KR20040044530A - 플럭싱 조성물 - Google Patents

플럭싱 조성물 Download PDF

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Publication number
KR20040044530A
KR20040044530A KR10-2004-7003183A KR20047003183A KR20040044530A KR 20040044530 A KR20040044530 A KR 20040044530A KR 20047003183 A KR20047003183 A KR 20047003183A KR 20040044530 A KR20040044530 A KR 20040044530A
Authority
KR
South Korea
Prior art keywords
composition
diyl
electrical
metal
fluxing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR10-2004-7003183A
Other languages
English (en)
Korean (ko)
Inventor
로버드 제이. 키니
마이클 에이. 크로프
스코트 비. 찰스
Original Assignee
쓰리엠 이노베이티브 프로퍼티즈 컴파니
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 쓰리엠 이노베이티브 프로퍼티즈 컴파니 filed Critical 쓰리엠 이노베이티브 프로퍼티즈 컴파니
Publication of KR20040044530A publication Critical patent/KR20040044530A/ko
Ceased legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/29—Compounds containing one or more carbon-to-nitrogen double bonds
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/012—Manufacture or treatment of encapsulations on active surfaces of flip-chip devices, e.g. forming underfills
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3613—Polymers, e.g. resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3615—N-compounds
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3489—Composition of fluxes; Application thereof; Other processes of activating the contact surfaces
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/853—On the same surface
    • H10W72/856—Bump connectors and die-attach connectors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Adhesives Or Adhesive Processes (AREA)
KR10-2004-7003183A 2001-09-04 2002-07-03 플럭싱 조성물 Ceased KR20040044530A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/946,013 US20030111519A1 (en) 2001-09-04 2001-09-04 Fluxing compositions
US09/946,013 2001-09-04
PCT/US2002/021206 WO2003020816A1 (en) 2001-09-04 2002-07-03 Fluxing compositions

Publications (1)

Publication Number Publication Date
KR20040044530A true KR20040044530A (ko) 2004-05-28

Family

ID=25483831

Family Applications (1)

Application Number Title Priority Date Filing Date
KR10-2004-7003183A Ceased KR20040044530A (ko) 2001-09-04 2002-07-03 플럭싱 조성물

Country Status (6)

Country Link
US (1) US20030111519A1 (https=)
EP (1) EP1423467A1 (https=)
JP (1) JP2005501725A (https=)
KR (1) KR20040044530A (https=)
CN (1) CN1549843A (https=)
WO (1) WO2003020816A1 (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20120060773A (ko) * 2010-12-02 2012-06-12 롬 앤드 하스 일렉트로닉 머트어리얼즈, 엘.엘.씨. 아민 플럭스 조성물 및 솔더링 방법
KR20120060775A (ko) * 2010-12-02 2012-06-12 롬 앤드 하스 일렉트로닉 머트어리얼즈, 엘.엘.씨. 경화성 아민 플럭스 조성물 및 솔더링 방법

Families Citing this family (57)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003101164A1 (en) * 2002-05-23 2003-12-04 3M Innovative Properties Company Nanoparticle filled underfill
US6796482B2 (en) * 2002-10-31 2004-09-28 Freescale Semiconductor, Inc. Phase separated system for fluxing
US7004375B2 (en) * 2003-05-23 2006-02-28 National Starch And Chemical Investment Holding Corporation Pre-applied fluxing underfill composition having pressure sensitive adhesive properties
JP4170839B2 (ja) * 2003-07-11 2008-10-22 日東電工株式会社 積層シート
US7213739B2 (en) * 2004-04-02 2007-05-08 Fry's Metals, Inc. Underfill fluxing curative
US20060025509A1 (en) * 2004-07-29 2006-02-02 Ruzhi Zhang Fluxing no-flow underfill composition containing benzoxazines
US7247683B2 (en) * 2004-08-05 2007-07-24 Fry's Metals, Inc. Low voiding no flow fluxing underfill for electronic devices
US7687119B2 (en) * 2005-04-04 2010-03-30 Henkel Ag & Co. Kgaa Radiation-curable desiccant-filled adhesive/sealant
US20060223978A1 (en) * 2005-04-04 2006-10-05 Shengqian Kong Radiation- or thermally-curable oxetane barrier sealants
US20060223937A1 (en) * 2005-04-04 2006-10-05 Herr Donald E Radiation curable cycloaliphatic barrier sealants
JP4883996B2 (ja) * 2005-05-24 2012-02-22 四国化成工業株式会社 水溶性プレフラックス及びその利用
US20060272747A1 (en) * 2005-06-03 2006-12-07 Renyi Wang Fluxing compositions
US20070049665A1 (en) * 2005-08-25 2007-03-01 Musa Osama M Quinolinols and quinolinol derivatives as adhesion promoters in die attach adhesives
US7378523B2 (en) * 2005-08-25 2008-05-27 National Starch And Chemical Investment Holding Corporation Quinolinols as fluxing and accelerating agents for underfill compositions
US20130131007A1 (en) 2005-09-07 2013-05-23 Bebaas, Inc. Vitamin b12 compositions
US7468407B2 (en) * 2005-09-26 2008-12-23 National Starch And Chemical Investment Holding Copporation Metal salts of quinolinols and quinolinol derivatives in curable compositions
US20070095432A1 (en) * 2005-11-02 2007-05-03 National Starch And Chemical Investment Holding Corporation Fluxing compositions containing benzotriazoles
JP4757070B2 (ja) * 2006-03-27 2011-08-24 富士通株式会社 半田付け用フラックス及び半導体素子の接合方法
JP5394066B2 (ja) * 2006-10-03 2014-01-22 住友ベークライト株式会社 接着テープ
JP2008179698A (ja) * 2007-01-24 2008-08-07 Fujifilm Corp レーザー分解用樹脂組成物およびそれを用いるパターン形成材料
US8835551B2 (en) * 2007-09-14 2014-09-16 3M Innovative Properties Company Ultra low viscosity iodine containing amorphous fluoropolymers
US20090283133A1 (en) * 2008-05-14 2009-11-19 3M Innovative Properties Company Solar concentrating mirror
US20090283144A1 (en) * 2008-05-14 2009-11-19 3M Innovative Properties Company Solar concentrating mirror
ES2690653T3 (es) * 2008-06-16 2018-11-21 3M Innovative Properties Company Composiciones curables reforzadas
US8334170B2 (en) * 2008-06-27 2012-12-18 Taiwan Semiconductor Manufacturing Company, Ltd. Method for stacking devices
US9523516B2 (en) 2008-12-30 2016-12-20 3M Innovative Properties Company Broadband reflectors, concentrated solar power systems, and methods of using the same
KR101197193B1 (ko) * 2010-01-05 2012-11-02 도레이첨단소재 주식회사 비유동성 언더필용 수지 조성물, 그를 이용한 비유동성 언더필 필름 및 그 비유동성 언더필 필름의 제조방법
TWI500467B (zh) * 2010-01-08 2015-09-21 Arakawa Chem Ind 無鉛焊劑用助熔劑組成物及無鉛焊劑膏
US8070043B1 (en) * 2010-12-02 2011-12-06 Rohm And Haas Electronic Materials Llc Curable flux composition and method of soldering
US8070044B1 (en) * 2010-12-02 2011-12-06 Rohm And Haas Electronic Materials Llc Polyamine flux composition and method of soldering
US8070047B1 (en) * 2010-12-02 2011-12-06 Rohm And Haas Electronic Materials Llc Flux composition and method of soldering
JP5856747B2 (ja) * 2011-03-28 2016-02-10 ハリマ化成株式会社 はんだ付け用フラックスおよびはんだペースト組成物
JP4897932B1 (ja) * 2011-05-25 2012-03-14 ハリマ化成株式会社 はんだペースト用フラックスおよびはんだペースト
JP6155261B2 (ja) 2011-07-15 2017-06-28 スリーエム イノベイティブ プロパティズ カンパニー 半導体パッケージ樹脂組成物及びその使用方法
US8430295B2 (en) 2011-09-30 2013-04-30 Rohm And Haas Electronic Materials Llc Curable flux composition and method of soldering
US8430293B2 (en) 2011-09-30 2013-04-30 Rohm And Haas Electronic Materials Llc Curable amine, carboxylic acid flux composition and method of soldering
US8434667B2 (en) 2011-09-30 2013-05-07 Rohm And Haas Electronic Materials Llc Polyamine, carboxylic acid flux composition and method of soldering
US8430294B2 (en) 2011-09-30 2013-04-30 Rohm And Haas Electronic Materials Llc Amine, carboxylic acid flux composition and method of soldering
US8434666B2 (en) 2011-09-30 2013-05-07 Rohm And Haas Electronic Materials Llc Flux composition and method of soldering
JP2014091744A (ja) 2012-10-31 2014-05-19 3M Innovative Properties Co アンダーフィル組成物、半導体装置およびその製造方法
CN103056560B (zh) * 2012-12-28 2015-03-11 深圳市美克科技有限公司 软钎焊助焊剂
US9631065B2 (en) * 2013-03-12 2017-04-25 Intel Corporation Methods of forming wafer level underfill materials and structures formed thereby
CN104646861A (zh) * 2013-11-25 2015-05-27 刘现梅 一种含有噻二唑衍生物的助焊剂
KR20170093891A (ko) 2014-12-08 2017-08-16 쓰리엠 이노베이티브 프로퍼티즈 캄파니 아크릴 폴리비닐 아세탈 필름, 조성물, 및 열 접합성 물품
CN107001549A (zh) 2014-12-08 2017-08-01 3M创新有限公司 基于丙烯酸系嵌段共聚物共混物的组合物
JP6709221B2 (ja) 2014-12-08 2020-06-10 スリーエム イノベイティブ プロパティズ カンパニー アクリル系ポリビニルアセタールフィルム及び組成物
WO2017112458A1 (en) 2015-12-22 2017-06-29 3M Innovative Properties Company Acrylic polyvinyl acetal graphic films
JP7030054B2 (ja) 2015-12-22 2022-03-04 スリーエム イノベイティブ プロパティズ カンパニー 接着剤層を備えたアクリルポリビニルアセタールフィルム
US11034830B2 (en) 2015-12-22 2021-06-15 3M Innovative Properties Company Acrylic polyvinyl acetal films comprising a second layer
CN108430766B (zh) 2015-12-22 2020-11-10 3M创新有限公司 包括结构化层的丙烯酸类膜
KR102437478B1 (ko) 2016-06-07 2022-08-30 쓰리엠 이노베이티브 프로퍼티즈 캄파니 광 지향 용품을 위한 아크릴 폴리비닐 아세탈 필름
US11935803B2 (en) 2018-04-26 2024-03-19 Mitsubishi Gas Chemical Company, Inc. Resin composition, laminate, semiconductor wafer with resin composition layer, substrate for mounting semiconductor with resin composition layer and semiconductor device
EP3786233B1 (en) * 2018-04-26 2025-04-23 Mitsubishi Gas Chemical Company, Inc. Resin composition, laminate, semiconductor wafer with resin composition layer, substrate for mounting semiconductor with resin composition layer and semiconductor device
US11618109B2 (en) * 2020-06-30 2023-04-04 Electronics And Telecommunications Research Institute Wire for electric bonding
CN114105812B (zh) * 2020-08-26 2024-07-05 中国石油化工股份有限公司 一种利用氯丙烯副产1,2-二氯丙烷合成n,n’-双水杨叉-1,2-丙二胺的方法
CN113579442B (zh) * 2021-09-27 2022-02-08 新恒汇电子股份有限公司 双界面模块电学连接材料及其制备方法和应用
CN115975087B (zh) * 2023-01-04 2023-12-19 哈尔滨工业大学（威海） 一种功能性席夫碱高分子聚合物及其制备方法与应用

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3791027A (en) * 1971-06-30 1974-02-12 Ibm Soldering method
DE2245559A1 (de) * 1972-09-16 1974-04-04 Basf Ag Verfahren zum verkleben oder be-schichten von metallen
US4611046A (en) * 1985-03-15 1986-09-09 Ford Motor Company Hydroxyl terminated azomethines and high glass transition temperature polyether products produced therefrom
US4737564A (en) * 1987-06-25 1988-04-12 Ashland Oil, Inc. Polyphenate salts of triethylene diamine and their use in polymerizing a polyisocyanate and a polyepoxide
US5376403A (en) * 1990-02-09 1994-12-27 Capote; Miguel A. Electrically conductive compositions and methods for the preparation and use thereof
US5062902A (en) * 1990-03-30 1991-11-05 Air Products And Chemicals, Inc. Fluxing agents comprising β-diketone and β-ketoimine ligands and a process for using the same
US5128746A (en) * 1990-09-27 1992-07-07 Motorola, Inc. Adhesive and encapsulant material with fluxing properties
KR100254927B1 (ko) * 1994-12-07 2000-05-01 오까베 히로시 납땜용 플럭스, 땜납 페이스트 및 이것을 사용한 납땜 방법
US5648407A (en) * 1995-05-16 1997-07-15 Minnesota Mining And Manufacturing Company Curable resin sols and fiber-reinforced composites derived therefrom
US5814401A (en) * 1997-02-04 1998-09-29 Motorola, Inc. Selectively filled adhesive film containing a fluxing agent
US6180696B1 (en) * 1997-02-19 2001-01-30 Georgia Tech Research Corporation No-flow underfill of epoxy resin, anhydride, fluxing agent and surfactant
US5883193A (en) * 1997-07-01 1999-03-16 Minnesota Mining And Manufacturing Company Adhesive compositions with durability under conditions of high humidity
JP2001510944A (ja) * 1997-07-21 2001-08-07 アギラ テクノロジーズ インコーポレイテッド 半導体フリップチップ・パッケージおよびその製造方法
US6017634A (en) * 1997-07-21 2000-01-25 Miguel Albert Capote Carboxyl-containing polyunsaturated fluxing agent and carboxyl-reactive neutralizing agent as adhesive

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20120060773A (ko) * 2010-12-02 2012-06-12 롬 앤드 하스 일렉트로닉 머트어리얼즈, 엘.엘.씨. 아민 플럭스 조성물 및 솔더링 방법
KR20120060775A (ko) * 2010-12-02 2012-06-12 롬 앤드 하스 일렉트로닉 머트어리얼즈, 엘.엘.씨. 경화성 아민 플럭스 조성물 및 솔더링 방법

Also Published As

Publication number Publication date
WO2003020816A1 (en) 2003-03-13
EP1423467A1 (en) 2004-06-02
US20030111519A1 (en) 2003-06-19
JP2005501725A (ja) 2005-01-20
CN1549843A (zh) 2004-11-24

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