WO2010134306A1 - 電子部品実装方法および電子部品実装構造 - Google Patents
電子部品実装方法および電子部品実装構造 Download PDFInfo
- Publication number
- WO2010134306A1 WO2010134306A1 PCT/JP2010/003288 JP2010003288W WO2010134306A1 WO 2010134306 A1 WO2010134306 A1 WO 2010134306A1 JP 2010003288 W JP2010003288 W JP 2010003288W WO 2010134306 A1 WO2010134306 A1 WO 2010134306A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- electronic component
- solder
- thermosetting resin
- substrate
- resin
- Prior art date
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
- H05K3/305—Affixing by adhesive
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49866—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials
- H01L23/49883—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials the conductive materials containing organic materials or pastes, e.g. for thick films
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/0102—Calcium [Ca]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10954—Other details of electrical connections
- H05K2201/10977—Encapsulated connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3485—Applying solder paste, slurry or powder
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
Description
2 電極
3 半田接合材
3a 第1の熱硬化性樹脂
3b 半田粒子
4 接着剤
6,6A 電子部品
6a 外縁部
7,7A バンプ
Claims (4)
- 下面にバンプが設けられた電子部品を基板に実装する電子部品実装方法であって、
前記基板に形成された電極に半田粒子を第1の熱硬化性樹脂に含有させた半田接合材を供給する接合材供給工程と、前記基板において前記電子部品の外縁部に対応する位置に設定された複数の補強点に半田粒子を含まない第2の熱硬化性樹脂を主成分とする接着剤を塗布する接着剤塗布工程と、前記半田接合材が供給され前記接着剤が塗布された前記基板に前記電子部品を搭載して、前記バンプを前記半田接合材を介して前記電極に着地させるとともに、前記電子部品の外縁部を前記接着剤に接触させる部品搭載工程と、
部品搭載工程後の前記基板を加熱することにより、前記半田粒子を溶融固化させて前記バンプを前記電極に半田接合する半田接合部を形成するとともに、前記第1の熱硬化性樹脂を熱硬化させて前記半田接合部を補強する第1の樹脂補強部を形成し、さらに前記第2の熱硬化性樹脂を熱硬化させて前記電子部品の外縁部と前記基板の補強点とを固着する第2の樹脂補強部を形成する加熱接合工程とを含むことを特徴とする電子部品実装方法。 - 前記第1の熱硬化性樹脂および第2の熱硬化性樹脂の2種類の樹脂の成分組成において、前記2種類の樹脂に含まれる主剤および硬化剤は、共通の成分をそれぞれ50%以上含むことを特徴とする請求項1記載の電子部品実装方法。
- 半田粒子を第1の熱硬化性樹脂に含有させた半田接合材および半田粒子を含まない第2の熱硬化性樹脂を主成分とする接着剤を用いることにより、下面にバンプが設けられた電子部品を基板に実装してなる電子部品実装構造であって、
前記半田粒子を溶融固化させることにより形成され前記バンプを前記基板に形成された電極に半田接合する半田接合部と、前記第1の熱硬化性樹脂を熱硬化させることにより形成され前記半田接合部を補強する第1の樹脂補強部と、前記第2の熱硬化性樹脂を熱硬化させることにより形成され前記電子部品の外縁部と前記基板に設定された補強点とを固着する第2の樹脂補強部とを備えたことを特徴とする電子部品実装構造。 - 前記第1の熱硬化性樹脂および第2の熱硬化性樹脂の2種類の樹脂の成分組成において、前記2種類の樹脂に含まれる主剤および硬化剤は、共通の成分をそれぞれ50%以上含むことを特徴とする請求項3記載の電子部品実装構造。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13/201,084 US8557630B2 (en) | 2009-05-19 | 2010-05-14 | Electronic component mounting method and electronic component mount structure |
CN201080011226.1A CN102349362B (zh) | 2009-05-19 | 2010-05-14 | 电子部件安装方法和电子部件安装结构 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009120581A JP5310252B2 (ja) | 2009-05-19 | 2009-05-19 | 電子部品実装方法および電子部品実装構造 |
JP2009-120581 | 2009-05-19 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2010134306A1 true WO2010134306A1 (ja) | 2010-11-25 |
Family
ID=43125999
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2010/003288 WO2010134306A1 (ja) | 2009-05-19 | 2010-05-14 | 電子部品実装方法および電子部品実装構造 |
Country Status (4)
Country | Link |
---|---|
US (1) | US8557630B2 (ja) |
JP (1) | JP5310252B2 (ja) |
CN (1) | CN102349362B (ja) |
WO (1) | WO2010134306A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20130026212A1 (en) * | 2011-07-06 | 2013-01-31 | Flextronics Ap, Llc | Solder deposition system and method for metal bumps |
Families Citing this family (11)
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JP6077813B2 (ja) * | 2012-01-23 | 2017-02-08 | 日本電波工業株式会社 | 圧電モジュール |
EP2849216B1 (en) * | 2012-05-10 | 2018-10-24 | Panasonic Intellectual Property Management Co., Ltd. | Mounting structure and method for manufacturing same |
JP6094871B2 (ja) * | 2013-01-31 | 2017-03-15 | パナソニックIpマネジメント株式会社 | 電子部品実装方法 |
AT515071B1 (de) * | 2013-09-03 | 2019-03-15 | Zkw Group Gmbh | Verfahren zum positionsstabilen Verlöten |
DE102013220302B4 (de) * | 2013-10-08 | 2022-08-11 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Optoelektronisches Bauteil |
US9925612B2 (en) * | 2014-07-29 | 2018-03-27 | Panasonic Intellectual Property Management Co., Ltd. | Semiconductor component, semiconductor-mounted product including the component, and method of producing the product |
KR20160085171A (ko) * | 2015-01-07 | 2016-07-15 | 삼성전자주식회사 | 반도체 장치와, 그를 포함하는 전자 장치 및 반도체 장치를 장착하는 방법 |
US10823355B2 (en) * | 2016-01-27 | 2020-11-03 | Lite-On Electronics (Guangzhou) Limited | Light-emitting module for vehicle lamp |
EP3419006A4 (en) * | 2016-02-16 | 2019-01-16 | Sony Corporation | ELECTRONIC DEVICE, METHOD FOR PRODUCING THE ELECTRONIC DEVICE AND SUBSTRATE LAMINATE |
JP6753725B2 (ja) * | 2016-08-08 | 2020-09-09 | 株式会社フジクラ | 実装体 |
JP6489274B1 (ja) * | 2018-08-10 | 2019-03-27 | 千住金属工業株式会社 | フラックス組成物、はんだペースト、はんだ接合部及びはんだ接合方法 |
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2009
- 2009-05-19 JP JP2009120581A patent/JP5310252B2/ja active Active
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2010
- 2010-05-14 CN CN201080011226.1A patent/CN102349362B/zh active Active
- 2010-05-14 US US13/201,084 patent/US8557630B2/en active Active
- 2010-05-14 WO PCT/JP2010/003288 patent/WO2010134306A1/ja active Application Filing
Patent Citations (2)
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JPH1092876A (ja) * | 1988-04-20 | 1998-04-10 | Seiko Epson Corp | 異方性導電膜および異方性導電膜を用いた半導体素子の実装方法 |
JPH08186156A (ja) * | 1994-12-30 | 1996-07-16 | Casio Comput Co Ltd | 電子部品の接続方法 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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US20130026212A1 (en) * | 2011-07-06 | 2013-01-31 | Flextronics Ap, Llc | Solder deposition system and method for metal bumps |
Also Published As
Publication number | Publication date |
---|---|
US8557630B2 (en) | 2013-10-15 |
JP5310252B2 (ja) | 2013-10-09 |
CN102349362B (zh) | 2014-02-19 |
US20120052633A1 (en) | 2012-03-01 |
CN102349362A (zh) | 2012-02-08 |
JP2010272557A (ja) | 2010-12-02 |
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