CA467387A - Controlling polymerization of polyhydric alcohol esters of alpha-olefinic dicarboxylic acids with ethylenic monomers - Google Patents
Controlling polymerization of polyhydric alcohol esters of alpha-olefinic dicarboxylic acids with ethylenic monomersInfo
- Publication number
- CA467387A CA467387A CA467387A CA467387DA CA467387A CA 467387 A CA467387 A CA 467387A CA 467387 A CA467387 A CA 467387A CA 467387D A CA467387D A CA 467387DA CA 467387 A CA467387 A CA 467387A
- Authority
- CA
- Canada
- Prior art keywords
- alpha
- dicarboxylic acids
- polyhydric alcohol
- alcohol esters
- ethylenic monomers
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CA467387T |
Publications (1)
Publication Number | Publication Date |
---|---|
CA467387A true CA467387A (en) | 1950-08-15 |
Family
ID=35597156
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CA467387A Expired CA467387A (en) | Controlling polymerization of polyhydric alcohol esters of alpha-olefinic dicarboxylic acids with ethylenic monomers |
Country Status (1)
Country | Link |
---|---|
CA (1) | CA467387A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3786233A4 (en) * | 2018-04-26 | 2021-12-29 | Mitsubishi Gas Chemical Company, Inc. | Resin composition, laminate, resin composition layer-attached semiconductor wafer, substrate for mounting resin composition layer-attached semiconductor, and semiconductor device |
-
0
- CA CA467387A patent/CA467387A/en not_active Expired
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3786233A4 (en) * | 2018-04-26 | 2021-12-29 | Mitsubishi Gas Chemical Company, Inc. | Resin composition, laminate, resin composition layer-attached semiconductor wafer, substrate for mounting resin composition layer-attached semiconductor, and semiconductor device |
US11924979B2 (en) | 2018-04-26 | 2024-03-05 | Mitsubishi Gas Chemical Company, Inc. | Resin composition, laminate, semiconductor wafer with resin composition layer, substrate for mounting semiconductor with resin composition layer and semiconductor device |
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