组合物中的总计量100质量份,包含30质量份以上且60质量份以下的甲乙酮的清漆的情况下,在1个气压下、在90℃以上且160℃以下的加热条件下、1分钟以上且10分钟以下左右的干燥成为标准。特别是对于加热温度,必须注意热自由基聚合引发剂(B)的氧所导致的失活、挥发。如果加热本实施方式的清漆,则热自由基聚合引发剂(B)的分解进行,所产生的活性自由基由于气氛中的氧而失活,或而且热自由基聚合引发剂、其分解物挥发,从而有利于自由基聚合性化合物(C)的聚合的自由基数会减少,有倒装芯片安装中树脂组合物的固化反应不进行的担心。由此,本实施方式的树脂组合物适合的是,使用在清漆的干燥温度以上的温度区域具有10小时半衰期温度的热自由基聚合引发剂(B)。本实施方式的层叠体中的树脂组合物层的厚度没有限定,从树脂组合物层干燥时更良好地去除溶剂等轻挥发成分的观点、和更有效且确实地发挥作为层叠体的功能的观点出发,5μm以上且500μm以下的范围是适合的。
〔II-2.使用层叠体制作的带树脂组合物层的半导体晶圆、使用层叠体制作的带树脂组合物层的基板〕
本实施方式的带树脂组合物层的半导体晶圆由前述本实施方式的层叠体和半导体晶圆形成,本实施方式的带树脂组合物层的基板由前述本实施方式的层叠体和基板形成。
对制作本实施方式的带树脂组合物层的半导体晶圆的方法没有限定,例如,通过使半导体晶圆的形成有电极的面、即进行与基板的接合的面跟本实施方式的层叠体的树脂组合物层以对置的方式进行贴合,从而可以得到。另外,对制作本实施方式的带树脂组合物层的基板的方法没有限定,例如,通过使基板的芯片搭载侧的面与本实施方式的层叠体的本实施方式的树脂组合物层以对置的方式贴合,从而可以得到。
作为使本实施方式的层叠体与半导体晶圆或基板贴合的方法,没有特别限定,可以适合使用真空加压式层压机。上述情况下,优选对于本实施方式的层叠体借助橡胶等弹性体进行加压并贴合的方法。作为层压条件,只要为本领域中通常使用的条件就没有特别限定,例如在10℃以上且140℃以下的温度、1kgf/cm2以上且11kgf/cm2以下的范围的接触压力、以及20hPa以下的气氛减压下进行。层压工序后,通过利用金属板的热加压,可以进行贴合后的层叠体的平滑化。前述层压工序和平滑化工序可以利用市售的真空加压式层压机连续地进行。贴附于半导体晶圆或基板的层叠体在任意情况下在直至芯片的倒装芯片安装前均进行支撑基材的去除。
〔II-3.半导体装置〕
本实施方式的半导体装置具备本实施方式的带树脂组合物层的半导体晶圆和/或本实施方式的带树脂组合物层的基板,由本实施方式的树脂组合物、芯片和基板等构成。制造本实施方式的半导体装置的方法没有限定,例如可以举出如下方法:对于本实施方式的带树脂组合物层的半导体晶圆,利用磨削的手段,进行薄化和基于切割机的单片化,形成带树脂组合物层的芯片,将其搭载于基板。另外,可以在本实施方式的带树脂组合物层的基板上搭载芯片。将带树脂组合物层的芯片搭载于基板的方法和将半导体芯片搭载于带树脂组合物层的基板的方法中,可以适当地使用与热压接工艺相应的倒装芯片焊接机。另外,本实施方式中,简便地说明将芯片倒装芯片安装于基板的情况,但也可以将芯片进行倒装芯片安装的同时应用本实施方式的树脂组合物的对象设为基板以外。例如,本实施方式的树脂组合物也可以用于将芯片搭载于半导体晶圆上时的半导体晶圆与芯片的接合部、经由TSV(硅通孔技术,Through Silicon Via)进行芯片间连接的芯片层叠体的各芯片间的接合部,任意情况下均可以得到基于本实施方式的优势性。
实施例
以下,示出实施例和比较例,对本发明详细地进行说明,但本发明不受这些实施例的任何限定。
1.螯合助焊剂评价
(1)评价对象
为了评价螯合助焊剂单独的各特性,将以下4种螯合助焊剂作为评价对象,将结果示于表1。
(i)N,N’-双(亚水杨基)-1,2-丙二胺(熔点:45℃、分子量:282、东京化成工业株式会社制)
(ii)N,N’-双(亚水杨基)乙二胺(熔点:126℃、分子量:268、东京化成工业株式会社制)
(iii)N,N’-双(亚水杨基)-1,3-丙二胺(熔点:53℃、分子量:282、东京化成工业株式会社制)
(iv)N,N’-双(亚水杨基)-1,2-苯二胺(熔点:164℃、分子量:316、东京化成工业株式会社制)
(2)焊料润湿性试验
将(i)~(iv)的螯合助焊剂散布于厚度12μm的电解铜箔(3EC-III、三井金属矿业株式会社制)的光泽面,放置直径0.5mm的焊料球(ECO SOLDER BALL M705、Sn-3.0Ag-0.5Cu合金、千住金属工业株式会社制)。将其在保持为235℃的热板上加热1分钟,在铜箔上使焊料熔融后,在室温下冷却。对于焊料球在铜箔上的润湿铺开测定焊料球的接触角,由此对助焊剂活性进行评价。焊料球的接触角如下算出:用数码显微镜(KH-7700、HIROX CO.,LTD.制)测定在铜箔上熔融后润湿铺开了的焊料球的半径(a)和焊料球的高度(b),根据下式算出接触角。需要说明的是,焊料球的半径(a)使用的是,焊料熔融后润湿铺开了的范围中的最大直径的一半的值。另外,焊料球的高度(b)使用的是,从熔融了的焊料的顶点引出垂直于铜箔面的线的长度。
焊料球的接触角=2arctan{(b)/(a)}
将焊料球的接触角低于1.20弧度的情况记作A、1.20弧度以上的情况记作C。
[表1]
(i) | (ii) | (iii) | (iv) | |
焊料润湿性试验 | A(0.90rad) | A(0.90rad) | A(0.96rad) | A(1.03rad) |
根据表1,焊料润湿性试验中,(i)~(iv)均确认到良好的结果。以下的实施例中,作为螯合助焊剂,使用N,N’-双(亚水杨基)-1,2-丙二胺和N,N’-双(亚水杨基)-1,3-丙二胺。
2.树脂组合物和层叠体的制作
(实施例1)
将作为螯合助焊剂(A)的N,N’-双(亚水杨基)-1,2-丙二胺(东京化成工业株式会社制)的甲乙酮(以下,有时简记作“MEK”)溶液(以不挥发成分换算计为20质量份)、作为热自由基聚合引发剂(B)的过氧化二异丙苯(Kishida Chemical Co.,Ltd.制、10小时半衰期温度:116.4℃)0.5质量份、作为第1自由基聚合性化合物(C)的式(3)中的R8全部为氢原子、n1为1以上且3以下的马来酰亚胺化合物(BMI-2300、大和化成工业株式会社制)的MEK溶液(以不挥发成分换算计为8质量份)、作为第2自由基聚合性化合物(C)的马来酰亚胺化合物(BMI-1000P、K·I Chemical Industry Co.,LTD.制)的MEK溶液(以不挥发成分换算计为25质量份)、作为第3自由基聚合性化合物(C)的双-(3-乙基-5-甲基-4-马来酰亚胺苯基)甲烷(BMI-70、K·I Chemical Industry Co.,LTD.制)的MEK溶液(以不挥发成分换算计为16质量份)、作为第4自由基聚合性化合物(C)的2,2-双{4-(4-马来酰亚胺苯氧基)苯基}丙烷(BMI-80、K·I Chemical Industry Co.,LTD.制)的MEK溶液(以不挥发成分换算计为16质量份)、作为第1无机填充材料(D)的浆料二氧化硅(SV-EM1、固体成分65%、平均粒径:0.3μm、Admatechs Co.,Ltd.制)75质量份、作为第2无机填充材料(D)的浆料二氧化硅(SX-EM1、固体成分65%、平均粒径:0.3μm、Admatechs Co.,Ltd.制)25质量份、作为挠性赋予成分(E)的丙烯酸类聚合物(US-6170、东亚合成株式会社制)10质量份、进一步作为密合性赋予成分的苯并噁嗪(Pd型苯并噁嗪、四国化成工业株式会社制)的MEK溶液(以不挥发成分换算计为25质量份)进行混合,用高速搅拌装置搅拌30分钟,得到清漆。将该清漆涂布于表面涂布有脱模剂的厚度38μm的聚对苯二甲酸乙二醇酯薄膜(TR1-38、UNITIKA LTD.制),以100℃加热干燥5分钟,得到本发明的树脂组合物层的厚度为30μm的层叠体。
(实施例2)
作为螯合助焊剂(A),变更为使用以不挥发成分换算计为20质量份的N,N’-双(亚水杨基)-1,3-丙二胺(东京化成工业株式会社制)的MEK溶液,除此之外,与实施例1同样地制备清漆,得到层叠体。
(实施例3)
作为热自由基聚合引发剂(B),使用二(2-叔丁基过氧化异丙基)苯(Perbutyl P、日油株式会社制、10小时半衰期温度:119.2℃),将其用量变更为0.5质量份,除此之外,与实施例1同样地制备清漆,得到层叠体。
(实施例4)
作为螯合助焊剂(A),使用以不挥发成分换算计为20质量份的N,N’-双(亚水杨基)-1,3-丙二胺(东京化成工业株式会社制)的MEK溶液,作为热自由基聚合引发剂(B),使用二(2-叔丁基过氧化异丙基)苯(Perbutyl P、日油株式会社制、10小时半衰期温度:119.2℃),将其用量变更为0.5质量份,除此之外,与实施例1同样地制备清漆,得到层叠体。
(实施例5)
作为螯合助焊剂(A),使用N,N’-双(亚水杨基)-1,2-丙二胺(东京化成工业株式会社制)的MEK溶液,将其用量变更为以不挥发成分换算计为60质量份,除此之外,与实施例1同样地制备清漆,得到层叠体。
(实施例6)
作为热自由基聚合引发剂(B),使用1,1-二(叔己基过氧化)环己烷(Perhexa HC、日油株式会社制、10小时半衰期温度:87.1℃),将其用量变更为0.5质量份,除此之外,与实施例1同样地制备清漆,得到层叠体。
(比较例1)
不使用螯合助焊剂(A),除此之外,与实施例3同样地制备清漆,得到层叠体。
(比较例2)
不使用热自由基聚合引发剂(B),作为固化促进剂,变更为2-苯基-4-甲基咪唑(东京化成工业株式会社制)的MEK溶液(以不挥发成分换算计为0.5质量份),除此之外,与实施例1同样地制备清漆,得到层叠体。
(比较例3)
将双酚A型环氧化合物(EXA-850CRP、环氧基当量171g/eq.、DIC株式会社制)的MEK溶液(以不挥发成分换算计为62质量份)、酚醛清漆型酚化合物(Phenolite KA-1163、羟基当量118g/eq.、DIC株式会社制)的MEK溶液(以不挥发成分换算计为38质量份)、作为螯合助焊剂(A)的N,N’-双(亚水杨基)-1,2-丙二胺(东京化成工业株式会社制)的MEK溶液(以不挥发成分换算计为20质量份)、作为固化促进剂的2-苯基-4-甲基咪唑的MEK溶液(以不挥发成分换算计为0.1质量份)、作为无机填充材料(D)的浆料二氧化硅(SC-1050MLQ、平均粒径:0.3μm、以不挥发成分换算计为100质量份)、作为挠性赋予成分(E)的丙烯酸类聚合物(US-6170、东亚合成株式会社制)10质量份、进一步作为密合性赋予成分的苯并噁嗪(Pd型苯并噁嗪、四国化成工业株式会社制)的MEK溶液(以不挥发成分换算计为25质量份)进行混合,用高速搅拌装置搅拌30分钟,得到清漆。将该清漆涂布于表面涂布有脱模剂的厚度38μm的聚对苯二甲酸乙二醇酯薄膜(TR1-38),以100℃加热干燥5分钟,得到层叠体。
3.评价方法
(1)能否制作清漆
实施例1~6和比较例1~3的清漆制作过程中,如果确认不到清漆的凝胶化、树脂组合物成分的沉降等,则记作A,如果确认到清漆的凝胶化、树脂组合物成分的沉降等,则记作C。将结果示于表2。
(2)清漆保存稳定性
用B型粘度计(东京计器株式会社制)测定实施例1~6和比较例1~3中得到的清漆的粘度(c),用B型粘度计再次测定在密闭容器内室温放置2周后的粘度(d)。用下述式算出经过2周后的粘度的变化率,变化率低于20%的情况记作AA、经过2周后的粘度的变化率为20%以上且低于40%的情况记作A、经过2周后的粘度的变化率为40%以上的情况记作C。将结果示于表2。
粘度的变化率={|(d)-(c)|/(c)}×100
(3)安装试验
将实施例1~6和比较例1~3中得到的层叠体切成8mm×8mm的正方形,层压在评价用基板上后,用倒装芯片焊接机(LFB-2301、株式会社新川制),在工作台温度70℃、接合头温度300℃、载荷50N、时间8秒的条件下,将半导体芯片压接进行安装试验。通过安装试验样品的截面观察,如果在半导体芯片侧的Cu柱上的焊料与基板侧的布线之间确认到合金生成则记作A、如果确认不到合金生成则记作C。将结果示于表2。
(4)安装样品外观
从半导体芯片的正上方用光学显微镜观察安装试验后的样品。将在半导体芯片的表面未确认到实施例1~6和比较例1~3中得到的树脂组合物的附着的情况记作AA,在半导体芯片的表面稍确认到实施例1~6和比较例1~3中得到的树脂组合物的附着、但实际使用上认为不对品质造成影响的情况记作A,在半导体芯片的表面确认到实施例1~6和比较例1~3中得到的树脂组合物的附着、实际使用上不允许的情况记作C。将结果示于表2。
(5)挠性
将实施例1~6和比较例1~3中得到的树脂层叠体裁切成5cm×10cm的条状后,在室温下,以支撑基材的聚对苯二甲酸乙二醇酯薄膜成为内侧的方式,缠绕于外径为3cm的金属管,保持5秒后退卷。重复该操纵10次后,以目视确认本发明的树脂组合物层的裂纹的有无,进行挠性的评价。将完全确认不到裂纹的产生的情况记作AA,稍确认到裂纹的产生、但实际使用上认为不对品质造成影响的情况记作A,产生了裂纹、实际使用上不允许的情况记作C。将结果示于表2。
(6)绝缘可靠性
利用真空层压机,在印刷电路基板的L/S=40μm/40μm的微细电路图案上,贴附实施例1~6和比较例1~3中得到的层叠体,埋入微细布线间。使用烘箱,将带前述中制作的层叠体的微细电路图案基板以200℃加热3小时,制作试验样品。对得到的试验样品,进行在温度85℃、湿度60%的条件下加湿热处理168小时作为前处理,对处理后的样品,进行最高温度设定为260℃的回流工序3次。对于前处理后的试验样品,在温度130℃、湿度85%、施加电压5.0V的条件下,测定连续湿中绝缘电阻。评价基准如下:将电阻值107Ω以下记作短路、直至短路的时间为300小时以上的情况记作A、低于300小时情况记作C。将结果示于表2。
[表2]
实施例1 | 实施例2 | 实施例3 | 实施例4 | 实施例5 | 实施例6 | 比较例1 | 比较例2 | 比较例3 | |
能否制作清漆 | A | A | A | A | A | A | A | A | A |
清漆保存稳定性 | AA | AA | AA | AA | A | AA | AA | C | C |
安装试验 | A | A | A | A | A | A | C | A | C |
安装样品外观 | AA | AA | AA | AA | AA | A | AA | C | C |
挠性 | AA | AA | AA | AA | A | AA | AA | AA | AA |
绝缘可靠性 | A | A | A | A | A | A | C | A | C |
本申请基于2018年4月26日申请的日本专利申请(日本特愿2018-84967),将其内容作为参照引入至此。
产业上的可利用性
本发明的树脂组合物如前述,助焊剂活性、挠性和低热膨胀性优异,发挥各种效果,因此,可以适合作为树脂组合物、特别是粘接剂用树脂组合物使用。另外,本发明的树脂组合物作为预施底部填充材料是有用的。本发明的树脂组合物的助焊剂活性优异,因此,进行半导体芯片与基板的接合、半导体芯片与半导体晶圆的接合、进一步半导体芯片与半导体芯片的接合时,可以得到良好的接合状态,因此,是极有用的。
Claims (32)
1.一种树脂组合物,其含有:
螯合助焊剂(A)、
热自由基聚合引发剂(B)、和
自由基聚合性化合物(C)。
2.根据权利要求1所述的树脂组合物,其中,所述螯合助焊剂(A)的熔点为235℃以下。
3.根据权利要求1或2所述的树脂组合物,其中,所述螯合助焊剂(A)的分子量为150以上且500以下。
4.根据权利要求1~3中任一项所述的树脂组合物,其中,使用所述螯合助焊剂(A)在下述的焊料润湿性试验中得到的、焊料球的接触角低于1.20弧度,
(焊料润湿性试验)
在厚度12μm的铜箔的光泽面涂布所述螯合助焊剂,在所述螯合助焊剂上放置直径0.5mm的焊料球,之后,在保持为235℃的热板上加热1分钟,使焊料熔融后,冷却至室温,在冷却后,测定在所述铜箔上铺开的、焊料球的半径(a)和焊料球的高度(b),根据下式算出接触角,
焊料球的接触角=2arctan{(b)/(a)}。
5.根据权利要求1~4中任一项所述的树脂组合物,其中,所述螯合助焊剂(A)含有下述式(1)所示的化合物和/或下述式(2)所示的亚胺化合物,
式中,Q为亚芳基、亚烷基、亚烯基、环亚烷基、环亚烯基、亚杂环基、或亚杂芳基,R1和R2各自独立地为氢原子、甲基、乙基、丙基、丁基、戊基、或己基,R3和R4各自独立地为烷基、环烷基、芳基、杂芳基、或杂环基,对于亚芳基、亚烷基、亚烯基、环亚烷基、环亚烯基、亚杂环基、亚杂芳基、烷基、环烷基、芳基和杂芳基,键合于基团的氢原子任选被羟基或巯基所取代,
式中,R5为氢原子、甲基、乙基、丙基、丁基、戊基、或己基,R6和R7各自独立地为烷基、环烷基、芳基、杂芳基、或杂环基,对于烷基、环烷基、芳基、杂芳基、和杂环基,键合于基团的氢原子任选被羟基或巯基所取代。
6.根据权利要求5所述的树脂组合物,其中,所述式(1)所示的亚胺化合物中的R3和R4为2-羟基苯基。
7.根据权利要求1~6中任一项所述的树脂组合物,其中,所述螯合助焊剂(A)含有选自由N,N’-双(亚水杨基)-1,2-丙二胺、N,N’-双(亚水杨基)乙二胺、N,N’-双(亚水杨基)-1,3-丙二胺、和N,N’-双(亚水杨基)-1,2-苯二胺组成的组中的至少一种。
8.根据权利要求1~7中任一项所述的树脂组合物,其中,所述螯合助焊剂(A)含有N,N’-双(亚水杨基)-1,2-丙二胺和/或N,N’-双(亚水杨基)-1,3-丙二胺。
9.根据权利要求1~8中任一项所述的树脂组合物,其中,所述热自由基聚合引发剂(B)为有机过氧化物。
10.根据权利要求9所述的树脂组合物,其中,所述热自由基聚合引发剂(B)的10小时半衰期温度为100℃以上。
11.根据权利要求9或10所述的树脂组合物,其中,所述热自由基聚合引发剂(B)为二烷基过氧化物和/或氢过氧化物。
12.根据权利要求9~11中任一项所述的树脂组合物,其中,所述热自由基聚合引发剂(B)含有选自由过氧化二异丙苯、二(2-叔丁基过氧化异丙基)苯、二叔丁基过氧化物、1,1,3,3-四甲基丁基氢过氧化物、2,5-二甲基-2,5-二(叔丁基过氧化)-3-己炔、2,5-二甲基-2,5-二(叔丁基过氧化)己烷、二叔己基过氧化物、叔丁基枯基过氧化物、二叔戊基过氧化物、叔戊基过氧化氢、叔丁基过氧化氢、氢过氧化枯烯、过氧化氢二异丙苯、和对薄荷烷过氧化物组成的组中的至少一种。
13.根据权利要求9~12中任一项所述的树脂组合物,其中,所述热自由基聚合引发剂(B)含有选自由过氧化二异丙苯、氢过氧化枯烯、过氧化氢二异丙苯、二(2-叔丁基过氧化异丙基)苯、和对薄荷烷过氧化物组成的组中的至少一种。
14.根据权利要求1~13中任一项所述的树脂组合物,其中,所述自由基聚合性化合物(C)为含有选自由马来酰亚胺基、(甲基)丙烯酰基、丙烯基、和乙烯基组成的组中的至少一种官能团的化合物。
15.根据权利要求14所述的树脂组合物,其中,所述自由基聚合性化合物(C)为含有马来酰亚胺基的化合物。
16.根据权利要求14或15所述的树脂组合物,其中,所述自由基聚合性化合物(C)含有选自由2,2-双{4-(4-马来酰亚胺苯氧基)苯基}丙烷、1,2-双(马来酰亚胺)乙烷、1,4-双(马来酰亚胺)丁烷、1,6-双(马来酰亚胺)己烷、N,N’-1,3-亚苯基二马来酰亚胺、N,N’-1,4-亚苯基二马来酰亚胺、N-苯基马来酰亚胺、下述式(3)所示的马来酰亚胺化合物、下述式(4)所示的马来酰亚胺化合物、和下述式(5)所示的马来酰亚胺化合物组成的组中的至少一种,
式(3)中,R8各自独立地表示氢原子或甲基,n1表示1以上的整数,
式(4)中,n2的平均值为1以上且30以下,
式(5)中,R9和R10各自独立地表示氢原子、甲基或乙基,R11各自独立地表示氢原子或甲基。
17.根据权利要求14~16中任一项所述的树脂组合物,其中,所述自由基聚合性化合物(C)含有选自由所述2,2-双{4-(4-马来酰亚胺苯氧基)苯基}丙烷、所述式(3)所示的马来酰亚胺化合物、所述式(4)所示的马来酰亚胺化合物、和所述式(5)所示的马来酰亚胺化合物组成的组中的至少一种马来酰亚胺化合物。
18.根据权利要求1~17中任一项所述的树脂组合物,其中,所述树脂组合物中的所述螯合助焊剂(A)的含量相对于所述自由基聚合性化合物(C)的总计量100质量份为5质量份以上且50质量份以下。
19.根据权利要求1~18中任一项所述的树脂组合物,其中,所述树脂组合物中的所述热自由基聚合引发剂(B)的含量相对于所述自由基聚合性化合物(C)的总计量100质量份为0.005质量份以上且5质量份以下。
20.根据权利要求1~19中任一项所述的树脂组合物,其中,还含有无机填充材料(D)。
21.根据权利要求20所述的树脂组合物,其中,所述无机填充材料(D)具有电绝缘性。
22.根据权利要求20或21所述的树脂组合物,其中,所述无机填充材料(D)含有选自由二氧化硅、氢氧化铝、氧化铝、勃姆石、氮化硼、氮化铝、氧化镁、和氢氧化镁组成的组中的至少1种。
23.根据权利要求20~22中任一项所述的树脂组合物,其中,所述无机填充材料(D)的平均粒径为3μm以下。
24.根据权利要求20~23中任一项所述的树脂组合物,其中,所述树脂组合物中的所述无机填充材料(D)的含量相对于所述自由基聚合性化合物(C)的总计量100质量份为300质量份以下。
25.根据权利要求1~24中任一项所述的树脂组合物,其中,还含有挠性赋予成分(E)。
26.根据权利要求25所述的树脂组合物,其中,所述挠性赋予成分(E)含有热塑性的高分子化合物,
所述高分子化合物的重均分子量为1000以上且1000000以下。
27.根据权利要求25或26所述的树脂组合物,其中,所述挠性赋予成分(E)为(甲基)丙烯酸类低聚物和/或(甲基)丙烯酸类聚合物。
28.根据权利要求1~27中任一项所述的树脂组合物,其用于预施底部填充材料。
29.一种层叠体,其具备:
支撑基材;和,
层叠于所述支撑基材上的含有权利要求1~28中任一项所述的树脂组合物的层。
30.一种带树脂组合物层的半导体晶圆,其具备:
半导体晶圆;和,
层叠于所述半导体晶圆的权利要求29所述的层叠体,
含有所述树脂组合物的层层叠于所述半导体晶圆。
31.一种带树脂组合物层的半导体搭载用基板,其具备:
半导体搭载用基板;和,
层叠于所述半导体搭载用基板的权利要求29所述的层叠体,
含有所述树脂组合物的层层叠于所述半导体搭载用基板。
32.一种半导体装置,其具备:权利要求30所述的带树脂组合物层的半导体晶圆和/或权利要求31所述的带树脂组合物层的半导体搭载用基板。
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US11924979B2 (en) | 2024-03-05 |
US20210147629A1 (en) | 2021-05-20 |
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